Chip eutectic soldering pressing block, chip eutectic soldering positioning piece and soldering device

Abstract

The utility model provides a chip eutectic soldering pressing block, a chip eutectic soldering positioning sheet and a soldering device, the pressing block comprises a pressing block body made of ceramic material, and the pressing block body is provided with a plurality of salient points. According to the utility model, as the chip eutectic soldering pressing block and the chip eutectic soldering positioning sheet are both made of the ceramic material, the cost is reduced, the flatness is improved, the chip eutectic soldering pressing block and the chip eutectic soldering positioning sheet are prevented from being adhered with soldering tin during eutectic soldering, demolding is easy, dust cannot fall off, and the surface of the chip is prevented from being polluted. Meanwhile, the pressing block body and the positioning body can be respectively processed by adopting a laser processing technology to form the convex points and the accommodating grooves, so that the processing stress is eliminated, the thicknesses of the chip eutectic welding pressing block and the chip eutectic welding positioning piece and the sizes of the convex points and the accommodating grooves are not limited, the convex points with any patterns and the accommodating grooves with any micro-spacing can be processed, and the chip eutectic welding pressing block can be used for chip eutectic welding. The heights, sizes and positions of the salient points and the accommodating grooves can be flexibly designed according to the patterns on the surface of the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of chip eutectic welding, in particular to a chip eutectic welding pressing block, a chip eutectic welding positioning sheet and a welding device. Background Art

[0002] RF power amplifier chips convert weak radio signals into powerful signals through amplification circuits to transmit data in wireless communications. This process requires high-precision process manufacturing and the coordinated work of multiple transistors to ensure signal stability and quality.

[0003] RF power amplifier tube chips are high-power chips, and vacuum eutectic welding is usually used to connect the chip to the substrate. In order to obtain eutectic welding effects with high conductivity, high thermal conductivity and low void rate, the RF power amplifier tube chip eutectic welding in a vacuum furnace requires: 1) Use positioning pieces to position the chip and device, generally requiring a positioning accuracy of 25 microns. 2) A pressure block is required to apply pressure to the chip and device. When applying pressure, avoid sensitive areas of the chip, such as air bridge areas, etc. The pressure of the pressure block can overcome the tension after the solder melts, ensure the welding void rate, and avoid the device from floating and tilting.

[0004] At present, the materials and processing methods used for existing positioning pieces and pressing blocks are as follows:

[0005] 1) The positioning plate is made of graphite / metal material and processed by wire cutting / CNC milling. Due to the size of the processing tool itself, this processing method cannot process holes with small spacing, and the processing cycle is long, resulting in inaccurate positions between the device positioning grooves processed on the positioning plate, resulting in low precision.

[0006] 2) The pressing block is made of graphite / metal material, and the processing methods of the pressing block mainly adopt the following two methods: one is to use machining method to mill out the air-avoiding area, and the remaining area is the bump of the pressing block, and the device is pressed by the bump during welding. However, the machining method is difficult, especially for the processing of micro-sizes. For example, some chips are very small, only about 0.5mm in size, and their contactable area is even smaller, only about 0.15mm, which cannot be processed by machining. The second is to make gold bumps on the metallized substrate that only touch the contactable area of ​​the chip. This method requires the substrate to be plated with thick gold, and a special wire bonding process is required to make the gold bumps. The height consistency of the gold bumps is difficult to control, and the position accuracy of the gold bumps is also difficult to control. The height of the micro-bumps made of gold is the same, and devices of different heights cannot be pressed at one time.

[0007] At the same time, the existing positioning blocks and pressing blocks also have the following disadvantages:

[0008] 1) Graphite materials are prone to dust during use, which pollutes the chip surface;

[0009] 2) When using metal materials, the surface needs special treatment, otherwise the solder will adhere to the metal block under high temperature and it is difficult to demold. In addition, the thermal expansion coefficient of the metal is very different from that of the chip, which may cause the chip to crack during the welding process. At the same time, the flatness of the positioning piece or pressing block made of metal material is difficult to control and cannot meet the stringent flatness requirements of the chip eutectic. Utility Model Content

[0010] The utility model aims to overcome the deficiencies of the prior art and provide a chip eutectic welding pressing block, a chip eutectic welding positioning sheet and a welding device, which can reduce costs, improve flatness, avoid adhesion with solder during eutectic welding, facilitate demoulding, and prevent dust from falling off, thus avoiding contamination of the chip surface. At the same time, the thickness of the chip eutectic welding pressing block and the chip eutectic welding positioning sheet, as well as the size of the bumps and the receiving grooves are not restricted, and bumps of any pattern and receiving grooves of any micro pitch can be processed. The height, size and position of the bumps and the receiving grooves can be flexibly designed according to the pattern on the chip surface.

