Flow guide device and deposition equipment
By designing a flow guide device in the deposition equipment and changing the airflow direction by using the tilt of the flow guide plate, the problem of easy damage to the silicon wafer substrate by positive airflow during chemical vapor deposition is solved, and the protection and deposition of the silicon wafer substrate is achieved. Improved reliability of the work.
Patent Information
- Application Number
- CN202421216422.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-05-30
AI Technical Summary
The silicon wafer substrate is easily damaged by positive gas flow during chemical vapor deposition, affecting the deposition operation.
A flow guide device is designed, including a deposition chamber, a carrier rack, a vacuum pump and a flow guide rack, and the air flow direction is changed through the tilt of the deflector plate to prevent the air flow from directly acting on the silicon wafer substrate.
It effectively reduces damage to the silicon wafer substrate by airflow, protects the silicon wafer substrate, and improves the reliability of deposition operations.
Smart Images
Figure CN222349125U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of battery preparation, and more specifically, to a flow guiding device and a deposition device using the flow guiding device. Background Art
[0002] When a silicon wafer substrate is subjected to chemical vapor deposition to form a deposited film, the silicon wafer substrate is usually placed on a carrier, and the carrier is placed in a deposition chamber. The reaction gas in the deposition chamber can react with the silicon wafer substrate to form a deposited film.
[0003] However, when the reaction gas flows in the deposition chamber, the gas flow will act positively on the silicon wafer substrate due to the way and spacing of the silicon wafer substrate placed on the carrier. The gas flow acting positively on the silicon wafer substrate has a large pressure and is easy to crush the silicon wafer substrate, causing damage to the silicon wafer substrate, thereby affecting the deposition operation of the silicon wafer substrate. Utility Model Content
[0004] The purpose of the embodiments of the present application is to provide a flow guiding device and a deposition device to solve the problem existing in the related art that the silicon wafer substrate placed on the carrier is easily broken and damaged by the positive airflow, thereby affecting the deposition operation.
[0005] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is:
[0006] In one aspect, a flow guiding device is provided, comprising:
[0007] A deposition chamber, one end of the deposition chamber being an air inlet end, and the other end of the deposition chamber being an air outlet end;
[0008] A carrier, installed in the deposition chamber, for carrying the object to be deposited;
[0009] A vacuum pump, installed at the gas outlet, for discharging the gas in the deposition chamber;
[0010] The guide frame is arranged between the carrier frame and the vacuum pump, and the guide frame comprises a guide bracket installed in the deposition chamber and a guide plate installed on the guide bracket, and the guide plate is inclined to the flow direction of the gas in the deposition chamber.
[0011] In one embodiment, the guide bracket includes two guide side plates arranged at intervals, a guide base connecting one end of the two guide side plates, and a guide top seat connecting the other end of the two guide side plates; the two ends of the guide plate are respectively installed on the two guide side plates.
[0012] In one embodiment, each of the guide side plates is provided with an installation inclined groove, and two ends of the guide plate extend into the two installation inclined grooves respectively.
[0013] In one embodiment, there are multiple guide plates, and the multiple guide plates are vertically installed on the guide bracket. The multiple guide plates are arranged in parallel and spaced apart, and the distance between two adjacent guide plates is the same.
[0014] In one embodiment, the height of the guide plate gradually decreases along the direction from the air inlet end to the air outlet end; or, the height of the guide plate gradually increases along the direction from the air inlet end to the air outlet end.
[0015] In one embodiment, the deposition chamber includes a deposition section, an exhaust section and a transition section connecting the deposition section and the exhaust section, the carrier and the guide frame are respectively installed in the deposition section, and the vacuum pump is installed on the exhaust section.
[0016] In one embodiment, a cross-sectional area of the transition section gradually decreases along a direction from the deposition section to the exhaust section.
[0017] In one embodiment, the exhaust section includes a first section and a second section connecting the transition section and the first section; the second section is arranged along the direction from the air inlet end to the air outlet end, and the first section is arranged inclined to the second section; the vacuum pump is installed on the first section.
[0018] In one embodiment, the flow guide device further comprises a switch valve installed on the deposition chamber, and the switch valve is arranged between the flow guide frame and the vacuum pump.
[0019] On the other hand, a deposition device is provided, comprising the guide device provided by any of the above embodiments.
