Inductor assembly arrangement structure, angular displacement measuring device and linear displacement measuring device

Abstract

The utility model discloses an inductance assembly arrangement structure, an angular displacement measuring device and a linear displacement measuring device, which comprise a main coil and mutual inductance coils, at least two mutual inductance coils are arranged in the projection contour range of the main coil, each mutual inductance coil is an inductance element with a surface mount type winding structure, and the linear displacement measuring device is arranged in the main coil. And the winding axial direction of each mutual inductance coil is parallel to the winding axial direction of the main coil. The beneficial effects of the utility model are that the mutual inductance coil employs a surface-mounted winding structure element, not only has the advantages of low cost and stable parameters, but also the inductance element of the surface-mounted winding structure is small in size and beneficial to overall arrangement, so that the mutual inductance coil and the main coil can be arranged in a manner that the winding axial direction is parallel. Due to the fact that the coils are parallel in the axial direction, the mutual inductance coils can be assembled in sequence in the axial direction and do not need to avoid the main coil, and the production and assembly process is greatly simplified.

Description

Technical Field

[0001] The utility model relates to the technical field of encoders, in particular to an inductance component arrangement structure. Background Art

[0002] An encoder is a device that converts angular displacement or linear displacement into an electrical signal. Based on the working principle, encoders can be divided into photoelectric, inductive or mutual inductive, and contact brush types. Among them, inductive or mutual inductive encoders are widely used in various complex environments that other encoders cannot be used for due to their simple structure, strong anti-interference, and fast response speed. Inductive or mutual inductive encoders are also a technology that has received attention in recent years, especially for the optimization of coils. PCB direct printing coils and micro-machined coils have emerged as the representative development direction. Among them, the main disadvantage of PCB direct printing coils is that the volume is relatively large. Since there must be a certain gap between its lines, the coil inductance value formed is relatively low under the same area and thickness. The micro coil adopts the hollow winding method and precision micro-machining technology, but its processing difficulty determines its high cost.

[0003] Inductive or mutual inductive encoders are mainly based on coil mutual inductive technology for angle or position detection. In terms of physical structure, they are composed of a main coil, a mutual inductive coil, and a movable target grid. The mutual inductive coil is staggered in the main coil, and the target grid does not contact the coil. The target grid moves relative to the main coil and the mutual inductive coil, which can interfere with the magnetic lines of force between the main coil and the mutual inductive coil, thereby achieving the purpose of sensing measurement.

[0004] In the prior art, the main coil and mutual inductance coil of the inductance or mutual inductance encoder are more commonly set on the PCB board using the PCB printing process. The winding axis of the coil is parallel to the circuit board. On the one hand, special attention should be paid to the positional relationship between the coils during the assembly layout process, and the coil printing process is relatively complicated. On the other hand, due to the complex process and the need for extremely strict position control, the main magnetic field induction line area is easily blocked by the solder on the circuit board, resulting in technical defects such as low coil inductance and high operating frequency.

[0005] Therefore, it is urgent to redevelop and design an inductor arrangement scheme with low cost, good consistency, small size and a wide range of coil inductance selection. Utility Model Content

[0006] One of the purposes of the present invention is to provide an inductor component arrangement structure, aiming to meet the technical requirements proposed by the background technology.

[0007] To achieve the above purpose, the technical solution of the utility model is as follows:

[0008] An inductor component arrangement structure includes a main coil, the key of which is that at least two mutual inductance coils are arranged within the projection contour range of the main coil, each of the mutual inductance coils is an inductance element of a patch winding structure, and the winding axis of each of the mutual inductance coils is parallel to the winding axis of the main coil.

[0009] Preferably, it further comprises a substrate, the main coil is printed on the substrate, the substrate is provided with a mounting through hole penetrating the substrate in the thickness direction, and the mutual inductance coil is welded in the mounting through hole.

[0010] Preferably, the substrate is formed by a multi-layer PCB board or two layers of PCB boards stacked together, and the soldering area connected to the mutual inductance coil is located at the upper and lower ends of the hole wall of the mounting through hole.

[0011] Preferably, the main coil and the mutual inductance coil are arranged opposite to each other, and a gap channel is formed therebetween, and the gap channel is used to install a target grid element that can move relative to the main coil and the mutual inductance coil.

