Wafer film pasting platform

Abstract

The utility model discloses a wafer film pasting platform which comprises a transverse moving frame, a transverse moving driving module, a height adjusting assembly, a lifting assembly and a rotating assembly, an adsorption platform is used for adsorbing a wafer to be pasted with a film, an auxiliary supporting platform is used for supporting a film material when the inner ring film material is cut, and the transverse moving driving module is configured to drive the transverse moving frame to move. The height adjusting assembly is configured to drive the auxiliary supporting platform to a high position or a low position, the lifting assembly is configured to drive the adsorption platform to ascend to a preset height and place a wafer on the adsorption platform, and the rotating assembly is configured to drive the adsorption platform to rotate by a preset angle so as to drive the wafer on the adsorption platform to rotate. The wafer film pasting platform is simple in structure and ingenious in design, two or more layers of films can be pasted on the wafer at a time, meanwhile, the film pasting angle can be adjusted, multiple times of film pasting are not needed, in addition, the wafers within a certain size range can be subjected to film pasting on the same platform, compatibility is remarkably improved, and cost is greatly reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing, and in particular relates to a wafer film attaching platform. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. The silicon crystal rod is then ground, polished, and sliced ​​to form a silicon wafer, also known as a wafer.

[0003] As we all know, during the wafer processing, multiple protective films are pasted on the wafer surface to protect the wafer when cutting. At present, the wafer film pasting platform is basically fixed in a certain position. Each platform corresponds to a wafer size and is not compatible with multiple product sizes. In addition, the platform only has an adsorption function but no steering function. However, in the specific film pasting process, the film pasting platform is often rotated to different angles for film pasting. Obviously, the existing film pasting platform cannot adapt to the film pasting requirements of multiple products and complex processes, and it is urgent to solve this problem. Utility Model Content

[0004] The utility model aims to provide a wafer film attaching platform to solve the problem that the conventional film attaching platform in the prior art cannot adapt to the film attaching requirements of various products and complex processes.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A wafer film attaching platform includes a traverse frame, a traverse drive module, a height adjustment component, a lifting component and a rotating component, wherein:

[0007] The traverse frame is provided with an adsorption platform and an auxiliary support platform, both of which can be lifted and lowered on the traverse frame, with a gap between the adsorption platform and the auxiliary support platform, the adsorption platform is configured to adsorb the wafer to be filmed, and the auxiliary support platform is configured to support the film material when cutting the inner ring film material.

[0008] The driving end of the transverse driving module is connected to the transverse frame, and the transverse driving module is configured to drive the transverse frame to move back and forth between the positioning detection unit and the film cutting unit. A film pasting unit is provided on one side of the film cutting unit. The positioning detection unit is at least configured to detect whether the film material on the adsorption platform is pasted in place. The film cutting unit is configured to cut off the film material except the film material on the adsorption platform. The film pasting unit is configured to attach the film material to the adsorption platform.

[0009] The driving end of the height adjustment component is connected to the auxiliary support platform, and the height adjustment component is configured to drive the auxiliary support platform to a high position or a low position. When the auxiliary support platform is in a high position, the auxiliary support platform will support the film material on the adsorption platform.

[0010] The lifting assembly is configured to drive the adsorption platform to rise to a preset height so as to place the film material on the wafer located on the adsorption platform.

[0011] The driving end of the rotating assembly is connected to the adsorption platform, and the rotating assembly is configured to drive the adsorption platform to rotate a preset angle to drive the wafer on the adsorption platform to rotate.

[0012] During operation, the transverse driving module drives the transverse frame to move to the positioning detection unit to perform positioning detection on the wafer on the adsorption platform, and then moves to the film pasting unit to perform the first film pasting, and the film cutting unit performs the first cutting on the outer ring film material of the wafer after film pasting, and the rotating component drives the adsorption platform to rotate by a preset angle, and the transverse driving module drives the transverse frame to move to the positioning detection unit to perform positioning detection on the film piece on the adsorption platform after the first cutting, and then moves to the film pasting unit to perform the second film pasting, and the height adjustment component drives the auxiliary support platform to rise to a high position, and the film cutting unit performs the second cutting on the inner ring film material of the wafer after film pasting through the gap between the adsorption platform and the auxiliary support platform, and the transverse driving module drives the transverse frame to move to the positioning detection unit to perform positioning detection on the film piece on the adsorption platform after the second cutting.

[0013] Furthermore, the transverse driving module includes a transverse driving motor, a transverse guiding assembly and a connecting member, wherein the transverse guiding assembly extends along a first direction, and the connecting member can be slidably disposed on the transverse guiding assembly, wherein the first end of the connecting member is connected to the driving end of the transverse driving motor, and the second end of the connecting member is connected to the transverse frame, and the transverse driving motor drives the connecting member to reciprocate on the transverse guiding assembly to drive the transverse frame to move.

