High-density interconnection circuit board with high reliability

Abstract

The utility model discloses a high-density interconnection circuit board with high reliability. The high-density interconnection circuit board comprises an electric connecting ring and a plurality of board bodies, the electric connecting ring is of a circular ring structure design and is made of conductive metal materials, and an insulating paint layer is further arranged on the outer surface of the electric connecting ring. The plurality of plate bodies are radially arranged at intervals in a surrounding manner, and the plurality of plate bodies are all provided with electric communication holes of which the two sides are through; and the electric connecting ring sequentially penetrates through the plurality of plate bodies along the plurality of electric communication holes and is electrically connected with the plurality of plate bodies. According to the utility model, through designing the high-density interconnection board with the radial unfolding structure, compared with a conventional laminated circuit board, the heat dissipation effect can be greatly improved, so that the operation and the use of the circuit board are more reliable; a plurality of groups of electric connecting rings playing a role in electric connection are designed on the circuit board and have various specifications, so that the circuit board can be adapted to more complicated circuits on the circuit board, and the applicability of the circuit board is greatly expanded; the utility model has the advantages of strong practicability and strong popularization significance.

Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to a high-density interconnection circuit board with high reliability. Background Art

[0002] Circuit board, also known as printed circuit board or printed circuit board, PCB in English, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Before the emergence of circuit boards, the interconnection between electronic components was completed by direct connection of wires. Nowadays, wires are only used for experimental applications in laboratories, and circuit boards have occupied an absolute dominant position in the electronics industry.

[0003] High-density interconnected circuit boards are used to interconnect multiple circuit boards to meet different equipment requirements. Existing high-density interconnected circuit boards are often formed by stacking multiple circuit boards, but the thickness of the stacked circuit boards is significantly increased, which seriously inhibits the heat dissipation capacity of the circuit boards. Utility Model Content

[0004] Based on this, it is necessary to provide a high-density interconnection circuit board with high reliability to address the deficiencies in the prior art.

[0005] A high-density interconnection circuit board with high reliability, comprising an electrical connection ring and a plurality of plate bodies. The electrical connection ring is designed in a circular ring structure, and is made of a conductive metal material, and is also provided with an insulating paint layer on the surface. The plurality of plate bodies are arranged radially and spaced around each other, and the plurality of plate bodies are provided with electrical connection holes penetrating on both sides. The electrical connection ring is sequentially penetrated on the plurality of plate bodies along the plurality of electrical connection holes and is electrically connected to the plurality of plate bodies.

[0006] Furthermore, the electrical connection rings are provided in multiple groups, corresponding to the electrical connection holes on the plurality of the plates, and the plurality of electrical connection rings are sequentially passed through the plurality of plates along the corresponding electrical connection holes and electrically connected to the plurality of plates.

[0007] Furthermore, the plurality of groups of electrical connection rings are provided with different diameters, and the electrical connection holes on the corresponding plurality of plates are provided with different positions.

[0008] Furthermore, the high-reliability high-density interconnection circuit board also includes a mounting frame, and the mounting frame includes a base, a support shaft and a connecting rod. The base is located below the plurality of boards, the support shaft is inserted into the electrical connection ring, and the lower end of the support shaft is connected to the base, and the connecting rod is integrally arranged on both sides of the support shaft and its outer end is fixedly connected to the electrical connection ring.

[0009] Furthermore, the support shaft and the base are designed as a movable connection structure, wherein the base can drive the support shaft to rotate movably.

[0010] Furthermore, the high-reliability high-density interconnection circuit board also includes two groups of breathable dustproof nets, both of which are designed with a circular structure. The two groups of breathable dustproof nets are respectively passed through the upper and lower ends of the support shaft and are respectively fitted with the upper and lower ends of several board bodies.

[0011] In summary, the beneficial effects of the high-reliability high-density interconnection circuit board of the utility model are: by designing a high-density interconnection board with a radially expanded structure, the heat dissipation effect can be greatly improved compared with the conventional stacked circuit board, thereby making the operation and use of the circuit board more reliable; the electrical connection rings on the circuit board that play an electrical connection role are designed in multiple groups and with various specifications, so that they can adapt to more complex circuits on the circuit board, greatly expanding the applicability of the circuit board; a support frame is provided under the circuit board to support and install the circuit board, and the risk of damage to the circuit board due to bumps or pollution can be effectively reduced in conjunction with a breathable dustproof net; the utility model is highly practical and has a strong promotional significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the structure of a high-density interconnection circuit board with high reliability according to the utility model;

[0013] Figure 2 for Figure 1 Schematic diagram of the decomposition structure;

[0014] Figure 3 for Figure 2 Schematic diagram of the structure of the middle plate;

[0015] Figure 4 for Figure 2 Schematic diagram of the exploded structure of the mounting frame. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0017] like Figures 1 to 4 As shown, the utility model provides a high-density interconnection circuit board 100 with high reliability, which includes an electrical connection ring 10 and a plurality of board bodies 20.

[0018] The electrical connection ring 10 is designed in a circular ring structure, and its material is a conductive metal material, and an insulating paint layer is also provided on the surface. Several of the plate bodies 20 are arranged in a radially spaced manner, and the several plate bodies 20 are provided with electrical connection holes 21 penetrating on both sides. The electrical connection ring 10 is sequentially penetrated on several plate bodies 20 along several electrical connection holes 21 and electrically connected to several plate bodies 20. The multi-layer circuit board is connected in series by the electrical connection ring 10, and the high-density interconnection between the layers of the multiple plate bodies 20 is realized through the electrical path of the electrical connection ring 10. The surface of the electrical connection ring 10 is also provided with an insulating paint layer, and the insulating paint layer is only scraped off at the electrical connection holes 21 where the circuit board needs to be connected, so as to realize the interconnection between any layers of the multi-layer circuit board, and there is no need to worry about the circuit short circuit between the plate bodies 20. More importantly, the heat dissipation effect of the plate bodies 20 arranged in a radially spaced manner is significantly enhanced compared with the circuits stacked tightly, making the circuit board more reliable during operation.

