Loudspeaker assembly and electronic equipment

Abstract

The utility model discloses a loudspeaker assembly and electronic equipment, and belongs to the technical field of electronic equipment. The loudspeaker assembly comprises a shell and more than two loudspeaker modules, a containing cavity is formed in the shell, the shell comprises a first cavity wall and a second cavity wall which are oppositely arranged in the thickness direction, and the loudspeaker module directly and fixedly arranged on the first cavity wall and the loudspeaker module directly and fixedly arranged on the second cavity wall are arranged in an up-down staggered mode. And the height of the bottom surface of the loudspeaker module arranged at the upper part is lower than the height of the top surface of the loudspeaker module arranged at the lower part. The vibration of the loudspeaker module on the first cavity wall and the vibration of the loudspeaker module on the second cavity wall can counteract each other, the vibration of the loudspeaker assembly is reduced, the output force of the loudspeaker assembly to the electronic equipment in the working process can be effectively reduced, and then the problem of noise of the electronic equipment can be reduced or avoided. In addition, the height of the bottom surface of the loudspeaker module arranged at the upper part is lower than the height of the top surface of the loudspeaker module arranged at the lower part, so that the thickness of the loudspeaker assembly can be obviously reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a speaker assembly and electronic equipment. Background Art

[0002] With the development of electronic technology, communication equipment is indispensable in people's daily life, and speakers (such as dynamic speakers, piezoelectric speakers or other external speakers) are an indispensable accessory for transmitting sound in communication equipment such as telephones, intercoms, and mobile phones. A speaker is a transducer that converts electrical signals into sound signals. The performance of the speaker has a great impact on the sound quality. The audio energy in the speaker vibrates the cone or diaphragm through electromagnetic, piezoelectric or electrostatic effects, and resonates (resonates) with the surrounding air to produce sound.

[0003] In the related art, the keyboard side of an electronic device (such as a laptop) is generally provided with a speaker assembly, which is connected to the middle frame of the laptop, and a plurality of keyboard keys are also connected to the middle frame. When the speaker is in working state, it will generate vibration, and the vibration of the speaker will drive the middle frame to vibrate, and the vibration of the middle frame will further drive the keyboard assembly to vibrate, thereby generating noise, causing abnormal sound of the whole machine structure, and affecting the user experience. In addition, the thickness of the current speaker assembly is relatively thick, which will affect the thickness of the electronic device. Utility Model Content

[0004] The present application provides a speaker assembly and an electronic device, which are used to reduce the problem of abnormal noise of the electronic device caused by the vibration of the speaker assembly, and solve the problem that the electronic device is thick due to the thickness of the speaker assembly.

[0005] The technical solution is as follows:

[0006] A first aspect of the present application provides a speaker assembly, comprising a shell and two or more speaker modules, a accommodating cavity being formed in the shell, the shell comprising a first cavity wall and a second cavity wall arranged opposite to each other along a thickness direction, the speaker module directly fixed on the first cavity wall and the speaker module directly fixed on the second cavity wall being staggered up and down, and the bottom surface height of the speaker module arranged above is lower than the top surface height of the speaker module arranged below.

[0007] Speaker modules are arranged on the first cavity wall and the second cavity wall of the speaker assembly housing. Since the first cavity wall and the second cavity wall are two wall surfaces arranged vertically, the speaker modules on the first cavity wall and the second cavity wall are controlled to vibrate in opposite directions, so that the vibrations on the speaker modules can offset each other, thereby reducing the vibration of the speaker assembly. This can effectively reduce the output force of the speaker assembly on the electronic device during operation, thereby reducing or avoiding the problem of noise in the electronic device, improving the call effect and external sound quality of the electronic device, and thus improving the user experience.

[0008] In addition, since the bottom surface height of the upper speaker module is lower than the top surface height of the lower speaker module, the thickness of the speaker assembly can be significantly reduced compared to the upper speaker module and the lower speaker module being arranged opposite to each other in vertical direction.

[0009] In some implementations, an internal reinforcement structure is disposed within the housing to increase strength.

[0010] Since the overall thickness of the speaker assembly is small, if no internal reinforcement structure is provided and only the strength of the shell itself is relied on, the strength of the entire speaker assembly will be weak. Therefore, an internal reinforcement structure can be provided in the accommodating cavity of the shell to improve the strength of the speaker assembly.

[0011] In some implementations, there are more than one internal reinforcement structure and the internal reinforcement structure is disposed between two adjacent speaker modules, the top end of the internal reinforcement structure is connected to the first cavity wall, and the bottom end of the internal reinforcement structure is connected to the second cavity wall.

