Batch positioning and fixing system for chip cutting

Abstract

The utility model discloses a batch positioning and fixing system for chip cutting, relates to the technical field of chip cutting, and can solve the problems that in the prior art, chip positions are difficult to position in batches, repeated positioning is needed in the laser cutting process, and the chip cutting efficiency is low. The batch positioning and fixing system for chip cutting provided by the embodiment of the utility model comprises a working table with a working table top, and further comprises a positioning assembly which is placed on the working table top and is used for positioning a plurality of chip sets, and a film releasing assembly which is used for releasing an elastic film, the film pressing mechanism is used for tensioning and fixing the elastic film on the positioning assembly; the film cutting mechanism is used for cutting the elastic film; the film releasing assembly, the film pressing mechanism and the film cutting mechanism are all arranged on the workbench body.

Description

Technical Field

[0001] The utility model relates to the technical field of chip cutting, in particular to a batch positioning and fixing system for chip cutting. Background Art

[0002] A single chipset is in the shape of a long strip, with several individual chips distributed on it. Currently, lasers are usually used for batch cutting to form multiple individual chips. In the current chipset cutting process, before laser cutting, the chipsets to be cut usually need to be arranged into multiple rows on a fixed base, and then the arranged chipsets are fixed with a film, and then the multiple chipsets fixed on the film are sent to the laser cutting equipment for cutting with laser. The chipsets fixed on the film can facilitate the positioning of the chipsets during the laser cutting process to avoid errors in the cutting position.

[0003] In the prior art, after the chipset is placed on a fixed base, it is necessary to manually fine-tune the position of the chipset so that the multiple chipsets in each column are on the same vertical line. However, the size of the chipset is small, and the current chipset positioning adjustment is based solely on manual experience and visual comparison by positioning personnel. There are problems such as non-parallelism between multiple chipsets and uneven spacing between multiple columns of chipsets. In order to avoid mistakes or errors in the cutting position, the laser cutting equipment needs to be positioned each time it cuts, resulting in low cutting efficiency of the chipset.

[0004] Based on the above background, the inventor has designed a batch positioning and fixing system for chip cutting to solve one or more of the above problems. Utility Model Content

[0005] The purpose of this application is to provide a batch positioning and fixing system for chip cutting, which is used to solve the problem in the prior art that it is difficult to locate the chip position in batches and repeated positioning is required during the laser cutting process, resulting in low chip cutting efficiency.

[0006] In order to solve the above technical problems, the utility model adopts the following solutions:

[0007] The present application provides a batch positioning and fixing system for chip cutting, comprising a workbench with a work surface, a positioning assembly placed on the work surface and used to position multiple groups of chips, a film releasing assembly used to release an elastic film, a film pressing mechanism used to tension and fix the elastic film on the positioning assembly, and a film cutting mechanism used to cut the elastic film;

[0008] The film placing assembly, film pressing mechanism and film cutting mechanism are all arranged on the workbench body;

[0009] The positioning component includes a positioning structure whose height is less than the thickness of the chipset.

[0010] Preferably, the positioning assembly comprises a positioning base and a film tensioning frame both placed on a work surface;

[0011] The positioning base is located in the film tensioning frame, and a plurality of positioning structures are distributed on the top of the positioning base in a rectangular array.

[0012] Preferably, the positioning base comprises a fixedly connected mounting base plate and a positioning platform, and the positioning structures are distributed on the top surface of the positioning platform;

[0013] The shape of the outer peripheral wall of the mounting base plate matches the shape of the inner peripheral wall of the tension frame;

[0014] When the tensioning frame and the positioning base are placed on the work surface, the top height of the tensioning frame is located between the top surface of the mounting base and the top surface of the positioning platform.

[0015] Preferably, the positioning structure comprises an X-direction positioning structure and a Y-direction positioning structure, the height of which is less than the thickness of the chipset, and the X-direction positioning structure and the Y-direction positioning structure are both in the shape of strips and perpendicular to each other.

[0016] Preferably, the positioning structure is a sunken positioning groove, which includes an X-direction positioning sidewall arranged along the X direction and having a depth less than the thickness of the chipset, and a Y-direction positioning sidewall arranged along the Y direction and having a height less than the thickness of the chipset.

