Movable partition plate device and semiconductor cleaning equipment

Abstract

The utility model provides a movable partition plate device and semiconductor cleaning equipment. The movable partition plate device comprises a partition plate, a driving source and a supporting assembly used for connecting the partition plate and the driving source. The driving source is used for driving the partition to move; the supporting assembly comprises a first supporting piece, a second supporting piece and a first connecting piece. The first supporting piece is fixedly connected with the partition plate. The second supporting piece is fixedly connected with the driving source; the two opposite ends of the first supporting piece and the second supporting piece are connected through a first connecting piece. The first connecting piece can be broken when subjected to impact force with the specified magnitude, so that the connected ends of the first supporting piece and the second supporting piece are separated, and therefore when the mechanical arm device collides with the partition plate, the partition plate can fall off along with the first supporting piece in time, the situation that the partition plate blocks movement of the mechanical arm device can be avoided, and the service life of the mechanical arm device is prolonged. Therefore, the wafer clamped by the manipulator device can be prevented from colliding with the partition plate and being damaged.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor cleaning technology, and specifically relates to a movable partition device and semiconductor cleaning equipment. Background Art

[0002] At present, semiconductor cleaning equipment usually has multiple cleaning tanks to use different components of liquid medicine to adapt to different cleaning needs. In addition, multiple partitions are also arranged around each cleaning tank to prevent the volatile gases of different cleaning liquids from mixing and producing byproducts that affect the cleaning process or interfere with the stability of the microenvironment in the semiconductor cleaning equipment. The semiconductor cleaning equipment also has a manipulator device to grab the wafer and transfer the wafer between multiple cleaning tanks. In addition, the partitions between adjacent cleaning tanks can be movable to avoid the manipulator device during the transfer of the wafer, and reset after the wafer transfer is completed to block it between adjacent cleaning tanks.

[0003] However, during the operation and debugging of the semiconductor cleaning equipment, there is a risk of collision between the robot device and the partition, which may cause damage to the wafers clamped by the robot device, and may also cause damage to components in the semiconductor cleaning equipment, resulting in economic losses and safety accidents. Utility Model Content

[0004] The utility model at least partially solves the problem that a robot arm and a movable partition in existing semiconductor cleaning equipment may collide and easily cause damage to wafers, and provides a movable partition device and semiconductor cleaning equipment.

[0005] The utility model provides a movable partition device for use in semiconductor cleaning equipment; the movable partition device comprises: a partition, a driving source and a supporting assembly for connecting the partition and the driving source; wherein:

[0006] The driving source is used to drive the partition to move;

[0007] The support assembly includes a first support member, a second support member and a first connecting member; the first support member is fixedly connected to the partition; the second support member is fixedly connected to the driving source; the two opposite ends of the first support member and the second support member are connected by the first connecting member; the first connecting member can break when subjected to an impact force of a specified magnitude, so that the interconnected ends of the first support member and the second support member can be detached.

[0008] Optionally, the first support member has a mounting groove on one end close to the second support member; the second support member has a mounting block on one end close to the first support member that matches the shape of the mounting groove, and the mounting block is used to be plugged into the mounting groove;

[0009] The first connecting member includes a pin;

[0010] The first support member has a first pin connection hole that passes through the side wall of the mounting groove, and the second support member has a second pin connection hole that passes through the mounting protrusion; the first pin connection hole and the second pin connection hole are coaxially arranged; the pin passes through the first pin connection hole and the second pin connection hole to connect the first support member and the second support member; the pin is also used to break when subjected to an impact force of a specified magnitude, so as to separate the interconnected ends of the first support member and the second support member.

[0011] Optionally, the support assembly further includes a second connecting member; the second connecting member is made of a flexible material;

[0012] The second connecting member is fixedly connected to the first supporting member and the second supporting member respectively; the second connecting member is used to keep the first supporting member and the second supporting member connected after the ends of the first supporting member and the second supporting member that are connected to each other are detached.

