Multi-surface reflection LED light source packaging structure

Abstract

The utility model belongs to the technical field of LED light source packaging, and particularly relates to a multi-face reflection LED light source packaging structure which comprises a substrate, reflection white glue and a plurality of LED chips. According to the LED light source packaging structure, the peripheral white glue enclosing wall and the internal white glue partition wall are arranged in the LED light source packaging structure, light emitted from the outer side of the LED chip can be reflected through the white glue enclosing wall, light emitted from the inner side of the LED chip can be reflected through the white glue partition wall, and therefore the light emitted from the LED chip in all directions can be effectively reflected by the reflection white glue, and the service life of the LED light source packaging structure is prolonged. Compared with a traditional reflection cup packaging LED light source structure, the light efficiency of the LED light source is effectively improved on the premise that the cost of the LED chip is not increased.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED light source packaging, and in particular relates to a multi-faceted reflective LED light source packaging structure. Background Art

[0002] With the continuous advancement of semiconductor technology, the luminous efficiency and brightness of LED light sources are constantly improving, while the cost is gradually decreasing, making LED light sources widely used in lighting, display, automotive lighting, outdoor advertising, backlighting, etc. LED light sources have the advantages of high efficiency, energy saving, and environmental protection. Compared with traditional light sources such as incandescent lamps and fluorescent lamps, LED light sources have higher luminous efficiency and longer service life.

[0003] SMD LED light sources are flexible to use and have become a common packaging specification in LED light sources. In the prior art, LED light sources are generally equipped with multiple LED chips inside, and reflective white glue walls are formed around them to reflect the light from the sides of the LED chips. However, LED light sources with this packaging structure have limited improvement in light efficiency because the light from the inside of the LED chip is difficult to be reflected by the reflective white glue walls around it. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the problem in the prior art that the packaging structure of the LED light source only forms a reflective white glue wall on all sides, resulting in low light efficiency, thereby providing a multi-faceted reflective LED light source packaging structure.

[0005] The utility model provides a multi-faceted reflective LED light source packaging structure, comprising a substrate, reflective white glue and a plurality of LED chips; the LED chip is fixed on the upper side of the substrate; the reflective white glue is fixed on the upper side of the substrate, comprising a white glue wall and a white glue partition wall, the white glue wall surrounds the LED chip, the two ends of the white glue partition wall are respectively connected to the white glue wall, and the upper side of the substrate is separated from the white glue wall to form two chip areas, and at least one LED chip is fixed on each chip area.

[0006] Furthermore, the area enclosed by the white glue wall forms a rectangle, and the white glue partition wall is strip-shaped.

[0007] Furthermore, it also includes a bracket, the bracket includes an isolation belt, the isolation belt is in a strip shape and is located between the two chip areas.

[0008] Furthermore, the white glue partition wall covers both sides of the isolation zone.

[0009] Furthermore, the top height of the isolation belt is higher than the top height of the LED chip.

[0010] Furthermore, pads are respectively formed on the upper sides of the two chip regions of the substrate, and the two pads are isolated from each other.

[0011] Furthermore, the LED chip is a front-mounted LED chip.

[0012] Furthermore, the number of LED chips on the two chip areas is the same, and the LED chips on the two chip areas are connected in series in pairs and are respectively connected to the positive electrode pad and the negative electrode pad.

[0013] Furthermore, the top heights of the white glue surrounding wall and the white glue partition wall are higher than the top height of the LED chip.

[0014] A multi-faceted reflective LED light source packaging structure comprises a substrate, reflective white glue and a plurality of LED chips; the LED chips are fixed on the upper side of the substrate; the reflective white glue is fixed on the upper side of the substrate, comprising a white glue wall and a white glue partition wall, the white glue wall surrounds the LED chips, two left and right chip areas are formed on the upper side of the substrate, and at least two LED chips are fixed on each chip area; the white glue partition wall is dot-shaped and formed between the two chip areas.

[0015] Beneficial effect: The utility model sets white glue walls around and white glue partition walls inside the LED light source packaging structure. The outer light of the LED chip can be reflected by the white glue walls, and the inner light can also be reflected by the white glue partition walls. Therefore, the light from all directions of the LED chip can be effectively reflected by the reflective white glue. Compared with the traditional reflective cup packaging LED light source structure, the lighting efficiency of the LED light source is effectively improved without increasing the cost of the LED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of the main structure of the utility model;

[0018] Figure 2 Another main structural schematic diagram of the utility model;

[0019] Figure 3 This is another main structural schematic diagram of the utility model.

