Heat dissipation light bar, backlight source and liquid crystal module

Abstract

The utility model discloses a heat dissipation light bar which comprises a circuit board, a heat conduction adhesive tape and a plurality of light-emitting devices, the circuit board is provided with a first surface and a second surface which are opposite to each other, the light-emitting devices are arranged on the first surface of the circuit board, and the heat conduction adhesive tape is arranged on the second surface of the circuit board; at least one exhaust groove is formed in the heat-conducting rubber strip, and the exhaust groove penetrates through the thickness direction of the heat-conducting rubber strip. The heat dissipation lamp strip can extrude and discharge bubbles generated when the heat conduction rubber strip is attached to the circuit board, so that the heat dissipation efficiency is guaranteed. The utility model further discloses a backlight source and a liquid crystal module. The backlight source comprises the heat dissipation light bar.

Description

Technical Field

[0001] The utility model relates to liquid crystal display technology, in particular to a heat dissipation light bar, a backlight source and a liquid crystal module. Background Art

[0002] The backlight is an important component of the liquid crystal module, used to provide display light for the liquid crystal panel. The light bar is the light source in the backlight, and it is also the main heat source in the backlight. As the size of the liquid crystal module becomes larger, the size of the backlight is also getting larger, and the power of the light bar in the backlight is also getting higher, and the heat dissipation requirements for the backlight are also getting higher.

[0003] In order to meet the heat dissipation requirements, existing backlight sources generally use a metal frame as a supporting structure, and then the light bar is glued and fixed to the metal frame through a thermal conductive adhesive strip. The thermal conductive adhesive strip is used to transfer the heat generated by the light bar to the metal frame, and then the good heat dissipation capacity of the metal frame is used to radiate the heat into the environment.

[0004] However, the heat-conductive adhesive strip is prone to generate bubbles when it is attached to the light bar. The presence of the bubbles increases the thermal resistance between the light bar and the metal frame, thereby reducing the heat transfer efficiency. Utility Model Content

[0005] In order to solve the above-mentioned deficiencies of the prior art, the utility model provides a heat dissipation light strip, which can squeeze out bubbles generated when the thermal conductive adhesive strip is attached to the circuit board to ensure heat dissipation efficiency.

[0006] The utility model also provides a backlight source and a liquid crystal module, including a heat dissipation light bar.

[0007] The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0008] A heat dissipation light strip comprises a circuit board, a thermally conductive adhesive strip and a plurality of light-emitting devices, wherein the circuit board has a first surface and a second surface opposite to each other, the plurality of light-emitting devices are arranged on the first surface of the circuit board, and the thermally conductive adhesive strip is arranged on the second surface of the circuit board; at least one exhaust groove is provided on the thermally conductive adhesive strip, and the exhaust groove runs through the thickness direction of the thermally conductive adhesive strip.

[0009] Furthermore, there are multiple exhaust grooves, which are divided into several groups, and one group of exhaust grooves corresponds to one light-emitting device.

[0010] Further, each group of exhaust grooves includes a first exhaust groove and a second exhaust groove, and the first exhaust groove and the second exhaust groove are respectively located on two sides of the corresponding light emitting device.

[0011] Furthermore, the first exhaust groove and the second exhaust groove are respectively located on two sides of the corresponding light emitting device along the length direction of the thermal conductive adhesive strip.

[0012] Furthermore, the first exhaust groove and the second exhaust groove are respectively located on two sides of the corresponding light emitting device along the width direction of the thermal conductive adhesive strip.

[0013] Furthermore, the exhaust groove extends along the width direction of the thermally conductive adhesive strip.

[0014] Furthermore, the light emitting device is an LED lamp.

[0015] A backlight source comprises a metal frame, a light guide plate and the above-mentioned heat dissipation light strip, wherein the light guide plate and the heat dissipation light strip are arranged in the metal frame, and the heat dissipation light strip is located outside a side surface of the light guide plate and is bonded and fixed to the metal frame by the thermal conductive adhesive strip.

