Chip liquid cooling assembly device

Abstract

The utility model discloses a chip liquid cooling assembly device which comprises a cold plate, the cold plate is composed of an upper cold plate and a lower cold plate, the lower cold plate is arranged below the upper cold plate in a sealing mode and forms a cooling cavity in a surrounding mode, and the upper cold plate is provided with a refrigerant inlet and a refrigerant outlet which are communicated with the cooling cavity. The refrigerant inlet and the refrigerant outlet are each provided with a water nozzle in a sealed mode, and each water nozzle is provided with a pipeline installation structure so that a pipeline can be communicated with the cooling cavity. A buckle assembly is detachably arranged on the portion, located on the periphery of the cooling cavity, of the cold plate, a buckle nut is arranged on the buckle assembly, and a first channel vertically communicated with the buckle nut is formed in the cold plate. A double-piece type cold plate structure is adopted, the upper cold plate and the lower cold plate are sealed in a welded mode, so that a cavity is formed in the interior, a liquid circulation flow channel is achieved, and the size of the cold plate is reduced; the fastener assembly can be compatible with the sizes of mounting hole sites of most server mainboards in the market, and is high in compatibility.

Description

Technical Field

[0001] The utility model belongs to the technical field of liquid cooling servers and relates to a chip liquid cooling component device. Background Art

[0002] Traditional chip heat sinks use air cooling for heat dissipation. High-power chips require bulky heat sinks to barely meet the heat dissipation requirements. The heat dissipation efficiency is unstable, and the chip is prone to over-temperature alarms, affecting the chip function. The heat dissipation teeth use traditional aluminum extruded fins, scraped teeth and other processing methods, and the heat dissipation cannot meet the needs of high-power chips. The installation of components and PCB substrates uses traditional screw locking, which cannot achieve quick installation, is time-consuming and labor-intensive, and has low installation compatibility, affecting the competitiveness of the product.

[0003] CN104576574A discloses a chip liquid cooling device, which uses a combination of a heat absorbing plate and a heat dissipating plate to achieve chip heat dissipation, but it requires a fluid drive unit with a complex structure, which is smaller in size than a fan, but still occupies a considerable area of ​​server space, and is costly. At the same time, the entire product is positioned by the fluid drive unit, which is easy to loosen from the chip during long-term use, affecting its installation stability.

[0004] Therefore, it is necessary to improve the prior art to overcome the defects in the prior art. Utility Model Content

[0005] The utility model aims to provide a chip liquid cooling assembly device, which adopts a double-piece cold plate structure to further reduce the volume and improve the stability after being installed on the chip.

[0006] The purpose of the utility model is achieved through the following technical solutions:

[0007] A chip liquid cooling component device comprises a cold plate, wherein the cold plate consists of an upper cold plate and a lower cold plate, the lower cold plate is sealed and arranged below the upper cold plate and encloses a cooling cavity, the upper cold plate is provided with a refrigerant inlet and a refrigerant outlet which are connected with the cooling cavity, the refrigerant inlet and the refrigerant outlet are both sealed and provided with water nozzles, the water nozzles are provided with a pipeline mounting structure to make the pipeline conductive with the cooling cavity; a fastener assembly is detachably provided on the cold plate located at the periphery of the cooling cavity, the fastener assembly has a fastener nut, and the cold plate is provided with a first channel which is vertically conductive with the fastener nut.

[0008] As a further improvement of an embodiment of the utility model, a plurality of PIN columns are arranged in the cooling cavity, and the PIN columns are integrally forged with the lower cold plate.

[0009] As a further improvement of one embodiment of the utility model, the fastener assembly includes a fastener seat, a fastener nut is fixedly arranged on the fastener seat, and a fastener spring is arranged on the fastener seat to lock the fastener seat to the cold plate; the cold plate is provided with an avoidance groove for avoiding the ejector pin on the fastener seat, and the cold plate is provided with a clamping groove for clamping the fastener spring.

[0010] As a further improvement of an embodiment of the utility model, gaskets for placing fastener components are provided at the four corners of the cold plate, and the fastener components are provided on the gaskets.

[0011] As a further improvement of an embodiment of the utility model, the pipeline adopts any one of a hose or a hard pipe.

[0012] As a further improvement of one embodiment of the utility model, the pipeline installation structure includes a locking nut and a hose connector, one end of the hose connector is locked to the interface of the faucet, the locking nut is sleeved on the hose, one end of the hose is clamped to the hose connector, the locking nut is threadedly connected to the hose connector and fixes the hose on the faucet.

