Novel DIP packaging structure

Abstract

The utility model discloses a novel DIP packaging structure, which comprises a lead frame and a plastic package body coated outside the lead frame, a plurality of pins extending out of the plastic package body are arranged on the front side and the rear side of the lead frame, and each pin is provided with a transverse extension part and a vertical extension part formed by bending downwards from one end, far away from the plastic package body, of the transverse extension part. The left side walls of the transverse extending parts are flush with the left side walls of the vertical extending parts, the right side walls of the transverse extending parts are flush with the right side walls of the vertical extending parts, the distance b1 between every two adjacent transverse extending parts is equal to the distance b2 between every two adjacent vertical extending parts, and b1 is larger than or equal to 2.0 mm. According to the utility model, the pins with the same width are adopted, the distance between every two adjacent pins is larger than or equal to 2.0 mm; therefore, the electric leakage phenomenon of the pins of the product in a high-voltage application scene can be avoided, and the insulativity of the product is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a novel DIP packaging structure. Background Art

[0002] DIP package, also known as dual in-line package technology, dual in-line package, is a component package form of DRAM. It refers to integrated circuit chips packaged in dual in-line form. Most small and medium-scale integrated circuits use this package form, and the number of pins generally does not exceed 100. The CPU chip in DIP package has two rows of pins and needs to be inserted into a chip socket with a DIP structure. It can also be directly inserted into a circuit board with the same number of solder holes and geometric arrangement for soldering.

[0003] However, since the pins of the traditional DIP packaging structure are wide at the top and narrow at the bottom, the distance between the wide upper parts of two adjacent pins is ≤1.0mm. In high-voltage application scenarios, leakage is prone to occur in the wide upper part of the pins, resulting in poor insulation of the product. In addition, the traditional DIP packaging structure also has the problem of poor heat dissipation. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a novel DIP packaging structure, which adopts pins with uniform width settings, and the distance between two adjacent pins is ≥2.0mm, thereby avoiding leakage of pins in high-voltage application scenarios and enhancing the insulation of the product.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A novel DIP packaging structure comprises a lead frame and a plastic package body wrapped around the lead frame, wherein a plurality of pins extending out of the plastic package body are provided on both the front and rear sides of the lead frame, wherein the pins have a lateral extension portion and a vertical extension portion formed by bending downward from one end of the lateral extension portion away from the plastic package body, wherein the left side wall of the lateral extension portion is flush with the left side wall of the vertical extension portion, the right side wall of the lateral extension portion is flush with the right side wall of the vertical extension portion, the spacing b1 between two adjacent lateral extension portions is equal to the spacing b2 between two adjacent vertical extension portions, and b1 is ≥ 2.0 mm.

[0007] By providing a pin consisting of a lateral extension portion and a vertical extension portion, the left side wall of the lateral extension portion is flush with the left side wall and the right side wall of the vertical extension portion, so that the width of the lateral extension portion and the vertical extension portion of the pin are consistent, the spacing b1 between two adjacent lateral extension portions and the spacing b2 between two adjacent vertical extension portions are equal, and b1 ≥ 2.0 mm, so that a distance of ≥ 2.0 mm is maintained between two adjacent pins, thereby avoiding leakage of the pins in high-voltage application scenarios and enhancing the insulation of the product.

[0008] As a preferred solution, support parts are provided on the front and rear sides of the bottom of the plastic package body, and a U-shaped heat dissipation groove is recessed upward between the two support parts. The left and right ends of the U-shaped heat dissipation groove extend to both sides of the plastic package body to form heat dissipation openings.

[0009] As a preferred solution, the depth h of the U-shaped heat dissipation groove is 0.03mm-0.20mm.

[0010] As a preferred solution, the width b5 of the U-shaped heat dissipation groove is ≤ 3 / 4 of the width b6 of the plastic package body.

[0011] As a preferred solution, the width b3 of the lateral extension portion is equal to the width b4 of the vertical extension portion, and b3 is 0.2 mm-0.5 mm.

[0012] As a preferred solution, the lower end of the vertical extension portion is bent to form a welding plate portion that can be mounted on a welding pad of a circuit board.

[0013] As a preferred solution, the welding plate portion extends outwardly in a direction away from the plastic packaging body.

[0014] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, by providing a pin composed of a horizontal extension part and a vertical extension part, the left side wall of the horizontal extension part is flush with the left side wall and the right side wall of the vertical extension part, so that the width of the horizontal extension part and the vertical extension part of the pin are consistent, the spacing b1 of two adjacent horizontal extension parts and the spacing b2 of two adjacent vertical extension parts are equal, and b1≥2.0mm, so that a distance of ≥2.0mm is maintained between two adjacent pins, thereby avoiding leakage of the pins in high-voltage application scenarios and enhancing the insulation of the product.

[0015] In order to more clearly explain the structural features, technical means and specific purposes and functions achieved by the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments: BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front view of the first embodiment of the utility model;

[0017] Figure 2 It is a top view of the first embodiment of the utility model;

[0018] Figure 3 It is a left side view of the first embodiment of the utility model;

[0019] Figure 4 It is a left side view of the second embodiment of the utility model.

[0020] Description of the accompanying drawings:

[0021] 10-plastic package body; 101-supporting portion; 102-U-shaped heat dissipation groove; 11-pin; 111-lateral extension portion; 112-vertical extension portion; 113-welding plate portion. DETAILED DESCRIPTION

[0022] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the position or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0024] like Figure 1-3 As shown, the utility model discloses a novel DIP packaging structure. In a first embodiment, the novel DIP packaging structure includes a lead frame (not shown) and a plastic package body 10 wrapped around the lead frame. The front and rear sides of the lead frame are provided with a plurality of pins 11 extending out of the plastic package body 10. Exemplarily, the front and rear sides of the lead frame are provided with four pins 11 extending out of the plastic package body 10.