[0017] Preferably, the positioning structure is an upward convex positioning sidewall, which includes an X-direction positioning sidewall arranged along the X direction and having a height less than the chipset thickness, and a Y-direction positioning sidewall arranged along the Y direction and having a height less than the chipset thickness.

[0018] Preferably, the film unwinding assembly includes a film unwinding roller and a film roll mounted on the film unwinding roller, and a support roller for supporting the elastic film, the support roller is horizontally arranged and has a height higher than a work surface, and the work surface is located on the film path of the film unwinding assembly, and the width of the film roll is greater than the width of the positioning assembly.

[0019] Preferably, the work surface is provided with an installation groove for installing the positioning assembly, and film pressing slide grooves located on both sides of the installation groove and parallel to the direction of the film;

[0020] The film pressing mechanism is slidably connected with the workbench body via a film pressing slide groove.

[0021] Preferably, it also includes a turning frame rotatably connected to the workbench body, and the turning axis of the turning frame is arranged horizontally and perpendicular to the direction of the film;

[0022] The film cutting mechanism comprises a film breaking mechanism arranged on the turning frame;

[0023] The film cutting mechanism includes a film cutting guide rod and a film cutting knife head arranged on the film cutting guide rod and slidably connected thereto. The film cutting guide rod is arranged perpendicular to the direction of the film. A film cutting slide groove is arranged parallel to the film cutting guide rod and adapted to the film cutting knife head.

[0024] Preferably, the film cutting mechanism further comprises a film repairing mechanism rotatably connected to the flip frame, and the film repairing mechanism comprises:

[0025] A rotating shaft running through the turning frame, a circular cutting handle and a circular cutting rotating rod respectively arranged on both sides of the rotating shaft, and at least one circular cutting cutter head arranged on the circular cutting rotating rod;

[0026] When the turning frame is turned down, the rotation axis is located directly above the center of the positioning assembly, and the distance between the circular cutting head and the rotation axis is greater than half of the width of the positioning assembly.

[0027] Beneficial effects of the utility model:

[0028] The present application can position multiple chip groups through a positioning component, and then use a film releasing component to release an elastic film, and then use a film pressing mechanism to press the film down onto the positioning component, and use the elastic deformation or viscosity of the film surface to fix the multiple chip groups to the elastic film, so as to achieve the positioning and positioning of the multiple chip groups. Then, the multiple chip groups that have been positioned and fixed can be placed in a laser cutting device for chip cutting. Compared with the prior art, the operator can conveniently position the chipset through the positioning structure, and can avoid repeated positioning of the laser cutting device after the multiple chip groups are positioned, which is beneficial to improving the chip cutting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of a top view of the structure of an embodiment of the present application;

[0030] Figure 2 This is a schematic diagram of the main structure of an embodiment of the present application;

[0031] Figure 3 This is a schematic diagram of a top view of the positioning base in an embodiment of the present application;

[0032] Figure 4 This is a schematic diagram of the three-dimensional structure of the positioning base in the embodiment of the present application;

[0033] Figure 5 This is a schematic diagram of a top view of the structure after multiple chipsets in an embodiment of the present application are fixed.

[0034] Figure 6 It is a schematic diagram of the top view of the positioning base in another embodiment of the present application.

[0035] Description of reference numerals:

[0036] 1-positioning base, 11-mounting base, 12-positioning table, 13-positioning structure, 131-Y-axis positioning structure, 132-X-axis positioning structure, 2-film tensioning frame, 3-workbench body, 31-work table surface, 32-film pressing chute, 33-film cutting chute, 34-taking and placing ear groove, 41-elastic film, 42-film placing roller, 43-supporting roller, 5-film pressing mechanism, 611-circular cutting rotating rod, 612-circular cutting knife head, 613-circular cutting handle, 614-rotating shaft, 621-film cutting knife head, 622-film cutting guide rod, 63-turning frame. DETAILED DESCRIPTION

[0037] The present invention will be further described in detail below in conjunction with the embodiments and drawings, but the implementation manner of the present invention is not limited thereto.

[0038] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inside", "outside", "front", "back", "top", "bottom", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model.

