Chip inductor and power supply module

Abstract

The utility model provides a chip inductor and power module, chip inductor includes coil body and wrap the magnet of coil body outside, the magnet has first surface, second surface and third surface, the electrode tip of coil body is located the third surface, the third surface is located the first surface and the second surface, the first surface is located on the first surface, the second surface is located on the second surface, the second surface is located on the second surface, and the third surface is located between the first surface and the second surface. And the third surface is not shielded towards the direction of the first surface.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a chip inductor and a power supply module. Background Art

[0002] In the prior art, there is a technology that integrates an inductor and a power chip to form a power module. Generally, the inductor is fixed on the packaging base of the power chip and packaged together with the power chip. There are two problems with this structure: 1. The power chip needs to be mounted first, and then the functional pins of the power chip are connected to the pins of the plastic package through a wire bonding process, while the inductor is first SMT mounted and then reflow soldered, resulting in different installation processes for the power chip and the inductor, and a cumbersome production process; 2. The packaging base originally does not have a welding area for the inductor, so a specially customized packaging base is required, resulting in a huge waste of cost. Utility Model Content

[0003] In order to solve the above problems, the purpose of the utility model is to provide a chip inductor and a power module, by lowering the electrode position of the inductor, so that the chip inductor and the power chip can be installed in a unified process, thereby reducing the manufacturing cost and material cost.

[0004] The utility model is realized by the following technical solutions:

[0005] A chip inductor, characterized in that it includes a coil body and a magnet wrapped outside the coil body, the magnet has a first surface, a second surface and a third surface, the electrode end of the coil body is located on the third surface, the third surface is located between the first surface and the second surface, and the third surface is unobstructed toward the first surface.

[0006] By adopting the above technical solution, the electrode position of the chip inductor is lowered, so that when the chip inductor is connected to other electronic components, it is convenient to use the wire bonding process to connect, reduce the height of the metal lead of the wire bonding, and then there is no need to change the plastic packaging specifications.

[0007] A power module comprises the above-mentioned chip inductor, and also comprises a power chip, a packaging base and a plastic cover; the chip inductor and the power chip are mounted on the packaging base, the electrode end of the chip inductor is bonded to the pin of the power chip or the pin of the packaging base through a metal lead, and the pin of the power chip is bonded to the relevant pin of the packaging base through a metal lead; the plastic cover is arranged on the packaging base, and the edges of the two are aligned.

[0008] By adopting the above technical solution, the chip inductor can be electrically connected through the wire bonding process, while reducing the height of the metal lead and avoiding the risk of the metal lead collapsing when touching the top. At the same time, the assembly process of the chip inductor and the power chip is unified, saving a step in packaging and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a structural diagram of a chip inductor provided in the first embodiment of the utility model;

[0010] Figure 2 It is a cross-sectional view of a chip inductor provided in the first embodiment of the present utility model.

[0011] Figures 3 to 6 It is a step diagram of a method for manufacturing a chip inductor provided in Embodiment 2 of the present utility model;

[0012] Figure 7 is a cross-sectional view of a coil body provided in Embodiment 2 of the present utility model;

[0013] Figure 8 and Fig. 9 is a cross-sectional view of a coil body provided in Embodiment 3 of the present utility model;

[0014] Figures 10 to 14 This is a step diagram of a method for manufacturing a chip inductor provided in Embodiment 4 of the present utility model;

[0015] Figures 15 to 17 is a cross-sectional view of a coil body provided in Embodiment 4 of the present utility model;

[0016] Fig.18 is a cross-sectional view of a coil body provided in Embodiment 5 of the present utility model;

[0017] Fig.19 It is a structural schematic diagram of the power supply module provided in the sixth embodiment of the present utility model.

