Heat dissipation system and electrical equipment

Abstract

The utility model discloses a heat dissipation system and electrical equipment, and belongs to the technical field of electrical equipment. The heat dissipation system comprises a radiator, the radiator defines a containing cavity and a first opening communicated with the containing cavity, and the containing cavity is used for bearing cooling liquid; the base is installed in the first opening and seals the first opening, and an installation position used for installing a power device is arranged on the side, away from the containing cavity, of the base; and the supporting piece is located in the containing cavity, and the supporting piece is in contact with the base. According to the heat dissipation system provided by the invention, the supporting piece is arranged in the accommodating cavity, and the supporting piece is in contact with the base, so that the strength of the base can be improved, the contact area between the base and the cooling liquid is increased, and the heat exchange efficiency and the heat dissipation effect are improved.

Description

Technical Field

[0001] The present application belongs to the technical field of electrical equipment, and in particular, relates to a heat dissipation system and electrical equipment. Background Art

[0002] In current power converters or other electrical equipment, power devices usually dissipate heat and cool down by contacting heat transfer with a heat sink. At the same time, in order to increase the contact area between the power device and the heat sink and reduce thermal resistance, a thermal conductive medium, such as thermal grease, thermal gel or other types of thermal conductive medium, can be added to the fitting surface of the power device and the heat sink. However, with the improvement of the functions of electrical equipment, the number of power devices inside the electrical equipment has increased, and the heat dissipation efficiency of the heat dissipation method using contact heat transfer with a heat sink is low, making it difficult for the power device to achieve a good heat dissipation effect. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a heat dissipation system and an electrical device, which can improve the strength of the base and increase the contact area between the base and the coolant by arranging a support in the accommodating cavity and contacting the support with the base, thereby improving the heat exchange efficiency and the heat dissipation effect.

[0004] In a first aspect, the present application provides a heat dissipation system, comprising:

[0005] A radiator, the radiator defining a receiving cavity and a first opening communicating with the receiving cavity, the receiving cavity being used to carry a cooling liquid;

[0006] A base, the base is mounted on the first opening and closes the first opening, and a mounting position for mounting a power device is provided on a side of the base away from the accommodating cavity;

[0007] A support member is located in the accommodating cavity and is in contact with the base.

[0008] According to the heat dissipation system provided in the embodiment of the present application, by arranging a support member in the accommodating cavity and the support member contacting the base, the strength of the base can be improved and the contact area between the base and the coolant can be increased, thereby improving the heat exchange efficiency and the heat dissipation effect.

[0009] According to one embodiment of the present application, the support member is connected to the bottom wall of the accommodating cavity.

[0010] According to one embodiment of the present application, the height of the support member is greater than or equal to the distance from the bottom wall of the accommodating cavity to the outer wall surface of the first opening, and the side of the base facing the accommodating cavity is in contact with the outer wall surface of the first opening.

[0011] According to one embodiment of the present application, the height of the support member is smaller than the distance from the bottom wall of the accommodating cavity to the outer wall surface of the first opening, and at least a portion of the base is embedded in the first opening.

[0012] According to one embodiment of the present application, the support member is connected to the base.

[0013] According to one embodiment of the present application, the base comprises:

[0014] A first substrate and a second substrate, wherein the first substrate and the second substrate are spaced apart and distributed along the height direction of the base, the support member is connected between the first substrate and the second substrate, the first substrate is installed in the first opening and closes the first opening, and the installation position is provided on a side of the first substrate away from the accommodating cavity.

[0015] According to an embodiment of the present application, the bottom wall of the accommodating cavity is provided with a second opening communicating with the accommodating cavity, and the second substrate is mounted on the second opening and closes the second opening.

[0016] According to an embodiment of the present application, an inner peripheral wall of the first opening is disposed in contact with a side wall of the first substrate.

[0017] According to an embodiment of the present application, a side of the first substrate facing the accommodating cavity is in contact with an outer wall surface of the first opening.

[0018] According to an embodiment of the present application, the base includes a first part and a second part stacked up and down, the power device is installed on the first part, the first part is a copper material, and the second part is an aluminum material.

