Circuit board assembly
By designing a symmetrical copper layer and interlaced signal hole group on the circuit board assembly, combined with the setting of heat dissipation holes, the thermal problems caused by high current density of bidirectional gallium nitride HEMT VGaN devices are solved, and the stability and reliability of the device are improved. sex.
Patent Information
- Application Number
- CN202420698863.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-07
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-04-07
AI Technical Summary
Bidirectional gallium nitride HEMT VGaN devices generate large heat when high current density passes, resulting in an increase in device temperature, affecting its performance stability and reliability.
A circuit board assembly is designed, including a printed circuit board and a pad. The first copper layer is arranged symmetrically to cover the pad. The multiple signal hole groups are arranged staggered in the vertical direction. The second copper layer is arranged symmetrically and at the source and leakage. There are heat dissipation holes at the pole and sampling resistor to ensure uniform current distribution and good heat dissipation.
Through uniform current distribution and effective heat dissipation design, the temperature rise of the device is reduced, the stability and reliability of circuit board components are improved, and local overheating and failure are avoided.
Smart Images
Figure CN222339649U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a circuit board assembly. Background Art
[0002] With the rapid development of power electronics technology, the demand for efficient, reliable and stable power semiconductor devices is growing. As a representative of the new generation of semiconductor technology, bidirectional gallium nitride HEMT VGaN devices have been widely used in the field of power electronics due to their significant advantages such as bidirectional blocking capability, high switching speed and low conduction loss. In particular, bidirectional gallium nitride HEMT VGaN devices play a vital role in key parts such as battery management systems (BMS), switching circuits in multi-power supply systems, and high-voltage side load switches in bidirectional converters.
[0003] With the expansion of applications and the increase of current load, bidirectional gallium nitride HEMT VGaN devices face severe heat dissipation challenges. When high current density passes through the device, a large amount of heat is generated, causing the device temperature to rise, which in turn affects its performance stability and reliability. In addition, non-uniform current distribution may also cause local overheating of the device and even cause failure. Utility Model Content
[0004] The utility model provides a circuit board assembly, which is used to solve the problem in the prior art that when a high current density passes through a device, a large amount of heat is generated, resulting in the temperature rise of the device, thus affecting the performance stability and reliability thereof.
[0005] The utility model provides a circuit board component, comprising: a printed circuit board and a soldering pad, wherein the soldering pad is arranged on a first surface layer of the printed circuit board; the printed circuit board comprises a first copper layer, the first copper layer covers the soldering pad, and the first copper layer is symmetrically arranged relative to a first direction of the printed circuit board; the printed circuit board is also provided with a plurality of signal hole groups, and the plurality of signal hole groups are arranged close to the soldering pad.
[0006] According to a circuit board assembly provided by the utility model, a plurality of signal hole groups are staggeredly arranged along a second direction of the printed circuit board, and the second direction is perpendicular to the first direction.
[0007] According to a circuit board assembly provided by the utility model, the second surface layer of the printed circuit board is further provided with a second copper layer, and the second copper layer is symmetrically arranged relative to the second direction, wherein the second surface layer of the printed circuit board is arranged opposite to the first surface layer of the printed circuit board.
[0008] According to a circuit board assembly provided by the utility model, the second copper layer includes two parts which are symmetrically arranged relative to the second direction.
[0009] According to a circuit board assembly provided by the utility model, there are multiple solder pads.
[0010] According to a circuit board assembly provided by the utility model, the distance between any two adjacent pads is equal.
[0011] According to a circuit board assembly provided by the utility model, the circuit board assembly also includes a bidirectional gallium nitride semiconductor device, the pad is provided with a source welding piece, a drain welding piece and a gate welding piece, and the bidirectional gallium nitride semiconductor device includes a source, a drain and a gate; the source is electrically connected to the pad through the source welding piece, the drain is electrically connected to the pad through the drain welding piece, and the gate is electrically connected to the pad through the gate welding piece.
[0012] According to a circuit board assembly provided by the utility model, a sampling resistor is further provided on the printed circuit board, and the two ends of the sampling resistor are electrically connected to the drain and the drain welding piece respectively; or, the two ends of the sampling resistor are connected to the source and the source welding piece respectively, for obtaining current information between the drain and the source.
[0013] According to a circuit board assembly provided by the utility model, heat dissipation holes are provided at locations of the second copper layer corresponding to the source electrode welding piece, the drain electrode welding piece and the sampling resistor.
[0014] According to a circuit board assembly provided by the utility model, heat dissipation holes are provided at the first copper layer and the second copper layer corresponding to the source electrode welding piece, the drain electrode welding piece and the sampling resistor.