[0013] Optionally, the first support member includes a first connecting rod; the second support member includes a second connecting rod; the first connecting rod and the second connecting rod are coaxially arranged;

[0014] The mounting groove has a first opening formed at the end of the first connecting rod and two second openings formed on both sides of the first connecting rod; the two second openings extend parallel to the axial direction of the first connecting rod;

[0015] The extending directions of the first pin connection hole and the second pin connection hole are perpendicular to the axial direction of the first connecting rod.

[0016] Optionally, the second connecting member includes a connecting rope; two ends of the connecting rope are respectively connected and fixed to the first supporting member and the second supporting member.

[0017] Optionally, a wire storage groove for accommodating the connecting rope is provided on the outer circumferential surface of the second support member; connecting nails are provided on the inner wall of the wire storage groove; connecting nails are also provided on the first support member; the two connecting nails are respectively used to connect the two ends of the connecting rope.

[0018] Optionally, the width of the bottom surface of the mounting groove in a direction parallel to the pin axis is greater than the width of the first opening in a direction parallel to the pin axis.

[0019] Optionally, both side walls of the mounting groove are provided with auxiliary grooves extending along the axis direction of the first connecting rod, and the cross section of the auxiliary groove in the direction perpendicular to the axis direction of the first connecting rod is a minor arc shape;

[0020] The mounting protrusion has an auxiliary protrusion which matches the shape of the auxiliary groove.

[0021] Optionally, an annular groove is provided on the outer peripheral surface of the pin; the annular groove is used to enable the pin to break when subjected to an impact force of a specified magnitude.

[0022] As another technical solution, an embodiment of the present invention further provides a semiconductor cleaning device, which includes a plurality of cleaning tanks, a robot device, and a movable partition device as described above;

[0023] The robot device is disposed above the plurality of cleaning tanks, and is used to clamp the wafer and drive the wafer to perform a cleaning process in the plurality of cleaning tanks;

[0024] The partition of the movable partition device is located above the notch of the cleaning tank, and is used to block between two adjacent cleaning tanks and avoid the robot device during the movement between the two adjacent cleaning tanks.

[0025] The utility model has the following beneficial effects:

[0026] The movable partition device provided by the embodiment of the utility model includes a support assembly for connecting the partition and the driving source, and the support assembly includes a first support member for connecting the partition, a second support member for connecting the driving source, and a first connecting member. The two opposite ends of the first support member and the second support member are connected by the first connecting member, and the first connecting member can break when subjected to an impact force of a specified magnitude, so that the two ends of the first support member and the second support member that are connected to each other are separated; in this way, when the robot device collides with the partition, the first support member and the second support member can be disconnected, so that the partition can fall together with the first support member, thereby preventing the partition from blocking the movement of the robot device, and further preventing the wafer clamped by the robot device from colliding with the partition and being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the structure of a semiconductor cleaning device provided by an embodiment of the utility model;

[0028] Figure 2 A schematic diagram of the structure of a movable partition device provided in an embodiment of the utility model;

[0029] Figure 3 A partial schematic diagram of a movable partition device provided in an embodiment of the utility model;

[0030] Figure 4 A partial cross-sectional view of a movable partition device provided in an embodiment of the utility model;

[0031] Figure 5Another partial schematic diagram of the movable partition device provided by the embodiment of the utility model;

[0032] Fig. 6A A three-dimensional diagram of a pin provided in an embodiment of the utility model;

[0033] Figure 6B A side view of a pin provided in an embodiment of the utility model;

[0034] Fig. 7A A three-dimensional diagram of a first support member provided in an embodiment of the utility model;

[0035] Figure 7B A top view of a first support member provided in an embodiment of the utility model;

[0036] Figure 7C A side view of a first support member provided in an embodiment of the utility model;

[0037] Fig.7D for Figure 7C Sectional view in the AA direction;

[0038] Fig. 7E An end side view of a first support member provided in an embodiment of the utility model;

[0039] Fig. 8A A top view of a second support member provided in an embodiment of the utility model;

[0040] Figure 8B for Fig. 8A Partial cross-sectional view in the middle DD direction;

[0041] Figure 8C An end side view of a second support member provided in an embodiment of the utility model;

[0042] Fig.8D A three-dimensional view of the end of the second support member provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0044] It should be understood that the specific embodiments and drawings described herein are only used to explain the present invention, rather than to limit the present invention.

