Cover plate assembly, battery cell, battery and electric equipment

Abstract

The utility model discloses a cover plate assembly which comprises a cover plate, a sealing piece and a solder piece, the cover plate is provided with a liquid injection hole and a containing groove, and the containing groove surrounds the liquid injection hole; the sealing piece is contained in the containing groove and seals the liquid injection hole, and at least one of the side wall of the containing groove and the peripheral wall, opposite to the side wall of the containing groove, of the sealing piece is provided with a containing groove; the solder piece is contained in the containing groove and connected to the cover plate and the sealing piece so as to be connected to the sealing piece and the cover plate in a sealed mode. The utility model further discloses a battery cell provided with the cover plate assembly, a battery and electric equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of batteries, and in particular to a cover plate assembly, a battery core, a battery and electrical equipment. Background Art

[0002] In the prior art, the sealing of the liquid injection hole of the battery is generally achieved by welding with sealing pins; however, since the welding joint is small, once there is a slight defect in the assembly, it is easy to have a poor connection or defective welding joint, which makes the welding joint have a large stress, and thus there is a tendency of stress corrosion cracking in the unwelded part of the welding surface, which will increase the risk of subsequent crack expansion and welding joint failure to a certain extent, affect the sealing effect, and greatly affect the service life of the battery cell. Utility Model Content

[0003] The utility model aims to provide a cover plate assembly, a battery core, a battery and an electrical device with better sealing effect.

[0004] The utility model provides a cover plate assembly, which comprises

[0005] A cover plate, wherein the cover plate is provided with a liquid injection hole, and the cover plate is provided with a receiving groove, and the receiving groove surrounds the liquid injection hole;

[0006] a sealing member, the sealing member being received in the receiving groove and closing the liquid injection hole, wherein at least one of a side wall of the receiving groove and an outer peripheral wall of the sealing member opposite to the side wall of the receiving groove is provided with a receiving groove; and

[0007] A solder piece is contained in the receiving groove and connected to the cover plate and the sealing piece so as to seal the sealing piece and the cover plate.

[0008] In some embodiments, a first receiving groove is provided on the side wall of the receiving groove, a second receiving groove is provided on the outer peripheral wall of the sealing member, the second receiving groove is connected to the first receiving groove, and the solder member is accommodated in a receiving space surrounded by the first receiving groove and the second receiving groove.

[0009] In some embodiments, the axial depth of the receiving space along the injection hole is less than or equal to the axial depth of the receiving groove along the injection hole.

[0010] In some embodiments, the first receiving groove is arranged in a circle along the edge of the containing groove, and the second receiving groove is arranged in a circle along the edge of the sealing member.

[0011] In some embodiments, a projection surface of the opening of the receiving space on a plane perpendicular to the axial direction of the injection hole covers a projection surface of a side wall of the receiving space on the plane.

[0012] In some embodiments, a first gap is defined between a side wall of the receiving groove and an outer peripheral wall of the sealing member opposite to the side wall of the receiving groove, the receiving groove is connected to the first gap, and the solder member is partially accommodated in the first gap.

[0013] In some embodiments, a second gap is defined between the bottom wall of the receiving groove and the bottom wall of the sealing member, the second gap is connected to the first gap, and the solder member is partially contained in the second gap.

[0014] In some embodiments, a blocking edge is provided on the bottom wall of the containing groove, and the blocking edge surrounds the liquid injection hole.

[0015] In some embodiments, a positioning mechanism is provided on the bottom wall of the sealing member facing the accommodating groove, and the blocking edge cooperates with the positioning mechanism for positioning.

[0016] In some embodiments, the blocking edge includes relative blocking surfaces and an inner circumferential surface, and a top surface connected between the blocking surface and the inner circumferential surface; the positioning mechanism is a positioning groove arranged around the injection hole, and the positioning groove includes a first inner circumferential surface and a second inner circumferential surface spaced apart from each other, and a connecting surface connected between the first inner circumferential surface and the second inner circumferential surface; the top surface is attached to the connecting surface, and the blocking surface and the second inner circumferential surface are used to form a liquid stopping groove.

[0017] In some embodiments, the cover plate assembly further includes a sealing member, and the sealing member is sealingly connected to the liquid injection hole.

[0018] The utility model also provides a battery cell, which includes a shell and a cover plate assembly, wherein the cover plate assembly includes a cover plate, a sealing member and a solder member, wherein the cover plate is provided with a liquid injection hole, and the cover plate is provided with a receiving groove, wherein the receiving groove surrounds the liquid injection hole; the sealing member is received in the receiving groove and closes the liquid injection hole, and the side wall of the receiving groove and at least one of the outer peripheral walls of the sealing member opposite to the side wall of the receiving groove are provided with a receiving groove; the solder member is received in the receiving groove and contacts with both the cover plate and the sealing member to seal and connect the sealing member and the cover plate, the cover plate is sealed and connected to the shell, and the liquid injection hole is connected to the inner cavity of the shell.

