Nanoscale diamond semiconductor fine polishing device
By designing a nano-level diamond semiconductor fine casting device and using a fine casting mechanism and a motor control system, the problem of difficult to achieve high quality and high precision in diamond semiconductor processing in the existing technology is solved, and high quality and high precision fine casting is achieved, simplified Operation and reduce material damage.
Patent Information
- Application Number
- CN202421044562.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-14
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-05-14
AI Technical Summary
The prior art is difficult to achieve high-quality and high-precision fine casting during diamond semiconductor processing, and it is inconvenient to operate, which easily leads to material damage.
A nano-level diamond semiconductor fine casting device is designed, including support feet, polishing box, observation box door, console, fine casting mechanism, fine casting liquid pool, motor and telescopic device, and fine casting mechanism is controlled through the main control board and motor. Perform precise lifting and expansion, combining self-priming pumps and pipeline systems to achieve liquid recovery and effective use of semen throwing to avoid material damage.
It improves the quality and accuracy of diamond semiconductors, simplifies the operation process, reduces material damage, and achieves high-quality automated fine casting.
Smart Images
Figure CN222345169U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of precision polishing equipment, in particular to a nano-level diamond semiconductor precision polishing device. Background Art
[0002] Diamond semiconductors have outstanding properties that are superior to other semiconductor materials, so they are known as the "ultimate power semiconductors." Based on the industry's long-term research and development activities, diamond semiconductors have now begun to gradually move towards practical application. However, it will still take a long time to truly popularize and promote the application of diamond semiconductors. However, there have been reports that diamond semiconductor trial samples will appear within a few years at the earliest. The more attention the industry pays to diamond semiconductors, the easier it is to gather advantageous resources and accelerate the speed of research and development. In the process of processing diamond semiconductors, precision polishing equipment is needed to process diamond semiconductors.
[0003] Therefore, in order to solve the above problems, we propose a nano-scale diamond semiconductor precision polishing device. Utility Model Content
[0004] The purpose of the utility model is to overcome the shortcomings of the prior art and to provide a nanometer-level diamond semiconductor fine polishing device which is easy to use and operate and can effectively improve the quality and accuracy of diamond semiconductor fine polishing.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a nano-scale diamond semiconductor fine polishing device, which includes a supporting foot and a polishing box, the supporting foot is arranged at the lower end of the polishing box, and the front end of the polishing box is distributed on the left and right sides with an observation box door and a control console, a fine polishing mechanism is arranged on the inner side of the observation box door, and a fine polishing liquid pool is arranged at the lower end of the fine polishing mechanism, and a first pipe is connected to the bottom of the lower end of the fine polishing liquid pool, and the first pipe is connected to a fixed block arranged on one side of the polishing box, and a collecting bottle is threadedly fixed to the lower end of the fixed block.
[0006] Preferably, the console is connected to a main control panel arranged inside the polishing box, a first motor is arranged at the bottom of the polishing box at the lower end of one side of the main control panel, a lifting slot is arranged at the upper end of the first motor, lifting teeth are arranged on both sides of the lifting slot, the lifting gear gear is engaged with a gear part, a self-priming pump is arranged inside the fixed block, one end of the self-priming pump is connected to the first pipe and the other end is connected to the collecting bottle.
[0007] Preferably, a screw rod is connected to the upper end of the first motor, a lifting block is arranged on the screw rod, the lifting block and the screw rod are arranged in the middle of the inner side of the lifting slot, and the gear parts are arranged on both sides of the lifting block.
[0008] Preferably, a telescopic device is fixed on the outside of the gear part, and the telescopic device is connected to a fixed seat through a telescopic rod. A lifting cylinder is arranged in the middle of the upper end of the fixed seat, and fine polishing liquid tanks are arranged on the upper ends of the fixed seat on both sides of the lifting cylinder, and the lower ends of the fine polishing liquid tanks on both sides are connected to second pipes.
[0009] Preferably, a lifting column is provided in the middle of the lower end of the fixing seat, a water injection tray is fixed to the lower end of the lifting column, the lower end of the water injection tray corresponds to the fine polishing liquid pool, and a fixing plate is fixed between the lifting column and the second pipeline.
[0010] Preferably, a second motor is arranged in the middle of the inner upper end of the water filling tray, the lower end of the second motor is connected to the upper rotating table, a plurality of third motors are arranged at the lower end of the upper rotating table, a fine polishing tray is arranged at the lower end of the third motor, the lower end of the fine polishing tray is arranged corresponding to the fine polishing liquid pool, and a plurality of valves are arranged between the second pipe inside the water filling tray and the upper rotating table.