[0025] The pin 11 has a lateral extension portion 111 and a vertical extension portion 112 formed by bending downward from one end of the lateral extension portion 111 away from the plastic package body 10, the left side wall of the lateral extension portion 111 is flush with the left side wall of the vertical extension portion 112, the right side wall of the lateral extension portion 111 is flush with the right side wall of the vertical extension portion 112, the spacing b1 between two adjacent lateral extension portions 111 and the spacing b2 between two adjacent vertical extension portions 112 are equal, and b1≥2.0mm.

[0026] The width b3 of the transverse extension portion 111 is equal to the width b4 of the vertical extension portion 112 , and b3 is 0.2 mm-0.5 mm, preferably b3 is 0.25 mm-0.46 mm, and illustratively, b3 can be 0.4 mm.

[0027] Support parts 101 are provided on both the front and rear sides of the bottom of the plastic packaging body 10, and a U-shaped heat dissipation groove 102 is recessed upwards between the two support parts 101, and the left and right ends of the U-shaped heat dissipation groove 102 extend to both sides of the plastic packaging body 10 to form heat dissipation openings; by arranging support parts 101 on both the front and rear sides of the bottom of the plastic packaging body 10, a U-shaped heat dissipation groove 102 is arranged between the two support parts 101, and there are tangible heat dissipation openings on the left and right ends of the U-shaped heat dissipation groove 102, when the product is soldered to the circuit board, the support part 101 abuts against the surface of the circuit board to play a limiting role, so that the product is installed stably; the U-shaped heat dissipation groove 102 can keep the product in good contact with the bottom and the air, and air can flow into the U-shaped heat dissipation groove 102 from one of the heat dissipation openings and flow out from the other heat dissipation opening, thereby taking away heat and improving the heat dissipation effect of the product.

[0028] The depth h of the U-shaped heat dissipation groove 102 is 0.03 mm-0.20 mm, preferably h is 0.1 mm.

[0029] The width b5 of the U-shaped heat dissipation groove 102 is ≤ 3 / 4 of the width b6 of the plastic package body 10; by setting the width b5 of the U-shaped heat dissipation groove 102 ≤ 3 / 4 of the width b6 of the plastic package body 10, both the limiting function of the support part 101 and the heat dissipation effect of the product are met.

[0030] like Figure 4 As shown, in the second embodiment, the difference from the first embodiment is that the lower end of the vertical extension portion 112 is bent to form a welding plate portion 113 that can be mounted on the soldering pad of the circuit board; by providing the welding plate portion 113, during welding, the welding plate portion 113 can be welded to the soldering pad on the circuit board by a mounting method, which meets the SMT mounting requirements and can improve the product installation efficiency and product reliability.

[0031] The welding plate portion 113 extends outwardly in a direction away from the plastic packaging body 10 . It is understandable that the welding plate portion 113 may also be configured to extend inwardly in a direction close to the plastic packaging body 10 .

[0032] To sum up, the utility model provides a pin 11 composed of a lateral extension portion 111 and a vertical extension portion 112, and the left side wall of the lateral extension portion 111 is flush with the left side wall and the right side wall of the vertical extension portion 112, so that the lateral extension portion 111 and the vertical extension portion 112 of the pin 11 have the same width, and the spacing b1 between two adjacent lateral extension portions 111 and the spacing b2 between two adjacent vertical extension portions 112 are equal, and b1 ≥ 2.0 mm, so that a distance of ≥ 2.0 mm is maintained between two adjacent pins 11, thereby avoiding leakage of the pin 11 in high-voltage application scenarios and enhancing the insulation of the product.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Therefore, any modification, equivalent replacement, improvement, etc. made to the above embodiment based on the technical practice of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A novel DIP packaging structure, comprising a lead frame and a plastic package body coated outside the lead frame, wherein the front and rear sides of the lead frame are provided with a plurality of pins extending outside the plastic package body, characterized in that: The pin has a lateral extension portion and a vertical extension portion formed by bending downward from one end of the lateral extension portion away from the plastic package body, the left side wall of the lateral extension portion is flush with the left side wall of the vertical extension portion, the right side wall of the lateral extension portion is flush with the right side wall of the vertical extension portion, the spacing b1 between two adjacent lateral extension portions and the spacing b2 between two adjacent vertical extension portions are equal, and b1≥2.0mm.

2. The novel DIP packaging structure according to claim 1 is characterized in that: Support parts are provided on both the front and rear sides of the bottom of the plastic package body, and a U-shaped heat dissipation groove is recessed upward between the two support parts. The left and right ends of the U-shaped heat dissipation groove extend to both sides of the plastic package body to form heat dissipation openings.

3. The novel DIP packaging structure according to claim 2 is characterized in that: The depth h of the U-shaped heat dissipation groove is 0.03mm-0.20mm.

4. The novel DIP packaging structure according to claim 2 is characterized in that: The width b5 of the U-shaped heat dissipation groove is ≤ 3 / 4 of the width b6 of the plastic package body.

5. The novel DIP packaging structure according to claim 1 is characterized in that: The width b3 of the transversely extending portion is equal to the width b4 of the vertically extending portion, and b3 is 0.2 mm-0.5 mm.

6. The novel DIP packaging structure according to claim 1 is characterized in that: The lower end of the vertical extension portion is bent to form a welding plate portion that can be mounted on a welding pad of a circuit board.

7. The novel DIP packaging structure according to claim 6 is characterized in that: The welding plate portion extends outwardly in a direction away from the plastic packaging body.

Images