[0012] In order to achieve a better supporting effect of the internal reinforcement structure and improve the strength of the speaker assembly, it is preferred to set the top end of the internal reinforcement structure to be connected to the first cavity wall, and the bottom end of the internal reinforcement structure to be connected to the second cavity wall. When the internal reinforcement structure contacts the first cavity wall and the second cavity wall, it needs to avoid the speaker module. By setting the internal reinforcement structure between two adjacent speaker modules, the internal reinforcement structure can be located in the middle area of ​​the speaker assembly, that is, by reasonably limiting the position of the internal reinforcement structure in the shell, the strength of the speaker assembly can be better improved.

[0013] In some implementations, the housing is divided into two or more speaker module cavities by an internal reinforcement structure, one or more speaker modules are disposed in each speaker module cavity, and two adjacent speaker module cavities are connected or independent.

[0014] Depending on the speaker module, it is considered whether the two speaker module cavities are connected or independent (not connected). Preferably, the speaker modules are identical and the cavities of two adjacent speaker modules are connected to facilitate the production of the speaker assembly.

[0015] In some implementations, the internal reinforcement structure is an integrated structure, and a conducting hole is provided on the internal reinforcement structure; or, the internal reinforcement structure includes more than two independent supporting members, and there is a distance between two adjacent supporting members.

[0016] The internal reinforcement structure is set as an integrated structure, which is easy to process and manufacture. The bottom, top, front and back of the internal reinforcement structure are all connected to the internal reinforcement structure. Two adjacent speaker module cavities can be connected only through the conductive hole, which is conducive to the normal operation of the speaker module while ensuring the strength of the speaker assembly.

[0017] Of course, the internal reinforcement structure is not limited to an integrated structure. The integrated structure is only a preferred method. The internal reinforcement structure can also be configured to include more than two independent support members, and the upper and lower surfaces of each support member are respectively connected to the first cavity wall and the second cavity wall to increase the strength of the speaker module.

[0018] In some implementations, the material of the internal reinforcement structure is plastic.

[0019] The internal reinforcement structure is made of plastic material, which not only improves the strength of the speaker assembly, but also has a vibration reduction effect to a certain extent.

[0020] In some implementations, the shell includes an upper shell and a lower shell, the upper shell is arranged above the lower shell and the two are connected, a accommodating cavity is formed between the upper shell and the lower shell, and a speaker module mounting hole is provided on the upper shell and the lower shell.

[0021] The housing only includes two main parts, an upper housing and a lower housing, and has a simple structure. When the components inside the speaker assembly are assembled on the inner sides of the upper housing and the lower housing, the upper housing and the lower housing can be assembled.

[0022] In some implementations, a connecting colloid is disposed between the upper shell and the lower shell.

[0023] The connecting colloid not only has the function of connecting the upper shell and the lower shell, but also has the function of vibration reduction.

[0024] In some implementations, all speaker modules are identical, and the number of speaker modules disposed on the first cavity wall and the number of speaker modules disposed on the second cavity wall are identical.

[0025] By setting all speaker modules to be identical and the number of speaker modules arranged on the first cavity wall and the second cavity wall to be the same, the magnitude of the reverse vibration force of the speaker module arranged above and the speaker module arranged below is made as similar as possible, so as to better reduce the vibration and abnormal noise of the electronic device.

[0026] In some implementations, the speaker modules disposed on the first cavity wall and the second cavity wall are alternately disposed up and down in a horizontal direction.

[0027] The speaker modules arranged on the first cavity wall and the second cavity wall are alternately arranged up and down in the horizontal direction, which is beneficial to vibration reduction of the speaker assembly.

[0028] A second aspect of the present application provides an electronic device, comprising one or more speaker assemblies provided by any of the above technical solutions.

[0029] Through the above technical solution, since the electronic device includes the above speaker assembly, it at least has all the beneficial effects of the speaker assembly, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a front structural schematic diagram of a speaker assembly provided in an embodiment of the present application;

[0031] Figure 2 is a schematic diagram of the back structure of a speaker assembly provided in an embodiment of the present application;

[0032] Figure 3 is a schematic top view of a speaker assembly provided in an embodiment of the present application;

[0033] Figure 4 yes Figure 3 AA sectional view of FIG.