[0011] Preferably, a fourth motor is arranged at the bottom of the polishing box in the middle of the fine polishing liquid pool, a lower rotating table is arranged at the upper end of the fourth motor, and a suction cup corresponding to the fine polishing disc is arranged at the upper end of the lower rotating table.
[0012] Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model is advantageous for observing the operation and status of the nano-scale diamond semiconductor fine polishing equipment through the observation box door arranged on the surface of the polishing box, so that the abnormality can be discovered and handled in time, and at the same time, the observation box door is arranged inside the polishing box, so that the water filling tray and the suction cup are arranged at the lower end of the observation box door, and the diamond semiconductor to be finely polished is placed through the suction cup, and the fine polishing tray arranged at the lower end of the water filling tray corresponds to the suction cup, and the fine polishing tray is driven by the third motor to perform nano-scale fine polishing on the diamond semiconductor, and the turntable fine polishing structure is improved, which is conducive to improving the quality of the fine polishing of the diamond semiconductor, and the lifting column and the second pipeline are driven by the fixed seat to improve the accuracy of the fine polishing of the diamond semiconductor, and at the same time, it can also avoid and reduce the damage to the surface of the diamond semiconductor, and at the same time achieve the purpose of high-quality automated diamond semiconductor fine polishing. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the overall structure of a nano-scale diamond semiconductor precision polishing device of the utility model;
[0014] Figure 2 This is a schematic diagram of the internal structure of a nano-scale diamond semiconductor precision polishing device of the utility model;
[0015] Figure 3 yes Figure 2 The enlarged structural diagram at A in the middle;
[0016] Figure 4 yes Figure 2 The enlarged structural diagram at B in the middle;
[0017] Figure 5 The utility model is a schematic diagram of the structure of a precision polishing mechanism of a nano-scale diamond semiconductor precision polishing device.
[0018] Explanations in the figure: 1. Support feet; 2. Polishing box; 3. Collecting bottle; 4. Fixed block; 5. Fine polishing mechanism; 6. Control console; 7. Lifting gear; 8. Lifting slot; 9. Observation box door; 10. Main control panel; 11. Lifting block; 12. Screw; 13. Gear part; 14. Telescopic device; 15. Fine polishing liquid tank; 16. Lifting cylinder; 17. Fixed seat; 18. Self-priming pump; 19. First pipeline; 20. First motor; 21. Lifting column; 22. Second pipeline; 23. Fixed plate; 24. Second motor; 25. Water filling tray; 26. Valve; 27. Upper rotating table; 28. Third motor; 29. Fine polishing plate; 30. Fine polishing liquid pool; 31. Suction cup; 32. Lower rotating table; 33. Fourth motor. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Example
[0020] like Figure 1-2 As shown, the present embodiment discloses a nano-scale diamond semiconductor fine polishing device, which includes a supporting foot 1 and a polishing box 2, the supporting foot 1 is arranged at the lower end of the polishing box 2, and an observation box door 9 and a control console 6 are distributed on the left and right sides of the front end of the polishing box 2, a fine polishing mechanism 5 is arranged on the inner side of the observation box door 9, and a fine polishing liquid pool 30 is arranged at the lower end of the fine polishing mechanism 5, and a first pipe 19 is connected to the bottom of the lower end of the fine polishing liquid pool 30, and the first pipe 19 is connected to a fixed block 4 arranged on one side of the polishing box 2, and a collecting bottle 3 is fixed to the lower end of the fixed block 4 with a thread, and the control console 6 is connected to a main control board 10 arranged on the inner side of the polishing box 2, and a first motor 20 is arranged at the bottom of the polishing box 2 at the lower end of one side of the main control board 10, and a lifting groove 8 is arranged on the upper end of the first motor 20, and lifting teeth 7 are arranged on both sides of the lifting groove 8, and the lifting teeth 7 gears are engaged with gear parts 13, and a self-priming pump 18 is arranged inside the fixed block 4, and one end of the self-priming pump 18 is connected to the first pipe 19 and the other end is connected to the collecting bottle 3.