[0018] Illustration Description:

[0019] First plane-1; second plane-2; third plane-3; electrode pin-4; chip inductor-5; power chip-6; package base-7; plastic cover-8; metal lead-9;

[0020] first conductive coil-10; electrode layer-11; second conductive coil-20; first insulating film-30; first through hole-31; second through hole-32; first magnet-40; second magnet-50; electrode pin-60;

[0021] Conductive coil-70; insulating film-80; through hole-81;

[0022] Conductive coil-100; bottom surface-101; top surface-102; first electrode end-103; second electrode end-104; electrode layer-110; insulating film-200; through hole-201; first magnet 300; second magnet-400; third magnet-500; electrode pin-600. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the embodiment of the utility model clearer, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0024] Embodiment 1

[0025] See also Figure 1 A chip inductor comprises a coil body and a magnet wrapped outside the coil body, the magnet having a parallel first surface 1, a second surface 2, and a third surface 3, the third surface 3 is located between the first surface 1 and the second surface 2, the electrode end of the coil body is located on the third surface 3, that is, the electrode end of the chip inductor is located between the top surface and the bottom surface of the chip inductor, and further, the horizontal position of the electrode end of the chip inductor is lower than the top surface of the chip inductor. By reducing the height of the electrode end of the chip inductor, the height of the metal lead is reduced when the chip inductor is electrically connected to other components through the wire bonding process, thereby effectively avoiding the risk of the metal lead collapsing when touching the top. In this embodiment, there is no obstruction from the third surface 3 to the first surface 1, so that the metal lead can be given way when the electrode end is wired. More preferably, the first surface 1, the second surface 2 and the third surface 3 are arranged in parallel.

[0026] In this embodiment, the chip inductor further includes a plurality of electrode pins 4, which are disposed on the third surface 3, and are electrically connected to the electrode terminals. The upper end surface of the electrode pins 4 is located between the first surface 1 and the second surface 2, that is, the upper end surface of the electrode pins 4 is also lower than the top surface of the chip inductor. The addition of electrode pins expands the electrode surface of the chip inductor, which is more conducive to the electrical connection of the chip inductor.

[0027] See also Figure 2The coil body has a parallel bottom surface and top surface, and the electrode end A and the electrode end B are both located on the top surface; the magnet includes a first magnet 40 and a second magnet 50, the coil body is embedded in the first magnet 40, and the upper end surface of the first magnet is flush with the electrode end; the second magnet 50 is arranged on the top surface of the coil body and above the first magnet 40, and the second magnet 50 avoids the electrode end and the area from the electrode end to the edge of the first magnet.

[0028] Embodiment 2

[0029] This embodiment further provides a method for manufacturing a chip inductor to form the chip inductor described in the first embodiment, and the steps are as follows:

[0030] S1. Manufacture a plurality of coil groups arranged in an array of coil bodies, with the electrode ends located on the same side of the coil group. Figure 3 , the electrode end A and the electrode end B are located on the same surface of the coil body. In this illustration, one of the coil bodies is taken as an example to demonstrate the manufacturing steps of the chip inductor. It can be understood that in actual manufacturing, several array-arranged coil bodies are manufactured simultaneously.

[0031] S2. The coil body is placed on a platform or in a jig with the side with the electrode end facing downward, and the magnetic slurry is first applied to the coil body so that the first magnet 40 formed by the magnetic slurry covers the surface of each coil body except the side with the electrode end, such as Figure 4 .

[0032] S3, turning over the semi-finished product obtained in S2 so that the electrode end faces upward, and applying magnetic slurry to the surface where the electrode end is located for the second time, wherein the second magnet 50 formed by the second application of magnetic slurry avoids the electrode end, such as Figure 5 , so that the horizontal position of the electrode end is lower than the top surface of the second magnet 50. It is understandable that when laying the magnetic slurry for the second time, it is also necessary to avoid the area from the electrode end to the edge of the first magnet 40 to make way for the metal lead wire in the subsequent wire bonding process.

[0033] S4. Silver plate the electrode end to form an electrode pin, such as Figure 6 It is understandable that, since the electrode end cannot be absolutely fitted with the platform or the bottom surface of the fixture, when the magnetic slurry is laid for the first time, the first magnet 40 covers or partially covers the electrode end. Therefore, before the electrode end A and the electrode end B are silver-plated, the electrode end A and the electrode end B need to be ground to make the electrode end A and the electrode end B completely exposed from the magnet.

[0034] S5. Cut the inductor group obtained in S4 to obtain a single chip inductor, which includes a coil body, a magnet (a first magnet 40 and a second magnet 50) wrapped outside the coil body, and an electrode pin 60 disposed at the electrode end (electrode end A and electrode end B). The electrode pin of the single chip inductor is located between the top surface and the bottom surface of the chip inductor, and the height of the effective body of the inductor coil is not reduced, so that the performance of the chip inductor will not be lost.