[0034] Figure 5 is a simplified cross-sectional view of a loudspeaker assembly provided in an embodiment of the present application;

[0035] Figure 6 is a simplified cross-sectional view of a loudspeaker assembly provided in an embodiment of the present application;

[0036] Figure 7 is a simplified cross-sectional view of a loudspeaker assembly provided in an embodiment of the present application;

[0037] Figure 8 is a simplified cross-sectional view of a loudspeaker assembly provided in an embodiment of the present application;

[0038] Fig. 9 A schematic diagram showing the sound wave vibration when the speaker module has no back cavity;

[0039] Fig.10 A schematic diagram illustrating the vibration of sound waves when the speaker module has a rear cavity;

[0040] Fig.11 It is a schematic diagram of the structure of a laptop computer provided in an embodiment of the present application.

[0041] The meanings of the figures are as follows:

[0042] 1. Laptop computer;

[0043] 11. Speaker assembly; 12. Keyboard assembly;

[0044] 111, housing; 112, speaker module; 113, speaker module cavity; 114, first cavity wall; 115, second cavity wall; 116, internal reinforcement structure; 117, connecting colloid;

[0045] 1111, upper housing; 1112, lower housing;

[0046] 1161. Through hole. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solution and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings. The embodiments described with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, but cannot be understood as limiting the present application.

[0048] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inside", "outside", "up", "down", "left", "right", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0049] In order to clearly describe the technical solution of the present application, the words "first", "second" and the like are used to distinguish the same or similar items with substantially the same functions and effects. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and execution order, and the words "first", "second" and the like do not necessarily limit the difference.

[0050] In this application, unless otherwise clearly specified and limited, the terms "connected", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0051] In this application, "and / or" is only a description of the association relationship of associated objects, indicating that there can be three relationships; for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0052] It should be noted that, in this application, words such as "in one embodiment", "exemplarily", "for example", etc. are used to indicate examples, illustrations or descriptions. Any embodiment or design described in this application as "in one embodiment", "exemplarily", "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "in one embodiment", "exemplarily", "for example", etc. is intended to present related concepts in a specific way.

[0053] With the development of electronic technology, mobile phones are indispensable in people's daily lives, and speakers (such as dynamic speakers, piezoelectric speakers or other external speakers) are indispensable components of mobile phones. Speakers are a transducer that converts electrical energy into sound energy. Specifically, they convert the electrical signal of the amplifier into the mechanical vibration of the diaphragm, which in turn changes the density of the surrounding air, so that the sound waves are transformed and sound is produced. The specific working principle of the speaker is as follows:

[0054] When a speaker receives an electrical signal, the coil inside generates a magnetic field, which interacts with the permanent magnet to cause the coil to vibrate. The speaker's diaphragm (usually a paper or plastic sheet) also vibrates, pushing the surrounding air to produce fluctuations, ultimately forming audible sound. The process of converting electrical signals into sound signals by the speaker relies on the force generated by electromagnetic induction and the vibration of the diaphragm, which can convert the changing current signal into a sound signal.

[0055] The keyboard side of a laptop is generally equipped with a speaker assembly, which is connected to the middle frame of the laptop, and multiple keyboard keys are also connected to the middle frame. When the speaker is in operation, it will vibrate, which will drive the middle frame to vibrate, and the vibration of the middle frame will further drive the keyboard assembly to vibrate, thus generating noise, causing abnormal sound in the entire machine structure, and affecting the user experience. In addition, the current speaker assembly is relatively thick, which will affect the thickness of the electronic device.

[0056] Based on this, an embodiment of the present application provides a speaker assembly, wherein speaker modules are arranged on the first cavity wall and the second cavity wall of a speaker assembly shell. Since the first cavity wall and the second cavity wall are two wall surfaces arranged vertically, the speaker modules on the first cavity wall and the second cavity wall are controlled to vibrate in opposite directions. For example, when the speaker module on the first cavity wall vibrates upward, the speaker module on the second cavity wall is controlled to vibrate downward, so that the vibrations on the speaker modules can offset each other, reducing the vibration of the speaker assembly, and effectively reducing the output force of the speaker assembly on the electronic device during operation, thereby reducing or avoiding the problem of noise in the electronic device, improving the call effect and external sound quality of the electronic device, thereby improving the user experience.

[0057] In addition, the embodiment of the present application provides a speaker assembly, which provides a premise for the bottom surface height of the speaker module arranged above to be lower than the top surface height of the speaker module arranged below by staggering the speaker module arranged above and below. Since the bottom surface height of the speaker module arranged above is lower than the top surface height of the speaker module arranged below, the thickness of the speaker assembly can be significantly reduced compared to the speaker module arranged above and the speaker module arranged below being arranged oppositely up and down, thereby avoiding the problem of thicker electronic equipment due to thicker speaker assembly.