[0014] Furthermore, the transverse guide assembly includes two guide rails, and the two guide rails are arranged at opposite sides of the transverse frame at intervals along a second direction, and the second direction is perpendicular to the first direction.

[0015] Furthermore, the lifting assembly includes a lifting drive motor and a lifting platform, the adsorption platform is located on the lifting platform, the fixed end of the lifting drive motor is arranged on the transverse frame, the movable end of the lifting drive motor is connected to the lifting platform, and the lifting drive motor drives the lifting platform to rise, so as to drive the adsorption platform to a preset height.

[0016] Furthermore, at least two floating devices and adsorption components are arranged on the lifting platform below the adsorption platform. The adsorption component is configured to adsorb the film material located on the adsorption platform. At least two of the floating devices are symmetrically arranged on opposite sides of the lifting platform to cushion the movement of the adsorption platform.

[0017] Furthermore, each of the floating devices includes a linear bearing and a buffer, the bottom end of the linear bearing is passed through and fixed on the lifting platform, the top end of the linear bearing is connected to the adsorption platform, and each buffer is sleeved on the corresponding linear bearing.

[0018] Furthermore, the rotating assembly includes a rotating drive member and a rotating platform, the adsorption platform is located on the rotating platform, the fixed end of the rotating drive member is arranged on the transverse frame, the movable end of the rotating drive member is connected to the rotating platform, and the rotating drive member drives the rotating platform to rotate a preset angle to drive the adsorption platform to rotate.

[0019] Furthermore, the rotary drive member adopts a servo motor.

[0020] Furthermore, the height adjustment component is located on the rotating platform, and the height adjustment component includes at least two adjustment driving components and a lifting component. The auxiliary support platform is located on the lifting component, at least two of the adjustment driving components are symmetrically arranged on opposite sides of the rotating platform, the fixed ends of at least two of the adjustment driving components are installed on the rotating platform, the driving ends of at least two of the adjustment driving components are connected to the lifting component, and at least two of the adjustment driving components drive the lifting component to rise and fall to drive the auxiliary support platform to a high position or a low position.

[0021] Furthermore, two adjusting drive members are provided, and both of the two adjusting drive members adopt lifting cylinders.

[0022] Compared with the prior art, the beneficial effects of the wafer film pasting platform are as follows: the transverse driving module drives the transverse frame to move to the film pasting unit for the first film pasting, the film cutting unit performs the first cutting on the outer ring film material of the wafer after film pasting, the rotating component drives the adsorption platform to rotate a preset angle, the transverse driving module drives the transverse frame to move to the film pasting unit for the second film pasting, and the film cutting unit performs the second cutting on the inner ring film material of the wafer after film pasting. It not only has a simple structure and ingenious design, but also can paste two or more layers of film on the wafer at one time, and can also adjust the film pasting angle at the same time, without the need for multiple film pasting. In addition, wafers within a certain size range can be pasted on the same platform, which significantly improves compatibility and greatly reduces costs. A floating device is added to buffer the descent of the wafer during film pasting to avoid hard contact. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate and understand the technical solutions in the embodiments of the present invention, the following briefly introduces the background technology of the present invention and the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0024] Figure 1 It is a three-dimensional structural schematic diagram of a wafer film attaching platform provided by an embodiment of the utility model;

[0025] Figure 2 It is a top view schematic diagram of a wafer film attaching platform provided by an embodiment of the utility model;

[0026] Figure 3 It is a side view schematic diagram of a wafer film attaching platform provided by an embodiment of the utility model;

[0027] Figure 4 It is a cross-sectional schematic diagram of a wafer film attaching platform provided in one embodiment of the utility model. DETAILED DESCRIPTION