[0021] In this embodiment, the fine polishing mechanism 5 is controlled by the main control board 10 provided on the inner side of the polishing box 2, so that the height and rotation speed of the fine polishing mechanism 5 can be controlled, so that the quality and precision of the fine polishing of the diamond semiconductor can be effectively improved. At the same time, through the fine polishing liquid pool 30 provided at the lower end of the fine polishing mechanism 5, the first pipeline 19 is provided at the lower end of the fine polishing liquid pool 30, so that the first pipeline 19 is connected to the self-priming pump 18 provided on the inner side of the fixed block 4, which is conducive to recovering the fine polishing liquid and collecting it in the collecting bottle 3. At the same time, the fine polishing mechanism 5 inside the polishing box 2 can be cleaned so that it does not affect the secondary use. At the same time, the collecting bottle 3 is fixed to the lower end of the fixed block 4 by bolts, which is conducive to conveniently disassembling the collecting bottle 3, so that it is more convenient to replace and process the recovered fine polishing liquid. In addition, the control console 6 provided on the surface of the polishing box 2 is connected to the main control board 10 inside the polishing box 2, so that the operation status and state of the nano-scale diamond semiconductor fine polishing equipment can be observed in real time, and the operation and use of the nano-scale diamond semiconductor fine polishing equipment can be more convenient. Example
[0022] like Figure 1-5As shown, the present embodiment discloses a nano-scale diamond semiconductor fine polishing device, which includes a support foot 1 and a polishing box 2, the support foot 1 is arranged at the lower end of the polishing box 2, the front end of the polishing box 2 is provided with an observation box door 9 and a control console 6, the inner side of the observation box door 9 is provided with a fine polishing mechanism 5, the lower end of the fine polishing mechanism 5 is provided with a fine polishing liquid pool 30, the lower end of the fine polishing liquid pool 30 is connected to a first pipeline 19, the first pipeline 19 is connected to a fixed block 4 arranged on one side of the polishing box 2, the lower end of the fixed block 4 is threadedly fixed with a collecting bottle 3, and the control console 6 is connected to a fixed block 4 arranged on the polishing box 2, a main control board 10 is provided at the bottom of the polishing box 2 at the lower end of one side of the main control board 10, a lifting slot 8 is provided at the upper end of the first motor 20, lifting teeth 7 are provided on both sides of the lifting slot 8, and the lifting teeth 7 are engaged with a gear member 13, a self-priming pump 18 is provided inside the fixed block 4, one end of the self-priming pump 18 is connected to the first pipeline 19 and the other end is connected to the collecting bottle 3, a screw 12 is connected to the upper end of the first motor 20, a lifting block 11 is provided on the screw 12, the lifting block 11 and the screw 12 are both provided in the middle of the inner side of the lifting slot 8, and the gear member 13 is provided The telescopic device 14 is fixed on the outside of the gear member 13 on both sides of the lifting block 11, and the telescopic device 14 is connected to the fixed seat 17 through a telescopic rod. A lifting cylinder 16 is arranged in the middle of the upper end of the fixed seat 17, and a fine polishing liquid tank 15 is arranged on the upper end of the fixed seat 17 on both sides of the lifting cylinder 16. The lower ends of the fine polishing liquid tanks 15 on both sides are connected to the second pipeline 22, and a lifting column 21 is arranged in the middle of the lower end of the fixed seat 17. A water injection tray 25 is fixed at the lower end of the lifting column 21. The lower end of the water injection tray 25 corresponds to the fine polishing liquid pool 30, and a fixed column 21 is fixed between the lifting column 21 and the second pipeline 22. Plate 23, a second motor 24 is arranged in the middle of the upper inner end of the water injection tray 25, the lower end of the second motor 24 is connected to an upper rotating table 27, a plurality of third motors 28 are arranged at the lower end of the upper rotating table 27, and a fine polishing disk 29 is arranged at the lower end of the third motors 28, a plurality of valves 26 are arranged between the upper rotating table 27 and the second pipeline 22 inside the water injection tray 25, a fourth motor 33 is arranged at the bottom of the middle polishing box 2 inside the fine polishing liquid pool 30, a lower rotating table 32 is arranged on the upper end of the fourth motor 33, and a suction cup 31 corresponding to the fine polishing disk 29 is arranged on the upper end of the lower rotating table 32.