[0058] The specific structure of the speaker assembly is described in detail below with reference to the accompanying drawings.

[0059] The present embodiment provides a speaker assembly, which can convert an audio electrical signal into a sound signal, and an electronic device can play music or make a hands-free call through the speaker assembly. Specifically, the speaker assembly includes a housing and two or more speaker modules, and the speaker modules are supported on the housing.

[0060] There are more than two speaker modules, that is, the number of speaker modules can be two, three, four... According to actual needs, a speaker assembly with a suitable number of speaker modules can be selected.

[0061] The speaker module includes coils, magnets, diaphragms and other components. When the speaker module receives an electrical signal, the internal coil generates a magnetic field, which interacts with the permanent magnet to make the coil vibrate, and the diaphragm will also vibrate, pushing the surrounding air to produce fluctuations, and finally forming audible sound. That is, the speaker module converts the electrical signal into a sound signal in the speaker assembly.

[0062] See also Figure 1-Figure 4 , Figure 1 This is a schematic diagram of the front structure of the speaker assembly. Figure 2 This is a schematic diagram of the back structure of the speaker assembly. Figure 3 is a top view of the speaker assembly. Figure 4 yes Figure 3 Schematic cross-sectional view of .

[0063] See also Figure 4 The housing 111 has a receiving cavity formed therein. The housing 111 includes a first cavity wall 114 and a second cavity wall 115 which are arranged opposite to each other in the thickness direction. Figure 4 In the Z direction, the speaker module 112 directly fixed on the first cavity wall 114 and the speaker module 112 directly fixed on the second cavity wall 115 are staggered up and down, and the bottom surface height of the upper speaker module 112 is lower than the top surface height of the lower speaker module 112.

[0064] For the first cavity wall 114 and the second cavity wall 115 which are arranged opposite to each other in the thickness direction of the housing 111, see Figure 4 , which are respectively the upper top surface and the lower bottom surface in the shell 111. The shell 111 is generally in the shape of a flat rectangular parallelepiped, and the accommodating cavity inside the shell 111 is also similarly in the shape of a rectangular parallelepiped.

[0065] A speaker module 112 is provided on both the first cavity wall 114 and the second cavity wall 115 of the shell 111 of the speaker assembly 11. Since the first cavity wall 114 and the second cavity wall 115 are two wall surfaces arranged vertically, the speaker modules 112 on the first cavity wall 114 and the second cavity wall 115 are controlled to vibrate in opposite directions, so that the vibrations on the speaker modules 112 can offset each other, thereby reducing the vibration of the speaker assembly 11. This can effectively reduce the output force of the speaker assembly 11 on the electronic device during operation, thereby reducing or avoiding the problem of noise in the electronic device, improving the call effect and external sound quality of the electronic device, and thus improving the user experience.

[0066] The speaker module 112 disposed on the first cavity wall 114 is referred to as the upper speaker module 112, and the speaker module 112 disposed at the bottom is referred to as the upper speaker module 112. There is a gap between the bottom surface of the upper speaker module 112 and the second cavity wall 115 to form a rear cavity area of ​​the upper speaker module 112, and there is a gap between the top surface of the lower speaker module 112 and the first cavity wall 114 to form a rear cavity area of ​​the upper speaker module 112.

[0067] By staggering the speaker module 112 disposed at the top and the speaker module 112 disposed at the bottom, a prerequisite is provided for the bottom surface height of the speaker module 112 disposed at the top to be lower than the top surface height of the speaker module 112 disposed at the bottom. Since the bottom surface height of the speaker module 112 disposed at the top is lower than the top surface height of the speaker module 112 disposed at the bottom, the thickness of the speaker assembly 11 can be significantly reduced compared to the speaker module 112 disposed at the top and the speaker module 112 disposed at the bottom being disposed oppositely up and down, thereby avoiding the problem of the electronic device being thick due to the thick speaker assembly 11.

[0068] Regarding the height difference between the bottom surface of the upper speaker module 112 and the top surface of the lower speaker module 112, if the usage is met, the height difference between the bottom surface of the upper speaker module 112 and the top surface of the lower speaker module 112 can be increased as much as possible to minimize the thickness of the speaker assembly 11.

[0069] Regarding the connection method between the speaker module 112 and the shell 111, an adhesive connection is preferably used, but it is not limited to only an adhesive connection. For example, it can be connected by pins or snaps, etc. The embodiment of the present application does not limit the specific connection method between the speaker module 112 and the shell 111.