[0039] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "open", "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] The present invention is described in detail below with reference to the accompanying drawings and in combination with embodiments:

[0041] like Figures 1 to 5 As shown, this embodiment provides: a batch positioning and fixing system for chip cutting, comprising a workbench with a workbench surface 31, a positioning assembly placed on the workbench surface 31 and used to position multiple groups of chip groups, a film releasing assembly used to release an elastic film 41, a film pressing mechanism 5 used to tighten and fix the elastic film 41 on the positioning assembly, and a film cutting mechanism used to cut the elastic film 41;

[0042] The film placing assembly, the film pressing mechanism 5 and the film cutting mechanism are all arranged on the workbench body 3 .

[0043] In this embodiment, a plurality of chip groups are positioned by a positioning component, and then an elastic film 41 is released by a film releasing component, and then the film is pressed down onto the positioning component by a film pressing component, and the plurality of chip groups are fixed to the elastic film 41 by the elastic deformation or viscosity of the film surface, thereby realizing the positioning and positioning of the plurality of chip groups, and then placing the positioned and fixed plurality of chip groups into a laser cutting device for chip cutting. Compared with the prior art, the operator can conveniently position the chip group through the positioning structure 13, and can avoid repeated positioning of the laser cutting device after the plurality of chip groups are positioned, thereby improving the chip cutting efficiency.

[0044] In some preferred embodiments, the positioning assembly includes a positioning base 1 and a film tensioning frame 2 both placed on a work surface 31;

[0045] The positioning base 1 is located in the film tensioning frame 2, and a plurality of positioning structures 13 distributed in a rectangular array are arranged on the positioning base 1. By setting the film tensioning frame 2, the film can be pressed against the edge of the film tensioning frame 2, so that the film in the tensioning frame can be deformed and tightened, and the part of the film in contact with the chipset is deformed, so that the chipset is positioned and fixed to the elastic film 41, and then the tensioning frame together with the film and the chipset can be taken out. At this time, the tensioning frame and the plurality of chipsets taken out are as follows: Figure 5 shown.

[0046] In this embodiment, the positioning structures 13 are distributed in a rectangular array, so that after the chipsets are positioned by the positioning structures 13, the spacing between the chipsets is fixed, and the chipsets can be repeatedly positioned when the laser cutting equipment cuts the chipsets.

[0047] In some preferred embodiments, the positioning base 1 comprises a fixedly connected mounting base plate 11 and a positioning platform 12, and the positioning structures 13 are distributed on the top surface of the positioning platform 12;

[0048] The shape of the outer peripheral wall of the mounting base 11 matches the shape of the inner peripheral wall of the tension frame;

[0049] When the tension frame and the positioning base 1 are placed on the work surface 31, the top height of the tension frame is located between the top surface of the mounting base 11 and the top surface of the positioning platform 12. In this embodiment, the mounting base 11 is disc-shaped, the positioning platform 12 is rectangular, the inner peripheral wall of the tension frame is circular, and the mounting base 11 and the positioning platform 12 are integrally formed.

[0050] In some preferred embodiments, the positioning structure 13 includes an X-direction positioning structure 132 and a Y-direction positioning structure 131, the height of which is less than the thickness of the chipset, and the X-direction positioning structure 132 and the Y-direction positioning structure 131 are both in the shape of strips and perpendicular to each other. When positioning the chipset, the chipset is first placed against the Y-direction positioning structure 131, and then pushed along the Y direction to the X-direction positioning structure 132 to complete the positioning of a single chipset. The positioning operation is simpler and more reliable than the original operation that relies on operating experience and naked eye observation.

[0051] Specifically, Figure 3 and Figure 4 As shown, in this embodiment, the positioning structure 13 is a sunken positioning groove, which includes an X-direction positioning side wall arranged along the X direction and having a depth less than the thickness of the chipset, and a Y-direction positioning side wall arranged along the Y direction and having a height less than the thickness of the chipset. In this embodiment, the positioning structure 13 is a sunken positioning groove, the depth of which is less than the thickness of the chipset, and after the chipset is placed in the positioning groove, the top of the chipset can protrude outward, so that after the film pressing mechanism 5 presses the film onto the positioning component, the film can be deformed at the chipset, so that the chipset can be fixed in the deformed film.

[0052] Specifically, in this embodiment, Figure 1 and Figure 2 As shown, the film unwinding assembly includes a film unwinding roller 42 and a film roll mounted on the film unwinding roller 42, and a support roller 43 for supporting the elastic film 41. The support roller 43 is horizontally arranged and has a height higher than the work surface 31. The work surface 31 is located on the film path of the film unwinding assembly, and the width of the film roll is greater than the width of the positioning assembly.