[0011] The technical solution of the utility model provides a chip eutectic welding pressing block, which comprises a pressing block body made of ceramic material, and a plurality of convex points are arranged on the pressing block body.

[0012] In one of the optional technical solutions, the heights of the plurality of protrusions are different.

[0013] In one of the optional technical solutions, the height of the bump is greater than the difference between the thickness of the positioning sheet and the thickness of the chip.

[0014] In one of the optional technical solutions, the pressing block body and the protrusions are integrally formed.

[0015] In one of the optional technical solutions, the protrusions are made by laser etching process.

[0016] The technical solution of the utility model further provides a chip eutectic welding positioning sheet, comprising a positioning body made of ceramic material, wherein the positioning body is provided with a plurality of accommodating grooves for accommodating chips.

[0017] In one of the optional technical solutions, the accommodating groove and the positioning body are integrally formed.

[0018] In one of the optional technical solutions, the receiving groove is made by laser etching process.

[0019] The technical solution of the utility model also provides a chip eutectic welding device, comprising the chip eutectic welding pressing block as mentioned above, and the chip eutectic welding positioning sheet as mentioned above.

[0020] In one of the optional technical solutions, it also includes a soldering sheet, and the chip eutectic soldering pressing block, the chip eutectic soldering positioning sheet and the soldering sheet are stacked in sequence from top to bottom.

[0021] After adopting the above technical solution, the following beneficial effects are achieved: since the chip eutectic welding block and the chip eutectic welding positioning sheet are both made of ceramic materials, the cost is reduced, the flatness is improved, the adhesion with solder during eutectic welding is avoided, the mold is easy to demould, and dust will not fall off, thus avoiding the pollution of the chip surface. At the same time, since they are made of ceramic materials, the laser processing technology can be used to process the convex points and the accommodating grooves of the block body and the positioning body respectively, which can eliminate the processing stress. The thickness of the chip eutectic welding block and the chip eutectic welding positioning sheet, as well as the size of the convex points and the accommodating grooves are not limited, and the convex points of any pattern and the accommodating grooves of any micro pitch can be processed. The height, size and position of the convex points and the accommodating grooves can be flexibly designed according to the chip surface pattern, thus avoiding the limitation of the tool or the size of the tool itself in the existing processing method. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The disclosure of the present invention will become easier to understand with reference to the accompanying drawings. It should be understood that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In the drawings:

[0023] Figure 1 This is a schematic structural diagram of a chip eutectic welding block provided by an embodiment of the utility model;

[0024] Figure 2 This is a schematic structural diagram of a chip eutectic welding positioning sheet provided by an embodiment of the utility model;

[0025] Figure 3 It is a structural schematic diagram of a chip eutectic welding device provided by an embodiment of the utility model; DETAILED DESCRIPTION

[0026] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings.

[0027] It is easy to understand that according to the technical solution of the utility model, without changing the essential spirit of the utility model, a variety of structural modes and implementation modes can be replaced by those skilled in the art. Therefore, the following specific implementation methods and drawings are only exemplary descriptions of the technical solution of the utility model, and should not be regarded as the entirety of the utility model or as a limitation or restriction on the technical solution of the utility model.

[0028] The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to the structures shown in the drawings. They are relative concepts and may change accordingly according to different positions and different usage conditions. Therefore, these or other directional terms should not be interpreted as restrictive terms.

[0029] like Figure 1 As shown, Figure 1 It is a schematic structural diagram of a chip eutectic welding press block provided by an embodiment of the utility model, comprising a press block body 11 made of a ceramic material, and a plurality of bumps 12 are arranged on the press block body 11.

[0030] The chip eutectic welding block provided in this embodiment mainly includes a block body 11 and a bump 12. The bump 12 is used to apply pressure to the contactable area of ​​the chip, so as to overcome the tension effect after the solder melts, ensure the welding void rate, and avoid the chip from floating and tilting. The block body 11 is a ceramic sheet made of ceramic material, including an aluminum oxide / aluminum nitride / zirconium oxide ceramic sheet, which has low cost and high flatness. It will not adhere to the solder when the chip is eutectic welded, is easy to demould, and will not drop dust, avoiding pollution of the chip surface. At the same time, since it is made of ceramic material, the laser processing technology can be used to process the bump 12 on the block body 11 to eliminate the processing stress. The thickness of the chip eutectic welding block and the size of the bump 12 are not limited, and any graphics (such as right-angle inner holes) and micro-pitch holes can be processed. The height, size, and position of the bump 12 can be flexibly designed according to the chip surface graphics, avoiding the limitation of the existing block due to the size of the tool or tool itself due to the machining method.