[0019] According to an embodiment of the present application, there are a plurality of support members, the plurality of support members are arranged at intervals, and flow channels for the flow of coolant are formed between the plurality of support members.

[0020] In a second aspect, the present application provides an electrical device, the electrical device comprising:

[0021] A heat dissipation system as described in any one of the above;

[0022] A power device is installed in the heat dissipation system.

[0023] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 It is one of the structural schematic diagrams of the heat dissipation system provided in the embodiment of the present application;

[0026] Figure 2 This is the second structural schematic diagram of the heat dissipation system provided in the embodiment of the present application;

[0027] Figure 3 is one of the cross-sectional views of the heat dissipation system provided in the embodiment of the present application;

[0028] Figure 4 This is the second cross-sectional view of the heat dissipation system provided in the embodiment of the present application;

[0029] Figure 5 This is the third cross-sectional view of the heat dissipation system provided in the embodiment of the present application;

[0030] Figure 6 This is the fourth cross-sectional view of the heat dissipation system provided in the embodiment of the present application;

[0031] Figure 7 It is one of the partial schematic diagrams of the heat dissipation system provided in the embodiment of the present application;

[0032] Figure 8 This is the fifth cross-sectional view of the heat dissipation system provided in the embodiment of the present application;

[0033] Fig. 9 This is the second partial schematic diagram of the heat dissipation system provided in the embodiment of the present application;

[0034] Fig.10 This is the third partial schematic diagram of the heat dissipation system provided in the embodiment of the present application.

[0035] Reference numerals:

[0036] Radiator 100, accommodating cavity 110, first opening 120;

[0037] Base 200, first substrate 210, second substrate 220, first portion 230, second portion 240;

[0038] A power device 300 and a support member 400 . DETAILED DESCRIPTION

[0039] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0040] Reference below Figure 1-Figure 10 A heat dissipation system and an electrical device according to embodiments of the present application are described.

[0041] The present application embodiment provides a heat dissipation system, such as Figure 1-Figure 10 As shown, the heat dissipation system includes a heat sink 100 , a base 200 and a support member 400 .

[0042] The heat sink 100 may be a cylindrical structure, a truncated cone structure or other shaped structures, for example, Figure 1-Figure 6 As shown, the heat sink 100 is a rectangular structure.

[0043] like Figure 1-Figure 10 As shown, the radiator 100 defines a accommodating cavity 110 and a first opening 120 connected to the accommodating cavity 110. The interior of the radiator 100 is a hollow structure, that is, the hollow portion of the radiator 100 is the accommodating cavity 110 of the radiator 100. An end face of the radiator 100 in the height direction defines the first opening 120. The first opening 120 passes through the wall of the radiator 100 where it is located, so that the first opening 120 is connected to the accommodating cavity 110.

[0044] The first opening 120 may be a circular structure, a trapezoidal structure, a triangular structure or other shapes, such as Figure 1-Figure 10 As shown, the first opening 120 is a rectangular structure.

[0045] like Figure 3 As shown, the accommodating chamber 110 is used to carry the cooling liquid. The accommodating chamber 110 can be connected with the condenser through a pipeline to form a cooling circuit, that is, the cooling liquid can circulate in the cooling circuit formed by the accommodating chamber 110 and the condenser.

[0046] In other embodiments, the coolant may reduce the temperature by phase change heat dissipation, thereby utilizing low-temperature coolant to dissipate heat for the power device 300 .

[0047] The base 200 may be a circular structure, a trapezoidal structure, a triangular structure or other shapes, for example Figure 1-Figure 10 As shown, the base 200 is a rectangular structure.

[0048] like Figure 1-Figure 10 As shown, the base 200 is installed on the first opening 120 and closes the first opening 120. The base 200 can be installed on the outer wall surface of the side of the radiator 100 where the first opening 120 is located, or can be installed in the first opening 120. By closing the first opening 120 with the base 200, it can be difficult for the coolant in the accommodating cavity 110 to leak from the first opening 120 when flowing through the accommodating cavity 110.