[0053] Specifically, in this embodiment, Figure 1 and Figure 2 As shown, the work surface 31 is provided with a mounting groove for mounting the positioning assembly, and a film pressing slide groove 32 located on both sides of the mounting groove and parallel to the direction of the film;

[0054] The film pressing mechanism 5 is slidably connected to the workbench body 3 via the film pressing slide groove 32. In this embodiment, the mounting groove is provided with a pick-and-place ear groove 34 for picking up and placing the positioning component. In this embodiment, the film pressing mechanism 5 is an existing mechanism and is not described in detail here.

[0055] Specifically, in this embodiment, Figure 1 and Figure 2 As shown, it also includes a turning frame 63 rotatably connected to the workbench body 3, and the turning axis of the turning frame 63 is arranged horizontally and perpendicular to the direction of the film;

[0056] The film cutting mechanism includes a film cutting mechanism arranged on the flip frame 63;

[0057] The film cutting mechanism includes a film cutting guide rod 622 and a film cutting blade head 621 disposed on the film cutting guide rod 622 and slidably connected thereto. The film cutting guide rod 622 is disposed perpendicular to the film direction. The work table 31 is provided with a film cutting chute 33 disposed parallel to the film cutting guide rod 622 and adapted to the film cutting blade head 621. By providing the film cutting mechanism, the film can be conveniently cut. In this embodiment, two film cutting guide rods 622 are provided to prevent the film cutting blade head 621 from turning over. When in use, the turning frame 63 is turned down, and the film cutting blade head 621 is slid so that the blade of the film cutting blade head 621 is located in the film cutting chute 33. The film cutting blade head 621 can be slid to cut the elastic film 41.

[0058] Specifically, in this embodiment, if Figure 1 and Figure 2 As shown, the film cutting mechanism also includes a film repairing mechanism rotatably connected to the flip frame 63, and the film repairing mechanism includes:

[0059] A rotating shaft 614 is provided through the turning frame 63, a circular cutting handle 613 and a circular cutting rotating rod 611 are respectively provided on both sides of the rotating shaft 614, and at least one circular cutting blade 612 is provided on the circular cutting rotating rod 611;

[0060] When the flip frame 63 is flipped down, the rotating shaft 614 is located directly above the center of the positioning assembly, and the distance between the circular cutting blade 612 and the rotating shaft 614 is greater than half the width of the positioning assembly. In this embodiment, the rotating shaft 614 is located in the middle of the rotating rod, and two circular cutting blades 612 are provided, located at both ends of the rotating rod. When in use, the flip frame 63 is flipped down, and the circular cutting handle 613 is rotated to trim the film and remove the excess waste. In this embodiment, the film trimming mechanism allows the excess film to be removed, making the tension frame neater after being taken out.

[0061] Embodiment 2:

[0062] like Figure 5 Hopewell Figure 6 As shown, based on the above-mentioned embodiment 1, in this embodiment, the positioning structure 13 is an upper convex positioning edge, and the upper convex positioning edge includes an X-direction positioning edge arranged along the X-direction and having a height less than the thickness of the chipset, and a Y-direction positioning edge arranged along the Y-direction and having a height less than the thickness of the chipset.

[0063] In this embodiment, by setting mutually perpendicular X-direction positioning bar edges and Y-direction positioning bar edges, the chipset can be positioned close to the Y-direction positioning bar edges and the X-direction positioning bar edges, and then the film pressing mechanism 5 is used to deform the film at the chipset, so that the chipset can be attached and fixed to the elastic film 41. After the tension frame is removed, Figure 5 shown.

[0064] The rest of the structure of this embodiment is the same as that of the above-mentioned embodiment 1 and will not be described again here.

[0065] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A batch positioning and fixing system for chip cutting, comprising a workbench having a worktable surface (31), characterized in that: It also includes a positioning assembly placed on a work surface (31) and used to position multiple chip groups, a film releasing assembly used to release an elastic film (41), a film pressing mechanism (5) used to tension and fix the elastic film (41) on the positioning assembly, and a film cutting mechanism used to cut the elastic film (41); The film placing assembly, the film pressing mechanism (5) and the film cutting mechanism are all arranged on the workbench body (3); The positioning component comprises a positioning structure (13) whose height is less than the thickness of the chipset.