[0019] The utility model also provides a battery, which includes a battery box and a battery cell, and the battery cell includes a shell and a cover plate assembly, and the cover plate assembly includes a cover plate, a sealing member and a solder member, the cover plate is provided with a liquid injection hole, and the cover plate is provided with a receiving groove, and the receiving groove surrounds the liquid injection hole; the sealing member is received in the receiving groove and closes the liquid injection hole, and the side wall of the receiving groove and at least one of the outer peripheral wall of the sealing member opposite to the side wall of the receiving groove are provided with a receiving groove; the solder member is received in the receiving groove and connected to the cover plate and the sealing member to seal the sealing member and the cover plate, the cover plate is sealingly connected to the shell, the liquid injection hole is connected to the inner cavity of the shell, and the battery cell is received in the battery box.

[0020] The utility model also provides an electrical device, which comprises a battery cell or a battery.

[0021] The cover plate assembly of the utility model is provided with a receiving groove surrounding the injection hole on the cover plate, the sealing member is received in the receiving groove and closes the injection hole, the side wall of the receiving groove and at least one of the outer peripheral walls of the sealing member opposite to the side wall of the receiving groove are provided with a receiving groove, the solder member is received in the receiving groove and connected to the cover plate and the sealing member, thereby realizing a sealed connection between the sealing member and the cover plate, and the welding surface is larger, thereby forming a good quality welding joint, without poorly connected or defective welding joints, and improving the sealing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solution of the present utility model, the drawings required for use in the implementation mode will be briefly introduced below.

[0023] Figure 1 It is a schematic diagram of the structure of the battery cell provided in the first embodiment of the utility model.

[0024] Figure 2 yes Figure 1 Schematic diagram of the three-dimensional structure of the cover assembly of the battery cell.

[0025] Figure 3 yes Figure 2 A schematic diagram of the three-dimensional structure of the cover plate assembly from another perspective is shown in FIG.

[0026] Figure 4 yes Figure 2 Schematic diagram of the three-dimensional structural decomposition of the cover assembly.

[0027] Figure 5 yes Figure 4 A schematic diagram of further three-dimensional structural decomposition of the cover assembly in FIG.

[0028] Figure 6 yes Figure 5 A schematic diagram of the three-dimensional structural decomposition of the cover assembly from another perspective.

[0029] Figure 7 yes Figure 2 One of the three-dimensional cross-sectional views of the cover assembly in FIG.

[0030] Figure 8 yes Figure 7 An enlarged view of section VIII in FIG.

[0031] Fig. 9 yes Figure 8 Schematic diagram of the three-dimensional structural decomposition of the cover assembly.

[0032] Fig.10 yes Fig. 9 A schematic diagram of further three-dimensional structural decomposition of the cover assembly in FIG.

[0033] Fig.11 yes Figure 8 Schematic cross-sectional view of the cover assembly in FIG.

[0034] Fig.12 yes Fig.11 An enlarged view of section XII in FIG.

[0035] Fig.13 yes Fig.11 Exploded view of the cover assembly in FIG.

[0036] Fig.14 yes Fig.11 Schematic diagram of the assembly process of the cover assembly.

[0037] Fig.15 It is a partial structural schematic diagram of the cover plate assembly provided in the second embodiment of the utility model.

[0038] Fig.16 yes Fig.15 Exploded view of the cover assembly in FIG.

[0039] Fig.17 It is a partial structural schematic diagram of a cover plate assembly provided in the third embodiment of the present utility model.

[0040] Fig.18 yes Fig.17 Exploded view of the cover assembly in FIG.