[0035] In this embodiment, the formation of a coil body having two layers of conductive coils and a bottom electrode is described.

[0036] See also Figure 7 , the first conductive coil 10, the first insulating film 30, and the second conductive coil 20 are stacked in sequence along the first direction, and the first insulating film 30 is provided with a first through hole 31 and a second through hole 32. The electrode layer 11 is separated from the first conductive coil 10 and is located in the same plane. In this embodiment, the electrode layer 11 and the first conductive coil 10 are photolithographically formed from the same conductive film. The first conductive coil 10 is in electrical contact with the second conductive coil 20 through a contact point provided in the first through hole 31, and the electrode layer 11 is in electrical contact with the second conductive coil 20 through a contact point in the second through hole 32. The starting end of the first conductive coil 10 and the electrode layer 11 form the bottom electrode end of the coil body.

[0037] The current flows in from the starting end of the first conductive coil 10, flows through the first conductive coil 10 and then conducts to the second conductive coil 20 through the contact, then flows through the second conductive coil 20 and then conducts to the electrode layer 11 through the contact, and flows out from the electrode layer 11. The current can also flow in from the electrode layer 11 and flow out from the end of the first conductive coil 10. In this embodiment, the first through hole 31 is located at the overlapping area of ​​the tail of the first conductive coil 10 and the head of the second conductive coil 20, and the second through hole 32 is located at the tail of the second conductive coil 20, so that the length of the current flowing through the coil is maximized, thereby ensuring the performance of the inductor.

[0038] The first conductive coil of this embodiment includes one or more first conductive films, and the plurality of first conductive films are stacked along a first direction. The second conductive coil of this embodiment includes one or more second conductive films, and the plurality of second conductive films are stacked along a first direction.

[0039] Embodiment 3

[0040] The basic principle of this embodiment is the same as that of the second embodiment, except that the bottom electrode of the coil assembly of this embodiment is formed in a different manner.

[0041] See also Figure 8In this embodiment, the coil body includes a plurality of conductive coils 70 and a plurality of insulating films 80, and the conductive coils 70 and the insulating films 80 are stacked and arranged in a first direction. Each insulating film 80 includes at least one through hole 81, and the through holes 81 on adjacent insulating films are staggered. A contact (not shown) is provided in each through hole 81 to electrically connect the conductive coils 70 located on both sides of the through hole. This structure is described in detail in the invention patent 2022800017607 Coil inductor and its manufacturing method entered into PCT in China.

[0042] See also Fig. 9 The starting end of the conductive coil of the bottom layer is the first electrode terminal A, and the end of the conductive coil of the top layer is the second electrode terminal B; the second electrode terminal B is bent in the opposite direction of the first direction until it is flush with the first electrode terminal A, so that the first electrode terminal A and the second electrode terminal B are located on the same side of the coil body, thereby forming a bottom electrode.

[0043] Embodiment 4

[0044] See also Figure 10-Figure 14 In this embodiment, the structure of the coil body is slightly different from that of the first embodiment. In this embodiment, the coil body has a parallel bottom surface 101 and a top surface 102, and the two electrode ends (103, 104) of the coil body are located between the top surface and the bottom surface, that is, the electrode ends are lower than the top surface 102. The magnets of this embodiment include a first magnet 300, a second magnet 400 and a third magnet 500; the first magnet is arranged between the electrode end and the bottom surface of the coil body, the second magnet 400 is arranged above the first magnet and the coil body, and avoids the electrode end and the area from the electrode end to the edge of the first magnet 300, and the third magnet 500 is arranged below the first magnet 300 and the coil body.

[0045] This embodiment further provides a method for manufacturing a chip inductor to form the above-mentioned chip inductor, and the steps are as follows:

[0046] S1. Manufacturing a coil assembly with a plurality of coil bodies arranged in an array, wherein the coil body comprises a parallel bottom surface 101 and a top surface 102, and the electrode ends (103, 104) are located between the bottom surface 101 and the top surface 102 of the coil body, such as Fig.10 In this illustration, one of the coil bodies is taken as an example to demonstrate the manufacturing steps of the chip inductor. It can be understood that in actual manufacturing, several coil bodies arranged in an array are manufactured simultaneously.