[0023] In this embodiment, the control console 6 provided at the front end of the polishing box 2 controls the fine polishing mechanism 5 and the motor provided thereto, controls the fine polishing mechanism 5 to lift up and down, left and right, and controls the fine polishing mechanism 5 to extend and retract through the telescopic device 14. By controlling the lifting cylinder 16 and combining the lifting column 21, the water injection plate 25 at the lower end of the fixed seat 17 is controlled to control the fit between the water injection plate 25 and the lower rotating table 32 inside the suction cup 31, so that it can cope with different nano-scale diamond semiconductor maintenance fine polishing treatments. At the same time, through the fine polishing liquid tank 15 provided at the upper end of the fixed seat 17, the second pipe 22 is provided at the lower end of the fine polishing liquid tank 15, and the valve 26 provided at the lower end of the second pipe 22 is provided to allow the liquid required for fine polishing to pass through during fine polishing, so as to improve the quality of fine polishing. Finally, the collecting bottle 3 connected to the lower end of the fine polishing liquid pool 30 through the first pipe 19 is used to collect the liquid after fine polishing, so as to facilitate the cleaning of the fine polishing liquid mixed slurry. At the same time, the device also has the advantages of simple structure, convenient use and operation, and effective improvement of the quality and accuracy of diamond semiconductor fine polishing.
[0024] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description. Therefore, it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the utility model, and any figure marks in the claims should not be regarded as limiting the claims involved.
[0025] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A nano-scale diamond semiconductor fine polishing device, comprising a support foot (1) and a polishing box (2), characterized in that: The supporting foot (1) is arranged at the lower end of the polishing box (2); an observation box door (9) and a control console (6) are arranged on the left and right sides of the front end of the polishing box (2); a fine polishing mechanism (5) is arranged inside the observation box door (9); a fine polishing liquid pool (30) is arranged at the lower end of the fine polishing mechanism (5); a first pipe (19) is connected to the bottom of the lower end of the fine polishing liquid pool (30); the first pipe (19) is connected to a fixed block (4) arranged on one side of the polishing box (2); a collecting bottle (3) is threadedly fixed to the lower end of the fixed block (4).
2. A nano-scale diamond semiconductor fine polishing device according to claim 1, characterized in that: The control console (6) is connected to a main control panel (10) arranged inside the polishing box (2); a first motor (20) is arranged at the bottom of the polishing box (2) at the lower end of one side of the main control panel (10); a lifting groove (8) is arranged at the upper end of the first motor (20); lifting teeth (7) are arranged on both sides of the lifting groove (8); the lifting teeth (7) on both sides are engaged with gear members (13) through gears; a self-priming pump (18) is arranged inside the fixed block (4); one end of the self-priming pump (18) is connected to the first pipe (19) and the other end is connected to the collecting bottle (3).
3. A nano-scale diamond semiconductor fine polishing device according to claim 2, characterized in that: The upper end of the first motor (20) is connected to a screw rod (12), a lifting block (11) is arranged on the screw rod (12), the lifting block (11) and the screw rod (12) are both arranged in the middle of the inner side of the lifting slot (8), and the gear member (13) is arranged on both sides of the lifting block (11).
4. The nano-scale diamond semiconductor fine polishing device according to claim 3, characterized in that: A telescopic device (14) is fixed to the outside of the gear member (13); the telescopic device (14) is connected to a fixed seat (17) via a telescopic rod; a lifting cylinder (16) is provided in the middle of the upper end of the fixed seat (17); polishing liquid tanks (15) are provided at the upper ends of the fixed seat (17) on both sides of the lifting cylinder (16); and the lower ends of the polishing liquid tanks (15) on both sides are connected to second pipes (22).
5. A nano-scale diamond semiconductor fine polishing device according to claim 4, characterized in that: A lifting column (21) is disposed in the middle of the lower end of the fixing seat (17), a water injection tray (25) is fixed to the lower end of the lifting column (21), the lower end of the water injection tray (25) corresponds to the fine polishing liquid pool (30), and a fixing plate (23) is fixed between the lifting column (21) and the second pipe (22).
6. The nano-scale diamond semiconductor fine polishing device according to claim 5, characterized in that: A second motor (24) is arranged in the middle of the upper inner end of the water injection tray (25); the lower end of the second motor (24) is connected to an upper rotating table (27); a plurality of third motors (28) are arranged at the lower end of the upper rotating table (27); a fine polishing tray (29) is arranged at the lower end of the third motor (28); the lower end of the fine polishing tray (29) is arranged corresponding to the fine polishing liquid pool (30); and a plurality of valves (26) are arranged between the second pipeline (22) inside the water injection tray (25) and the upper rotating table (27).
7. A nano-scale diamond semiconductor fine polishing device according to claim 6, characterized in that: A fourth motor (33) is arranged at the bottom of the polishing box (2) in the middle of the fine polishing liquid pool (30), a lower rotating platform (32) is arranged at the upper end of the fourth motor (33), and a suction cup (31) corresponding to the fine polishing disc (29) is arranged at the upper end of the lower rotating platform (32).