[0041] Description of reference numerals: 100, battery cell; 30, housing; 50, 50a, 50b, cover plate assembly; 51, 51a, 51b, cover plate; 510, first back surface; 511, first front surface; 512, injection hole; 5121, first connection hole; 5123, second connection hole; 5125, support surface; 513, support ring; 5130, second front surface; 5131, first receiving groove; 5131a, first bottom surface; 5131b, first inner peripheral surface; 514, receiving groove; 5141, first welding surface; 5143, second welding surface; 515, protrusion; 516, blocking edge; 5161, blocking surface; 5163, inner circumferential surface; 5165, top surface; 53, 53a, 53b, sealing member; 530, third front surface; 531, second receiving groove; 5311, second bottom surface; 5313, second inner circumferential surface; 532, 532a, 532b, receiving space; 535, third back surface; 537, positioning groove; 5371, first gap; 5370, second gap; 5372, first inner side surface; 5374, second inner side surface; 5376, connecting surface; 538, liquid stopping groove; 54, 54a, 54b, solder member; 56, sealing plug; 562, sealing column; 564, covering plate; 566, elastic hook. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of them. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0043] It should be noted that the reference to "embodiment" or "implementation method" in this document means that the specific features, structures or characteristics described in conjunction with the embodiment or implementation method may be included in at least one embodiment of the present utility model. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0044] The terms "first" and "second" appearing in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined. In the description of the present utility model, it should be noted that, unless otherwise clearly stipulated and defined, the terms "installed", "connected", "connected", and "set on..." should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0045] See also Figures 1 to 6One embodiment of the utility model provides a battery cell 100, including a shell 30 and a cover assembly 50, wherein the shell 30 stores electrolyte, the cover assembly 50 includes a cover 51, a sealing member 53, a solder member 54 and a sealing plug 56, the cover 51 is provided with a liquid injection hole 512, in this embodiment, the liquid injection hole 512 is located on the first front side 511 of the cover 51; the cover 51 is provided with a receiving groove 514 around the liquid injection hole 512, in this embodiment, the first front side 511 of the cover 51 is provided with a supporting The ring 513, the second front face 5130 of the support ring 513 is provided with a receiving groove 514, and the receiving groove 514 is arranged around the injection hole 512; the sealing plug 56 is sealed and connected to the injection hole 512, the sealing member 53 is accommodated in the receiving groove 514 and closes the injection hole 512, at least one of the side wall of the receiving groove 514 and the outer peripheral wall of the sealing member 53 opposite to the side wall of the receiving groove 514 is provided with a receiving groove, the solder member 54 is accommodated in the receiving groove and connected to the cover plate 51 and the sealing member 53, so as to seal and connect the sealing member 53 and the cover plate 51. In this embodiment, the side wall of the receiving groove 514 is provided with a first receiving groove 5131, the outer peripheral wall of the sealing member 53 is provided with a second receiving groove 531, the first receiving groove 5131 is connected to the second receiving groove 531, and the solder member 54 is accommodated in the receiving space surrounded by the first receiving groove 5131 and the second receiving groove 531. Specifically, the solder member 54 is formed by cooling the molten solder under the action of an external heat source. The molten solder has the function of wetting the connection surface of the cover plate 51 and the sealing member 53. That is, in this embodiment, the sealing member 53 and the cover plate 51 can be welded together by the molten solder through processes such as brazing and melting welding. After the molten solder solidifies, the solder member 54 is formed to seal the sealing member 53 to the cover plate 51. The cover plate 51 is sealed and connected to the housing 30, and the injection hole 512 of the cover plate 51 is connected to the inner cavity of the housing 30. In this embodiment, the receiving groove 514 is an annular groove surrounding the injection hole 512, the solder member 54 is a solder ring accommodated in the annular groove, and the sealing member 53 is a circular plate, which is accommodated in the receiving groove 514, and the outer diameter of the sealing member 53 is slightly smaller than the outer diameter of the receiving groove 514. The external heat source can be, but is not limited to, a laser heat source, etc. In this embodiment, the solder member 54 is formed by cooling the molten solder under the action of the induction coil heat source.

[0046] In some embodiments, the second front side 5130 of the support ring 513 is provided with a first receiving groove 5131, the first receiving groove 5131 is arranged in a circle along the edge of the receiving groove 514, and the first receiving groove 5131 passes through the inner circumference of the receiving groove 514; the receiving groove 514 is closer to the injection hole 512 than the first receiving groove 5131. Specifically, in the axial direction of the injection hole 512, the first receiving groove 5131 is farther away from the injection hole 512 than the receiving groove 514. Optionally, the receiving groove 514 is a first annular groove, the first receiving groove 5131 is a second annular groove, and the first annular groove and the second annular groove are coaxial; the inner diameter of the second annular groove is larger than the inner diameter of the first annular groove, and the first receiving groove 5131 is connected to the receiving groove 514.

[0047] In other embodiments, the third front side 530 of the sealing member 53 is provided with a first receiving groove, and the first receiving groove is arranged along the edge of the sealing member 53 . When the sealing member 53 is accommodated in the receiving groove 514 , the first receiving groove is connected to the receiving groove 514 .