[0047] S2, the coil assembly is placed in a jig with the electrode ends (103, 104) facing upwards, and magnetic slurry is applied to the coil assembly for the first time, so that the upper surface of the first magnet 300 formed by the magnetic slurry is flush with the electrode ends 103, as shown in FIG. Fig.11 .

[0048] S3, laying magnetic slurry on the coil group for the second time, wherein the second magnet 400 formed by the magnetic slurry avoids the electrode end (103, 104) and the area from the electrode end to the edge of the first magnet, that is, there is no obstruction from the electrode end to the edge of the first magnet, such as Fig.12 .

[0049] S4, turning the semi-finished product obtained in S3 by 180 degrees, and applying magnetic slurry on the upper surface of the semi-finished product (the bottom surface of the first magnet and the coil body) for the third time to form a third magnet 500, as shown in FIG. Fig.13 ;

[0050] S5, the semi-finished product obtained in S4 is turned over 180 degrees, and the electrode end is silver-plated to form an electrode pin 600, such as Fig.14 Before silver plating, if the magnetic slurry covers or partially covers the electrode end, the magnet can be ground so that the electrode end is exposed from the magnet. This is a conventional operation in the art and will not be described in detail here.

[0051] S6. Cut the inductor group obtained in S5 to obtain a single inductor, wherein the single inductor includes a coil body, a magnet wrapped outside the coil body, and an electrode pin arranged at an electrode end.

[0052] It is understandable that in the steps of the above-mentioned manufacturing method, there are also some conventional processing means in the industry. For example, in the process of laying the magnetic slurry, there may also be compression operations on the magnetic material through soft media, and flattening operations may be performed on the surface of the magnet, etc.

[0053] This embodiment also provides a structure of a coil body.

[0054] See also Fig.15 The coil body includes a plurality of conductive coils 100 and a plurality of insulating films 200, and the conductive coils 100 and the insulating films 200 are stacked and arranged in a first direction. Each insulating film 200 includes at least one through hole 201, and the through holes 201 on adjacent insulating films are staggered. A contact (not shown) is arranged in each through hole 201, so that the conductive coils 100 located on both sides of the through hole are electrically connected.

[0055] An electrode layer 110 is also provided above the starting end of the first layer of conductive coils. In this embodiment, the electrode layer 110 and the second layer of conductive coils are photolithographically formed by the same conductive film. In another embodiment, the electrode layer 110 may include more than one sublayer, each sublayer is photolithographically formed by the same conductive film as the conductive coils of the same layer, and the insulating film between adjacent sublayers is provided with through holes, and contacts are provided in the through holes, that is, the electrode layer is manufactured synchronously with the coil body, and the height of the electrode layer can be freely selected according to production needs. Among them, each sublayer is separated from the conductive coils of the same layer, and the electrode layer 110 is electrically connected to the first layer of conductive coils through contacts. The electrode layer 110 is the first electrode terminal 103, and the end of the top layer of conductive coils is the second electrode terminal 104.

[0056] See also Fig.16 The end of the top conductive coil is bent for the first time toward the first conductive coil, and then bent for the second time toward the direction away from the coil body. The upper surface of the end of the bent top conductive coil is located at the same horizontal plane as the upper surface of the electrode layer 110, and the formed electrode end (103, 104) is located between the top conductive coil and the bottom conductive coil.

[0057] See also Fig.17 In another embodiment, the end of the top conductive coil is bent toward the starting end of the first conductive coil, and then a second bend is performed in a direction away from the coil body. The upper surface of the end of the bent top conductive coil and the upper surface of the electrode layer are located in the same horizontal plane, so that the electrode end formed is located between the top conductive coil and the bottom conductive coil.

[0058] Embodiment 5

[0059] See also Fig.18 , this embodiment also provides a structure of a coil body.

[0060] The coil body includes a plurality of conductive coils 100 and a plurality of insulating films 200, and the conductive coils 100 and the insulating films 200 are stacked and arranged in a first direction. Each insulating film 200 includes at least one through hole 201, and the through holes 201 on adjacent insulating films are staggered. A contact (not shown) is arranged in each through hole 201, so that the conductive coils 100 located on both sides of the through hole are electrically connected.

