Middle frame assembly and electronic equipment

Abstract

The utility model provides a middle frame assembly and electronic equipment, and belongs to the technical field of electronics. The middle frame assembly comprises a supporting plate and a frame piece. The frame piece is arranged around at least one side edge of the supporting piece; the side edge of the supporting plate is provided with at least one first connecting part, and the frame piece is provided with at least one second connecting part. The first connecting part comprises at least one first lapping surface, the second connecting part comprises at least one second lapping surface, and the first lapping surface is lapped on one second lapping surface. The middle frame assembly comprises the supporting plate and the frame piece, the frame piece is arranged on the side edge of the supporting piece in a surrounding mode, the side edge of the supporting plate is provided with the first connecting part, the frame piece is provided with the second connecting part, the first connecting part is connected with the second connecting part in a lap joint mode through the first lap joint face and the second lap joint face of the second connecting part, and therefore the thickness of the supporting piece is small. Therefore, the thickness of the middle area of the middle frame assembly can be reduced, the stacking space of the electronic equipment can be increased, and the stacking thickness of the electronic equipment can be optimized.

Description

Technical Field

[0001] The utility model relates to the field of electronic technology, in particular to a middle frame component and electronic equipment. Background Art

[0002] As the concept of full-screen mobile phones becomes more popular, competition in the full-screen mobile phone market is becoming increasingly fierce, requiring better design solutions and cost control. Among them, the middle frame component, as the main structure of mobile electronic devices, has a significant impact on the thickness and cost of the entire device.

[0003] In the related art, the most common solution for the mobile phone middle frame is the overall aluminum alloy CNC (Computer Numerical Control, CNC machine tool) solution, or the die-cast middle plate welded aluminum alloy frame solution, but the above solutions have the problem of large stacking thickness of the whole machine. Utility Model Content

[0004] The utility model provides a middle frame component and an electronic device, which can solve the problem of large stacking thickness of the whole device.

[0005] The technical solution is as follows:

[0006] In one aspect, a middle frame assembly is provided, the middle frame assembly comprising: a support plate and a frame member;

[0007] The frame member is arranged around at least one side edge of the support plate; at least one first connection portion is arranged on the side edge of the support plate, and the frame member is arranged with at least one second connection portion;

[0008] The first connection portion includes at least one first overlapping surface, the second connection portion includes at least one second overlapping surface, and the first overlapping surface is overlapped on one of the second overlapping surfaces.

[0009] In some embodiments, the first overlapping surface and the second overlapping surface extend in directions parallel to the plate surface of the support plate respectively.

[0010] In some embodiments, the number of the first overlapping surfaces is at least two, and at least two of the first overlapping surfaces are arranged in a stepped shape on the edge of the support plate;

[0011] and / or,

[0012] The number of the second overlapping surfaces is at least two, and at least two of the second overlapping surfaces are arranged in a stepped shape on the frame member.

[0013] In some embodiments, the support plate includes a first metal layer, the first metal layer is connected to the frame member, and a potential difference between the first metal layer and the frame member is less than a target potential difference.

[0014] In some embodiments, the support plate includes a first metal layer and a second metal layer, and the second metal layer is located on the surface of the first metal layer;

[0015] The second metal layer is connected to the frame member, and a potential difference between the second metal layer and the frame member is smaller than a target potential difference.

[0016] In some embodiments, the first overlapping surface and the second overlapping surface are connected by one or more of the following methods: welding connection, riveting connection, and adhesive connection.

[0017] In some embodiments, the first connection portion includes at least one bending portion, the second connection portion is located on the side wall of the frame member, and the at least one bending portion is connected to the second connection portion along a direction parallel to the plate surface of the support plate.

[0018] In some embodiments, the frame member includes a first structural portion and a second structural portion;

[0019] At least a portion of the first structural portion is located on a side where the first board surface of the support plate is located, and at least a portion of the second structural portion is located on a side where the second board surface of the support plate is located.

[0020] In some embodiments, the thickness of the support plate ranges from 0.15 mm to 0.3 mm.

[0021] On the other hand, an electronic device is provided, the electronic device comprising: the middle frame assembly described in the utility model, and a screen module and a battery module;

[0022] The screen module is located on the side where the first board surface of the support plate is located, and the battery module is located on the side where the second board surface of the support plate is located.

[0023] In some embodiments, the frame member includes a first structural portion and a second structural portion;

[0024] The edge of the screen module is connected to the first structural part; and / or,

[0025] The second structural portion and the second plate surface of the support plate form a battery compartment, and the depth of the battery compartment is greater than or equal to the dimension of the battery module along the stacking direction.