[0048] In the production process of the battery cell in the prior art, after the electrolyte is injected into the shell 30 through the injection hole, the injection hole will be sealed. The existing method is to directly weld the sealing pin to the cover plate through a laser welding process to seal the injection hole; however, the above direct laser welding method has the following problems: First, since the sealing pin is small, the welding depth and width between the sealing pin and the battery cover are less than 1mm. Therefore, before laser welding, the assembly accuracy of the sealing pin and the injection hole is relatively high. Once there is a slight defect in the assembly between the two, it will The formation of bad or defective welding joints, and the sealing nail welding is the last step of the battery core sealing welding. If the repair welding is not successful, the entire battery core can only be scrapped, resulting in a waste of resources; secondly, the thickness of the weld between the sealing nail and the battery core cover is generally about 0.7mm, but the actual welding penetration after direct laser welding is generally less than 0.3mm. However, there is a large stress at the welding joint. Under the action of stress, there is a tendency of stress corrosion cracking in the unwelded part of the welding surface. Therefore, it will increase the risk of subsequent crack expansion and welding joint failure to a certain extent, greatly affecting the service life of the battery core. The cover plate assembly 50 of the utility model is provided with a receiving groove 514 on the cover plate 51, and the sealing member 53 is accommodated in the receiving groove 514. The side wall of the receiving groove 514 and at least one of the peripheral walls of the sealing member 53 and the side wall of the receiving groove 514 are provided with a receiving groove. The solder member 54 is accommodated in the receiving groove and connected to the cover plate 51 and the sealing member 53, so that the sealing member 53 and the cover plate 51 are welded together, the welding surface is large, and there will be no poor connection or defective welding joints. Therefore, the welding of the seal 53 and the cover plate 51 through the solder piece 54 in the present application has the following advantages: First, during the welding process, the induction coil heat source is used to melt the solder, and the melted solder can infiltrate the welding surface and fill the gap between the seal 53 and the cover plate 51; due to the low melting point of the solder, the required heat input is small, which reduces the heat input to the battery cell 100 as a whole to a certain extent, thereby reducing the impact of heat on the performance of the battery cell 100, and is also conducive to reducing welding deformation. Second, compared with the laser direct welding in the prior art, which makes the seal 53 and the cover plate 51 melt and weld together, the use of the solder piece 54 in the present application can avoid defects such as welding spatter, undercut, welding deviation, welding holes and welding cracks during the welding process. Thirdly, in the present application, the receiving groove and the gap between the seal 53 and the cover plate 51 are filled with a large area of ​​the solder part 54, and a good quality weld joint is formed after solidification; compared with other fusion welding in the prior art, the laser brazing of the present application has lower requirements on the welding surface processing and pre-welding assembly accuracy, which greatly reduces the manufacturing cost. At the same time, the high-quality weld joint reduces resource waste.

[0049] Optionally, the material of the solder part 54 may be, but is not limited to, solder, solder paste, solder, etc., all of which can be melted under the action of an external heat source to form the solder part 54 .

[0050] Please also read Figure 5-Figure 6 The cover plate 51 may be, but is not limited to, a rectangular cover plate, a circular cover plate, or a polygonal cover plate. The cover plate 51 includes a first front surface 511, a first back surface 510 facing away from the first front surface 511, and an outer peripheral surface surrounding the cover plate 51. The injection hole 512 is provided on the first front surface 511. The support ring 513 is convexly provided on the first front surface 511 and surrounding the injection hole 512. The first back surface 510 and / or the outer peripheral surface of the cover plate 51 are sealed and connected to the housing 30. The first back surface 510 of the cover plate 51 is provided with a protrusion 515 opposite to the injection hole 512, and the injection hole 512 passes through the protrusion 515. Optionally, the injection hole 512 is a countersunk hole, and the injection hole 512 includes a first connecting hole 5121 and a second connecting hole 5123. The first connecting hole 5121 and the second connecting hole 5123 are coaxial, and the inner diameter of the first connecting hole 5121 is smaller than the inner diameter of the second connecting hole 5123. The cover plate 51 forms a supporting surface 5125 between the first connecting hole 5121 and the second connecting hole 5123, and the end of the first connecting hole 5121 facing away from the second connecting hole 5123 passes through the back side of the protrusion 515.

[0051] Optionally, the axial depth of the first receiving groove 5131 along the injection hole 512 is less than the axial depth of the receiving groove 514 along the injection hole 512. Optionally, the receiving groove 514 includes a first welding surface 5141 facing the back of the sealing member 53 and a second welding surface 5143 facing the outer peripheral surface of the sealing member 53, and the first receiving groove 5131 passes through the second welding surface 5143. The first receiving groove 5131 includes a first bottom surface 5131a and a first inner peripheral surface 5131b connected to the first bottom surface 5131a, a side of the first bottom surface 5131a away from the first inner peripheral surface 5131b is connected to the second welding surface 5143, and a side of the first inner peripheral surface 5131b away from the first bottom surface 5131a is connected to the second front surface 5130 of the support ring 513; in this embodiment, the first inner peripheral surface 5131b is perpendicular to the first bottom surface 5131a. The intersection of the first bottom surface 5131a of the first receiving groove 5131 and the inner surface of the receiving groove 514 is an arc transition. Specifically, the intersection of the first bottom surface 5131a and the second welding surface 5143 is an arc transition.

[0052] Optionally, the blocking edge 516 is arranged around the injection hole 512 and includes a blocking surface 5161 and an inner peripheral surface 5163 opposite to each other, and a top surface 5165 connected between the blocking surface 5161 and the inner peripheral surface 5163; the blocking surface 5161, the first welding surface 5141 and the second welding surface 5143 surround the receiving groove 514; the blocking edge 516 is used to block the molten solder from being injected into the injection hole 512. The thickness of the blocking edge 516 along the axial direction of the injection hole 512 is less than the axial depth of the receiving groove 514 along the injection hole 512. The blocking surface 5161 can be vertical or inclined relative to the first welding surface 5141. In this embodiment, the blocking surface 5161 is inclined relative to the first welding surface 5141 to increase the space of the receiving groove 514. Optionally, the inner circumferential surface 5163 of the blocking edge 516 may be coplanar or non-coplanar with the inner circumferential surface of the second connection hole 5123 . In the present embodiment, the inner circumferential surface 5163 is coplanar with the inner circumferential surface of the second connection hole 5123 .