[0061] The end of the top conductive coil is bent for the first time toward the bottom conductive coil, and then bent for the second time toward a direction away from the coil body. The upper surface of the end of the top conductive coil after bending is located at the same horizontal plane as the upper surface of the bottom conductive coil. The upper surface of the end of the top conductive coil and the upper surface of the starting end of the bottom conductive coil are electrode ends (103, 104), and the electrode ends are silver-plated to form electrode pins.

[0062] It is understandable that the relative position between the two electrode ends, the shape of the coil body, the area and number of the electrode pins, etc. can all be adjusted according to actual production to achieve the same orientation of the two electrode pins.

[0063] Embodiment 6

[0064] See also Fig.19 This embodiment provides a power module, including the chip inductor 5 described in the first embodiment, and also including a power chip 6, a packaging base 7 and a plastic cover 8. The chip inductor 5 and the power chip 6 are mounted on the packaging base 7, the electrode end of the chip inductor 5 is bonded to the pin of the power chip 6 or the pin of the packaging base 7 through a metal lead 9 (the connection relationship is adjusted according to the actual circuit), the pin of the power chip 6 is bonded to the relevant pin of the packaging base 7 through the metal lead 9, and the plastic cover 8 is covered on the packaging base 7, and the edges of the two are aligned, so that the chip inductor and the power chip are packaged in the same package body to achieve integration. In subsequent applications, one mounting process of electrical components is reduced, and production efficiency is improved.

[0065] Embodiment 7

[0066] This embodiment provides a method for manufacturing a power module, the steps of which are as follows:

[0067] Prepare a package base, the package base has corresponding pins, and the package base has placement positions for chip inductors and power chips.

[0068] The chip inductor and the power chip patch are fixed on the corresponding placement positions of the package base. The chip inductor of this embodiment adopts the chip inductor shown in the first embodiment, that is, the horizontal position of the electrode pin is lower than the top surface of the chip inductor.

[0069] The electrode terminals of the chip inductor and / or the pins of the power chip are bonded to the corresponding pins of the package base through wire bonding.

[0070] The plastic cover is placed on the packaging base, the edges of the two are aligned, and the packaging is cured.

[0071] In the manufacturing process of the power module of this embodiment, the chip inductor and the power chip are simultaneously mounted and electrically connected through the wire bonding process, so that batch production can be achieved during production and manufacturing, thereby improving production efficiency. At the same time, since the electrode position of the chip inductor is lowered, the distance between the metal lead and the top surface of the package is simultaneously reduced, thereby avoiding the metal lead from collapsing when touching the top.

[0072] The above description shows and describes the preferred embodiments of the utility model. It should be understood that the utility model is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the utility model concept of this article through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art do not deviate from the spirit and scope of the utility model, and should be within the scope of protection of the claims attached to the utility model.

Claims

1. A chip inductor, characterized in that: It includes a coil body and a magnet wrapped outside the coil body, the magnet has a first surface, a second surface and a third surface, the electrode end of the coil body is located on the third surface, the third surface is located between the first surface and the second surface, and the third surface is unobstructed toward the first surface.

2. The chip inductor according to claim 1, characterized in that: It also includes a plurality of electrode pins, which are arranged on the third surface and are electrically connected to the electrode ends; wherein the upper end surfaces of the electrode pins are located between the first surface and the second surface.

3. The chip inductor according to claim 1, characterized in that: The first surface, the second surface and the third surface are arranged in parallel.

4. The chip inductor according to claim 1, characterized in that: The coil body has a parallel bottom surface and a top surface, and the electrode end is located on the top surface at the same time; the magnet includes a first magnet and a second magnet, the coil body is embedded in the first magnet, and the upper end surface of the first magnet is flush with the electrode end; the second magnet is arranged on the top surface of the coil body and above the first magnet, and the second magnet avoids the electrode end and the area from the electrode end to the edge of the first magnet.