[0070] Figure 4 In the figure, it is shown that a speaker module 112 is arranged on the first cavity wall 114, and a speaker module 112 is arranged on the second cavity wall 115, and the speaker module 112 fixed on the first cavity wall 114 and the speaker module 112 fixed on the second cavity wall 115 are arranged in a vertically staggered manner. It should be noted that the number of speaker modules 112 can be flexibly set, and the figure only shows an example of the speaker assembly 11 in the housing 111, which cannot be regarded as a special limitation to the present application.

[0071] In one embodiment, an internal reinforcement structure 116 is provided in the housing 111 for improving strength. Figure 4 and Figure 5 , illustrating the internal reinforcement structure 116.

[0072] Since the overall thickness of the speaker assembly 11 is small, if the internal reinforcement structure 116 is not provided and the strength of the shell 111 itself is relied on, the strength of the entire speaker assembly 11 will be relatively weak. Therefore, considering the strength of the speaker assembly 11, the internal reinforcement structure 116 is provided in the accommodating cavity of the shell 111 to improve the strength of the speaker assembly 11.

[0073] Here, it is to be noted that, in order to improve the strength of the speaker assembly 11, it is preferred to provide an internal reinforcement structure 116 in the housing 111. Of course, the internal reinforcement structure 116 may not be provided. Figure 6 , indicating that the internal reinforcement structure 116 is not provided in the housing 111. In order to improve the strength of the speaker assembly 11, the wall thickness of the housing 111 may be increased to improve the strength of the speaker assembly 11. However, increasing the wall thickness of the housing 111 will increase the thickness of the entire speaker assembly 11, while providing a reinforcement structure inside the housing 111 will not affect the thickness of the entire speaker assembly 11.

[0074] In one embodiment, there are more than one internal reinforcement structure 116 and the internal reinforcement structure 116 is disposed between two adjacent speaker modules 112 . The top end of the internal reinforcement structure 116 is connected to the first cavity wall 114 , and the bottom end of the internal reinforcement structure 116 is connected to the second cavity wall 115 .

[0075] In order to achieve a better supporting effect of the internal reinforcement structure 116 and improve the strength of the speaker assembly 11, it is preferred that the top end of the internal reinforcement structure 116 is connected to the first cavity wall 114, and the bottom end of the internal reinforcement structure 116 is connected to the second cavity wall 115. Of course, the internal reinforcement structure 116 is not limited to being connected to the first cavity wall 114 and the second cavity wall 115 at the top and the bottom respectively. The bottom of the internal reinforcement structure 116 may be connected to the housing 111, and there is a gap between the top and the first cavity wall 114, or the top of the internal reinforcement structure 116 is connected to the housing 111, and there is a gap between the bottom and the second cavity wall 115, which can also achieve the effect of improving the strength of the speaker assembly 11.

[0076] By disposing the internal reinforcement structure 116 between two adjacent speaker modules 112 , the internal reinforcement structure 116 can be located in the middle area of ​​the speaker assembly 11 . That is, by reasonably limiting the position of the internal reinforcement structure 116 in the shell 111 , the strength of the speaker assembly 11 can be better improved.

[0077] See also Figure 5 , showing an internal reinforcement structure 116. The number of internal reinforcement structures 116 is not limited to only one, for example, it can be two, in which case three speaker module cavities 113 are formed in the housing 111. When the internal reinforcement structure 116 is disposed between two adjacent speaker modules 112, the number of internal reinforcement structures 116 can be reasonably set according to the number of speaker modules 112 in the housing 111.

[0078] In one embodiment, the speaker module cavity 113 is divided into two or more speaker module cavities 113 by the internal reinforcement structure 116. More than one speaker module 112 is disposed in each speaker module cavity 113, and two adjacent speaker module cavities 113 are connected or independent.

[0079] See also Figure 5 , Figure 7-Figure 8 , schematically shows a speaker module cavity 113, which is the rear cavity of the corresponding speaker module 112. The number of internal reinforcement structures 116 can be set to one. In this case, two speaker module cavities 113 are formed in the shell 111, and more than one speaker module 112 is arranged in each speaker module cavity 113. Preferably, the same number of speaker modules 112 is arranged in each speaker module cavity 113, for example, one or two speaker modules 112 are arranged in each speaker module cavity 113. Of course, different numbers of speaker modules 112 can also be arranged in each speaker module cavity 113. See Figure 5 , schematically showing that a speaker module 112 is disposed in each speaker module cavity 113, see Figure 7 and Figure 8 , illustrating that two speaker modules 112 are arranged in each speaker module cavity 113.