[0053] like Figure 4-Figure 9 As shown, the seal 53 also includes a third back side 535 away from the third front side 530, and the third front side 530 of the seal 53 is provided with a second receiving groove 531. When the seal 53 is accommodated in the receiving groove 514, the second receiving groove 531 communicates with the receiving groove 514 and the first receiving groove 5131, and the first receiving groove 5131 and the second receiving groove 531 form a receiving space 532. The solder member 54 can be accommodated in the receiving space 532. In this way, the welding area of ​​the cover plate 51 and the seal 53 can be increased, so that the welding is more firm and the sealing performance is improved. The axial depth of the receiving space 532 along the injection hole 512 is less than or equal to the axial depth of the receiving groove 514 along the injection hole 512, that is, the axial depths of the first receiving groove 5131 and the second receiving groove 531 along the injection hole 512 are both less than or equal to the axial depth of the receiving groove 514 along the injection hole 512. Optionally, the second receiving groove 531 is arranged in a circle along the edge of the seal 53, and the receiving space 532 is an annular space. The intersection of the outer circumference of the sealing member 53 and the inner surface of the second receiving groove 531 is in an arc transition. Specifically, the second receiving groove 531 includes a second bottom surface 5311 and a second inner circumference 5313 connected to the second bottom surface 5311, the side of the second bottom surface 5311 away from the second inner circumference 5313 is connected to the outer circumference of the sealing member 53, and the side of the second inner circumference 5313 away from the second bottom surface 5311 is connected to the third front surface 530 of the sealing member 53. In this embodiment, the second inner circumference 5313 is perpendicular to the second bottom surface 5311. The intersection of the second bottom surface 5311 and the outer circumference of the sealing member 53 is in an arc transition.

[0054] Optionally, a blocking edge 516 is provided on the bottom wall of the receiving groove 514, and a positioning mechanism is provided on the bottom wall of the sealing member 53 facing the receiving groove 514, and the blocking edge 516 cooperates with the positioning mechanism for positioning. In this embodiment, the positioning mechanism is a positioning groove 537 arranged around the injection hole 512, that is, the positioning groove 537 is arranged on the bottom wall of the sealing member 53, and the blocking edge 516 cooperates with the positioning groove 537 for positioning. Specifically, a blocking edge 516 is provided on the edge of the bottom surface of the receiving groove 514 close to the injection hole 512, and the blocking edge 516 is arranged on the edge of the first welding surface 5141 at the injection hole 512; a positioning groove 537 is provided on the surface of the sealing member 53 facing the injection hole 512, and the blocking edge 516 can be positioned in the positioning groove 537; that is, the positioning groove 537 is arranged on the third back surface 535 of the sealing member 53. When the sealing member 53 is accommodated in the receiving groove 514, the blocking edge 516 is positioned in the positioning groove 537, and a first gap 5371 is defined between the side wall of the receiving groove 514 and the peripheral wall of the sealing member 53 opposite to the side wall of the receiving groove 514. The receiving groove 514 is connected to the first gap 5371, and the solder member 54 is partially accommodated in the first gap 5371. Specifically, the first gap 5371 is located between the peripheral surface of the sealing member 53 and the second welding surface 5143. A second gap 5370 is defined between the bottom wall of the receiving groove 514 and the bottom wall of the sealing member 53, and the second gap 5370 is connected to the first gap 5371. The solder member 54 is partially accommodated in the second gap 5370. The molten solder infiltrates into the second gap 5370 and the first gap 5371 through capillary action, so that the sealing member 53 is sealed and connected to the support ring 513. Specifically, the positioning groove 537 is arranged around the injection hole 512 and includes a first inner side surface 5372 and a second inner side surface 5374 that are spaced apart from each other, and a connecting surface 5376 connected between the first inner side surface 5372 and the second inner side surface 5374. When the blocking edge 516 is positioned in the positioning groove 537, the inner peripheral surface 5163 is attached to the first inner side surface 5372, the top surface 5165 is attached to the connecting surface 5376, and the blocking surface 5161 and the second inner side surface 5374 form a liquid stopping groove 538, which is used to accommodate excess solder liquid to prevent the solder liquid from crossing the blocking edge 516.

[0055] In some embodiments, the solder member 54 is a solder ring that can be accommodated in the receiving space 532, and the molten solder can fully fill the receiving space 532 and wet the second welding surface 5143 and the first welding surface 5141 of the entire receiving groove 514, thereby realizing the sealed connection between the sealing member 53 and the support ring 513. Optionally, the solder member 54 can be melted by aluminum-based solder, silver-based solder, etc., and the aluminum-based solder contains 2%-10% silicon by weight, and the balance is aluminum and inevitable impurities. The silver-based solder contains 4%-80% silver by weight, 18%-60% copper by weight, and 5%-45% zinc by weight, and the balance is silicon and inevitable impurities. The melting temperature of the solder member 54 is 550℃-1000℃. In this embodiment, the radial cross-section of the solder member 54 is a rectangular surface.

