Silicon wafer adsorption device and wafer loading and unloading equipment

Abstract

The utility model discloses a silicon wafer adsorption device and a wafer loading and unloading device, the silicon wafer adsorption device comprises a pedestal and at least two groups of adsorption assemblies, the adsorption assemblies are installed on the pedestal and are arranged at intervals along a first direction, at least one group of adsorption assemblies is slidably connected to the pedestal along the first direction, and the adsorption assemblies are arranged at intervals along the first direction. The adsorption assembly comprises a plurality of adsorption units arranged in the second direction. The wafer loading and unloading equipment comprises a silicon wafer adsorption device. According to the utility model, the distance between the different adsorption assemblies in the first direction is adjustable, and each adsorption assembly can adsorb a plurality of silicon wafers arranged in the second direction at the same time, so that the overall adsorption area of the adsorption assemblies can be adjusted by changing the positions of the adsorption assemblies in the first direction; therefore, the orientation requirements of the silicon wafers with various specifications and arrangement modes can be met, the wafers do not need to be taken and placed repeatedly, and the wafer loading and unloading efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic cell manufacturing, in particular to a silicon wafer adsorption device and wafer loading and unloading equipment. Background Art

[0002] During the preparation process of solar cells, thin film deposition needs to be carried out in a reaction chamber. For example, when coating by PECVD (plasma enhanced chemical vapor deposition), the silicon wafers need to be loaded into a graphite boat or a basket in the graphite boat before the PECVD process, and the silicon wafers need to be taken out after the process is completed. However, the specifications and arrangements of the silicon wafers in the graphite boat are different. The silicon wafer adsorption assembly in the related technology cannot complete the placement and removal of the wafers through a single adsorption, resulting in low efficiency in loading and unloading the silicon wafers. Summary of the invention

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a silicon wafer adsorption device that can meet the requirements of taking and placing silicon wafers of various specifications and arrangements, and improve the efficiency of loading and unloading wafers.

[0004] The utility model also provides a wafer loading and unloading device with the silicon wafer adsorption device.

[0005] According to the first aspect of the present invention, the silicon wafer adsorption device includes:

[0006] Pedestal;

[0007] At least two groups of adsorption components, which are all mounted on the base and arranged at intervals along a first direction, and at least one group of the adsorption components is slidably connected to the base along the first direction;

[0008] In which, the adsorption assembly includes a plurality of adsorption units arranged along the second direction, and an accommodating channel is defined between adjacent adsorption units. Each of the adsorption units has an adsorption plate and an adsorption body. The adsorption body is installed on the adsorption plate, and the adsorption plate has an air flow channel. The adsorption body has an adsorption surface in the second direction. The air flow channel is connected to the inner cavity of the adsorption body and is used to form a negative pressure in the adsorption body. The first direction is perpendicular to the second direction.

[0009] The silicon wafer adsorption device according to the embodiment of the utility model has at least the following beneficial effects:

[0010] In the utility model, the spacing between different adsorption components in the first direction is adjustable, and each adsorption component can simultaneously adsorb multiple silicon wafers arranged in the second direction. By changing the position of the adsorption component in the first direction, the overall adsorption area of ​​the adsorption component can be adjusted, thereby being able to meet the orientation requirements of silicon wafers of various specifications and arrangements. There is no need to repeatedly take and place the wafers, thereby improving the efficiency of loading and unloading the wafers.

[0011] According to some embodiments of the present utility model, the silicon wafer adsorption device further includes a driving component, the driving component is connected to at least one group of the adsorption components, and drives the adsorption components to move along the first direction;

[0012] The driving component includes a driving element and a moving part. The driving element is installed on the base. The moving part is slidably connected to the base and connected to the adsorption component. The moving part can be driven by the driving element to drive the adsorption component to move.

[0013] According to some embodiments of the utility model, the driving assembly also includes a sensing member, a follower and a mounting member, the follower is driven to move synchronously with the moving member, the mounting member is installed on the base, the sensing member is connected to the mounting member, the sensing member is used to detect the position of the follower and is communicatively connected with the driving element.

