Double-sided active light-emitting LED lamp filament
By adopting a double-sided active light emitting structure and an interlaced light source chip in the LED filament, the problem of brightness differences between the front and back sides of the filament is solved, brightness consistency and cost reduction are achieved, and luminous efficiency and service life are improved.
Patent Information
- Application Number
- CN202421105186.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-21
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-05-21
AI Technical Summary
The brightness of the front and back sides of the filament on the market is different due to the light transmittance of ceramics or sapphires. It is necessary to distinguish between the front and back side welding, which increases labor costs. In addition, the single-side installation of the light source chip causes the shadow on the back to affect the consistency of the brightness.
Adopt a double-sided active luminescent LED filament structure, the bracket has solid crystal positions on both sides, and the light source chip is installed, and is covered with chip packaging strips of the same material. The bracket is made of sapphire, ceramic or graphene, and the light source chip includes the front side. The chips on the back are arranged interlaced to improve heat dissipation and light efficiency.
The brightness consistency of the front and back sides of the filament is achieved, which reduces costs, improves the light efficiency and service life, and is suitable for different power drive methods.
Smart Images

Figure CN222339937U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of LED filament structures, and more specifically, to a double-sided active light-emitting LED filament. Background Art
[0002] The filaments used on the market on a large scale have different brightness on the front and back sides due to the transmittance of ceramic or sapphire. The way of setting the light source on one side of the filament means that the sealing factory needs to distinguish the front and back sides for welding, which indirectly increases the labor cost and requires the use of larger chips to meet the brightness requirements. The single-sided installation of the light source chip will also cause shadows on the back of the filament, affecting the brightness consistency on both sides of the filament. Utility Model Content
[0003] In order to overcome the above-mentioned defects of the prior art, the embodiments of the present invention provide a double-sided active light-emitting LED filament to solve the above-mentioned problems.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a double-sided active light-emitting LED filament, comprising a bracket, wherein a plurality of crystal fixing positions are provided on both the front and back sides of the bracket, and each crystal fixing position is electrically connected to an external power supply; a light source chip is placed in the crystal fixing positions on the front and back sides of the bracket and is electrically connected to the external power supply; and a chip packaging strip is used to cover the outside of the light source chip.
[0005] In a preferred embodiment, the light source chip includes a front chip and a back chip, and the front chip and the back chip are symmetrically arranged on the front and back surfaces of the bracket, respectively.
[0006] In a preferred embodiment, the light source chip includes a front chip and a back chip, and the front chip and the back chip are respectively arranged alternately on the front and back surfaces of the bracket.
[0007] In a preferred embodiment, the thickness of the bracket is 0.2 mm-0.5 mm.
[0008] In a preferred embodiment, the light source chip is one or more of an LED chip, a control IC chip or a driving power chip.
[0009] In a preferred embodiment, the material of the bracket is one or more of sapphire, ceramic, and graphene.
[0010] Technical effects and advantages of the utility model:
[0011] 1. The double-sided installation of the light source chip makes the brightness of the front and back sides of the filament close, so there is no need to distinguish between the front and back sides, which optimizes operability.
[0012] 2. Reasonable selection of bracket material can improve lighting efficiency, reduce the loss of light transmittance, increase chip spacing to reduce light loss after lighting, and use small chips to achieve the brightness of current large chips and reduce costs.
[0013] 3. Reasonable layout of light source chips can effectively improve the heat dissipation problem, that is, the chip spacing is increased, the heat dissipation is more balanced, and the service life is increased. In addition, cheaper phosphors can be used to reduce costs.
[0014] 4. The brightness of the front and back sides is consistent, and the same phosphor ratio can be used directly to improve the consistency of light color.
[0015] 5. The bracket structure can be changed to be applicable to different series and parallel modes to meet different power drive needs. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The accompanying drawings are used to provide a further understanding of the technical solution of the present utility model and constitute a part of the present utility model. The embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation on the present utility model.
[0017] Figure 1 This is a schematic diagram of the double-sided light-emitting LED filament of the utility model.
[0018] Figure 2 This is a schematic diagram of another light source chip layout method for the double-sided light-emitting LED filament of the utility model.
[0019] Figure 3 It is a cross-sectional schematic diagram of the double-sided active light-emitting LED filament packaging structure of the utility model.
[0020] Figure 4 It is a schematic diagram of the structure of an existing single-sided luminous LED filament.
[0021] Figure 5 It is a schematic cross-sectional view of an existing single-sided light-emitting LED filament packaging structure.
[0022] The accompanying drawings are marked as follows: 1. bracket; 2. light source chip; 21. front chip; 22. back chip; 3. chip packaging strip; 4. backplane packaging strip. DETAILED DESCRIPTION
[0023] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that the description of the present disclosure will be more comprehensive and complete and the concepts of the example embodiments will be fully conveyed to those skilled in the art. The accompanying drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.
[0024] In addition, the described features, structures or characteristics may be combined in one or more example embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the example embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced while omitting one or more of the specific details, or other methods, components, steps, etc. may be adopted. In other cases, well-known structures, methods, implementations or operations are not shown or described in detail to avoid obscuring various aspects of the present disclosure.