[0049] like Figure 1-Figure 10 As shown, a mounting position for mounting the power device 300 is provided on a side of the base 200 facing away from the accommodating cavity 110 , and the mounting position may be located at the upper end of the base 200 in the height direction.

[0050] like Figure 3 As shown, the support member 400 is located in the accommodating cavity 110, and the support member 400 is in contact with the base 200. The support member 400 can extend along the height direction of the radiator 100, or can be bent. The support member 400 can be partially located in the accommodating cavity 110, or can be located entirely in the accommodating cavity 110.

[0051] like Figure 1-Figure 10 As shown, the support member 400 may be a cylindrical structure, a prismatic structure, a wavy strip structure, a truncated cone structure, a trapezoidal structure or other shapes.

[0052] During the actual implementation, when the power device 300 is in working state, the power device 300 itself generates a large amount of heat. Since the base 200 is provided with an installation position for installing the power device 300, the heat of the power device 300 can be transferred to the end face of the base 200 facing the power device 300, and transferred from the end face of the base 200 facing the power device 300 to the end face of the base 200 facing the accommodating cavity 110, and the coolant in the cooling circuit continues to circulate. When the coolant flows through the accommodating cavity 110, the coolant is in direct contact with the end face of the base 200 facing the accommodating cavity 110 at the first opening 120. At this time, the low-temperature coolant takes away the heat on the base 200, and the temperature of the base 200 is reduced. The coolant after absorbing the heat flows through the condenser in the cooling circuit to cool down. The cooled coolant flows through the accommodating cavity 110 again to absorb heat, thereby realizing the heat dissipation of the power device 300.

[0053] In the above process, since the support member 400 is abutted or connected to the base 200 and the support member 400 is located in the accommodating cavity 110, the support member 400 can be used to provide a certain supporting force for the base 200, thereby reducing the probability of the base 200 bending into the first opening 120 under the action of gravity of the power device 300. At the same time, after the heat of the power device 300 is transferred to the base 200, part of the heat can continue to be transferred from the base 200 to the support member 400, and the heat can be transferred to the coolant through the contact between the support member 400 and the coolant.

[0054] By setting a support member 400 in the accommodating cavity 110 and the support member 400 in contact with the base 200, the supporting force of the support member 400 on the base 200 can be used to improve the strength of the base 200, reduce the probability of deformation and cracking of the base 200 when the pressure in the accommodating cavity 110 is high due to thermal siphoning, and absorb the heat transferred from the power device 300 to the base 200 through contact with the base 200, thereby increasing the contact area with the coolant and improving the heat exchange efficiency and heat dissipation effect.

[0055] According to the heat dissipation system provided in the embodiment of the present application, by setting a support member 400 in the accommodating cavity 110, and the support member 400 is in contact with the base 200, the strength of the base 200 can be improved, and the contact area between the base 200 and the coolant can be increased, thereby improving the heat exchange efficiency and the heat dissipation effect.

[0056] In some embodiments, Figure 3 As shown, the support member 400 is connected to the bottom wall of the accommodating cavity 110 .

[0057] Among them, Figure 3 As shown, one end of the support member 400 is connected to the bottom wall of the accommodating cavity 110, and the other end of the support member 400 contacts the end surface of the base 200 facing the accommodating cavity 110, that is, the support member 400 is supported between the base 200 and the bottom wall of the accommodating cavity 110 in the height direction of the radiator 100.

[0058] like Figure 3 As shown, the support member 400 and the bottom wall of the accommodating cavity 110 can be integrally formed, or can be separately formed and then connected to the bottom wall of the accommodating cavity 110 by welding, bonding, snap-fit ​​connection or other methods.

[0059] By installing the support member 400 on the bottom wall of the accommodating cavity 110 , the support member 400 can provide a relatively stable supporting force to the base 200 , thereby increasing the heat dissipation area and strength of the base 200 and improving the overall strength of the accommodating cavity 110 .

[0060] In some embodiments, Figure 3 As shown, the height of the support member 400 is greater than or equal to the distance from the bottom wall of the accommodating cavity 110 to the outer wall of the first opening 120 , and the side of the base 200 facing the accommodating cavity 110 is in contact with the outer wall of the first opening 120 .