[0012] Preferably, the mutual inductance coil is welded on the substrate, and the main coil is arranged opposite to the mutual inductance coil via a transition bracket.

[0013] The second object of the utility model is to provide an angular displacement inductive measuring device, including a target code disk, characterized in that: the measuring device is provided with the inductance component arrangement structure, and a circular array of conductive metal grids are distributed on the target code disk. The target code disk can move in the measuring device in a rotating manner so that each conductive metal grid can pass through the inductance component arrangement structure.

[0014] Preferably, the circular array on the target code disk is distributed by two circles of conductive metal grids, and the number of the two circles of conductive metal grids is different.

[0015] Preferably, in the two circles of the conductive metal grids, the number of the conductive metal grids in the outer circle is one more than the number of the conductive metal grids in the inner circle.

[0016] Preferably, the angular displacement inductive measuring device is provided with at least two groups of the above-mentioned inductive component arrangement structures.

[0017] The third object of the utility model is to provide a linear displacement sensing measuring device, including a linear scale, characterized in that: the measuring device is provided with the inductance component arrangement structure, and the linear scale is distributed with conductive metal grids, and the linear scale can move in the measuring device in a linear sliding manner so that each conductive metal grid can pass through the inductance component arrangement structure.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] 1. The inductor assembly arrangement structure provided by the utility model is adopted, and the mutual inductance coil adopts a patch winding structure element, which not only has the advantages of low cost and stable parameters, but also the inductance element of the patch winding structure is small in size, which is conducive to overall arrangement, so that the mutual inductance coil and the main coil can be arranged in a manner in which the winding axis is parallel. Since the axes of the coils are parallel, the mutual inductance coils can be assembled in sequence in the axial direction without avoiding the main coil, which greatly simplifies the production and assembly process.

[0020] 2. The layout of the main and secondary coils with parallel winding axes can ensure that there is no solder obstruction in the main magnetic field induction line area, which helps the inductor achieve excellent mutual inductance effect.

[0021] 3. The main coil and the mutual inductance coil provide a face-to-face layout. When the target grid passes through the gap between the two, the coil inductance value can be significantly improved and the induction working frequency can be optimized, which has obvious advantages in terms of manufacturing process simplicity and comprehensive application cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the arrangement structure of the inductor assembly (the main coil and the mutual inductance coil are located on the same side);

[0023] Figure 2 The schematic diagram of the installation of the inductor assembly arrangement structure in the substrate (the main coil and the mutual inductance coil are located on the same side);

[0024] Figure 3 For attachment Figure 2 An example of optimization of the schematic structure of the installation;

[0025] Figure 4 Another schematic diagram of the arrangement of the inductor assembly (the main coil and the mutual inductance coil are located on the same side);

[0026] Figure 5 This is a schematic diagram of the inductor assembly layout (the main coil and the mutual inductance coil are arranged opposite each other);

[0027] Figure 6 Another schematic diagram of the arrangement of the main coil and the mutual inductance coil facing each other in the inductor assembly arrangement structure;

[0028] Figure 7 It is a structural schematic diagram of the angular displacement inductive measuring device in the second embodiment;

[0029] Figure 8 is a schematic diagram of the target code disk 4 in the second embodiment;

[0030] Fig. 9 Schematic diagram of the structure of the linear displacement sensing measuring device in Example 3. DETAILED DESCRIPTION

[0031] The utility model is further described below in conjunction with embodiments and drawings.

[0032] Embodiment 1

[0033] like Figure 1 As shown, an inductor component arrangement structure includes a substrate 3, a main coil 1 and at least two mutual inductance coils 2, wherein the main coil 1 is a flat and relatively large spiral coil, the projection contour of the main coil is larger than the mutual inductance coil 2, each mutual inductance coil 2 is located within the projection contour range of the main coil 1, each mutual inductance coil 2 is an inductance element of a patch winding structure, and the winding axis of each mutual inductance coil 2 is parallel to the winding axis of the main coil 1. In this embodiment, the mutual inductance coil patch winding structure element has the advantages of being cheap, having stable parameters, and being small in size, which is conducive to overall arrangement and achieving excellent mutual inductance effect. At the same time, because the winding center lines of the main and secondary coils are parallel, they can be assembled in sequence without having to avoid the main coil 1, which is conducive to assembly and simplifies the manufacturing process.