[0045] It can be understood that, in the absence of conflict, the various embodiments of the present utility model and the various features in the embodiments can be combined with each other.

[0046] It can be understood that, for the convenience of description, the drawings of the present invention only show the parts related to the embodiments of the present invention, while the parts unrelated to the embodiments of the present invention are not shown in the drawings.

[0047] It is understandable that, in the absence of conflict, the functions and steps marked in the flowcharts and block diagrams of the embodiments of the present utility model may occur in an order different from that marked in the drawings.

[0048] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

[0049] Existing semiconductor cleaning equipment usually includes a machine body, a plurality of cleaning tanks and a plurality of partitions arranged inside the machine body, wherein the plurality of partitions are arranged between and around the plurality of cleaning tanks to separate a plurality of cleaning modules inside the machine body, and each cleaning module has an independent gas flow field, so as to avoid mutual contamination or disturbance of gases volatilized from different cleaning solutions. The plurality of partitions specifically include fixed partitions and movable partitions; wherein the fixed partitions are arranged at the side edges of each cleaning tank and are fixed to the machine body with screws; the movable partitions can be movably arranged between adjacent cleaning tanks and can enclose a semi-enclosed space with the plurality of fixed partitions.

[0050] Semiconductor cleaning equipment usually also includes a robot device for holding wafers. The robot device can move above the cleaning tank to drive the wafer to move to multiple cleaning tanks for cleaning, so as to drive the wafer to perform a variety of different cleaning processes. The movable partition will block the movement path of the robot device. Therefore, when the robot device passes by, the movable partition will move away from the initial position to make room for the robot device to move; after the robot device passes by, the movable partition will return to the initial position to re-enclose a semi-enclosed environment with multiple fixed partitions.

[0051] However, during the actual cleaning and equipment debugging process, problems such as control signal delays may occur, which may cause the movable partition to fail to avoid the robot movement in time, and then cause the robot device to collide with the movable partition when it moves to the movable partition, which may cause the wafer to break, the movable partition to break, and even damage the robot device.

[0052] In order to solve the above technical problems, this embodiment provides a movable partition device applied to semiconductor cleaning equipment, such as Figure 1 As shown, it includes a partition 1, a driving source 2 and a supporting assembly.

[0053] The initial position of the partition 1 is located between two adjacent cleaning tanks and is higher than the cleaning tanks to prevent the atmosphere above the two cleaning tanks from mixing. The support assembly is used to connect the partition 1 and the driving source 2; the driving source 2 is used to drive the partition 1 to move, so as to drive the partition 1 away from the initial position and drive the partition 1 back to the initial position; specifically, the driving source 2 is, for example, a cylinder.

[0054] like Figure 2-5 As shown, the support assembly includes a first support member 3, a second support member 4 and a first connecting member. The first support member 3 is fixedly connected to the partition 1; the second support member 4 is fixedly connected to the driving source 2. The two opposite ends of the first support member 3 and the second support member 4 are connected by a first connecting member; moreover, the first connecting member can break when subjected to an impact force of a specified magnitude, so that the two ends of the first support member 3 and the second support member 4 that are connected to each other are separated, thereby causing the partition 1 connected to the first support member 3 to fall off. In this way, when the robot device collides with the partition 1, the first support member 3 and the second support member 4 can be disconnected, so that the partition 1 and the first support member 3 will fall together under the action of their own gravity, so that the partition 1 can be quickly moved away from its initial position to avoid the partition 1 blocking the movement of the partition 1, thereby preventing the robot device and the wafer clamped therein from being damaged due to the collision with the partition 1.

[0055] It is easy to understand that the above-mentioned "impact force of specified magnitude" should be equal to or less than the impact force generated when the manipulator device collides with the partition 1, so as to ensure that the first connecting member can be broken when the manipulator device collides with the partition 1, thereby ensuring that the partition 1 falls off in time. Specifically, the impact force depends on the actual moving speed, driving force and other dynamic parameters of the manipulator device, which can be obtained through multiple impact tests in actual production.

