Narrow-frame TP (Touch Panel)
By bent the traces of the Film Sensor and combined with the design of FPC and PI reinforcement boards, the problem of reduced screen-to-body ratio in the narrow-bezel Film TP is solved, achieving higher screen-to-body ratio and cost reduction.
Patent Information
- Application Number
- CN202421012436.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-10
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-05-10
AI Technical Summary
When the existing Film TP pursues narrow borders, due to the space demand for peripheral wiring, the screen-to-body ratio is reduced, and the black edges are occupied too much, which affects the product competitiveness.
By bent the peripheral traces on both sides of the Film Sensor downwards and using FPC and PI reinforcement boards to cover the vias, the black edge occupation is reduced and the screen-to-body ratio is increased.
It effectively increases the screen-to-body ratio, reduces product costs, and enhances product competitiveness.
Smart Images
Figure CN222354414U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of liquid crystal display, and more specifically to a narrow-frame film TP. Background Art
[0002] Film TP is a touch cover with a film sensor. With the introduction of the concept of screen-to-body ratio, more and more mobile phone manufacturers are pursuing narrow borders on display panels to grab the market. Conventional film sensors require space for peripheral wiring on both sides, which results in the cover having to retain larger black borders for peripheral shielding of wiring. At this time, the cover retains more black borders, resulting in a smaller screen-to-body ratio. The more peripheral wiring of the film sensor, the more space it needs to occupy, and the more space needs to be reserved at the cover, resulting in a lower screen-to-body ratio. Therefore, the narrow-border film TP leaves less and less space for film sensor wiring. Utility Model Content
[0003] The technical problem to be solved by the utility model is how to design a narrow-frame film TP with a high screen-to-body ratio.
[0004] The technical problem to be solved by the utility model is achieved through the following technical solutions:
[0005] In order to solve the above technical problems, the utility model provides a narrow-frame film TP, which includes a cover plate and a film sensor. The film sensor is fixed to the lower surface of the cover plate. The film sensor includes a touch pattern area located in the display area and a peripheral wiring area located in the non-display area. The film sensors at the peripheral wiring areas on both sides are bent downward.
[0006] As a preferred implementation of the narrow-frame film TP provided by the present invention, the film Sensors located at the peripheral wiring areas on both sides are bent downward and curled into a vortex shape.
[0007] As a preferred implementation of the narrow-frame film TP provided by the present invention, an FPC is bound to the edge of the film Sensor.
[0008] As a preferred implementation of the narrow-frame film TP provided by the utility model, the FPC includes a non-bending area and bending areas arranged on both sides of the non-bending area, and the bending area is provided with a PI reinforcement plate and a plurality of vias, and the PI reinforcement plate completely covers the plurality of vias.
[0009] As a preferred implementation of the narrow-frame film TP provided by the present invention, a plurality of via holes are arranged in a line segment shape.
[0010] As a preferred implementation of the narrow-frame film TP provided by the utility model, the FPC includes a lower protective film, a lower copper layer, a substrate layer, an upper copper layer and an upper protective film arranged in sequence from bottom to top, and the PI reinforcement plate is arranged above the upper protective film.
[0011] As a preferred implementation of the narrow-frame film TP provided by the utility model, the PI reinforcement plate is a PI covering film.
[0012] As a preferred implementation of the narrow-frame film TP provided by the present invention, the thickness of the PI covering film is 0.1 mm.
[0013] As a preferred implementation of the narrow-frame film TP provided by the present invention, the PI reinforcement plate does not exceed the non-bending area.
[0014] As a preferred implementation of the narrow-frame film TP provided by the present invention, the via hole is in the shape of a circular hole.
[0015] The utility model has the following beneficial effects:
[0016] Due to the softness and flexibility of the film sensor, the left and right sides of the film sensor can be bent downward, so that the cover needs to retain fewer black borders. Even if the outer wiring is very long, the space in the direction of the cover can be used for bending without occupying the black border position of the cover, effectively increasing the screen-to-body ratio, reducing the size of the cover, reducing the cost of the product, and improving the competitiveness of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1 The utility model provides a structural schematic diagram of a narrow-frame film TP.
[0019] Figure 2 for Figure 1 Schematic diagram of the improved structure of FPC.
[0020] Figure 3 for Figure 2 Schematic diagram of the location of the middle via on the FPC.
[0021] Description of Figure Numbers:
[0022] Cover 1; Film Sensor 2; FPC 3;
[0023] Non-bending area 301; bending area 302; via 31; PI reinforcement plate 32; lower protective film 33; lower copper layer 34; substrate layer 35; upper copper layer 36; upper protective film 37. DETAILED DESCRIPTION
[0024] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0026] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0027] The utility model provides a narrow-frame film TP, which includes a cover plate and a film sensor, wherein the film sensor is fixed to the lower surface of the cover plate, and the film sensor includes a touch pattern area located in a display area and a peripheral wiring area located in a non-display area, and the film sensors located at the peripheral wiring areas on both sides are bent downward.
[0028] Due to the softness and flexibility of the film sensor, the left and right sides of the film sensor can be bent downward, so that the cover needs to retain fewer black borders. Even if the outer wiring is very long, the space in the direction of the cover can be used for bending without occupying the black border position of the cover, effectively increasing the screen-to-body ratio, reducing the size of the cover, reducing the cost of the product, and improving the competitiveness of the product.
[0029] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.
