Anti-falling mechanism of portable semiconductor laser
By designing a drop-proof mechanism on a portable semiconductor laser, using springs and damping rods to buffer the impact force when dropped, the problem of laser damage during transport is solved, achieving both drop protection and portability.
Patent Information
- Application Number
- CN202420797402.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-17
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-04-17
AI Technical Summary
Portable semiconductor lasers are easily damaged by drops during transport, and their internal components are also prone to damage.
A drop protection mechanism was designed, including components such as a protective shell, a support ring, a spring, and a damping rod. The impact force is buffered by the compression of the spring and the movement of the damping rod to prevent damage to the laser. The shell is also easily removed for use by a limiting mechanism.
It effectively cushions the impact force when dropped, protects the internal components of the laser, and facilitates the disassembly and use of the laser, thus improving the laser's drop resistance and portability.
Smart Images
Figure CN222355695U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of anti-fall mechanisms for portable semiconductor lasers, in particular to an anti-fall mechanism for a portable semiconductor laser. Background Art
[0002] Semiconductor lasers, also known as laser diodes, are an important type of chip-level comb-type integrated light source. They use semiconductor materials as working substances to generate lasers. Due to the differences in the material structure of different semiconductor materials, the specific process of generating lasers will vary.
[0003] Portable semiconductor lasers in the prior art are generally small in size, but during the carrying process, the laser may fall from the hand. Since the laser has many precision parts inside, its internal parts are easily damaged after falling, which in turn causes damage to the laser. Therefore, it is necessary to design an anti-fall mechanism for the portable semiconductor laser to solve the above problem. Utility Model Content
[0004] The purpose of the utility model is to provide a drop-proof mechanism for a portable semiconductor laser to solve the problems raised by the above-mentioned background technology.
[0005] To achieve the above objectives, the present invention provides the following technical solutions: a drop protection mechanism for a portable semiconductor laser, comprising a semiconductor laser, a protective housing provided on the surface of the semiconductor laser, support rings provided on both sides of the semiconductor laser and located inside the protective housing, a first spring welded to the inner wall of the support ring, and a plurality of first springs arranged in a ring shape, a first sleeve welded between the plurality of first springs, a second spring welded to one side of the inner cavity of the first sleeve, a damping rod welded to one end of the second spring, and one end of the damping rod welded to one side of the inner cavity of the protective housing;
[0006] Insert sleeves are fixedly mounted on both sides of the semiconductor laser, and an insert rod is fixedly mounted on the rear of the support ring, with one end of the insert rod extending into the interior of the insert sleeve.
[0007] Preferably, an L-shaped rod is fixedly mounted on the surface of the support ring via a bracket, an insert is fixedly mounted between the two L-shaped rods, and a limiting mechanism used in conjunction with the insert is provided at the rear of the semiconductor laser.
[0008] Preferably, the limiting mechanism includes a square sleeve and a second sleeve fixedly mounted on the rear of the semiconductor laser, the rear end of the insert extends to the interior of the square sleeve, a third spring is welded to the top of the inner cavity of the second sleeve, and a trapezoidal rod is welded to the bottom end of the third spring.
[0009] Preferably, the bottom end of the trapezoidal rod passes through the square sleeve and the insert block in sequence and extends to the outside of the square sleeve, and the tops of the insert block and the square sleeve are both provided with limiting openings for use with the trapezoidal rod.
[0010] Preferably, a pull rod is fixedly mounted on the surface of the trapezoidal rod, and a movable opening for use with the pull rod is opened on the surface of the second sleeve.
[0011] Preferably, a handle is fixedly mounted on the top of the protective shell.
[0012] Compared with the prior art, the beneficial effects of the present invention are:
[0013] 1. The anti-fall mechanism of the portable semiconductor laser is provided with a protective shell. When the protective shell is subjected to impact forces from both sides due to falling, it can drive the damping rod to move. The movement of the damping rod can compress the second spring, thereby achieving the effect of buffering the impact forces on both sides. When the protective shell is subjected to front and back or up and down impact forces, the protective shell can drive the damping rod to move. The movement of the damping rod drives the movement of the first sleeve. The movement of the first sleeve compresses the first spring, thereby achieving the effect of buffering the front and back or up and down impact forces, thereby effectively achieving an anti-fall effect.