[0056] In some specific embodiments, Figure 2 As shown, the first support member 3 is fixedly connected to the partition plate 1 by a plurality of bolts.

[0057] In some embodiments, Figure 5 As shown, the first support member 3 has a mounting groove 31 on one end close to the second support member 4 ; the second support member 4 has a mounting block 41 on one end close to the first support member 3 that matches the shape of the mounting groove 31 , and the mounting block is used to be plugged into the mounting groove 31 .

[0058] Moreover, the first connecting member includes a pin 5; accordingly, the first support member 3 has a first pin connection hole that passes through the side wall of the mounting groove 31, and the second support member 4 has a second pin connection hole that passes through the mounting protrusion 41, and the first pin connection hole and the second pin connection hole are coaxially arranged so that the first pin connection hole and the second pin connection hole are connected to each other. The pin 5 passes through the first pin connection hole and the second pin connection hole so that the pin 5 can pass through the mounting protrusion 41 and the side wall of the mounting groove 31, thereby connecting the first support member 3 and the second support member 4. Specifically, the pin 5 can break when subjected to a specified external force, so that the first support member 3 and the second support member 4 are released from the pin connection, thereby separating the ends of the two connected to each other. Moreover, in the subsequent maintenance process, a new pin 5 is replaced to re-pin the first support member 3 and the second support member 4, so that the partition 1 can be restored to its original position.

[0059] Furthermore, in some embodiments, Figure 5 As shown, the first support member 3 includes a first connecting rod 32; the second support member 4 includes a second connecting rod 42; the first connecting rod 32 and the second connecting rod 42 are coaxially arranged. The mounting groove 31 has a first opening formed at the end of the first connecting rod 32 and two second openings formed on both sides of the first connecting rod 32, that is, the mounting groove 31 is a three-sided groove. Moreover, the two second openings of the mounting groove 31 extend parallel to the axial direction of the first connecting rod 32, and correspondingly, the two side walls of the mounting groove 31 extend parallel to the axial direction of the first connecting rod 32. The extension direction of the first pin connection hole and the second pin connection hole is perpendicular to the axial direction of the first connecting rod 32, and correspondingly, the extension direction of the pin 5 is also perpendicular to the axial direction of the first connecting rod 32, so that the first connecting rod 32 and the second connecting rod 42 are axially fixedly connected.

[0060] In some preferred embodiments, the first connecting rod 32 and the second connecting rod 42 both extend in the horizontal direction, and correspondingly, the two second openings also extend in the horizontal direction, so that the two side walls of the mounting groove 31 can support the mounting protrusion 41 in the gravity direction, ensuring that the first connecting rod 32 and the second connecting rod 42 will not be separated during the normal movement of the partition 1. In addition, since the manipulator device usually moves horizontally, the pin 5 will be subjected to a horizontal impact force when the manipulator device collides with the partition 1; and after the pin 5 breaks, the mounting protrusion 41 can be disengaged from the second opening of the mounting groove 31 in the horizontal direction, so that the first connecting rod 32 and the second connecting rod 42 are separated.

[0061] In some specific embodiments, the outer circumference of the pin 5 has a certain taper, and when the pin 5 is inserted into the first pin-connecting hole and the second pin-connecting hole, the thicker end of the pin 5 is higher than the thinner end, so as to facilitate the insertion of the pin 5 into the pin-connecting hole and prevent the pin 5 from falling from the bottom of the pin-connecting hole. For example, the outer circumference of the pin 5 has a draft angle of 3°.

[0062] In some embodiments, Figure 6A-6B As shown, an annular groove 51 is formed on the outer circumference of the pin 5, so that the pin 5 can be easily broken from the annular groove 51, thereby ensuring that the first connecting rod 32 and the second connecting rod 42 are separated in time when the partition 1 is hit by the manipulator device. Specifically, the annular groove 51 is used to enable the pin 5 to break when subjected to an impact force of a specified magnitude.