[0025] like Figure 4 , Figure 5 The filament structure in the prior art shown includes a main support 1, and a plurality of light source chips 2 are fixed on a single side of the support 1. The light source chip 2 is electrically connected to an external power supply. Based on this structure, it is necessary to first distinguish the front and back sides of the support 1, and then use a dispensing machine to cover the front packaging strip 3 and the back packaging strip 4 of different proportions to complete the packaging of the LED filament. In the assembly of the whole lamp, the operator also needs to weld the filament according to the markings on the front and back sides. Since the LED filament emits light on one side, the LED lamp assembled in this way will have the defect of uneven brightness on the front and back sides of the LED light bar.
[0026] Example
[0027] The technical solution of the utility model is as follows:
[0028] like Figure 1-Figure 3 The specific structure of a double-sided active light-emitting LED filament is as follows: it specifically includes a bracket 1 and a light source chip 2, the bracket 1 is the main structure, and crystal fixing positions are opened on the front and back sides of the bracket 1, and a light source chip 2 is placed in each crystal fixing position. Wires or conductive paths are arranged on the bracket 1, and the wires or conductive paths are connected to an external power supply so that current can be transmitted to the light source chip 2 on the crystal fixing position through the wires or conductive paths, allowing the light source chip 2 to emit light.
[0029] The light source chip 2 is one or more of an LED chip, a control IC chip or a driving power chip.
[0030] It can be known that the light source chip 2 mentioned in this embodiment can use a traditional pin chip or a flip chip.
[0031] Preferably, the thickness of the support 1 can be selected in the range of 0.2 mm to 0.5 mm to improve the stability of the entire filament.
[0032] Specifically, the light source chip 2 includes a front chip 21 and a back chip 22, and the front chip 21 and the back chip 22 are respectively arranged on the front and back sides of the bracket 1 to achieve the purpose of allowing the front and back sides of the bracket 1 to emit light outward, reducing the risk of color difference and improving the consistency of light color.
[0033] Preferably, the front chip 21 and the back chip 22 located on the front and back sides of the bracket 1 are symmetrically arranged with respect to the bracket 1, thereby improving the heat dissipation effect of the filament structure.
[0034] Preferably, the front chip 21 and the back chip 22 located on the front and back sides of the bracket 1 are staggered with respect to the bracket 1, which further improves the heat dissipation effect of the filament structure.
[0035] The lighting effects of the above two preferred methods are slightly different. The user makes a specific selection according to the required scene, and this embodiment will not be described in detail here.
[0036] Chip packaging strips 3 are also laid on the outer sides of the light source chips 2 on the front and back sides of the bracket 1. During the laying of the chip packaging strips 3, since the chip packaging strips 3 on both sides are made of the same material and have the same laying process, a certain economic cost can be saved compared to the laying method of the prior art.
[0037] Among them, the material of the bracket 1 is one or more of sapphire, ceramic, and graphene. On the basis of the above structure, the light transmission loss can be further reduced and the light effect can be improved.
[0038] Furthermore, the same phosphor ratio can be used directly to improve light color consistency.
[0039] In addition, in order to improve the adjustability of light and color, the front and back sides of the LED filament can have a variety of light effects, and preferably the light emitted from the front and back sides can be one or more of white light, red light, green light, and blue light.
[0040] Preferably, the front chip 21 is matched with the chip packaging strip 3. When it is lit alone, the packaging strip is stimulated to emit 3000K warm white light. The back chip 22 is matched with the backplane packaging strip 4. When it is lit alone, the packaging strip is stimulated to emit 6000K pure white light. When the front chip 21 and the back chip 22 are lit at the same time, the warm white light and the pure white light are mixed to obtain 4500K neutral white light.
[0041] The above example uses white light. In actual application, one or more combinations of blue light, red light, and green light can be selected to achieve adjustable warmth and coldness of the light and adjustable color, thereby improving the light atmosphere and expanding the scope of application of the present design.
[0042] It can be known that this product is used in combination with an LED controller, that is, the switches of each light source chip 2 in the LED lamp circuit are controlled by chip processing. The controller controls the driving circuit according to a pre-set program to make the LED array emit light regularly, thereby displaying text or graphics to improve the lighting effect of the entire structure.
[0043] In addition, by reasonably changing the structure of the bracket, it can be applied to different series and parallel modes to meet different power drive needs.
[0044] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.
Claims
1. A double-sided active light-emitting LED filament, characterized in that include: A bracket (1), wherein a plurality of crystal fixing positions are provided on both the front and back surfaces of the bracket (1), and each crystal fixing position is electrically connected to an external power supply; The light source chip (2) is placed in the die-bonding positions on the front and back sides of the bracket (1) and is electrically connected to an external power source; The chip packaging strip (3) is used to cover the outer side of the light source chip (2).
2. A double-sided active light-emitting LED filament according to claim 1, characterized in that: The light source chip (2) comprises a front chip (21) and a back chip (22), and the front chip (21) and the back chip (22) are symmetrically arranged on the front and back surfaces of the bracket (1), respectively.
3. A double-sided active light-emitting LED filament according to claim 1, characterized in that: The light source chip (2) comprises a front chip (21) and a back chip (22), and the front chip (21) and the back chip (22) are respectively arranged alternately on the front and back surfaces of the bracket (1).
4. A double-sided active light-emitting LED filament according to claim 1, characterized in that: The thickness of the support (1) is 0.2 mm-0.5 mm.
5. A double-sided active light-emitting LED filament according to any one of claims 1 to 4, characterized in that: The light source chip (2) is one or more of an LED chip, a control IC chip or a driving power chip.
6. A double-sided active light-emitting LED filament according to claim 5, characterized in that: The material of the support (1) is one or more of sapphire, ceramic, and graphene.