[0028] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0029] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings. The preferred embodiments of the utility model are given in the drawings. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thoroughly understood. It should be noted that when a component is referred to as "fixed to" another component, it can be directly on another component or there can also be a central component. When a component is considered to be "connected" to another component, it can be directly connected to another component or there may be a central component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and are not intended to be the only implementation method. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the utility model. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0030] See also Figures 1 to 4As shown, in this embodiment, a wafer film pasting platform includes a transverse frame 1, a transverse driving module 2, a height adjustment component 3, a lifting component 4 and a rotating component 5, wherein the transverse frame 1 is provided with an adsorption platform 10 and an auxiliary support platform 11, the adsorption platform 10 and the auxiliary support platform 11 can be lifted and lowered on the transverse frame 1, there is a gap between the adsorption platform 10 and the auxiliary support platform 11, the adsorption platform 10 is configured to adsorb the wafer to be pasted with film, the auxiliary support platform 11 is configured to support the film material when cutting the inner circle film material, the driving end of the transverse driving module 2 is connected to the transverse frame 1, the transverse driving module 2 is configured to drive the transverse frame 1 to reciprocate between the positioning detection unit and the film cutting unit, a film pasting unit is provided on one side of the film cutting unit, and the positioning detection unit is at least configured to It is detected whether the film material on the adsorption platform 10 is in place, the film cutting unit is configured to cut off the film material on the adsorption platform 10, the film sticking unit is configured to attach the film material to the adsorption platform 10, the driving end of the height adjustment component 3 is connected to the auxiliary support platform 11, the height adjustment component 3 is configured to drive the auxiliary support platform 11 to a high position or a low position, when the auxiliary support platform 11 is in a high position, the auxiliary support platform 11 supports the film material on the adsorption platform 10, the lifting component 4 is configured to drive the adsorption platform 10 to rise to a preset height to place the film material on the wafer located on the adsorption platform 10, the driving end of the rotating component 5 is connected to the adsorption platform 10, and the rotating component 5 is configured to drive the adsorption platform 10 to rotate a preset angle to drive the wafer located on the adsorption platform 10 to rotate.

[0031] During operation, the transverse driving module 2 drives the transverse frame 1 to move to the positioning detection unit to perform positioning detection on the wafer on the adsorption platform 10, and then moves to the film pasting unit for the first film pasting. The film cutting unit performs the first cutting on the outer ring film material of the wafer after film pasting. The rotating component 5 drives the adsorption platform 10 to rotate a preset angle. The transverse driving module 2 drives the transverse frame 1 to move to the positioning detection unit to perform positioning detection on the film piece on the adsorption platform 10 after the first cutting, and then moves to the film pasting unit for the second film pasting. The height adjustment component 3 drives the auxiliary support platform 11 to rise to a high position. The film cutting unit performs the second cutting on the inner ring film material of the wafer after film pasting through the gap between the adsorption platform 10 and the auxiliary support platform 11. The transverse driving module 2 drives the transverse frame 1 to move to the positioning detection unit to perform positioning detection on the film piece on the adsorption platform 10 after the second cutting.

[0032] It can be seen that the transverse driving module 2 drives the transverse frame 1 to move to the film pasting unit for the first film pasting, and the film cutting unit performs the first cutting on the outer circle film material of the wafer after film pasting, and the rotating component 5 drives the adsorption platform 10 to rotate the preset angle, and the transverse driving module 2 drives the transverse frame 1 to move to the film pasting unit for the second film pasting, and the film cutting unit performs the second cutting on the inner circle film material of the wafer after film pasting. It not only has a simple structure and ingenious design, but also can paste two or more layers of film on the wafer at one time, and can also adjust the film pasting angle at the same time, without the need for multiple film pasting, and wafers within a certain size range can be pasted on the same platform, which significantly improves compatibility and greatly reduces costs.

[0033] As an embodiment, the transverse driving module 2 includes a transverse driving motor 20, a transverse guiding assembly 21 and a connecting member 22. The transverse guiding assembly 21 moves in a first direction ( Figure 1 The connecting member 22 extends in the X direction in the transverse direction, the connecting member 22 can be slidably arranged on the transverse guide assembly 21, the first end of the connecting member 22 is connected to the driving end of the transverse drive motor 20, the second end of the connecting member 22 is connected to the transverse frame 1, and the transverse drive motor 20 drives the connecting member 22 to reciprocate on the transverse guide assembly 21 to drive the transverse frame 1 to move.

[0034] As an embodiment, the lateral guide assembly 21 includes two guide rails 210, and the two guide rails 210 are arranged along the second direction ( Figure 1 The two guide rails 210 (in the Y direction) are spaced apart on the opposite sides of the transverse moving frame 1. Obviously, the transverse moving frame 1 reciprocates on the two guide rails 210, which further improves the stability of the movement.

[0035] As an embodiment, the lifting assembly 4 includes a lifting drive motor 40 and a lifting platform 41. The adsorption platform 10 is located on the lifting platform 41. The fixed end of the lifting drive motor 40 is set on the transverse frame 1. The movable end of the lifting drive motor 40 is connected to the lifting platform 41. The lifting drive motor 40 drives the lifting platform 41 to rise, so as to drive the adsorption platform 10 to a preset height.