[0063] In some specific embodiments, the pin 5 is made of, for example, a ceramic material, which has a high hardness and is prone to brittle fracture, thereby ensuring that the first connecting rod 32 and the second connecting rod 42 are axially fixedly connected when the partition 1 moves normally, and ensuring that the partition 1 breaks in time when hit by the manipulator device, thereby ensuring that the first connecting rod 32 and the second connecting rod 42 are separated in time.

[0064] In some embodiments, Figures 7A-7D As shown, the width of the bottom surface of the mounting groove 31 in the direction parallel to the axis of the pin 5 is greater than the width of the first opening in the direction parallel to the axis of the pin 5, that is, the mounting groove 31 is a trapezoidal groove. Correspondingly, the mounting protrusion 41 is also a trapezoidal block corresponding to the shape of the mounting groove 31. In this way, after the mounting protrusion 41 is plugged into the mounting groove 31, the mounting protrusion 41 is not easy to fall out of the first opening, so that the connection strength of the first connecting rod 32 and the second connecting rod 42 in the axial direction can be guaranteed, and then the partition 1 can be guaranteed to move normally when not hit, and will not fall off accidentally. Moreover, when installing the first connecting rod 32 and the second connecting rod 42, the mounting protrusion 41 can be inserted from the second opening on the side of the mounting groove 31.

[0065] Furthermore, in some embodiments, Fig. 7A and 7E As shown, both side walls of the mounting groove 31 have auxiliary grooves 33 extending along the axis direction of the first connecting rod 32, and the cross section of the auxiliary groove 33 in the direction perpendicular to the axis direction of the first connecting rod 32 is an inferior arc shape. Fig. 8A As shown, the mounting protrusion 41 has an auxiliary protrusion 43 that matches the shape of the auxiliary groove 33. In this way, after the first connecting rod 32 and the second connecting rod 42 are plugged in, the auxiliary protrusion 43 can block the second connecting rod 42 from escaping from the second opening on the side of the mounting groove 31 in the axial direction, thereby improving the connection stability between the first connecting rod 32 and the second connecting rod 42 during the normal movement of the partition 1, and preventing the partition 1 from falling during the normal movement; and, since the shape of the matching surface of the auxiliary groove 33 and the auxiliary protrusion 43 is an arc surface, the auxiliary protrusion 43 can provide resistance parallel to the radial direction of the second connecting rod 42, and will not completely prevent the second connecting rod 42 from escaping from the second opening of the mounting groove 31, thereby ensuring that the ends of the first connecting rod 32 and the second connecting rod 42 can be separated in time when the partition 1 is hit by the manipulator device.

[0066] In some specific embodiments, Fig. 7A As shown, the auxiliary groove 33 is, for example, a tapered groove, and the width of one end of the auxiliary groove 33 close to the bottom of the mounting groove 31 is smaller than the width of the other end, so as to facilitate the insertion of the mounting protrusion into the mounting groove 31.

[0067] In some specific embodiments, Fig. 7E and 8A As shown, the pin connection hole passes through the auxiliary groove 33 and the auxiliary protrusion 43 , and correspondingly, the pin 5 passes through the auxiliary groove 33 and the auxiliary protrusion 43 .

[0068] In some embodiments, Figure 5 and Fig. 7A As shown, the support assembly further includes a second connection member made of a flexible material. The second connection member is fixedly connected to the first support member 3 and the second support member 4 respectively. The second connection member is used to keep the first support member 3 and the second support member 4 connected after the ends of the first support member 3 and the second support member 4 are separated, so that the partition 1 remains suspended after falling under the action of gravity, thereby preventing the partition 1 from falling into the semiconductor cleaning equipment, thereby preventing damage to the partition 1 or the semiconductor cleaning equipment.

[0069] In some embodiments, Figure 3 As shown, the second connecting member includes a connecting rope 6, and two ends of the connecting rope 6 are respectively connected and fixed to the first supporting member 3 and the second supporting member 4.

[0070] Specifically, the connecting rope 6 is, for example, a nylon rope. Since the strength of the nylon rope is positively correlated with its diameter, the connection strength to the partition 1 can be adjusted by designing the diameter of the nylon rope, for example, 0.53 mm.

