Low-impedance multilayer circuit board

Abstract

The utility model discloses a low-impedance multilayer circuit board, comprising a housing, the bottoms of the front and rear sides of the housing are fixedly connected with mounting plates, the top of the housing is provided with a housing cover, the bottom in the housing is provided with a flame-retardant coating bottom plate, the flame-retardant coating bottom plate is internally provided with a plurality of circuit board bodies, and the circuit board bodies are arranged in the housing. The bottom of the circuit board body is sleeved with a heat insulation sleeve, the front end and the rear end of the left side of the heat insulation sleeve are fixedly connected with vertical connecting blocks, and clamping blocks are arranged in the flame-retardant coating bottom plate and correspond to the left sides of the vertical connecting blocks. According to the utility model, the design of the heat dissipation fan can realize rapid heat dissipation in the housing, which is crucial for maintaining the performance and the service life of electronic equipment, the design is relatively simple, the connection mode and the structure between the parts are relatively visual, the production, the assembly and the maintenance are convenient, and the installation plate and the installation bolts are arranged, so that the installation is convenient. Meanwhile, the design of the guide column and the guide groove also simplifies the installation process between the shell and the shell cover.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a low-impedance multilayer circuit board. Background Art

[0002] A multilayer board is a printed circuit board that has three or more conductive graphic layers and insulating materials in between, and the conductive graphics are interconnected as required. The multilayer circuit board is the product of the development of electronic information technology towards high speed, multi-function, large capacity, small size, thinness and light weight.

[0003] The Chinese patent application number 202320656914.8 discloses a low-impedance multilayer circuit board, which solves the problem that the corners are easily worn and damaged during use. These problems affect the use of the device. However, it has the following problems:

[0004] 1. High structural complexity: Its design seems to be more complicated, including multiple small parts and protective structures, such as shrink film 202, built-in space 203, anti-collision cushion 204, connecting column 206, pressing elastic column 207 and corner protection device 3, etc. This complexity may increase the difficulty of manufacturing and assembly, and may also lead to higher production costs.

[0005] 2. Low heat dissipation performance: It lacks an effective heat dissipation structure, which may affect the working performance of the circuit board in a high temperature environment.

[0006] 3. Poor maintainability: Due to its more compact and complex structure, it may require more steps and tools to maintain and replace parts. Utility Model Content

[0007] The purpose of the utility model is to provide a low-impedance multilayer circuit board to solve the problems raised in the above background technology.

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a low-impedance multilayer circuit board, comprising a shell, the bottoms of the front and rear sides of the shell are fixedly connected with mounting plates, and the top of the shell is provided with a shell cover, the bottom of the shell is provided with a flame-retardant coating bottom plate, a plurality of circuit board bodies are provided in the flame-retardant coating bottom plate, the bottom of the circuit board body is sleeved with a heat insulation sleeve, the front and rear ends of the left side of the heat insulation sleeve are fixedly connected with vertical connecting blocks, a clamping block is provided on the left side of the flame-retardant coating bottom plate corresponding to the vertical connecting block, and two limit grooves are provided at the front and rear ends of the clamping block close to one side of the vertical connecting block, a spring is fixedly connected in the limit groove, and a limit ball is fixedly connected to one side of the spring.

[0009] Compared with the prior art, the beneficial effects of the utility model are:

[0010] The design of the cooling fan of the utility model can realize rapid heat dissipation in the casing, which is very important for maintaining the performance and life of the electronic equipment. Secondly, the design is relatively simple, and the connection method and structure between the components are relatively intuitive, which is convenient for production, assembly and maintenance. The installation plate and mounting bolts are set, and the design of the guide column and guide groove also simplifies the installation process between the casing and the shell cover, which makes the installation process faster and more convenient. The design that the shell cover can be opened provides direct access and visibility to the circuit board, which is convenient for observing the working status and troubleshooting. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is the front view of the utility model;

[0012] Figure 2 It is a cross-sectional schematic diagram of the utility model;

[0013] Figure 3 It is a top view schematic diagram of the utility model with the shell cover removed;

[0014] Figure 4 It is a left side view of the circuit board body of the utility model;

[0015] Figure 5 It is a right side view of the clamping block of the utility model;

[0016] Figure 6 It is a top cross-sectional view of the clamping block of the utility model.