[0080] For the rear cavity of the speaker module 112, see Fig. 9 If there is no back cavity, the sound wave vibration generated by the upward vibration of the diaphragm will be in phase with the sound wave vibration generated by the downward vibration, resulting in an acoustic short circuit (sound cancellation), and the overall sound output will be very small; see Fig.10 If there is a back cavity, the sound waves generated by the downward vibration of the vibrating membrane are confined in the back cavity, and the sound wave vibrations generated by the upward vibration of the vibrating membrane will not offset the sound wave vibrations generated by the downward vibration of the vibrating membrane, and the overall sound output will be very large.

[0081] Taking two identical speaker modules 112 disposed in the housing 111 as an example, the communication between two adjacent speaker module cavities 113 is described.

[0082] Two identical speaker modules 112 are arranged in the housing 111, wherein one speaker module 112 is connected to the first cavity wall 114, and the other speaker module 112 is connected to the second cavity wall 115. The internal reinforcement structure 116 is arranged between the two speaker modules 112 and is divided into two speaker module cavities 113. The two speaker modules 112 are arranged in the corresponding speaker module cavities 113. When the two speaker module cavities 113 are independent of each other, that is, not connected, the rear cavities of the two speaker modules 112 are not connected. At this time, the rear cavities of the two speaker modules 112 need to be substantially the same in volume. In this case, the position of the speaker module 112 on the housing 111 and the position of the internal reinforcement structure 116 are relatively high, which makes the production and processing requirements become high. If the two speaker module cavities 113 are connected to each other, the rear cavities of the two speaker modules 112 are connected, so that even if the volume of the two speaker module cavities 113 is different, the use of the two speaker modules 112 can be satisfied. Therefore, when the same speaker module 112 is disposed in the housing 111 , it is preferred that two adjacent speaker module cavities 113 are connected.

[0083] Taking two different speaker modules 112 disposed in the housing 111 as an example, the communication between two adjacent speaker module cavities 113 is described.

[0084] When the size difference between the two speaker modules 112 is relatively large, the two speaker modules 112 are respectively in different speaker module cavities 113 and the two speaker module cavities 113 cannot be connected. As for the volume sizes of the two speaker module cavities 113, they need to be set to different volume sizes according to the two speaker modules 112. This makes the position of the speaker module 112 on the shell 111 and the position of the internal reinforcement structure 116 relatively high, which makes the requirements for production and processing higher.

[0085] Regarding the shape of the internal reinforcement structure 116 , in one embodiment, the internal reinforcement structure 116 is an integrated structure, and a through hole 1161 is provided on the internal reinforcement structure 116 , and two adjacent speaker module cavities 113 are mainly connected through the through hole 1161 .

[0086] See also Figure 4-Figure 8, schematically showing the conduction hole 1161 on the internal reinforcement structure 116. The shape of the internal reinforcement structure 116 is a thin long strip as a whole, the top of the internal reinforcement structure 116 is connected to the first cavity wall 114, the bottom of the internal reinforcement structure 116 is connected to the second cavity wall 115, and the two ends of the internal reinforcement structure 116 along the length direction are connected or in contact with the inner side surface of the shell 111 or there is a gap, so that the two adjacent speaker module cavities 113 are mainly connected through the conduction hole 1161, and the shape of the internal reinforcement structure 116 in this case can help improve the strength of the speaker assembly 11.

[0087] Of course, the shape of the internal reinforcement structure 116 can also be as follows: the top of the internal reinforcement structure 116 is connected to the first cavity wall 114, the bottom of the internal reinforcement structure 116 is connected to the second cavity wall 115, and there is a large spacing between the two ends of the internal reinforcement structure 116 along the length direction and the inner side surface of the shell 111, so that without adding a conductive hole 1161 on the internal reinforcement structure 116, the connection between the two adjacent speaker module cavities 113 can be achieved.

[0088] Regarding the conducting holes 1161 on the internal reinforcement structure 116, a row of conducting holes 1161 may be arranged at intervals along the length direction of the internal reinforcement structure 116, and more than one row of conducting holes 1161 may be arranged on the internal reinforcement structure 116 along the thickness direction of the speaker assembly 11, and the through holes may be circular or square. Alternatively, a notch may be formed along the top and / or bottom of the internal reinforcement structure 116, and the notch may be arc-shaped or square-shaped, and the notch is the conducting hole 1161, and the notch may be arranged at intervals along the length direction of the internal reinforcement structure 116.