[0071] In some embodiments, Figures 8B-8C As shown, a wire storage groove 44 for accommodating the connecting rope 6 is provided on the outer peripheral surface of the second support member 4. A connecting nail 7 is provided on the inner wall of the wire storage groove 44; a connecting nail 7 is also provided on the first support member 3; two connecting nails 7 are respectively used to connect the two ends of the connecting rope 6; specifically, the two ends of the connecting rope 6 are tied to the connecting nail 7. In this way, when the partition 1 does not collide with the manipulator device and moves normally, the connecting rope 6 is arranged inside the wire storage groove 44 to reduce the risk of interfering with the movement of other components; when the partition 1 collides with the manipulator device, the partition 1 will fall together with the first support member 3, and the connecting rope 6 will fall out of the wire storage groove 44, and the first support member 3 and the second support member 4 are kept connected, so that the front support rod and the movable partition 1 are suspended inside the semiconductor cleaning equipment, so as to avoid the partition 1 falling and causing damage to the partition 1 or the internal components of the semiconductor cleaning equipment. In addition, in the subsequent maintenance process, the first support member 3 and the second support member 4 can be re-pinned first, and the connecting rope 6 can be filled back into the wire storage groove 44.

[0072] Specifically, Figure 3 , Figure 7B and 8B As shown, the wire storage groove 44 is communicated with the mounting groove 31 , and two connecting nails 7 are respectively arranged on two side surfaces of the mounting groove 31 and the wire storage groove 44 that are opposite to each other.

[0073] In some specific embodiments, the length of the connecting rope 6 is, for example, 1.5 times the length of the wire storage groove 44. Within this length range, it can be ensured that the connecting rope 6 can be stored in the wire storage groove 44 after being folded, and can be easily removed from the wire storage groove 44. In addition, the length of the connecting rope 6 should also be adapted to the height of the internal components of the semiconductor cleaning equipment to ensure that it is suspended after the partition 1 falls.

[0074] Specifically, the length of the connecting rope 6 is, for example, 300 mm.

[0075] In some specific embodiments, the partition 1 is made of plastic, for example; thus, when the partition 1 falls and collides with other components in the semiconductor cleaning device, the partition 1 is not easily damaged, and the semiconductor cleaning device is not easily damaged by the collision with the partition 1. Moreover, the inner wall of the semiconductor cleaning device is also made of plastic, for example, to further avoid damage due to collision.

[0076] As another technical solution, this embodiment also provides a semiconductor cleaning device, such as Figure 1 As shown, it includes a plurality of cleaning tanks 01, a robot device (not shown in the figure) and a movable partition device as described above.

[0077] The partition 1 of the movable partition device is located above the notch of the cleaning tank 01, and is used to block between two adjacent cleaning tanks 01. The robot device is arranged above the multiple cleaning tanks 01, and is used to clamp the wafer and drive the wafer to perform the cleaning process in the multiple cleaning tanks 01.

[0078] Moreover, the partition 1 of the movable partition device is also used to avoid the robot device when it moves between two adjacent cleaning tanks 01, so as to allow the robot device to pass through. Moreover, as mentioned above, when the robot device collides with the partition 1 of the movable partition device, the partition 1 can fall off in time, thereby avoiding damage to the robot device and the wafers clamped therein.

[0079] In some embodiments, Figure 1 As shown, the semiconductor cleaning equipment further includes a plurality of fixed partitions 02. Moreover, the fixed partitions 02 surround the peripheral side of each cleaning tank 01 that is not adjacent to other cleaning tanks 01, and are located above the notch of the cleaning tank 01, so as to form a semi-enclosed space above each cleaning tank 01 with the movable partition device, thereby preventing the volatile gas of the cleaning solution from mixing.

[0080] As described above, the movable partition device and semiconductor cleaning equipment provided in this embodiment can achieve the separation of the two ends of the first support member and the second support member by using an easily breakable first connecting member to connect the two ends of the first support member and the second support member when the partition is hit by the robot device, so that the partition can fall together with the first support member to avoid the partition blocking the movement of the partition, thereby avoiding the wafer clamped by the robot device from colliding with the partition and being damaged. Moreover, this embodiment uses a flexible second connecting member to connect the first support member and the second support member, so that after the ends of the first support member and the second support member are separated, the first support member and the second support member are still softly connected, so that the partition remains suspended after falling, avoiding the partition from falling into the semiconductor cleaning equipment, thereby avoiding damage to the partition or the semiconductor cleaning equipment.