[0056] Optionally, the sealing plug 56 is sealed and connected to the injection hole 512, and the blocking edge 516 and the sealing member 53 are spaced from the sealing plug 56. Specifically, the sealing plug 56 includes a sealing column 562, a covering plate 564 provided at one end of the sealing column 562, and an elastic hook 566 provided at one end of the sealing column 562 away from the covering plate 564, and the sealing plug 56 is used to be plugged into the injection hole 512. Specifically, the sealing column 562 is plugged into the first connection hole 5121, the covering plate 564 is accommodated in the second connection hole 5123 and abuts against the support surface 5125, and the elastic hook 566 passes through the first connection hole 5121 and abuts against the back of the protrusion 515. The sealing plug 56 can be, but is not limited to, a rubber plug, a plastic plug, or a silicone plug. In this embodiment, the first connecting hole 5121 and the second connecting hole 5123 are coaxial circular holes; the sealing column 562 is a cylinder, the covering plate 564 is a circular plate, and the elastic hook 566 is an inverted cone. The sealing column 562, the covering plate 564 and the elastic hook 566 are coaxial, and the outer diameter of the covering plate 564 is smaller than the inner diameter of the second connecting hole 5123; when the sealing plug 56 is inserted into the injection hole 512, there is a gap between the outer peripheral surface of the covering plate 564 and the inner peripheral surface of the second connecting hole 5123.

[0057] like Figure 10-13 and Fig.14As shown, the assembly and welding process of the cover plate assembly 50 is as follows: the sealing plug 56 is assembled to the injection hole 512 of the cover plate 51, so that the elastic hook 566 elastically presses against the back of the protruding portion 515, and the covering plate 564 presses against the supporting surface 5125. At this time, there is a gap between the outer peripheral surface of the covering plate 564 and the inner peripheral surface of the second connecting hole 5123; the sealing member 53 is assembled to the receiving groove 514 of the supporting ring 513, so that the blocking edge 516 is inserted into the positioning groove 537. At this time, the top surface 5165 of the blocking edge 516 is supported on the connecting surface 5376 of the sealing member 53, the first inner side surface 5372 is attached to the inner peripheral surface 5163 of the blocking edge 516, the blocking surface 5161 and the second inner side surface 5374 form a liquid stopping groove 538, and there is a gap between the third back side 535 of the sealing member 53 and the sealing plug 56. 5 and the first welding surface 5141, there is a second gap 5370, there is a first gap 5371 between the outer peripheral surface of the sealing member 53 and the second welding surface 5143, the first receiving groove 5131 and the second receiving groove 531 form a receiving space 532, and the radial cross section of the receiving space 532 is a rectangular surface; a solder ring used to form a solder member 54 is placed in the receiving space 532, and then induction coil brazing is performed, so that the solder ring is melted and infiltrates into the second gap 5370 and the first gap 5371 through capillary action, and fills the receiving space 532, so that the solder ring is melted to form a solder member 54 that adheres to the first bottom surface 5131a, the first inner peripheral surface 5131b, the second bottom surface 5311 and the second inner peripheral surface 5313, and the liquid stop groove 538 receives excess solder liquid to prevent the solder liquid from crossing the blocking edge 516. At this time, the sealing member 53 is sealedly connected to the support ring 513.

[0058] The sealing member 53 of the cover plate assembly 50 and the supporting ring 513 of the cover plate 51 in this embodiment are welded together through the soldering member 54, which has the following advantages: since the heat source such as the induction coil only needs to provide the heat source for forming the soldering member 54, compared with the direct use of laser welding in the prior art, the required heat is smaller, that is, the heat input of the induction coil is lower, and the overall heat input to the cover plate assembly 50 can be reduced during the welding process, thereby reducing the welding deformation of the cover plate assembly 50; the solder forming the soldering member 54 does not need to melt the high-melting-point base material during the induction coil brazing process, and there are no defects such as welding spatter, undercut, welding deviation, welding holes and welding cracks during the welding process, thereby This can avoid the problems of low efficiency caused by processes such as remelting and joint surface treatment, and waste of resources caused by scrapping of the cover assembly 50. Induction brazing is adopted to add solder in the receiving space 532, and then melt the solder through the induction coil. The molten solder fills the receiving space 532 and infiltrates into the second gap 5370 and the first gap 5371 through capillary action. The molten solder forms a solder part 54 so that the sealing part 53 is sealed and connected to the support ring 513. A larger welding area can ensure that a welding joint with higher strength and better sealing can be formed even when the assembly precision is not high, thereby greatly improving the welding yield and reducing the waste of resources.

[0059] Optionally, the projection surface of the opening of the receiving space 532 on the plane perpendicular to the axial direction of the injection hole 512 covers the projection surface of the side wall of the receiving space 532 on the plane; specifically, the first projection surface of the opening of the receiving space 532 on the plane perpendicular to the axial direction of the injection hole 512 may coincide with the second projection surface of the side wall of the receiving space 532 on the plane, that is, the side wall of the receiving space 532 is parallel to the axial direction of the injection hole 512; or, the first projection surface of the opening of the receiving space 532 on the plane perpendicular to the axial direction of the injection hole 512 may be larger than the second projection surface of the side wall of the receiving space 532 on the plane, that is, the second projection surface is located within the first projection surface, and the side wall of the receiving space 532 is inclined relative to the axial direction of the injection hole 512.