[0089] The internal reinforcement structure 116 is preferably an integral structure for easy assembly and can be installed in the housing 111 by gluing.

[0090] Regarding the shape of the internal reinforcement structure 116, in another embodiment, the internal reinforcement structure 116 includes more than two independent support members, and there is a distance between two adjacent support members.

[0091] For example, the internal reinforcement structure 116 includes a plurality of independent cylindrical support members, a row of cylindrical support members is arranged between two speaker modules 112, and a gap between two adjacent cylindrical support members forms a "conducting hole 1161" to connect two adjacent speaker module cavities 113.

[0092] The number of support members can be reasonably set according to the size of the support members. For example, when the size of the support members is relatively large, two support members can be set.

[0093] In one embodiment, the internal reinforcement structure 116 is made of plastic.

[0094] Plastic material is a solid material made of polymer as the basic component, with additives added, and then processed and molded or cross-linked and cured under a certain temperature and pressure. Since most polymers have good insulation properties, they are widely used as insulation materials.

[0095] The internal reinforcement structure 116 is preferably made of plastic material, which can not only support the shell 111 to improve the strength of the speaker assembly 11, but also has a vibration reduction effect to a certain extent.

[0096] In one embodiment, the shell 111 includes an upper shell 1111 and a lower shell 1112. The upper shell 1111 is arranged above the lower shell 1112 and the two are connected. A accommodating cavity is formed between the upper shell 1111 and the lower shell 1112. The upper shell 1111 and the lower shell 1112 are both provided with speaker module mounting holes.

[0097] See also Figure 1-Figure 8 , schematically showing an upper shell 1111 and a lower shell 1112. The inner side of the upper shell 1111 facing the lower shell 1112 is a first cavity wall 114, and the inner side of the lower shell 1112 facing the upper shell 1111 is a second cavity wall 115. Both the upper shell 1111 and the lower shell 1112 are formed with speaker module mounting holes, and the diaphragm side of each speaker module 112 faces the outside of the shell 111.

[0098] In one embodiment, a connection colloid 117 is disposed between the upper shell 1111 and the lower shell 1112 .

[0099] By providing a connecting colloid 117 between the upper shell 1111 and the lower shell 1112, not only the connection between the upper shell 1111 and the lower shell 1112 can be achieved, but also a certain vibration reduction effect can be achieved.

[0100] In one embodiment, all speaker modules 112 are identical, and the number of speaker modules 112 disposed on the first cavity wall 114 and the second cavity wall 115 is the same.

[0101] When the speaker modules 112 are the same, the vibration magnitudes generated by the speaker modules 112 are similar. When the same number of speaker modules 112 are arranged on the first cavity wall 114 and the second cavity wall 115, the vibration magnitudes caused by the speaker modules 112 on the first cavity wall 114 and the vibration magnitudes caused by the speaker modules 112 on the second cavity wall 115 are similar, which is conducive to achieving a better vibration reduction effect when the speaker assembly 11 is working. Figure 5-Figure 8, illustrating that the number of speaker modules 112 on the first cavity wall 114 and the second cavity wall 115 is the same.

[0102] It is preferred that the speaker module 112 on the first cavity wall 114 and the speaker module 112 on the second cavity wall 115 are the same, but the speaker modules 112 on the first cavity wall 114 and the second cavity wall 115 may also be different speaker modules 112 that produce vibrations with little difference. In addition, the number of speaker modules 112 on the first cavity wall 114 and the second cavity wall 115 may be different, for example, two speaker modules 112 are provided on the first cavity wall 114, and one speaker module 112 is provided on the second cavity wall 115. Under the design concept of providing speaker modules 112 on the first cavity wall 114 and the second cavity wall 115, even if the number of speaker modules 112 on the first cavity wall 114 and the second cavity wall 115 is different, the vibration reduction effect has been achieved, but the final vibration reduction effect is not as good as the effect of providing the same number of speaker modules 112 on the first cavity wall 114 and the second cavity wall 115.

[0103] When the vibration magnitudes of the speaker modules 112 differ greatly, for example, when the vibration magnitude of one speaker module 112 is equal to the vibration magnitudes of the two small speaker modules 112, the speaker module 112 with the larger vibration may be arranged on the first cavity wall 114 or the second cavity wall 115, while the other two small speaker modules 112 are arranged on the second cavity wall 115 or the first cavity wall 114, respectively. In this case, the vibrations generated by the two small speaker modules 112 may be offset by the vibrations of one speaker module 112. In this case, it should be noted that the two small speaker modules 112 are arranged in the same speaker module cavity 113, and the other large speaker module 112 is arranged in another speaker module cavity 113, and the two speaker module cavities 113 are not connected.