[0016] Furthermore, the metal frame includes a metal side plate and a metal back plate, the metal side plate is located on the periphery of the metal back plate and is vertically connected to the metal back plate; the heat dissipation light strip is bonded and fixed to the metal side plate of the metal frame by the thermal conductive adhesive strip.

[0017] A liquid crystal module comprises a liquid crystal panel and the above-mentioned backlight source, wherein the liquid crystal panel is arranged on the light emitting surface of the backlight source.

[0018] The utility model has the following beneficial effects: the heat dissipation light strip of the utility model has the exhaust groove on the thermally conductive adhesive strip. If bubbles are generated when the thermally conductive adhesive strip is attached to the circuit board, the technician can squeeze the thermally conductive adhesive strip to move the bubbles, and finally squeeze and move the bubbles to the exhaust groove for release, thereby avoiding the generation of bubbles when the thermally conductive adhesive strip is attached, so as to ensure a low thermal resistance between the thermally conductive adhesive strip and the circuit board, and further ensure that the heat generated by the light-emitting device can be quickly transferred outward through the thermally conductive adhesive strip to ensure heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic structural diagram of the first surface of the heat dissipation light strip provided by the utility model.

[0020] Figure 2 This is a schematic structural diagram of the second surface of the heat dissipation light strip provided by the utility model.

[0021] Figure 3 for Figure 1 The schematic structural diagram of the AA section of the heat dissipation light bar is shown.

[0022] Figure 4This is a schematic diagram of the stacking structure of the backlight source provided by the utility model.

[0023] Figure 5 This is a schematic diagram of the stacking structure of the liquid crystal module provided by the utility model. DETAILED DESCRIPTION

[0024] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0025] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Embodiment 1

[0028] like Figure 1-3As shown, a heat dissipation light strip includes a circuit board 11, a thermally conductive adhesive strip 13 and a plurality of light-emitting devices 12, wherein the circuit board 11 has a first surface 110 and a second surface 111 opposite to each other, the plurality of light-emitting devices 12 are arranged on the first surface 110 of the circuit board 11, and the thermally conductive adhesive strip 13 is arranged on the second surface 111 of the circuit board 11; at least one exhaust groove 130 is opened on the thermally conductive adhesive strip 13, and the exhaust groove 130 runs through the thickness direction of the thermally conductive adhesive strip 13.

[0029] The heat dissipation light strip of the present invention has the exhaust groove 130 formed on the thermally conductive adhesive strip 13. If bubbles are generated when the thermally conductive adhesive strip 13 is attached to the circuit board 11, the technician can squeeze the thermally conductive adhesive strip 13 to move the bubbles, and finally squeeze and move the bubbles to the exhaust groove 130 for release, thereby avoiding the generation of bubbles when the thermally conductive adhesive strip 13 is attached, so as to ensure a low thermal resistance between the thermally conductive adhesive strip 13 and the circuit board 11, and further ensure that the heat generated by the light-emitting device 12 can be quickly transferred outward through the thermally conductive adhesive strip 13 to ensure heat dissipation efficiency.

[0030] Among them, the bubbles corresponding to the light-emitting device 12 located on the second surface 111 of the circuit board 11 have a greater impact on the heat dissipation efficiency of the light-emitting device 12. In order to maximize the heat dissipation efficiency, preferably, there are multiple exhaust grooves 130, which are divided into several groups, and a group of exhaust grooves 130 corresponds to one light-emitting device 12.

[0031] The heat dissipation light strip of the present invention opens the exhaust groove 130 on the thermally conductive adhesive strip 13 in the area corresponding to each light-emitting device 12, so that after the thermally conductive adhesive strip 13 is attached to the circuit board 11, the bubbles on the back side of each light-emitting device 12 and its accessories can be squeezed into the adjacent exhaust groove 130 for discharge.

[0032] In order to shorten the distance between the bubbles and the adjacent exhaust grooves 130, each group of exhaust grooves 130 includes a first exhaust groove 131 and a second exhaust groove 132, and the first exhaust groove 131 and the second exhaust groove 132 are respectively located on both sides of the corresponding light-emitting device 12. Optimally, the first exhaust groove 131 and the second exhaust groove 132 are respectively located on both sides of the corresponding light-emitting device 12 along the length direction of the thermal conductive adhesive strip 13, and the first exhaust groove 131 and the second exhaust groove 132 are respectively located on both sides of the corresponding light-emitting device 12 along the width direction of the thermal conductive adhesive strip 13.