[0015] The circuit board assembly provided by the utility model has a first copper layer symmetrically arranged along a first direction, which is convenient for heat dissipation, more uniform current, and small temperature rise; by arranging a plurality of signal hole groups near the pad on the printed circuit board, the heat dissipation effect is good, thereby improving the stability and reliability of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0017] Figure 1 It is a top view of the circuit board assembly provided by the utility model;
[0018] Figure 2 It is a bottom view of the circuit board assembly provided by the utility model;
[0019] Figure 3It is a schematic diagram of the partial structure of the first surface layer of the printed circuit board provided by the utility model;
[0020] Figure 4 It is a schematic diagram of the partial structure of the second surface layer of the printed circuit board provided by the utility model;
[0021] Reference numerals:
[0022] 1. Printed circuit board; 2. Solder pad; 3. Bidirectional gallium nitride semiconductor device; 4. Signal hole group; 5. Via hole; 6. Sampling resistor; 7. Second copper layer; 8. Heat dissipation hole; 9. Driving resistor. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described clearly and completely in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.
[0025] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.
[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.
[0028] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the utility model. In addition, the utility model can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the utility model provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the applicability of other processes and / or the use of other materials.
[0029] Combine the following Figures 1 to 4 The utility model describes a circuit board assembly.
[0030] The circuit board assembly provided by the embodiment of the utility model comprises: a printed circuit board 1 and a pad 2, wherein the pad 2 is arranged on the first surface layer of the printed circuit board 1, and the bidirectional gallium nitride semiconductor device 3 can be electrically connected to the printed circuit board 1 through the pad 2, such as Figure 1 The pad 2 can be arranged on the top layer of the printed circuit board 1 or on the bottom layer of the printed circuit board 1 , wherein the top layer or the bottom layer where the pad 2 is welded is the first surface layer of the printed circuit board 1 .
[0031] It should be noted that the bidirectional gallium nitride semiconductor device 3 utilizes the excellent performance and characteristics of gallium nitride materials to achieve high-performance and high-efficiency power electronic devices.
[0032] The pad 2 is a metal contact point or area for welding devices, and is a key part of the printed circuit board 1 for connecting devices. The pad 2 can be divided into multiple types and can be selected according to actual needs. The pins of the device are connected to the pad 2 through welding technology, thereby realizing the electrical connection and mechanical fixation of the device in the circuit.
[0033] The printed circuit board 1 includes a first copper layer (not shown in the figure), the first copper layer covers the pad 2, and the first copper layer is relative to the first direction of the printed circuit board 1 (such as Figure 3 The symmetrical arrangement (as shown) facilitates heat dissipation and ensures balanced overcurrent.
[0034] The printed circuit board 1 is also provided with a plurality of signal hole groups 4, which are arranged close to the pads 2. The plurality of signal hole groups 4 can not only realize signal transmission, but also enable the bidirectional gallium nitride semiconductor device 3 to dissipate heat better.
[0035] In the circuit board assembly provided by the embodiment of the utility model, the first copper layer is symmetrically arranged relative to the first direction, which is convenient for heat dissipation, more uniform current and small temperature rise; by arranging multiple signal hole groups 4 near the pad 2 on the printed circuit board 1, the heat dissipation effect is good, thereby improving the stability and reliability of the circuit board assembly.
[0036] In the embodiment of the utility model, a plurality of signal hole groups 4 are staggeredly arranged along a second direction of the printed circuit board 1 , and the second direction is perpendicular to the first direction.
[0037] The pad 2 has a plurality of welding areas, and the signal hole group 4 includes a plurality of signal holes, which can be set according to the welding areas. Figure 3 , there are 6 signal hole groups 4, and the 6 signal hole groups 4 are arranged in two rows along the first direction, with 3 signal hole groups 4 in each row, and the signal hole groups 4 in each row are arranged at intervals along the second direction, and any signal hole group 4 in the first row of signal hole groups 4 is located between two adjacent signal hole groups 4 in the second row. In the embodiment of the utility model, the plurality of signal hole groups 4 are staggered along the second direction to achieve good heat dissipation effect, and the bidirectional gallium nitride semiconductor device 3 has a large overcurrent and a small temperature rise. The number of signal hole groups 4 in the embodiment of the utility model is not specifically limited and can be set according to actual conditions.
[0038] The second surface layer of the printed circuit board 1 in the embodiment of the utility model is further provided with a second copper layer 7, which is symmetrically arranged along the second direction for overcurrent balance.
[0039] It should be noted that the first surface layer and the second surface layer of the printed circuit board 1 are respectively the top layer and the bottom layer of the printed circuit board 1 .
[0040] refer to Figure 1 There are multiple pads 2, multiple bidirectional gallium nitride semiconductor devices 3, and multiple bidirectional gallium nitride semiconductor devices 3 are connected to multiple pads 2 in a one-to-one correspondence. Multiple bidirectional gallium nitride semiconductor devices 3 can be connected in parallel to the printed circuit board 1.
[0041] Furthermore, the distance between any two adjacent pads 2 is equal. It can be understood that the distance between any two adjacent bidirectional gallium nitride semiconductor devices 3 is equal, which has a good heat dissipation effect and a small temperature rise, thereby improving the stability and reliability of the circuit board assembly and avoiding failure caused by local overheating of the circuit board assembly.
[0042] In the embodiment of the utility model, a plurality of pads 2 are arranged at intervals along the second direction, and a via hole 5 is also provided on the printed circuit board 1. The gates of a plurality of bidirectional gallium nitride semiconductor devices 3 are connected in parallel through the via hole 5, thereby dividing the second surface layer of the printed circuit board 1 into two parts.