[0020] Figure numerals: 1. substrate; 2. white glue wall; 3. white glue partition wall; 4. LED chip; 5. bracket; 6. isolation belt; 7. gold wire. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0022] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0024] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] Embodiment 1:

[0026] Reference Figure 1As shown, the utility model provides a multi-faceted reflective LED light source packaging structure, including a substrate 1, reflective white glue and multiple LED chips 4; the LED chip 4 is fixed on the upper side of the substrate 1; the reflective white glue is fixed on the upper side of the substrate 1, including a white glue wall 2 and a white glue partition wall 3, the white glue wall 2 surrounds the LED chip 4, the two ends of the white glue partition wall 3 are respectively connected to the white glue wall 2, and together with the white glue wall 2, separate the upper side of the substrate 1 into two chip areas, and at least one LED chip 4 is fixed on each of the chip areas.

[0027] In this embodiment, the area surrounded by the white glue wall 2 forms a rectangle, and the white glue partition wall 3 is a strip. And the white glue partition wall 3 is located on the center line of the area surrounded by the white glue wall 2. Specifically, pads are formed on the upper sides of the two chip areas of the substrate 1, and the two pads are isolated from each other. The pads are respectively a positive pad and a negative pad, which are conductively connected to the substrate 1 and lead to the outside as an external conductive connection mode of the LED light source.

[0028] As a preferred embodiment of the present invention, the LED chip 4 is a positive structure LED chip, and the electrodes of the LED chip 4 are conductively connected by a gold wire 7. The number of LED chips 4 on the two chip areas is the same, and the LED chips 4 on the two chip areas are connected in series in pairs, and are respectively connected to the positive electrode pad and the negative electrode pad. Specifically, eight LED chips 4 are provided, four of which are located on the positive electrode pad and four are located on the negative electrode pad. The positive electrode pad and the negative electrode pad are located on the left and right sides of the substrate 1, and the white glue partition wall 3 is formed between the positive electrode pad and the negative electrode pad. The LED chip 4 is arranged and fixed on the upper side of the substrate 1, and the top electrodes of each LED chip 4 are located on the left and right parts thereof. The left electrode of the LED chip 4 on the positive electrode pad is electrically connected to the positive electrode pad through the gold wire 7, and the right electrode of the LED chip 4 on the negative electrode pad is electrically connected to the negative electrode pad through the gold wire 7. The right electrode of the LED chip 4 on the positive electrode pad and the left electrode of the LED chip 4 on the negative electrode pad are electrically connected in pairs through the gold wire 7 crossing the white glue partition wall 3.

[0029] As a further improvement of this embodiment, the top heights of the white glue enclosure 2 and the white glue partition wall 3 are higher than the top height of the LED chip 4 , so that the white glue enclosure 2 and the white glue partition wall 3 can effectively emit light around and inside the LED chip 4 .

[0030] In this embodiment, white glue walls 2 are arranged around and white glue partition walls 3 are arranged inside the LED light source packaging structure. The outer light emitted by the LED chip 4 can be reflected by the white glue walls 2, and the inner light can also be reflected by the white glue partition walls 3. Therefore, the light emitted in all directions by the LED chip 4 can be effectively reflected by the reflective white glue. Compared with the traditional reflective cup packaging LED light source structure, the light efficiency of the LED light source is effectively improved without increasing the cost of the LED chip 4.

[0031] Embodiment 2:

[0032] In this embodiment, a bracket 5 is also included, and the bracket 5 includes an isolation belt 6. The isolation belt 6 is in a strip shape and is located between the two chip areas. The bracket 5 forms a rectangular bowl-cup structure on all sides, so that the white glue covers the inner side of the bracket 5 on all sides, forming a flat white glue wall 2 structure. The isolation belt 6 is an integral structure with the bracket 5, isolating the two pads, thereby effectively preventing the pads from short-circuiting. Specifically, the top height of the isolation belt 6 is lower than the top height of the LED chip 4.

[0033] In some implementations of this embodiment, the white glue partition wall 3 is located on the upper side of the isolation belt 6, and the top height of the white glue partition wall 3 is higher than the top height of the LED chip 4. The white glue partition wall 3 can effectively emit the inner light of the LED chip 4.

[0034] In some other implementations of this embodiment, the white glue partition wall 3 is respectively formed on both sides of the isolation belt 6 and is spaced apart from the isolation belt 6, and the top height of the white glue partition wall 3 is higher than the top height of the LED chip 4, so as to be able to reflect the inner light of the LED chips 4 on the left and right sides respectively.

[0035] Embodiment three:

[0036] Reference Figure 2 As shown, in this embodiment, a bracket 5 is also included, and the bracket 5 includes an isolation belt 6. The isolation belt 6 is in a strip shape and is located between the two chip areas. The bracket 5 forms a rectangular bowl-cup structure on all sides, so that the white glue covers the inner side of the bracket 5 on all sides to form a flat white glue wall 2 structure. The isolation belt 6 is an integral structure with the bracket 5, isolating the two pads, thereby effectively preventing the pads from short-circuiting. Specifically, the top height of the isolation belt 6 is higher than the top height of the LED chip 4.