[0031] The number of bumps 12 corresponds to the number of chips, and each bump 12 corresponds to one chip.

[0032] In this embodiment, the chip eutectic welding block has a block body made of ceramic material, which reduces costs, improves flatness, avoids adhesion with solder during eutectic welding, is easy to demould, and does not drop dust, avoiding contamination of the chip surface. At the same time, since the block body is made of ceramic material, laser processing technology can be used to process bumps on the block body to eliminate processing stress. The thickness of the chip eutectic welding block and the size of the bumps are not limited, and any graphics (such as right-angle inner holes) and micro-pitch holes can be processed. The height, size, and position of the bumps can be flexibly designed according to the chip surface graphics, avoiding the limitation of the existing block due to the size of the tool or tool itself due to the machining method.

[0033] In one embodiment, the heights of the plurality of protrusions 12 are different.

[0034] The pressing block body 11 is etched with laser etched protrusions 12 of different heights with high precision. Figure 1 As shown, the heights of the bumps 12 are 0.05 mm, 0.15 mm and 0.2 mm, so that the chip eutectic welding block can press chips of different thicknesses at the same time, thereby improving work efficiency.

[0035] in, Figure 1 The height of the bump 12 shown is for the sake of illustration only, and the height of the bump 12 is not limited to Figure 1 As shown, the height of the bump 12 corresponds to the thickness of the chip. The thicker the chip, the smaller the height of the bump 12.

[0036] In one embodiment, the height of the bump 12 is greater than the difference between the thickness of the positioning plate and the thickness of the chip. For example, if the thickness of the positioning plate is 0.3 mm, the thickness of the chip is 0.1 mm, and the height of the bump 12 is greater than 0.2 mm; if the thickness of the positioning plate is 0.3 mm, the thickness of the chip is 0.25 mm, and the height of the bump 12 is greater than 0.05 mm, the bump 12 can reduce the voids of the chip during the pressure application process, thereby further ensuring the welding void rate and preventing the chip from floating and tilting.

[0037] In one embodiment, in order to further improve the connection stability, the pressing block body 11 and the protrusion 12 are integrally formed.

[0038] In one embodiment, in order to facilitate the production of the bumps and improve the accuracy, the bumps 12 are produced by laser etching.

[0039] like Figure 2 As shown, Figure 2 The schematic structural diagram of a chip eutectic welding positioning sheet provided in one embodiment of the utility model comprises a positioning body 21 made of ceramic material, and a plurality of accommodating grooves 22 for accommodating chips are provided on the positioning body 21.

[0040] The chip eutectic welding positioning sheet provided in this embodiment mainly includes a positioning body 21 and a receiving groove 22. The receiving groove 22 is used to accommodate the chip. When welding, the chip is placed in the receiving groove 22 to realize the positioning function of the chip. The positioning body 21 is a ceramic sheet made of ceramic material, including an aluminum oxide / aluminum nitride / zirconium oxide ceramic sheet, which has low cost and high flatness. When the chip is eutectic welded, it will not adhere to the solder, is easy to demould, and will not drop dust, avoiding pollution of the chip surface. At the same time, since it is made of ceramic material, the positioning body 21 can be processed by laser processing technology, and the receiving groove 22 can be cut downward to eliminate processing stress. The thickness of the chip eutectic welding positioning sheet and the size of the receiving groove 22 are not limited, and the receiving groove 22 with any micro pitch can be processed. The position between multiple receiving grooves 22 is accurate, and the accuracy is improved. The height, size, and position of the receiving groove 22 can be flexibly designed according to the chip surface pattern, avoiding the limitation of the size of the tool or tool itself of the existing positioning sheet due to the wire cutting / CNC milling processing method, and the inability to process holes or grooves with small spacing.