[0061] Among them, Figure 3 As shown, the support member 400 extends along the height direction of the radiator 100, the lower end of the support member 400 is connected to the bottom wall of the accommodating cavity 110, and the upper end of the support member 400 can protrude from the outer wall surface of the first opening 120, or can be set flush with the outer wall surface of the first opening 120.

[0062] When the upper end of the support member 400 protrudes more from the outer wall surface of the first opening 120 , a groove may be provided on the side of the base 200 facing the accommodating cavity 110 , and the groove is plugged into and matched with the upper end of the support member 400 .

[0063] The projection of the base 200 on the surface of the heat sink 100 having the first opening 120 covers the first opening 120 .

[0064] When the upper end of the support member 400 is flush with the outer wall surface of the first opening 120, the side of the base 200 facing the accommodating cavity 110 is in contact with the outer wall surface of the first opening 120, and the upper end of the support member 400 just contacts the end surface of the base 200 facing the accommodating cavity 110; when the upper end of the support member 400 protrudes from the outer wall surface of the first opening 120, the upper end of the support member 400 contacts the end surface of the base 200 facing the accommodating cavity 110, and applies upward pressure to the base 200. Since the base 200 is installed in the first opening 120 of the radiator 100, the base 200 remains stationary relative to the radiator 100, and the upper end of the support member 400 applies upward pressure to the base 200, so that the upper end of the support member 400 can maintain contact with the base 200, thereby reducing the probability of the support member 400 and the base 200 being released from contact when the support member 400 vibrates due to external reasons.

[0065] By setting the height of the support member 400 to be greater than or equal to the distance from the bottom wall of the accommodating cavity 110 to the outer wall surface of the first opening 120, the stability of the contact between the support member 400 and the base 200 can be improved, thereby improving the stability of the heat dissipation effect and heat dissipation efficiency of the power device 300.

[0066] In some embodiments, the height of the support member 400 is smaller than the distance from the bottom wall of the accommodating cavity 110 to the outer wall of the first opening 120 , and at least a portion of the base 200 is embedded in the first opening 120 .

[0067] Among them, Figure 4 As shown, the base 200 can be integrally embedded in the first opening 120, that is, the side walls of the base 200 in the length and width directions of the radiator 100 are both fitted with the inner circumferential wall of the first opening 120. At this time, the shape of the base 200 is the same as the shape and structure of the first opening 120, and the size of the base 200 can be equal to or slightly smaller than the size of the first opening 120, so that the base 200 can be installed in the first opening 120.

[0068] In other embodiments, Figure 5 As shown, the base 200 may also be partially embedded in the first opening 120 .

[0069] By setting the base 200 to be at least partially embedded in the first opening 120, the overall volume of the base 200 can be reduced, and the production cost can be reduced to a certain extent. During the operation of the power device 300, each position of the end surface of the base 200 facing the accommodating cavity 110 can be in contact with the coolant. Compared with the partial position of the end surface of the base 200 facing the accommodating cavity 110 being in contact with the coolant, the heat dissipation effect and heat dissipation efficiency of the power device 300 can be further improved.

[0070] In some embodiments, Figure 6-Figure 8 As shown, the support member 400 is connected to the base 200 .

[0071] Among them, Figure 6-Figure 8 As shown, the end of the support member 400 can be connected to the base 200. For example, the end of the support member 400 is connected to the end surface of the base 200 facing the accommodating cavity 110 by welding, bonding, snap-fit ​​connection or other methods.

[0072] like Figure 6-Figure 8 As shown, the support member 400 can be integrally formed with the base 200, or can be separately formed with the base 200 and then connected through other connection methods.

[0073] By connecting the support member 400 to the base 200 , the contact stability between the support member 400 and the base 200 can be improved, thereby further improving the heat dissipation efficiency and heat dissipation effect of the power device 300 and further improving the strength of the base 200 .

[0074] In some embodiments, Figure 6-Figure 8 As shown, the base 200 includes a first substrate 210 and a second substrate 220 , the first substrate 210 and the second substrate 220 are spaced apart and distributed along a height direction of the base 200 , and the support member 400 is installed between the first substrate 210 and the second substrate 220 .