[0014] 2. The anti-fall mechanism of the portable semiconductor laser is configured by pulling the pull rod upward, which drives the trapezoidal rod upward. The trapezoidal rod can move to the outside of the limit opening. At this time, the plug block is no longer limited. Then, the L-shaped rod can be pulled backward to drive the support ring to move. The movement of the support ring causes the plug rod to move to the outside of the plug sleeve, thereby facilitating the removal of the protective shell from the surface of the semiconductor laser, thereby facilitating the use of the semiconductor laser. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the structure of the utility model;
[0016] Figure 2 This is a side view of the internal structure of the plug block, the second sleeve and the square sleeve of the utility model;
[0017] Figure 3 This is a schematic diagram of the structure of the first spring, the first sleeve and the limiting opening of the utility model;
[0018] Figure 4 This is a schematic structural diagram of the first spring, the first sleeve and the second spring of the utility model.
[0019] In the figure: 1. Semiconductor laser; 2. Protective shell; 3. Support ring; 4. First spring; 5. First sleeve; 6. Second spring; 7. Damping rod; 8. Insert sleeve; 9. Insert rod; 10. L-shaped rod; 11. Insert block; 12. Second sleeve; 13. Third spring; 14. Trapezoidal rod; 15. Square sleeve; 16. Limit opening; 17. Pull rod; 18. Movable opening; 19. Handle. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0021] Example 1
[0022] Please refer to Figure 1-4 As shown, the utility model provides a portable semiconductor laser anti-fall mechanism, comprising a semiconductor laser 1, a protective shell 2 is provided on the surface of the semiconductor laser 1, and support rings 3 are provided on both sides of the semiconductor laser 1 and inside the protective shell 2;
[0023] Specifically, the inner wall of the support ring 3 is welded with a first spring 4, and the first spring 4 is annularly arranged with several, the first spring 4 is an industrial-grade spring, has good fatigue resistance, can be repeatedly stretched for long-term use, and can be replaced after long-term use, a first sleeve 5 is welded between the multiple first springs 4, and a second spring 6 is welded on one side of the inner cavity of the first sleeve 5, the second spring 6 is an industrial-grade spring, has good fatigue resistance, can be repeatedly stretched for long-term use, and can be replaced after long-term use, a damping rod 7 is welded at one end of the second spring 6, the interior of the damping rod 7 is made of metal and the surface is made of rubber The protective shell 2 is made of high quality and has an interference fit with the first sleeve 5. One end of the damping rod 7 is welded to one side of the inner cavity of the protective shell 2. By setting the protective shell 2, when the protective shell 2 is subjected to impact forces on both sides due to falling, the damping rod 7 can be driven to move. The movement of the damping rod 7 can compress the second spring 6, thereby achieving the effect of buffering the impact forces on both sides. When the protective shell 2 is subjected to front, back or up and down impact forces, the protective shell 2 can drive the damping rod 7 to move. The movement of the damping rod 7 drives the first sleeve 5 to move. The movement of the first sleeve 5 compresses the first spring 4, thereby achieving the effect of buffering the front, back or up and down impact forces.
[0024] Specifically, a sleeve 8 is fixedly installed on both sides of the semiconductor laser 1, a rod 9 is fixedly installed on the rear of the support ring 3, one end of the rod 9 extends to the inside of the sleeve 8, an L-shaped rod 10 is fixedly installed on the surface of the support ring 3 through a bracket, and an insert block 11 is fixedly installed between the two L-shaped rods 10. A limiting mechanism used in conjunction with the insert block 11 is provided at the rear of the semiconductor laser 1. The limiting mechanism includes a square sleeve 15 and a second sleeve 12 fixedly installed at the rear of the semiconductor laser 1. The rear end of the insert block 11 extends to the inside of the square sleeve 15. A third spring 13 is welded to the top of the inner cavity of the second sleeve 12. The third spring 13 is an industrial-grade spring with good fatigue resistance. It can be repeatedly stretched for long-term use and can be replaced after long-term use. A trapezoidal rod 14 is welded to the bottom end of the third spring 13. The lower surface of the trapezoidal rod 14 is set as an inclined surface. The bottom end of the L-shaped rod 14 passes through the square sleeve 15 and the plug block 11 in sequence and extends to the outside of the square sleeve 15. The top of the plug block 11 and the square sleeve 15 are both provided with a limiting opening 16 for use with the trapezoidal rod 14. A pull rod 17 is fixedly installed on the surface of the trapezoidal rod 14, and a movable opening 18 for use with the pull rod 17 is provided on the surface of the second sleeve 12. By setting a limiting mechanism and pulling the pull rod 17 upward, the pull rod 17 rises and drives the trapezoidal rod 14 to rise. The trapezoidal rod 14 rises and can be moved to the outside of the limiting opening 16. At this time, the plug block 11 is no longer limited. Then, the L-shaped rod 10 can be pulled backward to drive the support ring 3 to move. The support ring 3 moves to move the plug rod 9 to the outside of the plug sleeve 8, so as to facilitate the removal of the protective shell 2 from the surface of the semiconductor laser 1, thereby facilitating the use of the semiconductor laser 1.