2. A batch positioning and fixing system for chip cutting according to claim 1, characterized in that: The positioning assembly comprises a positioning base (1) and a film tensioning frame (2) both of which are placed on a work surface (31); The positioning base (1) is located in the film tensioning frame (2), and a plurality of positioning structures (13) are distributed on the top of the positioning base (1) in a rectangular array.

3. A batch positioning and fixing system for chip cutting according to claim 2, characterized in that: The positioning base (1) comprises a fixedly connected mounting base (11) and a positioning platform (12), and the positioning structures (13) are distributed on the top surface of the positioning platform (12); The shape of the outer peripheral wall of the mounting base plate (11) is adapted to the shape of the inner peripheral wall of the tensioning frame; When the tensioning frame and the positioning base (1) are placed on a work surface (31), the top height of the tensioning frame is located between the top surface of the mounting base (11) and the top surface of the positioning platform (12).

4. A batch positioning and fixing system for chip cutting according to claim 2, characterized in that: The positioning structure (13) comprises an X-direction positioning structure (132) and a Y-direction positioning structure (131) whose height is less than the thickness of the chipset; the X-direction positioning structure (132) and the Y-direction positioning structure (131) are both in the shape of strips and perpendicular to each other.

5. A batch positioning and fixing system for chip cutting according to claim 4, characterized in that: The positioning structure (13) is a sunken positioning groove, which comprises an X-direction positioning side wall arranged along the X direction and having a depth less than the thickness of the chipset, and a Y-direction positioning side wall arranged along the Y direction and having a height less than the thickness of the chipset.

6. A batch positioning and fixing system for chip cutting according to claim 4, characterized in that: The positioning structure (13) is an upward convex positioning sidewall, which includes an X-direction positioning sidewall arranged along the X direction and having a height less than the thickness of the chipset, and a Y-direction positioning sidewall arranged along the Y direction and having a height less than the thickness of the chipset.

7. The batch positioning and fixing system for chip cutting according to claim 1 is characterized in that: The film unwinding assembly comprises a film unwinding roller (42) and a film roll mounted on the film unwinding roller (42), and a support roller (43) for supporting the elastic film (41), wherein the support roller (43) is arranged horizontally and has a height higher than a work surface (31), and the work surface (31) is located on the film path of the film unwinding assembly, and the width of the film roll is greater than the width of the positioning assembly.

8. The batch positioning and fixing system for chip cutting according to claim 1, characterized in that: The work surface (31) is provided with an installation groove for installing the positioning component, and film pressing slide grooves (32) located on both sides of the installation groove and parallel to the direction of the film; The film pressing mechanism (5) is slidably connected to the workbench body (3) via a film pressing slide groove (32).

9. The batch positioning and fixing system for chip cutting according to claim 1, characterized in that: It also includes a turning frame (63) rotatably connected to the workbench body (3), wherein the turning axis of the turning frame (63) is arranged horizontally and perpendicular to the direction of the film; The film cutting mechanism comprises a film cutting mechanism arranged on the turning frame (63); The film cutting mechanism comprises a film cutting guide rod (622) and a film cutting knife head (621) arranged on the film cutting guide rod (622) and slidably connected thereto. The film cutting guide rod (622) is arranged perpendicular to the direction of the film. A film cutting slide groove (33) is arranged on the work surface (31) and is arranged parallel to the film cutting guide rod (622) and adapted to the film cutting knife head (621).

10. A batch positioning and fixing system for chip cutting according to claim 9, characterized in that: The film cutting mechanism also includes a film repairing mechanism rotatably connected to the turning frame (63), and the film repairing mechanism includes: A rotating shaft (614) penetrating the turning frame (63), a circular cutting handle (613) and a circular cutting rotating rod (611) respectively arranged on both sides of the rotating shaft (614), and at least one circular cutting blade (612) arranged on the circular cutting rotating rod (611); When the flip frame (63) is flipped down, the rotation axis (614) is located directly above the center of the positioning assembly, and the distance between the circular cutting head (612) and the rotation axis (614) is greater than half the width of the positioning assembly.

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