[0060] Please also read Figure 15-16 The structure of the cover assembly 50a provided in the second embodiment of the utility model is similar to the structure of the cover assembly 50 in any of the above-mentioned embodiments, except that: the shape of the receiving space 532a surrounded by the first receiving groove 5131 of the cover plate 51a and the second receiving groove 531 of the sealing member 53a in the second embodiment is different from the shape of the receiving space 532 surrounded by the first receiving groove 5131 of the cover plate 51 and the second receiving groove 531 of the sealing member 53 in the first embodiment, and the radial cross-section of the solder member 54a in the second embodiment is different from the radial cross-section of the solder member 54 in the first embodiment.

[0061] The radial cross section of the receiving space 532a in the second embodiment is a trapezoidal surface, the radial cross section of the soldering member 54a is a trapezoidal surface, and the soldering member 54a is accommodated in the receiving space 532a. Specifically, the first inner circumferential surface 5131b of the cover plate 51a is inclined relative to the first bottom surface 5131a, and the inner diameter of the first receiving groove 5131 gradually increases from the first bottom surface 5131a to the front direction of the support ring 513; the second inner circumferential surface 5313 of the sealing member 53a is inclined relative to the second bottom surface 5311, and the inner diameter of the second receiving groove 531 gradually increases from the second bottom surface 5311 to the front direction of the sealing member 53a; the molten solder forming the soldering member 54a is accommodated in the inverted trapezoidal receiving space 532a, which can increase the amount of solder used, which is beneficial to brazing, and the molten solder can fully infiltrate the second gap 5370 and the first gap 5371 through gravity to achieve a sealed connection between the sealing member 53a and the cover plate 51a.

[0062] The assembly and welding process of the cover plate assembly 50a in the second embodiment is the same as that of the cover plate assembly 50 in the first embodiment, and will not be described again.

[0063] Please also read Figure 17-Figure 18 The structure of the cover assembly 50b provided in the third embodiment of the utility model is similar to the structure of the cover assembly 50 in any of the above-mentioned embodiments, except that: the shape of the receiving space 532b surrounded by the first receiving groove 5131 of the cover plate 51b and the second receiving groove 531 of the sealing member 53b in the third embodiment is different from the shape of the receiving space 532 surrounded by the first receiving groove 5131 of the cover plate 51 and the second receiving groove 531 of the sealing member 53 in the first embodiment, and the radial cross-section of the solder member 54b in the third embodiment is different from the radial cross-section of the solder member 54 in the first embodiment.

[0064] The radial cross section of the receiving space 532b in the third embodiment is a semicircular surface, the radial cross section of the soldering member 54b is a semicircular surface, and the soldering member 54b is accommodated in the receiving space 532b. Specifically, the first inner circumference of the first receiving groove 5131 of the cover plate 51b is a 1 / 4 circular surface, and the second inner circumference of the second receiving groove 531 of the sealing member 53b is a 1 / 4 circular surface; when the sealing member 53b is accommodated in the accommodating groove 514, the first inner circumference of the first receiving groove 5131 and the second inner circumference of the second receiving groove 531 enclose a receiving space 532b with a semicircular cross section. The molten solder forming the soldering member 54b is accommodated in the receiving space 532b, which can increase the amount of solder used and is conducive to brazing. The molten solder can fully infiltrate the first welding surface 5141 and the second welding surface 5143 through gravity to achieve a sealed connection between the sealing member 53b and the cover plate 51b.

[0065] The assembly and welding process of the cover plate assembly 50 b in the third embodiment is the same as that of the cover plate assembly 50 in the first embodiment, and will not be described in detail herein.

[0066] The present application also provides a battery cell 100, which includes a shell 30 and a cover plate assembly 50, the cover plate assembly 50 includes a cover plate 51, a seal 53 and a solder member 54, the cover plate 51 is provided with a liquid injection hole 512, and the cover plate 51 is provided with a receiving groove 514 around the liquid injection hole 512; the seal 53 is accommodated in the receiving groove 514 and closes the liquid injection hole 512, the side wall of the receiving groove 514 and at least one of the outer peripheral wall of the seal 53 opposite to the side wall of the receiving groove 514 is provided with a receiving groove, the solder member 54 is accommodated in the receiving groove 514 and is connected to both the cover plate 51 and the seal 53 to seal the seal 53 and the cover plate 51.