[0014] According to some embodiments of the present invention, the mounting member has a mounting groove extending along the first direction, at least two sensing members are provided, the sensing members are installed in the mounting groove, and can change their positions in the mounting groove.

[0015] According to some embodiments of the utility model, the movable part is slidably connected to the bottom of the base, the adsorption assembly includes a mounting base, the adsorption unit in each adsorption assembly is mounted on the mounting base, the mounting base is connected to the movable part, and the heights of the mounting bases in different adsorption assemblies are the same.

[0016] According to some embodiments of the utility model, the silicon wafer adsorption device also includes multiple air extraction components, each of the adsorption components is connected to one of the air extraction components, the air extraction components include an air extraction main pipe and multiple air extraction branch pipes, each of the air extraction branch pipes is connected to the air extraction main pipe, each of the air flow channels is connected to one of the air extraction branch pipes, and the air extraction components are located on the top of the base; wherein, the air extraction component used to extract air from the adsorption component slidably connected to the base is connected to the movable part.

[0017] According to some embodiments of the utility model, the adsorption unit also includes a plurality of gas pipes, the adsorption body is provided with a plurality of them, the adsorption plate is provided with a first installation cavity for embedding the gas pipe and a second installation cavity for embedding the adsorption body, and the two ends of the gas pipe are respectively connected to the inner cavity of the adsorption body and the airflow channel.

[0018] According to some embodiments of the utility model, the adsorption plate includes a connected mounting portion and a connecting portion, the airflow channel is arranged in the mounting portion, the mounting portion is connected to the base, at least part of the first mounting cavity and the second mounting cavity are arranged in the connecting portion, and the mounting portion protrudes relative to the connecting portion on both sides in the second direction.

[0019] According to some embodiments of the utility model, the adsorption unit also includes a plurality of elastic parts, and the adsorption plate also includes a plurality of third installation cavities, the elastic part is accommodated in the third installation cavity, and a plurality of the third installation cavities are arranged on the periphery of each of the second installation cavities, and the second installation cavity and the third installation cavity penetrate along the second direction, and the two ends of the elastic part are respectively connected to the adsorbent body and the inner wall of the second installation cavity, and apply pulling force to the adsorbent body.

[0020] The sheet loading and unloading device according to the second embodiment of the utility model comprises:

[0021] The silicon wafer adsorption device according to the first aspect;

[0022] A motion module, the base is installed on the motion module, and the motion module is used to drive the silicon wafer adsorption device to move.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0025] Figure 1 This is a schematic diagram of an embodiment of the silicon wafer adsorption device of the utility model;

[0026] Figure 2 for Figure 1 A side view of the silicon wafer adsorption device in another direction;

[0027] Figure 3 for Figure 1 A schematic diagram of an embodiment of an adsorption unit;

[0028] Figure 4 for Figure 1 A partial enlarged view of point A in the middle.

[0029] Reference numerals:

[0030] Base 100, avoidance hole 110, guide rail 120; adsorption component 200, adsorption unit 210, adsorption plate 211, air flow channel 2111, first installation cavity 2112, second installation cavity 2113, third installation cavity 2114, installation part 2115, connecting part 2116, adsorption body 212, air delivery pipe 213, elastic part 214, accommodating channel 220, installation base 230; driving component 300, driving element 310, moving part 320, sensing part 330, follower 340, mounting part 350, mounting groove 351, screw rod 360; exhaust component 400, exhaust main pipe 410, exhaust branch pipe 420. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0033] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0034] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0035] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0036] Reference Figure 1 and Figure 2 In an embodiment of the utility model, a silicon wafer adsorption device is provided, which includes a base 100 and at least two groups of adsorption components 200. The adsorption components 200 are all installed on the base 100. Multiple groups of adsorption components 200 are arranged at intervals along a first direction, and at least one group of adsorption components 200 is slidably connected to the base 100 along the first direction. It can be understood that when one group of adsorption components 200 slides relative to the base 100 along the first direction, the spacing between the adsorption component 200 and the adjacent adsorption component 200 in the first direction can be adjusted.