[0019] Specifically, in this embodiment, the electrical connection rings 10 are provided in multiple groups, and multiple electrical connection holes 21 are provided corresponding to the plurality of the board bodies 20. The plurality of electrical connection rings 10 are sequentially penetrated on the plurality of board bodies 20 along the corresponding electrical connection holes 21 and are electrically connected to the plurality of board bodies 20. The plurality of electrical connection rings 10 are provided with different diameters, and the electrical connection holes 21 on the plurality of the board bodies 20 are provided with different positions. The plurality of electrical connection rings 10 can build more conductive paths between the board bodies 20, and the electrical connection rings 10 with different diameters can adapt to the electrical connection holes 21 with different opening positions between the board bodies 20. The combination of the two designs can enable the circuit board design to load more complex operating circuits, thereby achieving more functional effects of the circuit board.

[0020] The high-density interconnection circuit board 100 with high reliability also includes a mounting frame 30, and the mounting frame 30 includes a base 31, a support shaft 32 and a connecting rod 33. The base 31 is located below the plurality of board bodies 20, the support shaft 32 is inserted into the electrical connection ring 10, and the lower end of the support shaft 32 is connected to the base 31, and the connecting rod 33 is integrally arranged on both sides of the support shaft 32, and its outer end is fixedly connected to the electrical connection ring 10. The support shaft 32 and the base 31 are designed as a movable connection structure, wherein the base 31 can drive the support shaft 32 to rotate. The support installation of the mounting frame 30 can prevent the circuit board body 20 from directly contacting the ground, which can not only reduce unnecessary bumps, but also reduce the risk of dirt and moisture on the ground being contaminated on the circuit board and affecting the normal use of the circuit board. The rotatable mounting frame 30 drives the circuit board to rotate, so that the air flow speed between the board bodies 20 becomes faster, further improving the heat dissipation effect of the circuit board.

[0021] The high-reliability high-density interconnection circuit board 100 further includes two groups of air-permeable dust-proof nets 40, both of which are circular in structure, and are respectively arranged at the upper and lower ends of the support shaft 32 and respectively attached to the upper and lower ends of the plurality of boards 20. The upper and lower groups of air-permeable dust-proof nets 40 can further prevent external dirt and moisture from corroding the circuit board from the upper and lower ends, and due to the rotatable characteristics of the circuit board, the outward flow of air around the circuit board also plays a considerable role in dust and moisture prevention.

[0022] In summary, the beneficial effects of the high-density interconnection circuit board 100 with high reliability of the utility model are: by designing a high-density interconnection board with a radially expanded structure, the heat dissipation effect can be greatly improved compared with the conventional stacked circuit board, so that the operation and use of the circuit board is more reliable; the electrical connection rings 10 that play an electrical connection role on the circuit board are designed in multiple groups and with various specifications, so that they can adapt to more complex circuits on the circuit board, greatly expanding the applicability of the circuit board; a support frame is provided under the circuit board to support and install the circuit board, and the breathable dustproof net 40 can effectively reduce the risk of damage to the circuit board due to bumps or pollution; the utility model is highly practical and has a strong promotion significance.

[0023] The above-mentioned embodiment only expresses one implementation method of the utility model, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A high-density interconnection circuit board with high reliability, characterized in that: It includes an electrical connection ring and a plurality of plates; the electrical connection ring is designed as a circular ring structure, and its material is a conductive metal material, and an insulating paint layer is also provided on the surface; the plurality of plates are radially arranged in a circle, and the plurality of plates are provided with electrical connection holes passing through both sides; the electrical connection ring is sequentially passed through the plurality of plates along the plurality of electrical connection holes and is electrically connected to the plurality of plates.

2. The high-reliability high-density interconnect circuit board according to claim 1, characterized in that: The electrical connection rings are provided in multiple groups, corresponding to the electrical connection holes on the plates. The electrical connection rings are sequentially passed through the plates along the corresponding electrical connection holes and are electrically connected to the plates.

3. The high-reliability high-density interconnection circuit board according to claim 2, characterized in that: The plurality of groups of electrical connection rings are provided with different diameters, and the electrical connection holes on the corresponding plates are provided with different positions.

4. The high-reliability high-density interconnection circuit board according to claim 1, characterized in that: It also includes a mounting frame, which includes a base, a support shaft and a connecting rod; the base is located below the plurality of plates, the support shaft is passed through an electrical connection ring, and the lower end of the support shaft is connected to the base, and the connecting rod is integrally arranged on both sides of the support shaft and its outer end is fixedly connected to the electrical connection ring.

5. The high-reliability high-density interconnection circuit board according to claim 4, characterized in that: The support shaft and the base are designed as a movable connection structure, wherein the base can drive the support shaft to rotate movably.

6. The high-density interconnection circuit board with high reliability as claimed in claim 4, characterized in that: It also includes two groups of breathable dustproof nets, both of which are designed with a circular structure. The two groups of breathable dustproof nets are respectively penetrated at the upper and lower ends of the support shaft and are respectively fitted with the upper and lower ends of the plurality of plates.

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