[0013] As a further improvement of an embodiment of the utility model, the pipeline installation structure includes a threaded joint, a seal and a locking nut, one end of the threaded joint is connected to the interface of the faucet, the locking nut is sleeved on the hard pipe, one end of the hard pipe is inserted into the seal, the seal is placed on the other end of the threaded joint, and the locking nut is threadedly connected to the threaded joint and fixes the hard pipe on the faucet.

[0014] As a further improvement of an embodiment of the utility model, a sealing ring is provided at the connection between the threaded joint and the faucet.

[0015] As a further improvement of an embodiment of the utility model, the lower cold plate is sealed on the upper cold plate by welding.

[0016] As a further improvement of an embodiment of the utility model, the lower cold plate is welded by brazing.

[0017] The above technical solution has the following beneficial effects:

[0018] 1. The double-piece cold plate structure is adopted. The lower cold plate close to the chip adopts an integrated forging process, and the inner side is forged to form a circular PIN column, which is densely arranged in combination with the liquid flow channel. The other upper cold plate adopts an integrated stamping process to form an upward convex shape in the middle. The upper and lower cold plates are sealed by welding to form a cavity inside, thereby realizing a circulating flow channel for the liquid; the overall volume of the device is reduced while achieving chip cooling and heat dissipation;

[0019] 2. The upper cold plate is equipped with a water spout for the inlet and outlet of liquid. The detachable installation of the clip assembly is compatible with the installation hole size of most server motherboards on the market. The universal clip is pre-installed and then locked with a nut to achieve high compatibility and quick installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0021] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0022] Figure 1 The utility model provides a schematic diagram of the explosion structure.

[0023] Figure 2 The present invention is a three-dimensional structural schematic diagram.

[0024] Figure 3 This is a schematic diagram of the pipeline installation structure when installing the hard pipe provided by the utility model.

[0025] Figure 4 This is a schematic diagram of the structure of the buckle assembly provided by the utility model.

[0026] In the figure: 1-upper cold plate; 2-lower cold plate; 3-refrigerant inlet; 4-refrigerant outlet; 5-water inlet nozzle; 6-water outlet nozzle; 7-PIN column; 8-chip; 9-PCB board; 10-fastener assembly; 11-gasket; 12, 16-locking nut; 13-hose connector; 14-threaded connector; 15-seal; 17-hard tube;

[0027] 101- fastener nut; 102- fastener seat; 103- fastener spring; 104- ejector pin. DETAILED DESCRIPTION

[0028] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0029] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0030] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention. Example

[0031] See also Figure 1-Figure 3 As shown, a chip liquid cooling assembly device includes a cold plate composed of an upper cold plate 1 and a lower cold plate 2, wherein the lower cold plate 2 is sealed and arranged below the upper cold plate 1 and encloses to form a cooling cavity, and the upper cold plate 1 is provided with a refrigerant inlet 3 and a refrigerant outlet 4 which are connected to the cooling cavity. A water inlet nozzle 5 is sealed and arranged at the refrigerant inlet 3, and a water outlet nozzle 6 is sealed and arranged at the refrigerant outlet 4. In this embodiment, the water inlet nozzle 5 and the water outlet nozzle 6 have the same structure and are collectively referred to as nozzles. The above-mentioned water inlet nozzle 5 and the water outlet nozzle 6 are welded and fixed on the upper cold plate 1 along a circle around their outer periphery, so that the water inlet nozzle 5 and the water outlet nozzle 6 are sealed and arranged on the upper cold plate 1. Since the water inlet nozzle 5 and the water outlet nozzle 6 are fixed to the upper cold plate 1 in the form of post-assembly, the positions of the liquid inlet end and the liquid outlet end of the refrigerant medium (cooling liquid) can be adjusted according to actual conditions before welding, so that it can meet the requirements of different working conditions.

[0032] The water nozzle is provided with a pipeline installation structure for connecting with an external pipeline so that the pipeline is connected with the cooling cavity, so that the refrigerant (cooling liquid) in the pipeline can enter the cooling cavity for cooling and take away the heat.

[0033] In order to improve the heat dissipation capacity of the cold plate to the chip in this embodiment, a heat dissipation component is arranged in the cooling cavity, and the heat dissipation component is composed of a plurality of PIN columns 7. The PIN columns 7 are centrally arranged on the lower cold plate 2, and the upper cold plate 1 is stamped to form the cooling cavity. When the lower cold plate 2 is sealed on the upper cold plate 1 by welding, the PIN columns 7 all fall into the cooling cavity.