[0037] The adsorption assembly 200 includes a plurality of adsorption units 210 arranged along the second direction, the first direction is perpendicular to the second direction, and a receiving channel 220 is defined between adjacent adsorption units 210. The receiving channel 220 is used to receive silicon wafers, and the adsorption units 210 are used to adsorb silicon wafers. Each adsorption assembly 200 can simultaneously adsorb a plurality of silicon wafers arranged along the second direction. During the adsorption process, the silicon wafer is inserted into the receiving channel 220 between adjacent adsorption units 210, so that the adsorption unit 210 is adsorbed toward the silicon wafer and has a greater contact force with the silicon wafer to ensure the stability of the adsorption of the silicon wafer. Figure 3 Each adsorption unit 210 has an adsorption plate 211 and an adsorption body 212. The adsorption body 212 is installed on the adsorption plate 211. The adsorption plate 211 has an air flow channel 2111. The air flow channel 2111 can be used for external air flow access. The adsorption body 212 has an adsorption surface in the second direction. The air flow channel 2111 is connected to the inner cavity of the adsorption body 212 and can form a negative pressure in the adsorption body 212. During the silicon wafer adsorption process, the adsorption surface contacts the surface of the silicon wafer. When a negative pressure is formed inside the adsorption body 212, the silicon wafer is subjected to the adsorption force, and is tightly attached to the adsorption surface and remains adsorbed by the adsorption body 212.

[0038] In this embodiment, the spacing between different adsorption components 200 in the first direction is adjustable, and each adsorption component 200 can simultaneously adsorb multiple silicon wafers arranged in the second direction. By changing the position of the adsorption component 200 in the first direction, the overall adsorption area of ​​the adsorption component 200 can be adjusted, thereby being able to meet the orientation requirements of silicon wafers of various specifications and arrangements. There is no need to repeatedly take and place the wafers, thereby improving the efficiency of loading and unloading the wafers.

[0039] It should be noted that the above-mentioned “adsorption area” refers to the sum of the projection area of ​​each adsorption component 200 projected onto the silicon wafer along the second direction and the projection area of ​​the area between adjacent adsorption components 200 projected onto the silicon wafer along the second direction.

[0040] For example, when there are two adsorption assemblies 200, when the adsorption units 210 in all adsorption assemblies 200 in the first direction adsorb the same silicon wafer, if the size of the silicon wafer is large, the position of the adsorption assembly 200 in the first direction can be adjusted to appropriately increase the spacing between the two adsorption assemblies 200, so that the adsorption area of ​​the adsorption assembly 200 is increased to match the adsorption requirements of large-size silicon wafers; if the size of the silicon wafer is small, the position of the adsorption assembly 200 in the first direction can be adjusted to release and reduce the spacing between the two adsorption assemblies 200, so that the adsorption area of ​​the adsorption assembly 200 is reduced to match the adsorption requirements of small-size silicon wafers. When there are multiple groups of silicon wafers arranged in the first direction, when the silicon wafer groups are placed in different types of boats, the spacing of the silicon wafer groups in the first direction is different. At this time, the adsorption units 210 in different adsorption assemblies 200 in the first direction adsorb different silicon wafers. By adjusting the position of the adsorption assembly 200 in the first direction, the spacing of the adsorption assembly 200 in the first direction matches the spacing of the silicon wafer groups in the first direction, so that multiple groups of silicon wafer groups can be taken and placed at the same time. Thus, in this embodiment, by changing the position of the adsorption assembly 200 in the first direction, the silicon wafer adsorption device can meet the orientation requirements of silicon wafers of various specifications and arrangements.

[0041] It should be noted that, in the present embodiment, the adsorption units 210 in different adsorption components 200 in the first direction can adsorb one silicon wafer at the same time, or adsorb different silicon wafers. Therefore, the silicon wafer adsorption device can be applicable to the situation where multiple groups of silicon wafers are arranged in the first direction of the boat, and can realize the simultaneous taking and placing of multiple groups of silicon wafers; for example, multiple groups of half-wafers are arranged in the graphite boat in the first direction, and different adsorption components 200 can respectively adsorb different groups of half-wafers, which can improve the efficiency of taking and placing wafers and the production capacity of photovoltaic cell preparation, and because the silicon wafers are smaller in size, the loss of silicon wafers during the process of taking and placing wafers can be reduced.