[0030] Example 1
[0031] See also Figure 1 , a narrow-frame film TP provided by the utility model includes a cover plate 1 and a film sensor 2. The film sensor 2 is fixed to the lower surface of the cover plate 1. The film sensor 2 includes a touch pattern area and a peripheral wiring area. The touch pattern area is located in the display area, and the peripheral wiring area is located in the non-display area. The film sensor 2 located at the peripheral wiring areas on both sides is bent downward. Due to the softness and bendability of the film sensor 2, the left and right sides of the film sensor 2 are bent downward, so that the black edges of the cover plate 1 need to be retained less. Even if the peripheral wiring is very long, the space in the direction of the cover plate 1 can be used for bending, without occupying the black edge position of the cover plate 1, effectively improving the screen-to-body ratio, and reducing the size of the cover plate 1, reducing the cost of the product, and improving the competitiveness of the product.
[0032] Furthermore, the film Sensor 2 located at the peripheral wiring areas on both sides is bent downward and curled into a spiral shape. This structure is more suitable for curved screens, and of course, flat screens can also adopt this structure.
[0033] Furthermore, the edge of the film Sensor 2 is bound with FPC 3 .
[0034] Example 2
[0035] See also Figure 2 and Figure 3As a further optimization scheme of Example 1, in this embodiment, FPC3 includes a non-bending area 301 and a bending area 302 arranged on both sides of the non-bending area 301. The bending area 302 is provided with a PI reinforcing plate 32 and a plurality of vias 31. These vias 31 are bridges connecting the upper and lower copper layers, and their reliability is very important. The vias 31 cannot be subjected to heavy pressure, and are afraid of being scratched, and are even more afraid of being broken. Therefore, it is not allowed to punch vias 31 in the general bending area 302, because the bending force will directly act on the vias 31, affecting the reliability of the vias 31. The PI reinforcing plate 32 completely covers a plurality of vias 31. There are multiple vias 31 on the non-bending area 301, and the vias 31 are relatively fragile, which is easy to cause stress concentration and cause fracture at the vias 31. Since the PI reinforcing plate 32 completely covers the vias 31, the stress is concentrated around the reinforcing plate instead of at the vias 31, preventing the risk of fracture at the vias 31 and avoiding the failure of FPC3.
[0036] Furthermore, a plurality of via holes 31 are arranged in a line segment shape. Since a reinforcing plate completely covering the via holes 31 is provided, even if the via holes 31 are arranged in a line segment shape, it can be ensured that the via holes 31 are not prone to breakage, thereby improving the designability of the product and improving the competitiveness of the product.
[0037] Furthermore, the FPC 3 includes a lower protective film 33 , a lower copper layer 34 , a substrate layer 35 , an upper copper layer 36 and an upper protective film 37 which are sequentially arranged from bottom to top, and the PI reinforcing plate 32 is arranged above the upper protective film 37 .
[0038] Furthermore, the PI reinforcing plate 32 is a PI covering film, which has lower cost and simpler assembly process.
[0039] Furthermore, the thickness of the PI covering film is 0.1 mm to ensure that the PI covering film has sufficient strength. The PI covering film is fixed by double-sided adhesive with a thickness of 0.025 mm. The edge of the covering film is more than 0.5 mm away from the via 31 to ensure that the stress concentration does not affect the via 31, prevent the risk of fracture at the via 31, and avoid failure of FPC3.
[0040] Furthermore, the PI reinforcing plate 32 does not extend beyond the non-bending area 301. That is, the PI reinforcing plate 32 is disposed in the non-bending area 301 to prevent stress from being concentrated in the bending area 302 and to avoid fracture in the bending area 302.
[0041] Furthermore, the via hole 31 is in the shape of a circular hole.
[0042] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0043] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.
Claims
1. A narrow frame film TP, characterized in that: It includes a cover plate and a film sensor, wherein the film sensor is fixed to the lower surface of the cover plate, and the film sensor includes a touch pattern area located in the display area and a peripheral wiring area located in the non-display area, and the film sensors located at the peripheral wiring areas on both sides are bent downward.
2. The narrow-frame film TP according to claim 1, characterized in that: The film sensors located at the outer wiring areas on both sides are bent downward and curled into a vortex shape.
3. The narrow-frame film TP according to claim 1, characterized in that: The edge of the film sensor is bound with FPC.
4. The narrow-frame film TP according to claim 3, characterized in that: The FPC includes a non-bending area and bending areas arranged on both sides of the non-bending area. A PI reinforcing plate and a plurality of vias are arranged on the bending area, and the PI reinforcing plate completely covers the plurality of vias.
5. The narrow-frame film TP according to claim 4, characterized in that: A plurality of the via holes are arranged in a line segment shape.
6. The narrow-frame film TP according to claim 4, characterized in that: The FPC comprises a lower protective film, a lower copper layer, a substrate layer, an upper copper layer and an upper protective film which are arranged in sequence from bottom to top, and the PI reinforcing plate is arranged above the upper protective film.
7. The narrow-frame film TP according to claim 4, characterized in that: The PI reinforcing plate is a PI covering film.
8. The narrow-frame film TP according to claim 7, characterized in that: The thickness of the PI covering film is 0.1 mm.
9. The narrow-frame film TP according to claim 4, characterized in that: The PI reinforcing plate does not extend beyond the non-bending area.
10. The narrow-frame film TP according to claim 4, characterized in that: The via hole is in the shape of a circular hole.