[0034] Based on the above inductor component arrangement structure, a better specific setting method is as follows:

[0035] Please refer to the attached Figure 2 and attached Figure 3 The substrate 3 is a multi-layer PCB or a 2-layer PCB stacked together. The main coil 1 is printed in the PCB. The substrate 3 is provided with mounting through holes b that run through the thickness direction thereof. The number of mounting through holes b is consistent with that of the mutual inductance coil 2. The mutual inductance coil 2 is electrically connected and fixed using the soldering area c. Based on this, it can be achieved that there is no solder obstruction in the main magnetic field induction line area, which helps to achieve an excellent mutual inductance effect. Furthermore, the soldering area c connecting the mutual inductance coil 2 is located at the upper and lower ends of the hole wall of the mounting through hole b.

[0036] In addition, the inductor assembly layout structure can also be arranged by welding or adding a mounting plate, as follows:

[0037] Please refer to the attached Figure 4 The main coil 1 is additionally fixed on the substrate 3 and is manufactured in a hollow winding manner. The mutual inductance coil 2 is soldered to a mounting board d using a normal surface mount method (SMT), and then the mounting board d is fixed to the substrate 3 by welding or other methods, and finally the same arrangement is formed. In this scheme, the main coil can also be printed on the substrate PCB, or it can be arranged in a directly opposite direction.

[0038] Embodiment 2

[0039] like Figure 7As shown, an angular displacement inductive measuring device includes a target code disk 4, a main coil 1 and two mutual inductance coils 2. Conductive metal grids 5 are distributed in a circular array on the target code disk 4. The target code disk 4 moves in the measuring device in a rotating manner. During the rotation of the target code disk 4, each conductive metal grid 5 can pass through the induction area formed by the main coil 1 and the mutual inductance coil 2 one by one. In this embodiment, the main coil 1 and the two mutual inductance coils 2 adopt a facing arrangement structure, and a gap channel a is formed between the main coil 1 and the mutual inductance coil 2. The target code disk 4 moves in the gap channel a. Please refer to the attached Figure 5 As shown, the main coil 1 and the mutual inductance coil 2 are arranged opposite to each other. Compared with the same-side layout adopted by the main coil and the mutual inductance coil, when the target code disk 4 passes through the gap between the two, the coil inductance value is more obvious, which can improve the induction working frequency. The angular displacement induction measuring device (i.e., the angular displacement induction encoder) has the advantages of simple manufacturing and low comprehensive application cost.

[0040] like Figure 6 As shown, the main coil 1 and the mutual inductance coil 2 are installed through the PCB substrate 3, wherein the mutual inductance coil 2 is directly welded on the substrate 3, and the main coil 1 is arranged opposite to the mutual inductance coil 2 through the transition bracket 3a. In this embodiment, one or all of the main coil 1 and the mutual inductance coil 2 adopts a chip inductor element, which has the advantages of small size, wide range of optional parameters, high consistency and low cost. The chip inductor element constituting the mutual inductance coil 2 is welded in the PCB substrate in a vertical layout, and its winding direction is parallel to the main coil.

[0041] For example Figure 6 As shown, the two mutual inductance coils 2 are staggered within the orthographic projection range of the main coil 1. The staggered layout is conducive to forming a phase difference induction curve, and more accurate angle data can be obtained through calculation. Furthermore, in order to facilitate phase detection and accurately determine the induction point, the winding directions of the two mutual inductance coils 2 are opposite.

[0042] In this embodiment, please refer to Figure 8 The circular array on the target code disk 4 is distributed by two circles of conductive metal grids, and the number of the two circles of conductive metal grids is different. Preferably, the number of conductive metal grids located in the outer circle is one more than the number of conductive metal grids in the inner circle. The use of such a conductive metal grid layout can help form a vernier measurement structure, which is similar to the principle of a vernier ruler, and can increase the range by calculation, thereby covering the absolute angle measurement of the entire stroke.

[0043] Furthermore, in the angular displacement inductive measuring device, multiple sets of inductive component arrangement structures formed by the above main coil 1 and the mutual inductive coil 2 can be set. In other words, multiple sensing points can be set in the measuring device as redundancy or sampling reference points. In specific implementation, each sensing point has at least one secondary coil, and each sensing point can share a main coil or independently set the main coil.