[0026] The beneficial effects brought by the technical solution provided by the utility model include at least:

[0027] The middle frame assembly of the utility model includes a support plate and a frame member, wherein the frame member is arranged around the side of the support plate, the side of the support plate is provided with a first connecting portion, and the frame member is provided with a second connecting portion. The first connecting portion is overlapped and connected by a first overlapping surface and a second overlapping surface of the second connecting portion, so that the thickness of the support plate is relatively small, which is conducive to reducing the thickness of the middle area of ​​the middle frame assembly, thereby increasing the stacking space of the electronic device and optimizing the stacking thickness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a structural schematic diagram of a middle frame assembly provided in an embodiment of the utility model;

[0030] Figure 2 It is a structural cross-sectional view of a middle frame assembly provided by an embodiment of the utility model;

[0031] Figure 3 is a structural cross-sectional view of a middle frame assembly provided by another embodiment of the utility model;

[0032] Figure 4 is a structural cross-sectional view of a middle frame assembly provided by another embodiment of the utility model;

[0033] Figure 5 It is a structural schematic diagram of an electronic device provided by an embodiment of the utility model.

[0034] The reference numerals in the figures represent respectively:

[0035] 1. Support plate;

[0036] 11. first connecting portion; 111. first overlapping surface; 112. bending portion;

[0037] 101, a first metal layer; 102, a second metal layer;

[0038] 1001, a first board surface; 1002, a second board surface;

[0039] 2. Frame parts;

[0040] 21. second connecting portion; 211. second overlapping surface; 22. first structural portion; 23. second structural portion;

[0041] 100. Screen module;

[0042] 200. Battery module. DETAILED DESCRIPTION

[0043] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the utility model. Instead, they are only examples of devices and methods consistent with some aspects of the utility model as detailed in the attached claims.

[0044] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate directions or positional relationships based on the attached Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0045] Unless otherwise defined, all technical terms used in the embodiments of the present invention have the same meanings as commonly understood by those skilled in the art.

[0046] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0047] On the one hand, combined with Figure 1 and Figure 2 As shown, this embodiment provides a middle frame assembly, which includes: a support plate 1 and a frame member 2.

[0048] The frame member 2 is arranged around at least one side edge of the support plate 1 ; at least one first connection portion 11 is provided on the side edge of the support plate 1 , and the frame member 2 is provided with at least one second connection portion 21 .

[0049] The first connection portion 11 includes at least one first overlapping surface 111, and the second connection portion 21 includes at least one second overlapping surface 211, and the first overlapping surface 111 overlaps one second overlapping surface 211. Figure 1 Only the structure of the first connection part 11 and the second connection part 21 in a connected state is shown.

[0050] The middle frame assembly of the present embodiment includes a support plate 1 and a frame member 2, wherein the frame member 2 is arranged around the side of the support plate 1, the side of the support plate 1 is provided with a first connecting portion 11, and the frame member 2 is provided with a second connecting portion 21. The first connecting portion 11 is overlapped and connected by a first overlapping surface 111 and a second overlapping surface 211 of the second connecting portion 21, so that the thickness of the support plate 1 is relatively small, which is conducive to reducing the thickness of the middle area of ​​the middle frame assembly, thereby increasing the stacking space of the electronic device and optimizing the stacking thickness of the electronic device.

[0051] In some possible implementations, the support plate 1 has four sides, and the frame member 2 is arranged around all the sides. Exemplarily, the support plate 1 is a rectangular plate member, and the frame member 2 is a rectangular frame member. Optionally, the support plate 1 is a stamping structure. The stamping structure has the advantages of simple structure, small thickness, and low cost, which is conducive to reducing the thickness of the support plate 1 and reducing the thickness of the middle area of ​​the middle frame.

[0052] In some possible implementations, the first overlapping surface 111 and the second overlapping surface 211 may be fixed by welding, bonding, or crimping in addition to overlapping.

[0053] Combination Figure 2 As shown, in some embodiments, the first overlapping surface 111 and the second overlapping surface 211 extend in directions parallel to the board surface of the support board 1 .

[0054] Through the above arrangement, the orthographic projections of the first overlap surface 111 and the second overlap surface 211 in the direction perpendicular to the surface of the support plate 1 (that is, the thickness direction of the middle frame assembly and the electronic device) coincide, thereby achieving overlap in the direction perpendicular to the surface of the support plate 1. In this way, there is no need to increase the structure of the support plate 1 in the thickness direction, which is conducive to reducing the thickness of the middle frame and increasing the stacking space in the middle frame assembly. In addition, the first overlap surface 111 is parallel to the surface of the support plate 1, which is also conducive to the stamping of the support plate 1 and the first overlap surface 111.