[0020] The guide device and deposition equipment provided by the embodiments of the present application have at least the following beneficial effects: The present application can support the workpiece to be deposited through the carrier. The gas entering the deposition chamber from the air inlet end can be discharged from the air outlet end through a vacuum pump. The guide plate can be supported by a guide bracket. By tilting the guide plate to the flow direction of the gas in the deposition chamber, the gas flowing from the air inlet end to the air outlet end can be changed in flow direction by the guide plate, so that the direction of the airflow acting on the workpiece to be deposited can be changed, avoiding the airflow from directly acting on the workpiece to be deposited, reducing the damage of the airflow to the workpiece to be deposited, and realizing deposition protection of the workpiece to be deposited. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or exemplary technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 A schematic diagram of the structure of a flow guide device provided in an embodiment of the present application;
[0023] Figure 2 A side view of a flow guide frame provided in an embodiment of the present application;
[0024] Figure 3 for Figure 2 The main view;
[0025] Figure 4 A side view of another flow guide frame provided in an embodiment of the present application;
[0026] Figure 5 This is a front view of the loading rack provided in an embodiment of the present application.
[0027] Among them, the main marks of the drawings in the figure are:
[0028] 1. deposition chamber; 11. air inlet; 12. air outlet; 13. deposition section; 14. exhaust section; 141. first section; 142. second section; 15. transition section;
[0029] 2. Carrying rack; 21. Support side plate; 22. Support flat plate;
[0030] 3. Vacuum pump;
[0031] 4. guide frame; 41. guide bracket; 411. guide side plate; 4111. installation chute; 412. guide base; 413. guide top seat; 42. guide plate;
[0032] 5. Open and close the valve. DETAILED DESCRIPTION
[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.
[0036] In the description of the present application, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0037] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0038] Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, when the phrases "in one embodiment" or "in some embodiments" appear in various places throughout the specification, not all references are to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.
[0039] See also Figures 1 to 3, the flow guide device provided in the embodiment of the present application is now described. The flow guide device includes a deposition chamber 1, a carrier 2, a vacuum pump 3 and a flow guide frame 4. Optionally, one end of the deposition chamber 1 is an air inlet end 11, and the other end of the deposition chamber 1 is an air outlet end 12. The carrier 2 is installed in the deposition carrier, and the carrier 2 is used to carry the object to be deposited. Among them, the object to be deposited can be a silicon wafer base, which is not the only limitation here. The vacuum pump 3 is installed at the air outlet end 12, and the vacuum pump 3 is used to discharge the gas in the deposition chamber 1, that is, the gas entering from the air inlet end 11 is discharged from the air outlet end 12. The flow guide frame 4 is installed in the deposition chamber 1, and the flow guide frame 4 is arranged between the carrier 2 and the vacuum pump 3. The flow guide frame 4 includes a flow guide bracket 41 installed in the deposition chamber 1 and a flow guide plate 42 installed on the flow guide bracket 41, and the flow guide plate 42 is inclined to the flow direction of the gas in the deposition chamber 1. Among them, the flow direction of the gas in the deposition chamber 1 is Figure 1 In the direction indicated by the arrow. With this structure, the support for the workpiece to be deposited can be achieved through the carrier 2. The gas entering the deposition chamber 1 from the air inlet end 11 can be discharged from the air outlet end 12 through the vacuum pump 3. The guide plate 42 can be supported by the guide bracket 41. By tilting the guide plate 42 to the flow direction of the gas in the deposition chamber 1, the gas flowing from the air inlet end 11 to the air outlet end 12 can be changed by the guide plate 42. In this way, the direction of the airflow acting on the workpiece to be deposited can be changed, avoiding the airflow from directly acting on the workpiece to be deposited, reducing the damage of the airflow to the workpiece to be deposited, and realizing the deposition protection of the workpiece to be deposited.
[0040] In one embodiment, see Figure 3 As a specific implementation of the guide device provided in the embodiment of the present application, the guide bracket 41 includes two guide side plates 411, a guide base 412 and a guide top seat 413. Optionally, the two guide side plates 411 are arranged in parallel and spaced apart; the guide base 412 is arranged at the bottom, and the guide base 412 connects the bottom ends of the two guide side plates 411; the guide top seat 413 is arranged at the top, and the guide top seat 413 connects the top ends of the two guide side plates 411; the two ends of the guide plate 42 are respectively installed on the two guide side plates 411. This structure can improve the stability of the guide bracket 41 through the two guide side plates 411, the guide base 412 and the guide top seat 413, thereby improving the installation stability of the guide plate 42 and avoiding position displacement under the action of airflow.