[0017] In the figure: 1. outer shell; 2. mounting plate; 3. mounting bolts; 4. cooling fan; 5. shell cover; 6. guide column; 7. guide groove; 8. elastic rubber block; 9. circuit board body; 10. flame retardant coating bottom plate; 11. thermal insulation sleeve; 12. vertical connecting block; 13. clamping block; 14. clamping groove; 15. limit ball; 16. limit groove; 17. spring. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-6The utility model provides a technical solution: a low-impedance multilayer circuit board, comprising a shell 1, the bottoms of the front and rear sides of the shell 1 are fixedly connected with mounting plates 2, and the top of the shell 1 is provided with a shell cover 5, the bottom of the shell 1 is provided with a flame-retardant coating bottom plate 10, a plurality of circuit board bodies 9 are provided in the flame-retardant coating bottom plate 10, the bottom of the circuit board body 9 is sleeved with a heat insulation sleeve 11, the front and rear ends of the left side of the heat insulation sleeve 11 are fixedly connected with vertical connecting blocks 12, a clamping block 13 is provided on the left side of the flame-retardant coating bottom plate 10 corresponding to the vertical connecting block 12, and the clamping block 13 is provided with two limit grooves 16 at the front and rear ends of one side of the vertical connecting block 12, a spring 17 is fixedly connected in the limit groove 16, and a limit ball 15 is fixedly connected to one side of the spring 17.

[0020] Guide columns 6 are fixedly connected to the left and right ends of the top of the shell 1, and guide grooves 7 matching the guide columns 6 are opened at both ends of the bottom of the shell cover 5. The guide columns 6 extend into the guide grooves 7. The guide columns 6 cooperate with the guide grooves 7 to achieve a snap-fit ​​fixation between the shell 1 and the shell cover 5.

[0021] The mounting plate 2 is provided with mounting bolts 3, and a cooling fan 4 is fixedly connected to the middle position of the front side of the mounting plate 2, and the cooling fan 4 can realize rapid heat dissipation in the housing 1, and the cooling fan 4 is electrically connected to an external power supply through a wire.

[0022] A ventilation slot is provided on the front side of the shell cover 5, and an elastic rubber block 8 is fixedly connected to the top of the shell cover 5, and the bottom of the elastic rubber block 8 contacts the circuit board body 9, thereby tightly limiting the circuit board.

[0023] A slot 14 matching the limiting ball 15 is formed on one side of the vertical connection block 12 away from the heat insulating sleeve 11 . One end of the limiting ball 15 extends into the slot 14 . The cooperation between the limiting ball 15 and the slot 14 can limit the heat insulating sleeve 11 .

[0024] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A low-impedance multilayer circuit board, comprising a housing (1), characterized in that: The bottom of both the front and rear sides of the shell (1) are fixedly connected with mounting plates (2), and the top of the shell (1) is provided with a shell cover (5), the bottom of the shell (1) is provided with a flame retardant coating bottom plate (10), a plurality of circuit board bodies (9) are provided in the flame retardant coating bottom plate (10), the bottom of the circuit board body (9) is sleeved with a heat insulation sleeve (11), the front and rear ends of the left side of the heat insulation sleeve (11) are fixedly connected with vertical connection blocks (12), a clamping block (13) is provided on the left side of the flame retardant coating bottom plate (10) corresponding to the vertical connection block (12), and the clamping block (13) is provided with two limit grooves (16) at the front and rear ends of the side close to the vertical connection block (12), a spring (17) is fixedly connected in the limit groove (16), and a limit ball (15) is fixedly connected to one side of the spring (17).

2. A low impedance multilayer circuit board according to claim 1, characterized in that: The left and right ends of the top of the shell (1) are fixedly connected with guide columns (6), and the two ends of the bottom of the shell cover (5) are provided with guide grooves (7) matching the guide columns (6), and the guide columns (6) extend into the guide grooves (7).

3. A low impedance multilayer circuit board according to claim 1, characterized in that: The mounting plate (2) is provided with mounting bolts (3), and a cooling fan (4) is fixedly connected to the middle position of the front side of the mounting plate (2), and the cooling fan (4) is electrically connected to an external power supply via a wire.

4. A low impedance multilayer circuit board according to claim 1, characterized in that: A ventilation slot is provided on the front side of the shell cover (5), and an elastic rubber block (8) is fixedly connected to the top of the shell cover (5), and the bottom of the elastic rubber block (8) is in contact with the circuit board body (9).

5. The low-impedance multilayer circuit board according to claim 1, characterized in that: A slot (14) matching with a limiting ball (15) is provided on a side of the vertical connection block (12) away from the heat insulation sleeve (11), and one end of the limiting ball (15) extends into the slot (14).

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