[0067] The present application also provides a battery, which includes a battery box and a battery cell 100. The battery cell 100 includes a shell 30 and a cover assembly 50. The cover assembly 50 includes a cover 51, a seal 53 and a solder member 54. The cover 51 is provided with a liquid injection hole 512. The cover 51 is provided with a receiving groove 514 around the liquid injection hole 512. The seal 53 is received in the receiving groove 514 and closes the liquid injection hole 512. At least one of the side wall of the receiving groove 514 and the outer peripheral wall of the seal 53 opposite to the side wall of the receiving groove 514 is provided with a receiving groove. The solder member 54 is received in the receiving groove 514 and is connected to both the cover 51 and the seal 53 to seal the seal 53 and the cover 51. The battery cell 100 is received in the battery box.

[0068] The present application also provides an electric device, which includes a battery cell 100 or a battery, and the battery cell includes a shell and a cover assembly 50, the cover assembly 50 includes a cover 51, a seal 53 and a solder member 54, the cover 51 is provided with a liquid injection hole 512, and a receiving groove 514 is provided on the cover 51 around the liquid injection hole 512; the seal 53 is accommodated in the receiving groove 514 and closes the liquid injection hole 512, and at least one of the side wall of the receiving groove 514 and the outer peripheral wall of the seal 53 opposite to the side wall of the receiving groove 514 is provided with a receiving groove, the solder member 54 is accommodated in the receiving groove 514 and is connected to both the cover 51 and the seal 53 to seal the seal 53 and the cover 51, and the liquid injection hole 512 is connected to the inner cavity of the shell. The electric device can be, but is not limited to, a vehicle, an aircraft, an energy storage cabinet or a computer.

[0069] The embodiments of the present invention are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the embodiments above is only used to help understand the method of the present invention and its core idea.

Claims

1. A cover plate assembly, characterized in that: The cover plate assembly includes A cover plate, wherein the cover plate is provided with a liquid injection hole, and the cover plate is provided with a receiving groove, and the receiving groove surrounds the liquid injection hole; A sealing member, the sealing member is accommodated in the receiving groove and closes the injection hole, and at least one of the side wall of the receiving groove and the outer peripheral wall of the sealing member opposite to the side wall of the receiving groove is provided with a receiving groove; as well as A solder piece is contained in the receiving groove and connected to the cover plate and the sealing piece so as to seal the sealing piece and the cover plate.

2. The cover plate assembly according to claim 1, characterized in that: The side wall of the receiving groove is provided with a first receiving groove, the outer peripheral wall of the sealing member is provided with a second receiving groove, the second receiving groove is connected to the first receiving groove, and the solder member is accommodated in a receiving space surrounded by the first receiving groove and the second receiving groove.

3. The cover plate assembly according to claim 2, characterized in that: The axial depth of the receiving space along the injection hole is less than or equal to the axial depth of the receiving groove along the injection hole.

4. The cover plate assembly according to claim 2, characterized in that: The first receiving groove is arranged in a circle along the edge of the containing groove, and the second receiving groove is arranged in a circle along the edge of the sealing member.

5. The cover plate assembly according to claim 2, characterized in that: The projection surface of the opening of the receiving space on a plane perpendicular to the axial direction of the injection hole covers the projection surface of the side wall of the receiving space on the plane.

6. The cover plate assembly according to any one of claims 1 to 5, characterized in that: A first gap is defined between the side wall of the receiving groove and the peripheral wall of the sealing member opposite to the side wall of the receiving groove. The receiving groove is communicated with the first gap, and the solder member is partially accommodated in the first gap.

7. The cover plate assembly according to claim 6, characterized in that: A second gap is defined between the bottom wall of the receiving groove and the bottom wall of the sealing member. The second gap is connected to the first gap, and the solder member is partially contained in the second gap.

8. The cover plate assembly according to claim 6, characterized in that: The bottom wall of the containing groove is provided with a blocking edge, and the blocking edge surrounds the liquid injection hole.

9. The cover plate assembly according to claim 8, characterized in that: A positioning mechanism is provided on the bottom wall of the sealing member facing the accommodating groove, and the blocking edge cooperates with the positioning mechanism for positioning.

10. The cover plate assembly according to claim 9, characterized in that: The blocking edge includes a relative blocking surface and an inner peripheral surface, and a top surface connected between the blocking surface and the inner peripheral surface; the positioning mechanism is a positioning groove arranged around the injection hole, and the positioning groove includes a first inner side surface and a second inner side surface spaced apart from each other, and a connecting surface connected between the first inner side surface and the second inner side surface; the top surface is attached to the connecting surface, and the blocking surface and the second inner side surface are used to form a liquid stopping groove.

11. The cover plate assembly according to claim 5, characterized in that: The cover plate assembly also includes a sealing plug, which is sealed and connected to the liquid injection hole.

12. A battery cell, characterized in that: The battery cell comprises a shell and a cover plate assembly as described in any one of claims 1 to 11, wherein a cover plate of the cover plate assembly is sealed and connected to the shell, and a liquid injection hole of the cover plate is connected to an inner cavity of the shell.

13. A battery, characterized in that: The battery comprises a battery box and the battery cell as claimed in claim 12 , wherein the battery cell is accommodated in the battery box.

14. An electrical device, characterized in that: The electrical device comprises the battery cell as claimed in claim 12 or the battery as claimed in claim 13.

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