[0075] The first substrate 210 may be a circular structure, a trapezoidal structure, a triangular structure or other shapes, such as Figure 6-Figure 8 As shown, the first substrate 210 is a rectangular structure; the second substrate 220 can be a circular structure, a trapezoidal structure, a triangular structure or other shapes, such as Figure 6-Figure 8 As shown, the second substrate 220 is a rectangular structure.

[0076] The first substrate 210 can be installed at the upper end of the heat sink 100 in the height direction and close the first opening 120. The second substrate 220 can be installed on the bottom wall of the accommodating cavity 110 or suspended in the accommodating cavity 110. Figure 6-Figure 8 As shown, the second substrate 220 is mounted on the bottom wall of the accommodating cavity 110 .

[0077] like Figure 6-Figure 8 As shown, the support member 400 is located between the lower end of the first substrate 210 and the upper end of the second substrate 220, and the support member 400 is connected to the first substrate 210 and the second substrate 220 by welding, bonding or other means, that is, the first substrate 210, the second substrate 220 and the support member 400 form an integral structure after installation.

[0078] During the actual implementation process, when the power device 300 generates heat during operation, the heat is transferred from the power device 300 to the first substrate 210, and part of the heat is transferred from the first substrate 210 to the support member 400, and then transferred from the support member 400 to the second substrate 220. When the coolant flows through the accommodating cavity 110, the end surface of the first substrate 210 facing the accommodating cavity 110, the outer wall surface of the support member 400, and the end surface of the second substrate 220 facing the support member 400 can all contact with the coolant and exchange heat with the coolant for cooling.

[0079] By disposing the first substrate 210 and the second substrate 220 , the overall contact area between the base 200 and the cooling liquid can be increased while the overall strength of the base 200 can be improved.

[0080] In some embodiments, the first substrate 210 is installed in the first opening 120 and closes the first opening 120 , and a mounting position is provided on a side of the first substrate 210 facing away from the accommodating cavity 110 .

[0081] By configuring the first substrate 210 to close the first opening 120 , the probability of coolant leakage can be reduced, thereby improving the safety of the heat dissipation system during use.

[0082] In some embodiments, Figure 6 and Figure 8 As shown, the bottom wall of the accommodating cavity 110 is provided with a second opening communicating with the accommodating cavity 110 , and the second substrate 220 is installed in the second opening and closes the second opening.

[0083] Among them, Figure 6 and Figure 8 As shown, the second opening may be a circular structure, a trapezoidal structure, a triangular structure or other shapes, for example, the second opening is a rectangular structure.

[0084] like Figure 6 and Figure 8 As shown, the second substrate 220 can be located above the second opening, and the projection of the second substrate 220 on the bottom wall of the accommodating cavity 110 covers the projection of the second opening on the upper end of the bottom wall of the accommodating cavity 110, and the lower end surface of the second substrate 220 is connected to the bottom wall of the accommodating cavity 110.

[0085] like Figure 6 and Figure 8As shown, the second substrate 220 may also be located in the second opening, that is, the side wall of the second substrate 220 is disposed in contact with the inner peripheral wall of the second opening.

[0086] The second substrate 220 can also be located below the second opening, in which case the projection of the second substrate 220 on the bottom wall of the accommodating cavity 110 covers the projection of the second opening on the upper end of the bottom wall of the accommodating cavity 110, and the upper end surface of the second substrate 220 is connected to the end surface of the heat sink 100 facing away from the power device 300.

[0087] It should be noted that a seal may be provided between the first substrate 210 and the first opening 120 , and a seal may be provided between the second substrate 220 and the second opening , to improve the sealing between the first substrate 210 and the first opening 120 , and between the second substrate 220 and the second opening .

[0088] Through the setting of the above-mentioned second opening, when the second substrate 220 is located above, inside and below the second opening, the staff can connect the second substrate 220 with the radiator 100 at the second opening, which is convenient for connecting the second substrate 220 with the radiator 100, thereby improving the connection reliability of the second substrate 220 with the radiator 100.