[0037] In some implementations of this embodiment, white glue covers both sides of the isolation belt 6, thereby forming a white glue partition wall 3 structure with flat sides. At the same time, the top height of the white glue partition wall 3 is higher than the top height of the LED chip 4, and the white glue partition wall 3 can effectively emit the inner light of the LED chip 4.

[0038] In some other implementations of this embodiment, the white glue partition wall 3 is respectively formed on both sides of the isolation belt 6 and is spaced apart from the isolation belt 6, and the top height of the white glue partition wall 3 is higher than the top height of the LED chip 4, so as to be able to reflect the inner light of the LED chips 4 on the left and right sides respectively.

[0039] Embodiment 4:

[0040] Reference Figure 3 As shown, this embodiment provides a multi-faceted reflective LED light source packaging structure, including a substrate 1, reflective white glue and multiple LED chips 4; the LED chip 4 is fixed on the upper side of the substrate 1; the reflective white glue is fixed on the upper side of the substrate 1, including a white glue wall 2 and a white glue partition wall 3, the white glue wall 2 surrounds the LED chip 4, and two left and right chip areas are formed on the upper side of the substrate 1, and at least two LED chips 4 are fixed on each of the chip areas; the white glue partition wall 3 is dot-shaped, formed between the two chip areas.

[0041] Specifically, in the present embodiment, each of the chip areas forms four rows and one column of LED chips 4, and the LED chips in the two chip areas are aligned with each other; the white glue partition wall 3 forms three separate dot-shaped areas, which are located between the two chip areas and on the spacing line between two adjacent rows of LED chips 4, so that the gold wire can pass between the white glue enclosure 2 and each of the dot-shaped areas of the white glue partition wall 3, facilitating the arrangement of the gold wire.

[0042] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A multi-faceted reflective LED light source packaging structure, characterized in that: The invention comprises a substrate (1), a reflective white glue and a plurality of LED chips (4); the LED chips (4) are fixed on the upper side of the substrate (1); the reflective white glue is fixed on the upper side of the substrate (1), and comprises a white glue wall (2) and a white glue partition wall (3); the white glue wall (2) surrounds the LED chips (4); two ends of the white glue partition wall (3) are respectively connected to the white glue wall (2), and the white glue wall (2) separates the upper side of the substrate (1) into two chip areas, and at least one LED chip (4) is fixed on each of the chip areas.

2. The multi-faceted reflective LED light source packaging structure according to claim 1, characterized in that: The area enclosed by the white glue enclosure wall (2) forms a rectangle, and the white glue partition wall (3) is strip-shaped.

3. The multi-faceted reflective LED light source packaging structure according to claim 2, characterized in that: It also comprises a support (5), wherein the support (5) comprises an isolation belt (6), wherein the isolation belt (6) is in the shape of a strip and is located between the two chip areas.

4. The multi-faceted reflective LED light source packaging structure according to claim 3, characterized in that: The white glue partition wall (3) covers both sides of the isolation zone (6).

5. The multi-faceted reflective LED light source packaging structure according to claim 4, characterized in that: The top height of the isolation belt (6) is higher than the top height of the LED chip (4).

6. The multi-faceted reflective LED light source packaging structure according to claim 1, characterized in that: Solder pads are respectively formed on the upper sides of the two chip regions of the substrate (1), and the two solder pads are isolated from each other.

7. The multi-faceted reflective LED light source packaging structure according to claim 1, characterized in that: The LED chip (4) is a front-mounted LED chip.

8. The multi-faceted reflective LED light source packaging structure according to claim 1, characterized in that: The number of LED chips (4) on the two chip areas is the same, and the LED chips (4) on the two chip areas are connected in series in pairs and are respectively connected to the positive electrode pad and the negative electrode pad.

9. The multi-faceted reflective LED light source packaging structure according to claim 1, characterized in that: The top heights of the white glue surrounding wall (2) and the white glue partition wall (3) are higher than the top height of the LED chip (4).

10. A multi-faceted reflective LED light source packaging structure, characterized in that: The invention comprises a substrate (1), a reflective white glue and a plurality of LED chips (4); the LED chips (4) are fixed on the upper side of the substrate (1); the reflective white glue is fixed on the upper side of the substrate (1), and comprises a white glue wall (2) and a white glue partition wall (3); the white glue wall (2) surrounds the LED chips (4) on all sides; two left and right chip areas are formed on the upper side of the substrate (1); at least two LED chips (4) are fixed on each chip area; the white glue partition wall (3) is dot-shaped and formed between the two chip areas.

Images