[0041] Optionally, the guide base 412 and each guide side plate 411 , as well as the guide top seat 413 and each guide side plate 411 , can be detachably connected by fasteners such as screws and bolts, thereby facilitating the disassembly and assembly of the guide bracket 41 .
[0042] In one embodiment, see Figure 2As a specific implementation of the guide device provided in the embodiment of the present application, each guide side plate 411 is provided with an installation inclined groove 4111, and the two ends of the guide plate 42 are respectively extended into the two installation inclined grooves 4111. This structure can realize the rapid disassembly and assembly of the guide plate 42 through the installation inclined grooves 4111, so as to realize the detachable connection between the guide plate 42 and the guide bracket 41.
[0043] In one embodiment, see Figure 2 As a specific implementation of the guide device provided in the embodiment of the present application, there are multiple guide plates 42, and multiple guide plates 42 are vertically installed on the guide bracket 41. Multiple guide plates 42 are arranged in parallel and spaced apart, and the distance between two adjacent guide plates 42 is the same. Specifically, each guide side plate 411 is provided with multiple installation bevels 4111 in the vertical direction, and multiple installation bevels 4111 are arranged in parallel and spaced apart, and the distance between two adjacent installation bevels 4111 is the same. In this structure, the reliability of changing the direction of the airflow can be improved by using multiple guide plates 42 arranged in parallel and spaced apart, and the airflow acting positively on the object to be deposited can be further reduced to achieve protection of the object to be deposited.
[0044] In one embodiment, see Figure 2 and Figure 4 As a specific implementation of the guide device provided in the embodiment of the present application, the height of the guide plate 42 gradually decreases from the air inlet end 11 to the air outlet end 12; or, the height of the guide plate 42 gradually increases from the air inlet end 11 to the air outlet end 12. Specifically, the guide plate 42 is tilted downward toward the guide base 412; or, the guide plate 42 is tilted upward toward the guide top seat 413. In this structure, by tilting the guide plate 42 upward or downward, the airflow direction in the deposition chamber 1 can be changed to prevent the airflow from acting positively on the object to be deposited, thereby protecting the object to be deposited.
[0045] In one embodiment, see Figure 5 The carrier 2 includes two supporting side plates 21 arranged opposite to each other and a supporting flat plate 22 connecting the two supporting side plates 21. The number of the supporting flat plates 22 can be multiple, and the multiple supporting flat plates 22 are arranged in parallel and spaced apart, and the distance between two adjacent supporting flat plates 22 is the same. Specifically, the supporting flat plate 22 can be located in a horizontal plane; the supporting flat plate 22 is arranged obliquely to the guide plate 42. In this structure, the support flat plate 22 can support the deposited object. Among them, the supporting flat plate 22 and each supporting side plate 21 can be detachably connected by fasteners such as screws and bolts, so that the carrier 2 can be disassembled and assembled.
[0046] Optionally, there may be multiple carriers 2, which are spaced apart in the deposition chamber 1. The multiple support plates 22 on the multiple carriers 2 are arranged in a counterposition manner, so that the multiple support plates 22 are prevented from blocking each other and affecting the deposition effect.
[0047] In one embodiment, see Figure 1 As a specific implementation of the flow guide device provided in the embodiment of the present application, the deposition chamber 1 includes a deposition section 13, an exhaust section 14, and a transition section 15 connecting the deposition section 13 and the exhaust section 14. The carrier 2 and the flow guide frame 4 are respectively installed in the deposition section 13, and the vacuum pump 3 is installed on the exhaust section 14. Specifically, the cross-sectional area of the deposition section 13 is larger than the cross-sectional area of the exhaust section 14. The deposition section 13 with a larger volume can increase the deposition space to improve the deposition effect. With this structure, the deposition operation of the object to be deposited can be performed through the deposition section 13; and the exhaust operation can be performed through the exhaust section 14.
[0048] In one embodiment, see Figure 1 As a specific implementation of the flow guide device provided in the embodiment of the present application, the cross-sectional area of the transition section 15 gradually decreases along the direction from the deposition section 13 to the exhaust section 14. Specifically, the cross-sectional area of the end of the transition section 15 close to the deposition section 13 is the largest, and the cross-sectional area of the end of the transition section 15 close to the exhaust section 14 is the smallest. With this structure, the exhaust rate can be increased through the transition section 15, which helps to improve the deposition efficiency.