[0042] It can be understood that when two groups of adsorption components 200 are provided, the two groups of adsorption components 200 can be slidably connected to the base 100 at the same time, and can move toward or away from each other along the first direction to adjust the spacing between the two groups of adsorption components 200 in the first direction. Of course, one group of adsorption components 200 can be slidably connected to the base 100, and the spacing between the two in the first direction can be changed by adjusting the position of the adsorption component 200 in the first direction; for the case where more than two groups of adsorption components 200 are provided, the adsorption components 200 located on the outermost side in the first direction are slidably connected to the base 100 to increase or decrease the overall adsorption area of ​​the multiple groups of adsorption components 200.

[0043] Reference Figure 1 and Figure 2 The silicon wafer adsorption device further includes a driving component 300, which is connected to at least one group of adsorption components 200 and drives the adsorption components 200 to move along the first direction. The driving component 300 includes a driving element 310 and a moving part 320. The driving element 310 is mounted on the base 100, and the moving part 320 is slidably connected to the base 100 and connected to the adsorption components 200. The moving part 320 is driven by the driving element 310 to drive the adsorption components 200. The driving element 310 can be a power component such as a motor, a motor, an electric cylinder, a cylinder, etc. that can output linear motion or rotational motion, such as a stepping motor; a transmission structure can also be provided in the driving component 300 to transmit the power of the driving element 310 to the moving part 320 and move the moving part 320, such as a screw and nut, a gear rack, a connecting rod structure, etc.

[0044] Reference Figure 4 The driving component 300 also includes a sensing member 330, a follower 340 and a mounting member 350. The follower 340 is driven to move synchronously with the moving member 320. The follower 340 can be connected to the moving member 320, or can be connected to a transmission structure between the moving member 320 and the driving element 310, such as a screw rod. When the driving element 310 drives the moving member 320 to move, the follower 340 moves synchronously, and the moving distance of the follower 340 is equal to the moving distance of the moving member 320. The sensing member 330 is connected to the mounting member 350. The sensing member 330 is used to detect the position of the follower 340 and is communicated with the driving element 310. The sensing member 330 can transmit the detected information to the control system. The control system analyzes the current position and moving distance of the moving member 320 based on the detection analysis, and then controls the driving element 310 to continue to drive the moving member 320 to move or stop driving the moving member 320. By providing the induction element 330 , the moving distance and position adjustment of the adsorption assembly 200 can be made more precise, thereby ensuring that the adsorption assembly 200 can accurately adsorb silicon wafers of different specifications and arrangements.

[0045] It can be understood that the sensing element 330 is configured as an electrical component that can sense the position of the follower 340, such as a displacement sensor, a position sensor, etc.; illustratively, the sensing element 330 is configured as a photoelectric sensor, and when the follower 340 moves to block the photoelectric signal emitted by the photoelectric sensor, the photoelectric sensor is triggered, and the control system controls the driving element 310 to start driving the moving element 320 to move or stop driving the moving element 320 to move according to the trigger information of the photoelectric sensor. There may be multiple sensing members 330, and different sensing members 330 are respectively configured to have different trigger information. For example, the sensing member 330 is configured to send a signal to the control system when it is triggered, and the control system sends an instruction to the driving element 310 to start driving the moving member 320 to move; or, the sensing member 330 is configured to send a signal to the control system when it is triggered, and the control system sends an instruction to the driving element 310 to stop driving the moving member 320 to move; or, the sensing member 330 is configured to send a signal to the control system when it is triggered, and the control system sends an instruction to the driving element 310 to continue driving the moving member 320 to move; multiple sensing members 330 are arranged so that the moving member 320 has a pre-calibrated initial position and the moving distance is set in advance. For silicon wafers of different specifications and arrangements, the moving member 320 can be accurately moved to different preset positions.