[0055] Combination Figure 2 As shown, in some embodiments, the number of the first overlapping surfaces 111 is at least two, and the at least two first overlapping surfaces 111 are arranged in a stepped shape on the edge of the support plate 1 .

[0056] By arranging at least two first overlapping surfaces 111 in a stepped shape at the edge of the support plate 1, the first overlapping surfaces 111 can serve as a positioning structure between the support plate 1 and the frame member 2, thereby improving the positioning accuracy of the support plate 1 and the frame member 2 and reducing the difficulty of assembling the support plate 1 and the frame member 2.

[0057] Exemplarily, the number of the first overlapping surfaces 111 may be two, three, or the like.

[0058] Combination Figure 2 As shown, in some embodiments, the number of the second overlapping surfaces 211 is at least two, and at least two second overlapping surfaces 211 are arranged on the frame member 2 in a stepped shape.

[0059] By arranging at least two second overlapping surfaces 211 in a stepped shape on the frame member 2, the second overlapping surfaces 211 can serve as a positioning structure between the frame member 2 and the support plate 1, thereby improving the positioning accuracy of the support plate 1 and the frame member 2 and reducing the difficulty of assembling the support plate 1 and the frame member 2.

[0060] Exemplarily, the number of the second overlapping surfaces 211 may be two, three, or the like.

[0061] In some possible implementations, the number of first lap surfaces 111 and the second lap surfaces 211 are the same, and they are in corresponding or identical stepped shapes, so that each first lap surface 111 can overlap with a second lap surface 211 respectively, and another adjacent first lap surface 111 corresponds to the side surface of the second connecting portion 21, providing a positioning reference for the support plate 1 and the frame member 2 along the board surface direction of the support plate 1.

[0062] refer to Figure 2 As shown, the number of the first lap surface 111 and the number of the second lap surface 211 are both two. Among the two first lap surfaces 111, the position of the first lap surface 111 on the left side is lower than the position of the first lap surface 111 on the right side, and among the two second lap surfaces 211, the position of the second lap surface 211 on the left side is lower than the position of the second lap surface 211 on the right side. When the support plate 1 is connected to the frame member 2, the first lap surface 111 on the left side overlaps with the second lap surface 211 on the left side, and the first lap surface 111 on the right side overlaps with the second lap surface 211 on the right side. In addition, since the first lap surface 111 on the left side is lower than the second lap surface 211 on the right side, the right side wall of the first lap surface 111 on the left side abuts against the left side wall of the second lap surface 211 on the right side, thereby providing a rightward positioning reference for the support plate 1. Figure 2 Only the support plate 1 and the frame member 2 on one side of the middle frame assembly are shown. When the support plate 1 and the frame member 2 on the opposite side have the same and symmetrical first overlap surface 111 and second overlap surface 211, a bidirectional positioning reference can be provided for the support plate 1. Alternatively, when such first overlap surfaces 111 and second overlap surfaces 211 are provided on all four sides of the middle frame assembly, an omnidirectional positioning reference in the vertical, horizontal, and horizontal directions can be provided for the support plate 1.

[0063] Combination Figure 3 As shown, in some embodiments, the support plate 1 includes a first metal layer 101, the first metal layer 101 is connected to the frame member 2, and the potential difference between the first metal layer 101 and the frame member 2 is less than the target potential difference.

[0064] Electrochemical corrosion is an oxidation or reduction reaction of metals in the electrochemical process. Due to the potential difference between two metal objects in electrical contact, electrons flow from high potential to low potential, accompanied by cathode reaction and anode reaction. In the anode reaction, the metal is oxidized or forms metal ions, which directly leads to the loss of metal substances, thus causing corrosion.

[0065] Therefore, in this embodiment, the first metal layer 101 is arranged on the surface of the support plate 1, and the potential difference between the first metal layer 101 and the frame member 2 is smaller than the target potential difference, so as to prevent electrochemical corrosion between the support plate 1 and the frame as much as possible. The target potential difference may be the critical potential difference for electrochemical corrosion between the first metal layer 101 and the frame member 2. If the actual potential difference between the first metal layer 101 and the frame member 2 reaches or exceeds the target potential difference, electrochemical corrosion may occur.