[0036] As an embodiment, two floating devices 6 and an adsorption component 7 are provided on the lifting platform 41 below the adsorption platform 10. The adsorption component 7 is configured to adsorb the film material located on the adsorption platform 10. The two floating devices 6 are symmetrically arranged on opposite sides of the lifting platform 41 to buffer the movement of the adsorption platform 10.

[0037] It can be seen that the floating device 6 is added to buffer the descent of the wafer during film lamination to avoid hard contact.

[0038] As an embodiment, each floating device 6 includes a linear bearing 60 and a buffer. The bottom end of the linear bearing 60 is fixed on the lifting platform 41, and the top end of the linear bearing 60 is connected to the adsorption platform 10. Each buffer is mounted on the corresponding linear bearing 60.

[0039] As an embodiment, the rotating assembly 5 includes a rotating driving member 50 and a rotating platform 51. The adsorption platform 10 is located on the rotating platform 51. The fixed end of the rotating driving member 50 is set on the transverse frame 1. The movable end of the rotating driving member 50 is connected to the rotating platform 51. The rotating driving member 50 drives the rotating platform 51 to rotate a preset angle to drive the adsorption platform 10 to rotate.

[0040] As an implementation mode, the rotating driving member 50 adopts a servo motor. Obviously, the servo motor is used to drive the rotating platform 51 to rotate, thereby driving the adsorption platform 10 to rotate, thereby improving the accuracy of the rotation, and can adjust the rotation of different wafers at different angles, which significantly improves the applicability of the equipment.

[0041] As an embodiment, the height adjustment component 3 is located on the rotating platform 51, and the height adjustment component 3 includes two adjustment driving components 30 and a lifting component 31. The auxiliary support platform 11 is located on the lifting component 31. The two adjustment driving components 30 are symmetrically arranged on opposite sides of the rotating platform 51. The fixed ends of the two adjustment driving components 30 are installed on the rotating platform 51, and the driving ends of the two adjustment driving components 30 are connected to the lifting component 31. The two adjustment driving components 30 drive the lifting component 31 to rise and fall, so as to drive the auxiliary support platform 11 to a high position or a low position.

[0042] As an implementation manner, two adjusting driving members 30 are provided, and both adjusting driving members 30 adopt lifting cylinders.

[0043] When the wafer film pasting platform is working: the transverse driving motor 20 drives the connecting member 22 to move, driving the transverse frame 1 to move to the positioning detection unit, and the positioning detection unit performs positioning detection on the wafer on the adsorption platform 10. After the detection is completed, the transverse driving motor 20 drives the transverse frame 1 to move to the film pasting unit for the first film pasting. At this time, the adjusting driving member 30 drives the auxiliary support platform 11 to the low position, the lifting driving motor 40 drives the lifting platform 41 to descend, and the film cutting unit performs the first cutting of the outer ring film material of the wafer after film pasting; after the cutting is completed, the rotating driving member 50 drives the adsorption platform 10 to rotate at a preset angle, and the transverse driving motor 20 drives the connecting member 22 to move, driving the transverse frame 1 to move to the positioning detection unit. The positioning detection unit performs positioning detection on the film sheet after the first cutting on the adsorption platform 10; after the detection is completed, the transverse driving motor 20 drives the transverse frame 1 to move to the film pasting unit for the second film pasting. At this time, the adjustment driving member 30 drives the auxiliary supporting platform 11 to rise to a high position, and the film cutting unit performs a second cutting on the inner circle film material of the wafer after the film pasting through the gap between the adsorption platform 10 and the auxiliary supporting platform 11, and the auxiliary supporting platform 11 supports the remaining film material except that on the adsorption platform 10; after the cutting is completed, the transverse driving motor 20 drives the connecting member 22 to move, driving the transverse frame 1 to move to the positioning detection unit, and the positioning detection unit performs positioning detection on the film sheet after the second cutting on the adsorption platform 10.