[0104] When all speaker modules 112 are identical and the number of speaker modules 112 disposed on the first cavity wall 114 and the second cavity wall 115 is the same, in one embodiment, the speaker modules 112 disposed on the first cavity wall 114 and the second cavity wall 115 are alternately disposed up and down in the horizontal direction.

[0105] See also Figure 8 , schematically shows that the speaker modules 112 arranged on the first cavity wall 114 and the second cavity wall 115 are alternately arranged up and down in the horizontal direction. By alternately arranging the speaker modules 112 on the first cavity wall 114 and the second cavity wall 115 up and down in the horizontal direction, the speaker modules 112 are evenly arranged on the first cavity wall 114 and the second cavity wall 115, which is beneficial to the vibration reduction of the speaker assembly 11.

[0106] The embodiment of the present application provides an electronic device, including but not limited to a laptop computer 1, a mobile phone, a tablet computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a driving recorder, a wearable device, a virtual reality device, a Bluetooth speaker / headphone, or a mobile or fixed terminal with a speaker such as a car front-end.

[0107] In the embodiment of the present application, a laptop computer 1 is taken as an example of the electronic device for description.

[0108] See also Fig.11 , schematically shows a laptop computer 1. The speaker assembly 11 is connected to the middle frame of the laptop computer 1. The number of speaker assemblies 11 provided on the laptop computer 1 may be one, two, three or more, which is not limited in the present embodiment. For example, Fig.11 In the embodiment, the laptop computer 1 may include one speaker assembly 11. Alternatively, the laptop computer 1 may include two speaker assemblies 11, the two speaker assemblies 11 have the same structure, and the two speaker assemblies 11 may be symmetrically arranged in the housing 111.

[0109] It should be noted that the position of the speaker assembly 11 in the notebook computer 1 can be flexibly set. Fig.11 Only one example of the position of the speaker assembly 11 in the laptop computer 1 is given, which should not be considered as a special limitation to the present application.

[0110] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A speaker assembly, characterized in that: The invention comprises a shell and two or more speaker modules, wherein a accommodating cavity is formed in the shell, and the shell comprises a first cavity wall and a second cavity wall which are arranged opposite to each other along the thickness direction, wherein the speaker module directly fixed on the first cavity wall and the speaker module directly fixed on the second cavity wall are arranged in an offset manner up and down, and the bottom surface height of the speaker module arranged on the upper side is lower than the top surface height of the speaker module arranged on the lower side.

2. The loudspeaker assembly according to claim 1, wherein: An internal reinforcement structure for improving strength is arranged in the shell.

3. The loudspeaker assembly according to claim 2, wherein: There are more than one internal reinforcement structure and the internal reinforcement structure is arranged between two adjacent speaker modules. The top end of the internal reinforcement structure is connected to the first cavity wall, and the bottom end of the internal reinforcement structure is connected to the second cavity wall.

4. The loudspeaker assembly according to claim 3, wherein: The housing is divided into two or more speaker module cavities by the internal reinforcement structure, one or more speaker modules are arranged in each speaker module cavity, and two adjacent speaker module cavities are connected or independent.

5. The loudspeaker assembly according to claim 2, wherein: The internal reinforcement structure is an integrated structure, and a conducting hole is provided on the internal reinforcement structure; or, the internal reinforcement structure includes more than two independent supporting members, and there is a distance between two adjacent supporting members.

6. The loudspeaker assembly according to claim 2, wherein: The material of the internal reinforcement structure is plastic.

7. The loudspeaker assembly according to claim 1, wherein: The shell comprises an upper shell and a lower shell, the upper shell is arranged above the lower shell and the two are connected, the upper shell and the lower shell form the accommodating cavity, and the upper shell and the lower shell are both provided with speaker module mounting holes.

8. The loudspeaker assembly according to claim 7, wherein: A connecting colloid is arranged between the upper shell and the lower shell.

9. The loudspeaker assembly according to any one of claims 1 to 8, characterized in that: All the speaker modules are the same, and the number of the speaker modules arranged on the first cavity wall and the second cavity wall is the same.

10. The loudspeaker assembly according to claim 9, wherein: The speaker modules arranged on the first cavity wall and the second cavity wall are arranged alternately up and down in the horizontal direction.

11. An electronic device, characterized in that: A loudspeaker assembly comprising one or more of claims 1-10.

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