[0066] Combination Figure 3 As shown, in some embodiments, the support plate 1 includes a first metal layer 101 and a second metal layer 102, and the second metal layer 102 is located on the surface of the first metal layer 101; the second metal layer 102 is connected to the frame member 2, and the potential difference between the second metal layer 102 and the frame member 2 is less than the target potential difference.

[0067] Since the support plate 1 needs to take into account both structural strength and material cost, some metals that meet the potential requirements have problems of insufficient structural strength or high cost. Therefore, the support plate 1 is arranged as a double-layer sandwich structure, in which the first metal layer 101 meets the strength and cost requirements, and the second metal layer 102 meets the potential requirements, thereby achieving multiple requirements such as strength, cost and anti-electrochemical corrosion.

[0068] In some embodiments, the first overlap surface 111 and the second overlap surface 211 are connected by one or more of the following methods: welding, riveting, and bonding. Through the above connection methods, the support plate 1 and the frame member 2 can be stably and reliably connected as one.

[0069] Combination Figure 4 As shown, in some embodiments, the first connection portion 11 includes at least one bent portion 112, the second connection portion 21 is located on the side wall of the frame member 2, and at least one bent portion 112 is connected to the second connection portion 21 along a direction parallel to the board surface of the support plate 1. The number of the bent portions 112 can be one, two, three, etc.

[0070] Through the above arrangement, the support plate 1 can be connected to the inner wall of the frame member 2 using at least one bent portion 112, which can simplify the structure of the support plate 1 and the frame member 2 and improve the production and assembly efficiency of the middle frame assembly.

[0071] Combination Figure 3 As shown, in some embodiments, the frame member 2 includes a first structure portion 22 and a second structure portion 23; at least a portion of the first structure portion 22 is located on the side where the first board surface 1001 of the support plate 1 is located, and at least a portion of the second structure portion 23 is located on the side where the second board surface 1002 of the support plate 1 is located. Thus, a groove-shaped stacking space can be formed on the first side surface and the second side surface of the support plate 1, respectively, to meet the stacking requirements of electronic devices.

[0072] In some possible implementations, one of the first structure portion 22 and the second structure portion 23 is an injection molding structure, and the other of the first structure portion 22 and the second structure portion 23 is a profile structure. The injection molding structure is formed by an injection molding process, and the profile structure is formed by a machining process.

[0073] In some possible implementations, the first board surface 1001 of the support board 1 is the screen side, and the first structural portion 22 is an injection molding structure; the second board surface 1002 of the support board 1 is the battery side, and the second structural portion 23 is a profile structure.

[0074] In some embodiments, the thickness of the support plate 1 ranges from 0.15 mm to 0.3 mm. When the thickness of the support plate 1 meets the above range, the middle frame assembly can provide a larger stacking space to meet the stacking requirements of electronic devices.

[0075] Exemplarily, the thickness of the support plate 1 is, for example, 0.15 mm, 0.17 mm, 0.2 mm, 0.22 mm, 0.25 mm, 0.27 mm, 0.3 mm, etc.

[0076] On the other hand, combined Figure 5 As shown, this embodiment provides an electronic device, which includes: the middle frame assembly of the present application, and a screen module 100 and a battery module 200; the screen module 100 is located on the side where the first board surface 1001 of the support plate 1 is located, and the battery module 200 is located on the side where the second board surface 1002 of the support plate 1 is located.

[0077] The electronic device of this embodiment adopts the middle frame assembly of the utility model, and has all the beneficial technical effects of all the embodiments of this invention. The middle frame assembly can obtain a smaller thickness, so a deeper stacking space can be formed between the first board surface 1001 and the second board surface 1002, thereby improving the stacking performance of the electronic device.

[0078] Combination Figure 5 As shown, in some embodiments, the frame member 2 includes a first structural portion 22 and a second structural portion 23; the edge of the screen module 100 is connected to the first structural portion 22; and / or the second structural portion 23 and the second board surface 1002 of the support plate 1 form a battery compartment, and the depth of the battery compartment is greater than or equal to the size of the battery module 200 along the stacking direction.

[0079] Exemplarily, the first structural part 22 is an injection molding structure, the second structural part 23 is a profile structure, the screen module 100 is connected to the injection molding structure, which has better reliability, and the second structural part 23 forms the back cover of the electronic device, which has a better appearance. Optionally, the screen module 100 has a curved cover plate, which can be covered on the entire first structural part 22, and the first structural part 22 of the injection molding structure cannot be seen from the outside, so that the electronic device has an appearance of a full glass cover on the front and a full metal body on the back.