[0081] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A movable baffle device, used in semiconductor cleaning equipment; characterized in that: include: A partition, a driving source and a supporting assembly for connecting the partition and the driving source; wherein, The driving source is used to drive the partition to move; The support assembly includes a first support member, a second support member and a first connecting member; the first support member is fixedly connected to the partition; the second support member is fixedly connected to the driving source; the two opposite ends of the first support member and the second support member are connected by the first connecting member; the first connecting member can break when subjected to an impact force of a specified magnitude, so that the interconnected ends of the first support member and the second support member can be detached.

2. The movable partition device according to claim 1, characterized in that: The first support member has a mounting groove on one end close to the second support member; the second support member has a mounting protrusion on one end close to the first support member that matches the shape of the mounting groove, and the mounting protrusion is used to be plugged into the mounting groove; The first connecting member includes a pin; The first support member has a first pin connection hole that passes through the side wall of the mounting groove, and the second support member has a second pin connection hole that passes through the mounting protrusion; the first pin connection hole and the second pin connection hole are coaxially arranged; the pin passes through the first pin connection hole and the second pin connection hole to connect the first support member and the second support member; the pin is also used to break when subjected to an impact force of a specified magnitude, so as to separate the interconnected ends of the first support member and the second support member.

3. The movable partition device according to claim 1, characterized in that: The support assembly further comprises a second connecting member; the second connecting member is made of a flexible material; The second connecting member is fixedly connected to the first supporting member and the second supporting member respectively; the second connecting member is used to keep the first supporting member and the second supporting member connected after the ends of the first supporting member and the second supporting member that are connected to each other are detached.

4. The movable partition device according to claim 2, characterized in that: The first support member includes a first connecting rod; the second support member includes a second connecting rod; the first connecting rod and the second connecting rod are coaxially arranged; The mounting groove has a first opening formed at the end of the first connecting rod and two second openings formed on both sides of the first connecting rod; the two second openings extend parallel to the axial direction of the first connecting rod; The extension directions of the first pin connection hole and the second pin connection hole are both perpendicular to the axial direction of the first connecting rod.

5. The movable partition device according to claim 3, characterized in that: The second connecting member includes a connecting rope; two ends of the connecting rope are respectively connected and fixed to the first supporting member and the second supporting member.

6. The movable partition device according to claim 5, characterized in that: A wire storage groove for accommodating the connecting rope is provided on the outer circumferential surface of the second supporting member; connecting nails are provided on the inner wall of the wire storage groove; connecting nails are also provided on the first supporting member; the two connecting nails are respectively used to connect the two ends of the connecting rope.

7. The movable partition device according to claim 4, characterized in that: The width of the bottom surface of the mounting groove in a direction parallel to the pin axis is greater than the width of the first opening in a direction parallel to the pin axis.

8. The movable partition device according to claim 4, characterized in that: Both side walls of the mounting groove are provided with auxiliary grooves extending along the axis direction of the first connecting rod, and the cross section of the auxiliary groove in the direction perpendicular to the axis direction of the first connecting rod is an inferior arc shape; The mounting protrusion has an auxiliary protrusion which matches the shape of the auxiliary groove.

9. The movable partition device according to claim 2, characterized in that: An annular groove is provided on the outer peripheral surface of the pin; the annular groove is used to enable the pin to break when subjected to an impact force of a specified magnitude.

10. A semiconductor cleaning device, characterized in that: It comprises a plurality of cleaning tanks, a manipulator device and a movable partition device as claimed in any one of claims 1 to 9; The robot device is disposed above the plurality of cleaning tanks, and is used to clamp the wafer and drive the wafer to perform a cleaning process in the plurality of cleaning tanks; The partition of the movable partition device is located above the notch of the cleaning tank, and is used to block between two adjacent cleaning tanks and avoid the robot device during the movement between the two adjacent cleaning tanks.

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