[0033] In this embodiment, the exhaust groove 130 extends along the width direction of the thermal conductive adhesive strip 13 , and the light emitting device 12 is an LED lamp. Embodiment 2

[0034] like Figure 4 As shown, a backlight source includes a metal frame 2, a light guide plate 3 and the heat dissipation light strip 1 described in Example 1, wherein the light guide plate 3 and the heat dissipation light strip 1 are arranged in the metal frame 2, and the heat dissipation light strip 1 is located outside a side surface of the light guide plate 3 and is bonded and fixed to the metal frame 2 by the thermal conductive adhesive strip 13.

[0035] Preferably in this embodiment, the metal frame 2 includes a metal side plate 21 and a metal back plate 22, the metal side plate 21 is located on the periphery of the metal back plate 22 and is vertically connected to the metal back plate 22; the heat dissipation light strip 1 is bonded and fixed to the metal side plate 21 of the metal frame 2 by the thermal conductive adhesive strip 13. Embodiment 3

[0036] like Figure 5 As shown, a liquid crystal module includes a liquid crystal panel 4 and the backlight source described in the second embodiment, wherein the liquid crystal panel 4 is arranged on the light emitting surface of the backlight source.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the utility model rather than to limit them. Although the embodiments of the utility model are described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the embodiments of the utility model can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A heat dissipation light strip, comprising a circuit board, a heat conductive adhesive strip and a plurality of light emitting devices, wherein the circuit board has a first surface and a second surface opposite to each other, the plurality of light emitting devices are arranged on the first surface of the circuit board, and the heat conductive adhesive strip is arranged on the second surface of the circuit board; characterized in that: At least one exhaust groove is formed on the thermally conductive adhesive strip, and the exhaust groove runs through the thickness direction of the thermally conductive adhesive strip.

2. The heat dissipation light strip according to claim 1, characterized in that: There are multiple exhaust grooves, which are divided into several groups, and one group of exhaust grooves corresponds to one light-emitting device.

3. The heat dissipation light strip according to claim 2, characterized in that: Each group of exhaust grooves includes a first exhaust groove and a second exhaust groove, and the first exhaust groove and the second exhaust groove are respectively located on two sides of the corresponding light emitting device.

4. The heat dissipation light strip according to claim 3, characterized in that: The first exhaust groove and the second exhaust groove are respectively located on two sides of the corresponding light emitting device along the length direction of the thermal conductive adhesive strip.

5. The heat dissipation light strip according to claim 3 or 4, characterized in that: The first exhaust groove and the second exhaust groove are respectively located on two sides of the corresponding light emitting device along the width direction of the thermal conductive adhesive strip.

6. The heat dissipation light strip according to claim 1, characterized in that: The exhaust groove extends along the width direction of the thermal conductive adhesive strip.

7. The heat dissipation light strip according to claim 1, characterized in that: The light emitting device is an LED lamp.

8. A backlight source, characterized in that: It comprises a metal frame, a light guide plate and the heat dissipation light strip according to claim 1, wherein the light guide plate and the heat dissipation light strip are arranged in the metal frame, and the heat dissipation light strip is located outside a side surface of the light guide plate and is bonded and fixed to the metal frame by the thermal conductive adhesive strip.

9. The backlight source according to claim 8, characterized in that: The metal frame includes a metal side plate and a metal back plate, wherein the metal side plate is located on the periphery of the metal back plate and vertically connected to the metal back plate; the heat dissipation light strip is bonded and fixed to the metal side plate of the metal frame by the thermal conductive adhesive strip.

10. A liquid crystal module, characterized in that: It comprises a liquid crystal panel and the backlight source as claimed in claim 8, wherein the liquid crystal panel is arranged on the light emitting surface of the backlight source.

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