[0044] The above embodiments are only to illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above embodiments. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and modifications, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A wafer film attaching platform, characterized in that: The wafer film attaching platform includes a lateral shift frame, a lateral shift driving module, a height adjustment component, a lifting component and a rotating component, wherein: The traverse frame is provided with an adsorption platform and an auxiliary support platform, both of which can be lifted and lowered on the traverse frame, with a gap between the adsorption platform and the auxiliary support platform, the adsorption platform is configured to adsorb the wafer to be filmed, and the auxiliary support platform is configured to support the film material when cutting the inner ring film material. The driving end of the transverse driving module is connected to the transverse frame, and the transverse driving module is configured to drive the transverse frame to move back and forth between the positioning detection unit and the film cutting unit. A film pasting unit is provided on one side of the film cutting unit. The positioning detection unit is at least configured to detect whether the film material on the adsorption platform is pasted in place. The film cutting unit is configured to cut off the film material except the film material on the adsorption platform. The film pasting unit is configured to attach the film material to the adsorption platform. The driving end of the height adjustment component is connected to the auxiliary support platform, and the height adjustment component is configured to drive the auxiliary support platform to a high position or a low position. When the auxiliary support platform is in a high position, the auxiliary support platform will support the film material on the adsorption platform. The lifting assembly is configured to drive the adsorption platform to rise to a preset height so as to place the film material on the wafer located on the adsorption platform. The driving end of the rotating assembly is connected to the adsorption platform, and the rotating assembly is configured to drive the adsorption platform to rotate a preset angle to drive the wafer on the adsorption platform to rotate. During operation, the transverse driving module drives the transverse frame to move to the positioning detection unit to perform positioning detection on the wafer on the adsorption platform, and then moves to the film pasting unit to perform the first film pasting, and the film cutting unit performs the first cutting on the outer ring film material of the wafer after film pasting, and the rotating component drives the adsorption platform to rotate by a preset angle, and the transverse driving module drives the transverse frame to move to the positioning detection unit to perform positioning detection on the film piece on the adsorption platform after the first cutting, and then moves to the film pasting unit to perform the second film pasting, and the height adjustment component drives the auxiliary support platform to rise to a high position, and the film cutting unit performs the second cutting on the inner ring film material of the wafer after film pasting through the gap between the adsorption platform and the auxiliary support platform, and the transverse driving module drives the transverse frame to move to the positioning detection unit to perform positioning detection on the film piece on the adsorption platform after the second cutting.

2. The wafer film attaching platform according to claim 1, characterized in that: The transverse driving module includes a transverse driving motor, a transverse guiding assembly and a connecting member, wherein the transverse guiding assembly extends along a first direction, and the connecting member can be slidably arranged on the transverse guiding assembly, wherein the first end of the connecting member is connected to the driving end of the transverse driving motor, and the second end of the connecting member is connected to the transverse frame, and the transverse driving motor drives the connecting member to reciprocate on the transverse guiding assembly to drive the transverse frame to move.

3. The wafer film attaching platform according to claim 2, characterized in that: The transverse guide assembly includes two guide rails, and the two guide rails are arranged at opposite sides of the transverse frame at intervals along a second direction, and the second direction is perpendicular to the first direction.

4. The wafer film attaching platform according to claim 1, characterized in that: The lifting assembly includes a lifting drive motor and a lifting platform. The adsorption platform is located on the lifting platform. The fixed end of the lifting drive motor is arranged on the transverse moving frame. The movable end of the lifting drive motor is connected to the lifting platform. The lifting drive motor drives the lifting platform to rise, so as to drive the adsorption platform to a preset height.

5. The wafer film attaching platform according to claim 4, characterized in that: At least two floating devices and adsorption components are arranged on the lifting platform below the adsorption platform. The adsorption component is configured to adsorb the film material on the adsorption platform. At least two of the floating devices are symmetrically arranged on opposite sides of the lifting platform to buffer the movement of the adsorption platform.

6. The wafer film attaching platform according to claim 5, characterized in that: Each of the floating devices includes a linear bearing and a buffer. The bottom end of the linear bearing passes through and is fixed on the lifting platform. The top end of the linear bearing is connected to the adsorption platform. Each buffer is sleeved on the corresponding linear bearing.

7. The wafer film attaching platform according to claim 1, characterized in that: The rotating assembly includes a rotating drive member and a rotating platform. The adsorption platform is located on the rotating platform. The fixed end of the rotating drive member is arranged on the transverse frame. The movable end of the rotating drive member is connected to the rotating platform. The rotating drive member drives the rotating platform to rotate a preset angle to drive the adsorption platform to rotate.

8. The wafer film attaching platform according to claim 7, characterized in that: The rotary drive member adopts a servo motor.

9. The wafer film attaching platform according to claim 7, characterized in that: The height adjustment component is located on the rotating platform, and the height adjustment component includes at least two adjustment driving members and a lifting member. The auxiliary support platform is located on the lifting member, and at least two of the adjustment driving members are symmetrically arranged on opposite sides of the rotating platform. The fixed ends of at least two of the adjustment driving members are installed on the rotating platform, and the driving ends of at least two of the adjustment driving members are connected to the lifting member. At least two of the adjustment driving members drive the lifting member to rise and fall to drive the auxiliary support platform to a high position or a low position.

10. The wafer film attaching platform according to claim 9, characterized in that: There are two adjusting drive members, and both of the two adjusting drive members adopt lifting cylinders.

Images