[0046] Furthermore, the mounting member 350 has a mounting groove 351 extending along the first direction, and at least two sensing members 330 are provided. The sensing members 330 are installed in the mounting groove 351 and can change their positions in the mounting groove 351 to adjust the position of the sensing member 330 in the first direction, and enable the moving member 320 to move different distances in the first direction to meet the adsorption requirements of silicon wafers of different specifications and arrangements. Specifically, the sensing member 330 can be detachably connected to the mounting groove 351, and the detachable connection method is not limited to threaded connection, clamping, etc. When the specifications and arrangement of the silicon wafers to be adsorbed change, the sensing member 330 can be disassembled and the position of the sensing member 330 in the mounting groove 351 can be changed, and then the sensing member 330 can be fixed in the mounting groove 351 again to complete the adjustment; scale lines can also be set on the mounting member 350 for the operator to observe, so that the position adjustment of the sensing member 330 is more accurate.

[0047] In one embodiment, the movable member 320 is slidably connected to the bottom of the base 100, the driving element 310 and the mounting member 350 are installed on the top of the base 100, the adsorption component 200 is located below the base 100, and there is no obstruction on the moving path of the adsorption component 200, which can avoid interference with other structures during the movement of the adsorption component 200. The base 100 has an avoidance hole 110 that runs through the top and bottom. The movable member 320 is slidably connected to the bottom of the base 100. At least part of the follower 340 is inserted into the avoidance hole 110. The driving element 310 is connected to the movable member 320 through the screw rod 360. The follower 340 is installed on the screw rod 360 and moves synchronously with the screw rod 360. The screw rod 360 is located below the base 100 to facilitate the connection between the screw rod 360 and the movable member 320. By setting the avoidance hole 110, the synchronous movement of the follower 340 following the screw rod 360 and the interaction with the sensing member 330 are realized, and the sensing member 330, the mounting member 350, and the driving element 310 avoid the moving path of the adsorption component 200, so that the adsorption component 200 can move smoothly.

[0048] In addition, refer to Figure 2 A guide rail 120 is provided at the bottom of the base 100 , and the moving member 320 is slidably connected to the guide rail 120 . The guide rail 120 extends along the first direction and guides the movement of the moving member 320 to ensure the position accuracy of the adsorption component 200 .

[0049] Reference Figure 1 The adsorption component 200 includes a mounting base 230. The adsorption units 210 in each adsorption component 200 are mounted on the mounting base 230. The mounting base 230 is connected to the moving part 320. The mounting base 230 can move with the moving part 320 and synchronously drive all adsorption units 210 in the same adsorption component 200 to move along the first direction. The heights of the mounting bases 230 in different adsorption components 200 are the same. Therefore, different adsorption components 200 can simultaneously cooperate with different groups of silicon wafers for positioning and adsorb different groups of silicon wafers.

[0050] The silicon wafer adsorption device further includes a plurality of air extraction components 400, each adsorption component 200 is connected to one air extraction component 400, the air extraction component 400 includes an air extraction main pipe 410 and a plurality of air extraction branch pipes 420, the air extraction branch pipes 420 in each air extraction component 400 are connected to the air extraction main pipe 410, after the adsorption unit 210 is installed on the mounting base 230, the air flow channel 2111 in each adsorption unit 210 is connected to one air extraction branch pipe 420, so that the air extraction main pipe 410 passes through each air extraction branch pipe 420. The tube 420 is connected to the corresponding air flow channel 2111; the vacuum component 400 is located on the top of the base 100, which can avoid the movement of the adsorption component 200. In addition, the vacuum component 400 used to extract air from the adsorption component 200 slidably connected to the base 100 is connected to the movable part 320, so that the vacuum component 400 can move synchronously with the adsorption component 200, avoiding the pulling of the pipeline between the adsorption component 200 and the vacuum component 400, which affects the air tightness of the channel and the adsorption strength of the adsorbent 212.