[0049] In one embodiment, see Figure 1 As a specific implementation of the flow guide device provided in the embodiment of the present application, the exhaust section 14 includes a first section 141 and a second section 142 connecting the transition section 15 and the first section 141; the second section 142 is arranged along the direction from the air inlet end 11 to the air outlet end 12, and the first section 141 is arranged obliquely to the second section 142; the vacuum pump 3 is installed on the first section 141. Specifically, the first section 141 is arranged perpendicular to the second section 142. In this structure, the airflow direction can be changed by obliquely arranging the first section 141 to the second section 142, and the effect of changing the airflow direction can be further improved by cooperating with the flow guide frame 4.
[0050] In one embodiment, see Figure 1As a specific implementation of the flow guide device provided in the embodiment of the present application, the flow guide device also includes a switch valve 5 installed on the deposition chamber 1, and the switch valve 5 is arranged between the flow guide frame 4 and the vacuum pump 3. Specifically, the switch valve 5 can be arranged on the first section 141. In this structure, the conduction and disconnection between the deposition chamber 1 and the vacuum pump 3 can be controlled by the switch valve 5. When the switch valve 5 is closed, the deposition chamber 1 is in a closed state, so that the deposition operation of the deposited part can be realized; when the switch valve 5 is opened, the deposition chamber 1 is connected to the vacuum pump 3, and under the action of the vacuum pump 3, the gas in the deposition chamber 1 can be discharged.
[0051] The present application also provides a deposition device, including the flow guide device provided in any of the above embodiments. With this structure, the deposition device using the flow guide device can change the flow direction of the gas, avoid the gas flow directly acting on the part to be deposited, reduce the damage of the gas flow to the part to be deposited, and achieve deposition protection for the part to be deposited.
[0052] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A flow guide device, characterized in that: include: A deposition chamber, one end of the deposition chamber being an air inlet end, and the other end of the deposition chamber being an air outlet end; A carrier, installed in the deposition chamber, for carrying the object to be deposited; A vacuum pump, installed at the gas outlet, for discharging the gas in the deposition chamber; The guide frame is arranged between the carrier frame and the vacuum pump, and the guide frame comprises a guide bracket installed in the deposition chamber and a guide plate installed on the guide bracket, and the guide plate is inclined to the flow direction of the gas in the deposition chamber.
2. The flow guiding device according to claim 1, characterized in that: The guide bracket includes two guide side plates arranged at intervals, a guide base connecting one end of the two guide side plates, and a guide top seat connecting the other end of the two guide side plates; the two ends of the guide plate are respectively installed on the two guide side plates.
3. The flow guiding device according to claim 2, characterized in that: Each of the guide side plates is provided with an installation inclined groove, and the two ends of the guide plate extend into the two installation inclined grooves respectively.
4. The flow guiding device according to claim 1, characterized in that: There are multiple guide plates, and the multiple guide plates are vertically installed on the guide bracket. The multiple guide plates are arranged in parallel and spaced apart, and the distance between two adjacent guide plates is the same.
5. The flow guiding device according to claim 1, characterized in that: The height of the guide plate gradually decreases along the direction from the air inlet end to the air outlet end; or, the height of the guide plate gradually increases along the direction from the air inlet end to the air outlet end.
6. The flow guiding device according to claim 1, characterized in that: The deposition chamber comprises a deposition section, an exhaust section and a transition section connecting the deposition section and the exhaust section. The carrier and the guide frame are respectively installed in the deposition section, and the vacuum pump is installed on the exhaust section.
7. The flow guiding device according to claim 6, characterized in that: The cross-sectional area of the transition section gradually decreases along the direction from the deposition section to the exhaust section.
8. The flow guiding device according to claim 6, characterized in that: The exhaust section includes a first section and a second section connecting the transition section and the first section; The second section is arranged along the direction from the air inlet end to the air outlet end, and the first section is arranged obliquely to the second section; and the vacuum pump is installed on the first section.
9. The flow guiding device according to any one of claims 1 to 8, characterized in that: The flow guide device further comprises a switch valve installed on the deposition chamber, and the switch valve is arranged between the flow guide frame and the vacuum pump.
10. A deposition device, characterized in that: It comprises a flow guiding device as described in any one of claims 1 to 9.