5. The chip inductor according to claim 4, characterized in that: The coil body comprises: A first conductive coil includes one or more first conductive films, wherein the plurality of first conductive films are stacked along a first direction; A first insulating film is disposed on the first conductive coil, the first insulating film extends along a second direction perpendicular to the first direction, and a first through hole is disposed on the first insulating film; A second conductive coil is disposed on the first insulating film, wherein the second conductive coil comprises one or more second conductive films, and the plurality of second conductive films are stacked along a first direction; wherein the first conductive coil is in electrical contact with the second conductive coil via a contact point disposed in the first through hole; an electrode layer, the electrode layer being separated from the first conductive coil and being located in the same plane, the first insulating film further being provided with a second through hole, the electrode layer being in electrical contact with the second conductive coil via a contact in the second through hole; The upper surface of the electrode layer and the upper surface of the starting end of the first conductive coil are the electrode ends of the coil body respectively.

6. The chip inductor according to claim 5, characterized in that: The first through hole is located at an overlapping area between the tail of the first conductive coil and the head of the second conductive coil; and the second through hole is located at the tail of the second conductive coil.

7. The chip inductor according to claim 4, characterized in that: The coil body comprises: a plurality of conductive coils; A plurality of insulating films, wherein the insulating films and the conductive coils are stacked and spaced apart along a first direction; each of the insulating films comprises at least one through hole, and the through holes on adjacent insulating films are staggered; and A contact point is disposed in each of the through holes so as to allow electrical contact between the conductive coils located on both sides of the through hole; The lower surface of the starting end of the conductive coil on the bottom layer is the first electrode end, and the end of the conductive coil on the top layer is the second electrode end; the second electrode end is bent in the opposite direction of the first direction to be flush with the first electrode end.

8. The chip inductor according to claim 1, characterized in that: The coil body has a parallel bottom surface and a top surface, and the two electrode ends of the coil body are located between the top surface and the bottom surface. The magnets include a first magnet, a second magnet and a third magnet; the first magnet is arranged between the electrode end and the bottom surface of the coil body, the second magnet is arranged above the first magnet and the coil body, and avoids the electrode end and the area from the electrode end to the edge of the first magnet, and the third magnet is arranged below the first magnet and the coil body.

9. The chip inductor according to claim 8, characterized in that: The coil body comprises: a plurality of conductive coils; A plurality of insulating films, wherein the insulating films and the conductive coils are stacked and spaced apart along a first direction; each of the insulating films comprises at least one through hole, and the through holes on adjacent insulating films are staggered; and A contact point is disposed in each of the through holes so as to allow electrical contact between the conductive coils located on both sides of the through hole; Among them, an electrode layer separated from the coil body is also arranged above the starting end of the first conductive coil, and the electrode layer is electrically connected to the first conductive coil through contacts; the ends of the electrode layer and the top conductive coil are the electrode ends of the coil body.

10. The chip inductor according to claim 9, characterized in that: The end of the conductive coil of the top layer is bent toward the first conductive coil and away from the coil body, and the upper surface of the end of the conductive coil of the top layer is located at the same horizontal plane as the upper surface of the electrode layer; Or, The end of the top conductive coil is bent towards the starting end of the first conductive coil, and the ends are bent away from the coil body. The upper surface of the end of the top conductive coil and the upper surface of the electrode layer are located in the same horizontal plane.

11. The chip inductor according to claim 8, characterized in that: The coil body comprises: a plurality of conductive coils; A plurality of insulating films, wherein the insulating films and the conductive coils are stacked and spaced apart along a first direction; each of the insulating films comprises at least one through hole, and the through holes on adjacent insulating films are staggered; and A contact point is disposed in each of the through holes so as to allow electrical contact between the conductive coils located on both sides of the through hole; The end of the top conductive coil is bent toward the first conductive coil and away from the coil body. The upper surface of the end of the top conductive coil and the upper surface of the starting end of the first conductive coil are located in the same horizontal plane; the upper surface of the end of the top conductive coil and the upper surface of the starting end of the first conductive coil are electrode ends.

12. A power module, characterized in that: The chip inductor comprises the chip inductor as claimed in any one of claims 1 to 3, and further comprises a power chip, a packaging base and a plastic cover; The chip inductor and the power chip are mounted on the package base, the electrode end of the chip inductor is bonded to the pin of the power chip or the pin of the package base through a metal lead, and the pin of the power chip is bonded to the relevant pin of the package base through a metal lead; The plastic cover is arranged on the packaging base, and the edges of the two are aligned.

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