[0041] In this embodiment, the chip eutectic welding positioning piece has a positioning body made of ceramic material, which reduces costs, improves flatness, avoids adhesion with solder during eutectic welding, is easy to demould, and does not drop dust, avoiding contamination of the chip surface. At the same time, since the positioning body is made of ceramic material, a laser processing process can be used to process the positioning body to form a receiving groove to eliminate processing stress. The thickness of the chip eutectic welding positioning piece and the size of the receiving groove are not limited, and any micro-pitch receiving grooves can be processed. The positions between multiple receiving grooves are accurate, and the accuracy is improved. The height, size, and position of the receiving groove can be flexibly designed according to the chip surface pattern, avoiding the limitation of the size of the tool or tool itself of the existing positioning piece due to the wire cutting / CNC milling processing method, and the inability to process holes or grooves with small spacing.

[0042] In one embodiment, in order to further improve the connection stability, the receiving groove 22 and the positioning body 21 are integrally formed.

[0043] In one embodiment, in order to facilitate the production of the receiving groove and improve the accuracy, the receiving groove 22 is made by laser etching process.

[0044] like Figure 3 As shown, Figure 3 A schematic structural diagram of a chip eutectic welding device provided in one embodiment of the utility model comprises the chip eutectic welding pressing block 10 as mentioned above, and the chip eutectic welding positioning sheet 20 as mentioned above.

[0045] The chip eutectic welding device provided in this embodiment mainly includes a chip eutectic welding block 10 and a chip eutectic welding positioning sheet 20. The block body 11 of the chip eutectic welding block 10 and the positioning body 21 of the chip eutectic welding positioning sheet 20 are both made of ceramic materials, thereby reducing costs, improving flatness, avoiding adhesion with solder during eutectic welding, and being easy to demould, and not dropping dust, thereby avoiding contamination of the chip surface. At the same time, since the block body 11 and the positioning body 21 are made of ceramic materials, the block body 11 and the positioning body 21 can be processed into bumps 12 and receiving grooves 22 respectively by laser processing technology to eliminate processing stress. The thickness of the chip eutectic welding block 10 and the chip eutectic welding positioning sheet 20, as well as the size of the bumps 12 and the receiving grooves 22 are not limited. Any bumps 12 of any pattern and any receiving grooves 22 of any micro pitch can be processed. The height, size, and position of the bumps 12 and the receiving grooves 22 can be flexibly designed according to the chip surface pattern, avoiding being limited by the size of the tool or tool itself of the existing processing method.

[0046] In one of the embodiments, in order to facilitate welding and further improve work efficiency, a welding sheet 31 is also included, and the chip eutectic welding block 10, the chip eutectic welding positioning sheet 20 and the welding sheet 31 are stacked in sequence from top to bottom.

[0047] The chip eutectic welding device also includes a welding piece 31, which is used to weld the chip 32 to the tube shell during welding. When in use, the chip eutectic welding positioning piece 20 is placed on the welding piece 31, and then the chip 32 is placed in the receiving groove 22 of the chip eutectic welding positioning piece 20, and finally the chip eutectic welding block 10 is placed on the chip eutectic welding positioning piece 20.

[0048] The above description is only the principle and preferred embodiment of the utility model. It should be pointed out that for ordinary technicians in this field, on the basis of the principle of the utility model, several other variations can be made, which should also be regarded as the protection scope of the utility model.

Claims

1. A chip eutectic welding block, characterized in that: The invention comprises a pressing block body made of ceramic material, wherein a plurality of convex points are arranged on the pressing block body.

2. The chip eutectic welding block according to claim 1, characterized in that: The heights of the plurality of protrusions are different.

3. The chip eutectic welding block according to claim 2, characterized in that: The height of the bump is greater than the difference between the thickness of the positioning sheet and the thickness of the chip.

4. The chip eutectic welding block according to any one of claims 1 to 3, characterized in that: The pressing block body and the protrusions are integrally formed.

5. The chip eutectic welding block according to claim 4, characterized in that: The convex points are made by laser etching process.

6. A chip eutectic welding positioning sheet, characterized in that: The invention comprises a positioning body made of ceramic material, on which a plurality of accommodating grooves for accommodating chips are arranged.

7. The chip eutectic welding positioning sheet according to claim 6, characterized in that: The accommodating groove and the positioning body are integrally formed.

8. The chip eutectic welding positioning sheet according to claim 7, characterized in that: The containing groove is made by laser etching process.

9. A chip eutectic welding device, characterized in that: It comprises the chip eutectic welding pressing block as described in any one of claims 1 to 5, and the chip eutectic welding positioning sheet as described in any one of claims 6 to 8.

10. The chip eutectic bonding device according to claim 9, characterized in that: It also includes a welding sheet, and the chip eutectic welding pressing block, the chip eutectic welding positioning sheet and the welding sheet are stacked in sequence from top to bottom.

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