[0034] Furthermore, the PIN column 7 and the lower cold plate 2 are formed by an integrated forging process, and the PIN column is forged on the side of the lower cold plate 2. The gaps between two adjacent PIN columns 7 are distributed throughout the cooling cavity, thereby maximizing the heat transfer from the chip 8 to the coolant in the cooling cavity, and quickly achieving chip cooling.

[0035] Preferably, the PIN column 7 in this embodiment is a cylindrical structure, and each of the PIN columns 7 is identical and equidistant between adjacent ones.

[0036] Of course, in addition to being arranged on the lower cold plate 2, the PIN column 7 can also be arranged in the cooling cavity of the upper cold plate 1. Although its heat conduction effect is worse than that of being fixed on the lower cold plate 2, and it cannot quickly conduct the heat on the chip, it can also conduct the heat on the cold plate to the coolant medium in the cooling cavity to achieve chip cooling.

[0037] In actual application, the chip 8 is mounted on the PCB board 9 and is a major heat source on the PCB board 9. By attaching the cold plate composed of the upper cold plate 1 and the lower cold plate 2 to the upper end surface of the chip 8, the heat of the chip 8 is transferred to the lower cold plate, and the heat is quickly exchanged with the cold medium in the cooling chamber through the PIN column 7, so as to cool the chip 8.

[0038] In this embodiment, the cooling cavity is formed by stamping in the middle of the upper cold plate 1, and the refrigerant inlet 3 and the refrigerant outlet 4 are distributed on both sides of the cooling cavity. When the lower cold plate 2 is arranged on the upper cold plate 1, the cooling cavity 3 is covered, and the lower cold plate 2 is sealed on the upper cold plate 1 by welding.

[0039] Furthermore, the lower cold plate 2 may be welded to the upper cold plate 1 by brazing to achieve a sealed welding of the two, thereby ensuring that the coolant in the cooling cavity 3 does not escape from the gap between the lower cold plate 2 and the upper cold plate 1 .

[0040] The cold plate located at the periphery of the cooling chamber is detachably provided with a fastener assembly 10, on which a fastener nut 101 is provided, and the cold plate is provided with a first channel vertically connected to the fastener nut 101. The fastener nut 101 can correspond to the installation hole size of most server motherboards on the market, and the staff can manually operate to lock the fastener nut 101 into the installation hole of the server motherboard.

[0041] In this embodiment, there are four clip assemblies 10 distributed at the four corners of the cold plate, which are compatible with most server motherboard applications on the market.

[0042] The clip assembly 10 in this embodiment can be detachably mounted on the cold plate, so as to realize quick assembly or disassembly of the clip assembly 10. Figure 4 As shown, the fastener assembly 10 includes a fastener seat 102, a fastener nut 101 is fixedly arranged on the fastener seat 102, and a fastener spring 103 for locking the fastener seat to the cold plate is arranged on the fastener seat 102. Correspondingly, a avoidance groove for avoiding the ejector pin 104 on the fastener seat is arranged on the cold plate, and a clamping groove for clamping the fastener spring 103 is arranged on the cold plate.

[0043] The clip assembly 10 in this embodiment is arranged at the four corners of the cold plate. Specifically, gaskets 11 are pre-placed at the four corners of the cold plate, the clip assembly 10 is installed on the gaskets 11, and the clip seat 102 and the gasket 11 are fixed to the cold plate by the clip spring 103.

[0044] In this embodiment, the pipeline connected to the water nozzle can be a hose or a hard pipe, depending on actual needs.

[0045] like Figure 1 The pipe installation structure is used to connect with the hose. Specifically, the pipe installation structure includes a locking nut 12 and a hose connector 13, one end of the hose connector 13 is locked to the interface of the faucet, the locking nut 12 is sleeved on the hose, one end of the hose is clamped to the hose connector, and the locking nut 12 is threadedly connected to the hose connector 13 to fix the hose on the faucet.

[0046] Preferably, the hose connector 13 can be fixed on the faucet by welding.

[0047] like Figure 3 The pipe installation structure is used to connect with a hard pipe. Specifically, the pipe installation structure includes a threaded joint 14, a seal 15 and a locking nut 16. One end of the threaded joint 14 is connected to the interface of the faucet. The locking nut 16 is sleeved on a hard pipe 17. One end of the hard pipe 17 is inserted into the seal 15. The seal 15 is placed on the other end of the threaded joint 14. The locking nut 16 is threadedly connected to the threaded joint 14 and fixes the hard pipe on the faucet.