[0080] In some possible implementations, the screen module 100 includes a flexible display panel, and the flexible display panel is an organic light-emitting diode (OLED) display.

[0081] Exemplarily, the flexible display panel includes a substrate, an organic light-emitting diode (OLED) layer, and a thin film encapsulation (TFE) layer which are stacked in sequence.

[0082] In another exemplary embodiment, the flexible display panel includes a substrate, a thin film transistor (TFT) layer, an organic light-emitting diode (OLED) layer, a thin film encapsulation (TFE) layer, a touch layer and a polarizer which are stacked in sequence.

[0083] It should be noted that the layer structure of the flexible display panel is not limited to the two structural forms listed above. Other layer structures can also be used when the folding display requirements are met.

[0084] In some possible implementations, the electronic device may also include a radio frequency (RF) circuit, a memory including one or more computer-readable storage media, an input unit, a display unit, a sensor, an audio circuit, a Wi-Fi module, a processor including one or more processing cores, and a power supply and other components.

[0085] It should be pointed out that in the description of the present invention, it should be explained that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0086] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0087] In the description of this specification, the reference terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present invention.

[0088] The above description is only an embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A middle frame assembly, characterized in that: The middle frame assembly comprises: a support plate (1) and a frame member (2); The frame member (2) is arranged around at least one side edge of the support plate (1); at least one first connecting portion (11) is provided on the side edge of the support plate (1), and the frame member (2) is provided with at least one second connecting portion (21); The first connecting portion (11) comprises at least one first overlapping surface (111), the second connecting portion (21) comprises at least one second overlapping surface (211), and the first overlapping surface (111) is overlapped on one of the second overlapping surfaces (211).

2. The middle frame assembly according to claim 1, characterized in that: The first overlapping surface (111) and the second overlapping surface (211) respectively extend in a direction parallel to the plate surface of the support plate (1).

3. The middle frame assembly according to claim 2, characterized in that: The number of the first overlapping surfaces (111) is at least two, and the at least two first overlapping surfaces (111) are arranged in a stepped shape on the edge of the support plate (1); and / or, The number of the second overlapping surfaces (211) is at least two, and the at least two second overlapping surfaces (211) are arranged in a stepped shape on the frame member (2).

4. The middle frame assembly according to claim 1, characterized in that: The support plate (1) comprises a first metal layer (101), the first metal layer (101) is connected to the frame member (2), and the potential difference between the first metal layer (101) and the frame member (2) is smaller than a target potential difference.

5. The middle frame assembly according to claim 1, characterized in that: The support plate (1) comprises a first metal layer (101) and a second metal layer (102), wherein the second metal layer (102) is located on the surface of the first metal layer (101); The second metal layer (102) is connected to the frame member (2), and the potential difference between the second metal layer (102) and the frame member (2) is smaller than the target potential difference.

6. The middle frame assembly according to claim 1, characterized in that: The first overlapping surface (111) and the second overlapping surface (211) are connected in one or more of the following ways: welding connection, riveting connection, and bonding connection.

7. The middle frame assembly according to claim 1, characterized in that: The first connecting portion (11) comprises at least one bent portion (112); the second connecting portion (21) is located on the side wall of the frame member (2); and the at least one bent portion (112) is connected to the second connecting portion (21) along a direction parallel to the plate surface of the support plate (1).

8. The middle frame assembly according to any one of claims 1 to 7, characterized in that: The frame member (2) comprises a first structural portion (22) and a second structural portion (23); At least part of the first structural portion (22) is located on the side where the first plate surface (1001) of the support plate (1) is located, and at least part of the second structural portion (23) is located on the side where the second plate surface (1002) of the support plate (1) is located.

9. The middle frame assembly according to claim 1, characterized in that: The thickness of the support plate (1) ranges from 0.15 mm to 0.3 mm.

10. An electronic device, characterized in that: The electronic device comprises: a middle frame assembly as claimed in any one of claims 1 to 9, a screen module (100) and a battery module (200); The screen module (100) is located on the side where the first board surface (1001) of the support plate (1) is located, and the battery module (200) is located on the side where the second board surface (1002) of the support plate (1) is located.

11. The electronic device according to claim 10, characterized in that: The frame member (2) comprises a first structural portion (22) and a second structural portion (23); The edge of the screen module (100) is connected to the first structural part (22); and / or, The second structural portion (23) and the second plate surface (1002) of the support plate (1) form a battery compartment, and the depth of the battery compartment is greater than or equal to the dimension of the battery module (200) along the stacking direction.

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