[0044] Embodiment 3

[0045] like Fig. 9 As shown, a linear displacement inductive measuring device includes a linear scale 6, a main coil 1 and two mutual inductive coils 2. Conductive metal grids 5 are distributed in an array on the linear scale 6, and the linear scale 6 can move in the measuring device in a linear sliding manner. During the linear sliding process of the linear scale 6, each conductive metal grid 5 thereon can pass through the inductive area formed by the main coil 1 and the mutual inductive coil 2 one by one. In this embodiment, the main coil 1 and the mutual inductive coil 2 adopt a facing arrangement structure, and a gap channel a is formed between the main coil 1 and the mutual inductive coil 2, and the linear scale 6 is located in the gap channel a. Since the main coil 1 and the mutual inductive coil 2 are arranged facing each other, when the linear scale 6 passes through the gap between the two, the coil inductance value is more obvious, which can improve the inductive working frequency. The linear position inductive measuring device (i.e., the linear position inductive encoder) has the advantages of simple manufacturing and low comprehensive application cost.

[0046] Finally, it should be noted that the above description is only a preferred embodiment of the present invention. Under the guidance of the present invention, ordinary technicians in this field can make a variety of similar expressions without violating the purpose and claims of the present invention, and such changes fall within the scope of protection of the present invention.

Claims

1. An inductor assembly arrangement structure, comprising a main coil (1), characterized in that: At least two mutual inductance coils (2) are arranged within the projection contour range of the main coil (1), each of the mutual inductance coils (2) is an inductance element of a patch winding structure, and the winding axis of each of the mutual inductance coils (2) is parallel to the winding axis of the main coil (1).

2. The inductor assembly arrangement structure according to claim 1, characterized in that: It also comprises a substrate (3), the main coil (1) is printed on the substrate (3), the substrate (3) is provided with a mounting through hole (b) penetrating in the thickness direction thereof, and the mutual inductance coil (2) is welded in the mounting through hole (b).

3. The inductor assembly arrangement structure according to claim 2, characterized in that: The substrate (3) is formed by a multi-layer PCB board or two layers of PCB boards stacked together; the soldering area connected to the mutual inductance coil (2) is located at the upper and lower ends of the hole wall of the installation through hole (b); and the main coil (1) is a flat spiral coil.

4. The inductor assembly arrangement structure according to claim 1, characterized in that: The main coil (1) and the mutual inductance coil (2) are arranged opposite to each other, and a gap channel (a) is formed between the two. The gap channel (a) is used to install a target grid element that can move relative to the main coil (1) and the mutual inductance coil (2).

5. The inductor assembly arrangement structure according to claim 4, characterized in that: It also comprises a base plate (3), the mutual inductance coil (2) is welded on the base plate (3), and the main coil (1) is arranged opposite to the mutual inductance coil (2) via a transition bracket (3a).

6. An angular displacement inductive measuring device, comprising a target code disc (4), characterized in that: The measuring device is provided with the inductor component arrangement structure as claimed in claim 1, and the target code disk (4) is provided with conductive metal grids (5) distributed in a circular array, and the target code disk (4) can be moved in the measuring device in a rotational manner so that each conductive metal grid (5) can pass through the inductor component arrangement structure.

7. The angular displacement induction measuring device according to claim 6, characterized in that: The circular array on the target code disk (4) is distributed by two circles of conductive metal grids, and the number of the two circles of conductive metal grids is different.

8. The angular displacement sensing measuring device according to claim 7, characterized in that: In the two circles of the conductive metal grids, the number of the conductive metal grids in the outer circle is one more than the number of the conductive metal grids in the inner circle.

9. The angular displacement sensing measuring device according to claim 6, characterized in that: The measuring device is provided with at least two inductive component arrangements according to claim 1 .

10. A linear displacement sensing measuring device, comprising a linear scale (6), characterized in that: The measuring device is provided with the inductor component arrangement structure as claimed in claim 1, and the linear scale (6) is distributed with conductive metal grids, and the linear scale (6) can move in the measuring device in a linear sliding manner so that each conductive metal grid can pass through the inductor component arrangement structure.

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