[0051] The adsorption unit 210 also includes multiple gas pipes 213, and the adsorption body 212 is provided with multiple ones. The adsorption plate 211 is provided with a first installation cavity 2112 for embedding the gas pipe 213 and a second installation cavity 2113 for embedding the adsorption body 212. The first installation cavity 2112 is connected to the second installation cavity 2113, and the two ends of the gas pipe 213 are respectively connected to the inner cavity of the adsorption body 212 and the air flow channel 2111; in this way, when the main exhaust pipe 410 in the exhaust component 400 exhausts air, different exhaust branch pipes 420 synchronously extract the gas in the corresponding air flow channel 2111, and the air flow in the air flow channel 2111 then drives the gas flow in the gas pipe 213, so that the inner cavity of the adsorption body 212 forms a negative pressure, and the adsorption surface of the adsorption body 212 continuously adsorbs the silicon wafer. It should be noted that the first installation cavity 2112 and the second installation cavity 2113 are penetrated along the second direction, and the gas pipe 213 is accommodated in the first installation cavity 2112, and the adsorption body 212 is accommodated in the second installation cavity 2113, so that there is no protruding structure on the surface of the adsorption plate 211. During the adsorption process of the silicon wafer, the adsorption surface of the adsorption body 212 can be in stable contact with the silicon wafer and continuously provide adsorption force.

[0052] The adsorption unit 210 also includes a plurality of elastic members 214, and the adsorption plate 211 also includes a plurality of third mounting cavities 2114. The elastic members 214 are accommodated in the third mounting cavities 2114. A plurality of third mounting cavities 2114 are arranged on the periphery of each second mounting cavity 2113. The second mounting cavity 2113 and the third mounting cavity 2114 penetrate each other along the second direction. The two ends of the elastic member 214 are respectively connected to the adsorption body 212 and the inner wall of the second mounting cavity 2113, and apply a pulling force to the adsorption body 212. The adsorption body 212 can float in the second mounting cavity 2113. When adsorbing silicon wafers, the adsorption body 212 can adaptively change its position and make the adsorption surface stably contact with the silicon wafer.

[0053] It is understandable that multiple adsorbents 212 can adsorb silicon wafers at the same time, and through multi-region adsorption, the adsorption strength of the adsorption unit 210 on the silicon wafer can be enhanced. Exemplarily, three adsorbents 212 are provided and distributed in a triangular shape, which, on the one hand, fully utilizes the installation space of the adsorption plate 211, and on the other hand, determines the adsorption plane of the silicon wafer through three adsorption regions to ensure the adsorption strength of the silicon wafer.

[0054] In addition, the adsorption plate 211 includes a connected mounting portion 2115 and a connecting portion 2116, the air flow channel 2111 is arranged in the mounting portion 2115, the mounting portion 2115 is connected to the mounting base 230, at least part of the first mounting cavity 2112 and the second mounting cavity 2113 are arranged in the connecting portion 2116, and the mounting portion 2115 protrudes on both sides in the second direction relative to the connecting portion 2116. Therefore, the thickness of the mounting portion 2115 in the second direction is greater than the thickness of the connecting portion 2116 in the second direction. On the one hand, it is convenient to connect the mounting portion 2115 with the mounting base 230 to ensure the connection strength between the two. On the other hand, an accommodating channel 220 for silicon wafers to enter and exit is formed between the connecting portions 2116 of adjacent adsorption units 210, providing a larger moving space for the silicon wafers to avoid interference between the silicon wafers and the adsorption units 210 during the process of taking and placing the wafers, thereby damaging the silicon wafers.

[0055] The utility model also provides a wafer loading and unloading device, including the above-mentioned silicon wafer adsorption device, and also includes a motion module, the base 100 is installed on the motion module, the motion module drives the silicon wafer adsorption device to move, so that the adsorption component 200 moves to the boat body or the wafer basket to pick up and place the component.

[0056] It can be understood that the motion module can be set as a multi-axis module or a robot, and the motion module has the freedom of movement or rotation in multiple directions, so that the movement of the silicon wafer adsorption device is more flexible and can take into account the needs of taking and placing silicon wafers in the boat or wafer basket at different workstations.

[0057] The embodiments of the utility model are described in detail above in conjunction with the accompanying drawings, but the utility model is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the utility model. In addition, the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.