[0089] In some embodiments, Figure 6 As shown, the inner peripheral wall of the first opening 120 is disposed in contact with the side wall of the first substrate 210 .

[0090] Among them, Figure 6 As shown, the first substrate 210 is installed in the first opening 120, that is, the side walls of the first substrate 210 in the length direction and the width direction of the heat sink 100 are both fitted with the inner circumferential wall of the first opening 120. At this time, the shape of the first substrate 210 is the same as the shape structure of the first opening 120, and the size of the first substrate 210 can be equal to or slightly smaller than the size of the first opening 120, so that the first substrate 210 can be installed in the first opening 120.

[0091] By setting the inner wall of the first opening 120 to fit with the side wall of the first substrate 210, the overall volume of the first substrate 210 can be reduced, and the production cost can be reduced to a certain extent. During the operation of the power device 300, each position of the end surface of the first substrate 210 facing the accommodating cavity 110 can be in contact with the coolant. Compared with the partial position of the end surface of the first substrate 210 facing the accommodating cavity 110 being in contact with the coolant, the heat dissipation effect and heat dissipation efficiency of the power device 300 can be further improved.

[0092] In some embodiments, Figure 7 and Figure 8 As shown, the side of the first substrate 210 facing the accommodating cavity 110 is in contact with the outer wall surface of the first opening 120 .

[0093] Among them, Figure 7 and Figure 8 As shown, the projection of the first substrate 210 on the surface of the heat sink 100 having the first opening 120 covers the first opening 120 , that is, the first substrate 210 is supported on the upper surface of the heat sink 100 .

[0094] By arranging the side of the first substrate 210 facing the accommodating cavity 110 to be in contact with the outer wall surface of the first opening 120 , the contact area between the first substrate 210 and the heat sink 100 can be increased, thereby improving the support force of the heat sink 100 on the first substrate 210 .

[0095] In some embodiments, Fig. 9 As shown, the base 200 includes a first part 230 and a second part 240 stacked up and down, and the power device 300 is installed on the first part 230. The first part 230 is made of copper, and the second part 240 is made of aluminum.

[0096] Among them, Fig. 9 As shown, when the base 200 is an integral single body structure, the base 200 includes a first part 230 and a second part 240 stacked up and down, and the power device 300 is installed on the first part 230 of the base 200; when the base 200 includes a first substrate 210 and a second substrate 220, the first substrate 210 includes a first part 230 and a second part 240 stacked up and down, and the power device 300 is installed on the first part 230 of the first substrate 210.

[0097] Since the thermal conductivity of copper material is stronger than that of aluminum material, and the heat dissipation of aluminum material is stronger than that of copper material, the power device 300 is installed on the first part 230 made of copper material, so that the heat of the power device 300 can be quickly transferred to the first part 230, and the heat can be transferred from the first part 230 to the second part 240 made of aluminum material. The heat dissipation effect and efficiency of the power device 300 are further improved through the rapid heat exchange with the coolant through the characteristics of the aluminum material itself. At the same time, the strength of copper material is relative to that of aluminum material. Therefore, installing the power device 300 on the first part 230 can improve the connection stability between the power device 300 and the base 200, and between the base 200 and the radiator 100.

[0098] In other embodiments, the base 200 may also be integral, and the base 200 may be integrally made of copper, aluminum or other materials.

[0099] In some embodiments, Fig.10As shown, there are a plurality of support members 400 , and the plurality of support members 400 are arranged at intervals, and flow channels for the flow of coolant are formed between the plurality of support members 400 .

[0100] Among them, Fig.10 As shown, a plurality of support members 400 may be arranged in a matrix structure, and the plurality of support members 400 are spaced apart from each other, and a gap between two adjacent support members 400 forms a flow channel for the flow of the coolant.

[0101] like Fig.10 As shown, the plurality of support members 400 may also be spaced apart and distributed along the length direction of the first opening 120 , and a flow channel along the width direction of the first opening 120 is formed between two adjacent support members 400 .

[0102] In the actual implementation process, when the coolant flows through the accommodating cavity 110 , it can flow through the flow channels formed between the multiple support members 400 and contact the multiple support members 400 , thereby taking away the heat from the multiple support members 400 .