[0048] The outer surfaces of the locking nuts 16 and 12 are both provided with knurling to facilitate the knob operation of the staff.

[0049] Preferably, a sealing ring is provided at the connection between the threaded joint 14 and the water nozzle, and the sealing ring is an "O"-shaped sealing ring to enhance the sealing performance between the two.

[0050] In summary, the embodiments of the present invention achieve the following technical effects:

[0051] By adopting a double-piece cold plate structure, the lower cold plate close to the chip adopts an integrated forging process, and the inner side is forged into a circular PIN column, which is densely arranged in combination with the liquid flow channel. The other upper cold plate adopts an integrated stamping process to form an upward convex shape in the middle. The upper and lower cold plates are sealed by welding to form a cavity inside, thereby realizing a circulation channel for the liquid; the overall volume of the device is reduced while achieving chip cooling and heat dissipation.

[0052] The upper cold plate is reserved for the position of the water nozzle for the inlet and outlet of the liquid. The position of the water nozzle can be adjusted at will before welding to meet the installation requirements of different scenarios. The detachable installation of the clip assembly is compatible with the installation hole size of most server motherboards on the market; the universal clip is pre-installed and then locked with a nut, so as to achieve high compatibility and fast installation.

[0053] Obviously, the embodiments described above are only some embodiments of the utility model, not all embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0054] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0055] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0056] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A chip liquid cooling assembly device, characterized in that: The invention comprises a cold plate, which is composed of an upper cold plate and a lower cold plate. The lower cold plate is sealed and arranged below the upper cold plate to enclose a cooling cavity. A refrigerant inlet and a refrigerant outlet which are connected with the cooling cavity are arranged on the upper cold plate. Water nozzles are sealed and arranged at the refrigerant inlet and the refrigerant outlet. A pipeline mounting structure is arranged on the water nozzle to make the pipeline connected with the cooling cavity. A fastener assembly is detachably arranged on the cold plate located at the periphery of the cooling cavity. A fastener nut is provided on the fastener assembly. A first channel which is vertically connected with the fastener nut is arranged on the cold plate.

2. The chip liquid cooling assembly device according to claim 1, characterized in that: A plurality of PIN columns are arranged in the cooling cavity, and the PIN columns are integrally forged with the lower cold plate.

3. The chip liquid cooling assembly device according to claim 1 or 2, characterized in that: The fastener assembly includes a fastener seat, a fastener nut is fixedly arranged on the fastener seat, and a fastener spring is arranged on the fastener seat to lock the fastener seat to the cold plate; the cold plate is provided with an avoidance groove for avoiding the ejector pin on the fastener seat, and the cold plate is provided with a clamping groove for clamping the fastener spring.

4. The chip liquid cooling assembly device according to claim 3, characterized in that: Gaskets for placing clip assemblies are arranged at the four corners of the cold plate, and the clip assemblies are arranged on the gaskets.

5. The chip liquid cooling assembly device according to claim 1 or 2, characterized in that: The pipeline is any one of a soft pipe or a hard pipe.

6. The chip liquid cooling assembly device according to claim 5, characterized in that: The pipeline installation structure includes a locking nut and a hose connector, one end of the hose connector is locked to the interface of the faucet, the locking nut is sleeved on the hose, one end of the hose is clamped to the hose connector, and the locking nut is threadedly connected to the hose connector and fixes the hose on the faucet.

7. The chip liquid cooling assembly device according to claim 5, characterized in that: The pipeline installation structure includes a threaded joint, a seal and a locking nut. One end of the threaded joint is connected to the interface of the faucet. The locking nut is sleeved on the hard pipe. One end of the hard pipe is inserted into the seal. The seal is placed on the other end of the threaded joint. The locking nut is threadedly connected to the threaded joint and fixes the hard pipe on the faucet.

8. The chip liquid cooling assembly device according to claim 7, characterized in that: A sealing ring is arranged at the connection between the threaded joint and the water nozzle.

9. The chip liquid cooling assembly device according to claim 1 or 2, characterized in that: The lower cold plate is sealed on the upper cold plate by welding.

10. The chip liquid cooling assembly device according to claim 9, characterized in that: The lower cold plate is welded by brazing.

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