Claims

1. A silicon wafer adsorption device, characterized in that: include: Pedestal; At least two groups of adsorption components, which are all mounted on the base and arranged at intervals along a first direction, and at least one group of the adsorption components is slidably connected to the base along the first direction; In which, the adsorption assembly includes a plurality of adsorption units arranged along the second direction, and an accommodating channel is defined between adjacent adsorption units. Each of the adsorption units has an adsorption plate and an adsorption body. The adsorption body is installed on the adsorption plate, and the adsorption plate has an air flow channel. The adsorption body has an adsorption surface in the second direction. The air flow channel is connected to the inner cavity of the adsorption body and is used to form a negative pressure in the adsorption body. The first direction is perpendicular to the second direction.

2. The silicon wafer adsorption device according to claim 1, characterized in that: The silicon wafer adsorption device further includes a driving component, which is connected to at least one group of the adsorption components and drives the adsorption components to move along the first direction; The driving component includes a driving element and a moving part. The driving element is installed on the base. The moving part is slidably connected to the base and connected to the adsorption component. The moving part can be driven by the driving element to drive the adsorption component to move.

3. The silicon wafer adsorption device according to claim 2, characterized in that: The driving component also includes a sensing member, a follower and a mounting member. The follower is driven to move synchronously with the moving member. The mounting member is installed on the base. The sensing member is connected to the mounting member. The sensing member is used to detect the position of the follower and is communicated with the driving element.

4. The silicon wafer adsorption device according to claim 3, characterized in that: The mounting member has a mounting groove extending along the first direction. At least two sensing members are provided. The sensing members are installed in the mounting groove and can change their positions in the mounting groove.

5. The silicon wafer adsorption device according to claim 2, characterized in that: The movable part is slidably connected to the bottom of the base, the adsorption assembly includes a mounting base, the adsorption unit in each adsorption assembly is mounted on the mounting base, the mounting base is connected to the movable part, and the heights of the mounting bases in different adsorption assemblies are the same.

6. The silicon wafer adsorption device according to claim 2, characterized in that: The silicon wafer adsorption device also includes multiple air extraction components, each of the adsorption components is connected to one of the air extraction components, the air extraction components include an air extraction main pipe and multiple air extraction branch pipes, each of the air extraction branch pipes is connected to the air extraction main pipe, each of the air flow channels is connected to one of the air extraction branch pipes, and the air extraction components are located on the top of the base; wherein, the air extraction component used to extract air from the adsorption component slidably connected to the base is connected to the movable part.

7. The silicon wafer adsorption device according to any one of claims 1 to 6, characterized in that: The adsorption unit also includes multiple air pipes, and the adsorption body is provided with multiple ones. The adsorption plate is provided with a first installation cavity for embedding the air pipe and a second installation cavity for embedding the adsorption body. The two ends of the air pipe are respectively connected to the inner cavity of the adsorption body and the airflow channel.

8. The silicon wafer adsorption device according to claim 7, characterized in that: The adsorption plate includes a connected mounting portion and a connecting portion, the airflow channel is arranged in the mounting portion, the mounting portion is connected to the base, at least part of the first mounting cavity and the second mounting cavity are arranged in the connecting portion, and the mounting portion protrudes relative to the connecting portion on both sides in the second direction.

9. The silicon wafer adsorption device according to claim 7, characterized in that: The adsorption unit also includes a plurality of elastic members, and the adsorption plate also includes a plurality of third mounting cavities. The elastic member is accommodated in the third mounting cavity. A plurality of third mounting cavities are arranged on the periphery of each of the second mounting cavities. The second mounting cavity and the third mounting cavity penetrate each other along the second direction. Both ends of the elastic member are respectively connected to the adsorbent body and the inner wall of the second mounting cavity, and apply pulling force to the adsorbent body.

10. The film loading and unloading equipment is characterized in that: include: The silicon wafer adsorption device according to any one of claims 1 to 9; A motion module, the base is installed on the motion module, and the motion module is used to drive the silicon wafer adsorption device to move.

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