[0043] The second copper layer 7 includes two parts symmetrically arranged relative to the second direction, namely the second copper layer a and the second copper layer b. The second copper layer a and the second copper layer b are arranged on both sides of the via hole 5. Figure 4 As shown, the heat dissipation and current passing effects are good.
[0044] In one embodiment, the wire-through hole 5 is disposed at the center of the printed circuit board 1 in the first direction, and the second copper layer a and the second copper layer b are symmetrically disposed on both sides of the wire-through hole 5 .
[0045] In the embodiment of the utility model, the pad 2 is provided with a source soldering piece, a drain soldering piece and a gate soldering piece, and the bidirectional gallium nitride semiconductor device 3 includes a source, a drain and a gate; the source is electrically connected to the pad 2 through the source soldering piece, the drain is electrically connected to the pad 2 through the drain soldering piece, and the gate is electrically connected to the pad 2 through the gate soldering piece.
[0046] Furthermore, a driving resistor 9 is provided next to the pad 2, and the driving resistor 9 plays a role of current limiting and protection.
[0047] In one embodiment, two ends of the sampling resistor 6 are electrically connected to the drain and the drain welding piece respectively, and the sampling resistor 6 is used to obtain the current information flowing from the drain to the source.
[0048] In another embodiment, two ends of the sampling resistor 6 are respectively connected to the source and the source welding piece, so as to obtain the current information between the drain and the source.
[0049] It can be understood that the sampling resistor 6 is also used to connect to an external device, and the external device is used to receive the corresponding current information obtained by the sampling resistor 6.
[0050] refer to Figure 2 In the embodiment of the utility model, heat dissipation holes 8 are provided at the source electrode welding piece, the drain electrode welding piece and the sampling resistor 6 on the second copper layer 7 corresponding to the welding pad 2, so as to increase the exposed area of the second copper layer 7 and improve the heat dissipation effect.
[0051] In another embodiment, heat dissipation holes 8 are provided at the source welding piece, the drain welding piece and the sampling resistor 6 on the corresponding pads of the first copper layer and the second copper layer 7, and the exposed area of the first copper layer and the second copper layer 7 is increased, and the heat dissipation and current passing effects are good.
[0052] In the embodiment of the utility model, the number and structure of the heat dissipation holes 8 are not specifically limited and can be set according to actual conditions.
[0053] The circuit board assembly provided by the embodiment of the utility model has a symmetrical design of the printed circuit board 1, so that the current is balanced and the heat dissipation effect of the printed circuit board 1 is good; the distances between two adjacent bidirectional gallium nitride semiconductor devices 3 are equal, the overcurrent is large, and the temperature rise is small.
[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.
Claims
1. A circuit board assembly, characterized in that: include: A printed circuit board and a solder pad, wherein the solder pad is arranged on a first surface layer of the printed circuit board; The printed circuit board includes a first copper layer, which covers the pad and is symmetrically arranged relative to a first direction of the printed circuit board; the printed circuit board is also provided with a plurality of signal hole groups, which are arranged close to the pad.
2. The circuit board assembly according to claim 1, characterized in that: The plurality of signal hole groups are staggeredly arranged along a second direction of the printed circuit board, and the second direction is perpendicular to the first direction.
3. The circuit board assembly according to claim 2, characterized in that: The second surface layer of the printed circuit board is further provided with a second copper layer, and the second copper layer is symmetrically arranged relative to the second direction, wherein the second surface layer of the printed circuit board is arranged opposite to the first surface layer of the printed circuit board.
4. The circuit board assembly according to claim 3, characterized in that: The second copper layer includes two parts symmetrically arranged with respect to the second direction.
5. The circuit board assembly according to claim 3, characterized in that: There are multiple pads.
6. The circuit board assembly according to claim 5, characterized in that: The distance between any two adjacent pads is equal.
7. The circuit board assembly according to any one of claims 3 to 6, characterized in that: The circuit board assembly further includes a bidirectional gallium nitride semiconductor device, the pad is provided with a source soldering pad, a drain soldering pad and a gate soldering pad, and the bidirectional gallium nitride semiconductor device includes a source, a drain and a gate; The source electrode is electrically connected to the pad via the source electrode welding piece, the drain electrode is electrically connected to the pad via the drain electrode welding piece, and the gate electrode is electrically connected to the pad via the gate electrode welding piece.
8. The circuit board assembly according to claim 7, characterized in that: A sampling resistor is also provided on the printed circuit board, and two ends of the sampling resistor are electrically connected to the drain electrode and the drain electrode welding piece respectively; Alternatively, two ends of the sampling resistor are respectively connected to the source and the source welding piece, so as to obtain the current information between the drain and the source.
9. The circuit board assembly according to claim 8, characterized in that: The second copper layer is provided with heat dissipation holes corresponding to the source electrode welding piece, the drain electrode welding piece and the sampling resistor.
10. The circuit board assembly according to claim 8, characterized in that: Heat dissipation holes are provided on the first copper layer and the second copper layer corresponding to the source electrode welding piece, the drain electrode welding piece and the sampling resistor.