[0025] Wherein: a handle 19 is fixedly installed on the top of the protective shell 2, and the provision of the handle 19 can achieve the effect of facilitating the carrying of the semiconductor laser 1.
[0026] Working principle: The utility model is a drop-proof mechanism for a portable semiconductor laser. By setting a protective shell 2, when the protective shell 2 is subjected to impact forces on both sides due to falling, the damping rod 7 can be driven to move. The movement of the damping rod 7 can compress the second spring 6, thereby achieving the effect of buffering the impact forces on both sides. When the protective shell 2 is subjected to front-back or up-down impact forces, the protective shell 2 can drive the damping rod 7 to move. The movement of the damping rod 7 drives the first sleeve 5 to move. The movement of the first sleeve 5 compresses the first spring 4, thereby achieving the effect of buffering the front-back or up-down impact forces, effectively achieving the anti-fall effect. When the semiconductor laser 1 needs to be used, the pull rod 17 can be pulled upward, and the pull rod 17 rises and drives the trapezoidal rod 14 to rise. The trapezoidal rod 14 rises and can move to the outside of the limit opening 16. At this time, the plug block 11 is no longer limited. Then, the L-shaped rod 10 can be pulled backward to drive the support ring 3 to move. The movement of the support ring 3 causes the plug rod 9 to move to the outside of the socket 8, so as to facilitate the removal of the protective shell 2 from the surface of the semiconductor laser 1, thereby achieving the effect of facilitating the use of the semiconductor laser 1. At the same time, by providing the handle 19, the semiconductor laser 1 can be easily carried.
[0027] The contents not described in detail in this specification belong to the prior art known to those skilled in the art.
[0028] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A portable semiconductor laser anti-fall mechanism, comprising a semiconductor laser (1), characterized in that: A protective shell (2) is arranged on the surface of the semiconductor laser (1), support rings (3) are arranged on both sides of the semiconductor laser (1) and inside the protective shell (2), a first spring (4) is welded to the inner wall of the support ring (3), and a plurality of first springs (4) are arranged in a ring shape, a first sleeve (5) is welded between the plurality of first springs (4), a second spring (6) is welded to one side of the inner cavity of the first sleeve (5), a damping rod (7) is welded to one end of the second spring (6), and one end of the damping rod (7) is welded to one side of the inner cavity of the protective shell (2); Insert sleeves (8) are fixedly mounted on both sides of the semiconductor laser (1), and an insert rod (9) is fixedly mounted on the rear of the support ring (3), with one end of the insert rod (9) extending into the interior of the insert sleeve (8).
2. The anti-fall mechanism of a portable semiconductor laser according to claim 1, characterized in that: An L-shaped rod (10) is fixedly mounted on the surface of the support ring (3) via a bracket, an insert block (11) is fixedly mounted between the two L-shaped rods (10), and a limiting mechanism for use in conjunction with the insert block (11) is provided at the rear of the semiconductor laser (1).
3. The anti-fall mechanism of a portable semiconductor laser according to claim 2, characterized in that: The limiting mechanism comprises a square sleeve (15) and a second sleeve (12) fixedly mounted on the rear part of the semiconductor laser (1); the rear end of the insert block (11) extends into the interior of the square sleeve (15); a third spring (13) is welded to the top of the inner cavity of the second sleeve (12); and a trapezoidal rod (14) is welded to the bottom end of the third spring (13).
4. The anti-fall mechanism of a portable semiconductor laser according to claim 3, characterized in that: The bottom end of the trapezoidal rod (14) passes through the square sleeve (15) and the insert block (11) in sequence and extends to the outside of the square sleeve (15); the tops of the insert block (11) and the square sleeve (15) are both provided with a limiting opening (16) for use in conjunction with the trapezoidal rod (14).
5. The anti-fall mechanism of a portable semiconductor laser according to claim 3, characterized in that: A pull rod (17) is fixedly mounted on the surface of the trapezoidal rod (14), and a movable opening (18) for use in conjunction with the pull rod (17) is provided on the surface of the second sleeve (12).
6. The anti-fall mechanism of a portable semiconductor laser according to claim 1, characterized in that: A handle (19) is fixedly mounted on the top of the protective shell (2).