[0103] By arranging the plurality of support members 400 to be spaced apart and distributed, the contact area between the coolant and the support member 400 can be increased compared to the integral support member 400 , thereby further improving the heat dissipation effect and heat dissipation efficiency of the power device 300 .

[0104] An embodiment of the present application further provides an electrical device, which includes a heat dissipation system and a power device 300 as described in any of the above embodiments, wherein the power device 300 is installed in the heat dissipation system.

[0105] The power device 300 is installed on the installation position of the base 200 of the heat dissipation system.

[0106] In some embodiments, the power device 300 may include a frame body, a power chip, a DBC (Direct Bond Copper) and a welding layer.

[0107] In other embodiments, the power device 300 may include a frame body, a power chip, a DBC, a solder layer, and a substrate.

[0108] In yet other embodiments, the power device 300 may include a frame body, a power chip, and an insulating layer.

[0109] According to the electrical equipment provided in the embodiments of the present application, by adopting the heat dissipation system of any of the above embodiments, the strength of the base 200 can be improved, and the contact area between the base 200 and the coolant can be increased, thereby improving the heat exchange efficiency and the heat dissipation effect.

[0110] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0111] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0112] In the description of this application, "first feature" or "second feature" may include one or more of the features.

[0113] In the description of the present application, “plurality” means two or more.

[0114] In the description of the present application, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0115] In the description of the present application, “above”, “over” and “above” a first feature to a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0116] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0117] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A heat dissipation system, characterized in that: include: A radiator, the radiator defining a receiving cavity and a first opening communicating with the receiving cavity, the receiving cavity being used to carry a cooling liquid; A base, the base is mounted on the first opening and closes the first opening, and a mounting position for mounting a power device is provided on a side of the base away from the accommodating cavity; A support member is located in the accommodating cavity and is in contact with the base.

2. The heat dissipation system according to claim 1, characterized in that: The supporting member is connected to the bottom wall of the accommodating cavity.

3. The heat dissipation system according to claim 2, characterized in that: The height of the support member is greater than or equal to the distance from the bottom wall of the accommodating cavity to the outer wall surface of the first opening, and the side of the base facing the accommodating cavity is in contact with the outer wall surface of the first opening.

4. The heat dissipation system according to claim 2, characterized in that: The height of the support member is smaller than the distance from the bottom wall of the accommodating cavity to the outer wall surface of the first opening, and at least a portion of the base is embedded in the first opening.

5. The heat dissipation system according to claim 1, characterized in that: The support member is connected to the base.

6. The heat dissipation system according to claim 5, characterized in that: The base comprises: A first substrate and a second substrate are provided, wherein the first substrate and the second substrate are spaced apart and distributed along a height direction of the base, and the support member is connected between the first substrate and the second substrate.

7. The heat dissipation system according to claim 6, characterized in that: The first substrate is installed on the first opening and closes the first opening. The installation position is provided on a side of the first substrate facing away from the accommodating cavity.

8. The heat dissipation system according to claim 6, characterized in that: The bottom wall of the accommodating cavity is provided with a second opening communicating with the accommodating cavity, and the second substrate is installed on the second opening and closes the second opening.

9. The heat dissipation system according to claim 6, characterized in that: The inner peripheral wall of the first opening is arranged in contact with the side wall of the first substrate.

10. The heat dissipation system according to claim 6, characterized in that: A side of the first substrate facing the accommodating cavity is in contact with an outer wall surface of the first opening.

11. The heat dissipation system according to any one of claims 1 to 10, characterized in that: The base includes a first part and a second part stacked up and down, the power device is installed on the first part, the first part is a copper material, and the second part is an aluminum material.

12. The heat dissipation system according to any one of claims 1 to 10, characterized in that: There are a plurality of support members, the plurality of support members are arranged at intervals, and flow channels for the flow of cooling liquid are formed between the plurality of support members.

13. An electrical device, characterized in that: include: The heat dissipation system according to any one of claims 1 to 12; A power device is installed in the heat dissipation system.

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