Electronic assembly and electronic atomization device

Abstract

The utility model discloses an electronic component and an electronic atomization device, relates to the technical field of atomization devices, and solves the problem of poor wireless communication quality. The electronic assembly comprises a shell, a circuit board and a radiator, wherein an accommodating space is formed in the shell; the circuit board is arranged in the accommodating space; the radiator is electrically connected to the circuit board, the radiator is flexibly arranged so as to be matched with the inner contour of the shell, and the radiator and the circuit board are arranged in a spaced mode. The electronic component is used for wireless communication.

Description

Technical Field

[0001] The present application relates to but is not limited to the field of atomization devices, and in particular to an electronic component and an electronic atomization device. Background Art

[0002] A radiator can be integrated into an electronic atomization device to achieve wireless communication. However, in the related art, the radiator is installed in an unreasonable position, resulting in poor communication quality. Utility Model Content

[0003] The electronic components and electronic atomization devices provided in the embodiments of the present application effectively reduce interference and improve the quality of wireless communication.

[0004] In a first aspect, an embodiment of the present application provides an electronic component, including a housing, a circuit board and a radiator, wherein the housing is formed with a receiving space; the circuit board is arranged in the receiving space; the radiator is electrically connected to the circuit board, the radiator is flexibly arranged to adapt to the inner contour of the housing, and the radiator is spaced apart from the circuit board.

[0005] In a possible implementation of the present application, the electronic component further includes a bracket, the bracket is disposed in the accommodating space, and the bracket is located between the circuit board and the radiator, and the radiator is connected to the bracket.

[0006] In a possible implementation of the present application, the radiator includes a radiating portion and a connecting portion, and the connecting portion extends between the circuit board and the bracket to electrically connect the circuit board.

[0007] In a possible implementation of the present application, the bracket is provided with an avoidance hole, the connecting portion includes a conducting section and a bending section, the bending section is bent to pass through the avoidance hole, the radiating portion and the conducting section are respectively arranged at two ends of the bending section, and the conducting section is in conductive contact with the circuit board.

[0008] In a possible implementation of the present application, an elastic conductive member is disposed on the circuit board, and the elastic conductive member abuts against the connecting portion through elastic force, so that the circuit board and the connecting portion are electrically connected.

[0009] In a possible implementation of the present application, the bracket is provided with a limiting hole, the contour of the limiting hole is adapted to the contour of the radiating portion, and the radiating portion is snapped into the limiting hole.

[0010] In a possible implementation of the present application, an open portion is provided at a position of the housing corresponding to the radiator, and the open portion is a through hole, or the open portion is made of an insulating material.

[0011] In a possible implementation of the present application, the electronic component further includes a functional component, the open portion is a through hole, the functional component is disposed in the through hole, and the radiator is located between the functional component and the circuit board.

[0012] In a possible implementation of the present application, the radiator includes a flexible bearing layer and a circuit layer, and the circuit layer is connected to the flexible bearing layer.

[0013] In a second aspect, an embodiment of the present application provides an electronic atomization device, comprising an atomization component and the electronic component of the first aspect, wherein the atomization component is disposed in a receiving space of a housing.

[0014] In the electronic assembly and electronic atomization device provided by the embodiment of the present application, the circuit board and the radiator are both arranged in the accommodation space of the shell, and the shell provides protection and installation basis for the circuit board, the radiator, etc. The radiator is used to send or receive wireless signals, and the circuit board is electrically connected to the radiator, which is used to drive the circuit board to send wireless signals and process the wireless signals received by the radiator. On this basis, the radiator is flexibly arranged to adapt to the inner contour of the shell, and the radiator and the circuit board are arranged at intervals. On the one hand, the flexibly arranged radiator can be deformed to adapt to the inner contour of the shell, thereby facilitating the arrangement of the radiator. On the other hand, the radiator is adapted to the shell, which is convenient for reducing the distance between the radiator and the outer side of the shell, which is conducive to the transmission of the wireless signal of the radiator through the shell, and the radiator and the circuit board are arranged at intervals, which reduces the mutual interference between the radiator and the electronic devices on the circuit board, so as to improve the wireless communication quality of the radiator, and further improve the wireless communication quality. Compared with the solution in the related art where the radiator is integrated on the circuit board, the radiator and the circuit board of the present application are arranged at intervals and adapted to the inner contour of the shell, which can effectively reduce the interference of the electronic devices on the circuit board and the shell on the wireless signal of the radiator, and improve the wireless communication quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the explosion structure of the electronic atomization device provided in an embodiment of the present application;

[0016] Figure 2 A schematic diagram of the internal structure of the electronic atomization device provided in an embodiment of the present application;

[0017] Figure 3 A schematic diagram of an exploded structure of an electronic component provided in an embodiment of the present application;

[0018] Figure 4 Provided in the embodiments of this application Figure 1 A schematic diagram of the local enlarged structure at point A in the middle;

[0019] Figure 5 A schematic diagram of the structure of a radiator in an electronic component provided in an embodiment of the present application (first viewing angle);

[0020] Figure 6 A schematic diagram of the structure of a radiator in an electronic component provided in an embodiment of the present application (second viewing angle);

[0021] Figure 7 A schematic diagram of the structure of a circuit board in an electronic component provided in an embodiment of the present application.

[0022] Reference numerals:

[0023] 1-housing; 11-accommodating space; 12-opening part; 2-circuit board; 21-elastic conductive part; 3-radiator; 31-radiating part; 32-connecting part; 321-conducting section; 322-bending section; 323-conductive contact piece; 4-bracket; 41-avoidance hole; 42-limiting hole; 5-functional part; 6-atomization component; 7-power supply component. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the specific technical solution of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0025] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more.

[0026] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components in the drawings.

[0027] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0028] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0029] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0030] The embodiment of the present application provides an electronic atomization device, which can atomize water as an atomization medium to humidify the air; the electronic atomization device can also be used to atomize aromatherapy liquid / aromatherapy paste and other atomization media to purify the air or improve the air quality; the electronic atomization device can also be used to heat atomization media such as plant leaves / cigarette paste / cigarette oil to generate atomized gas such as aerosol for user consumption. The embodiment of the present application does not limit the atomization medium atomized by the electronic atomization device, and the atomization medium can be a liquid medium, a paste medium, etc.

[0031] Reference Figure 1 The electronic atomization device usually includes an atomization component 6, a power supply component 7, a liquid storage component, etc. The liquid storage component is used to store the atomization medium, the power supply component 7 is used to supply power to the atomization component 6, etc., and the atomization component 6 is used to atomize the atomization medium.

[0032] It should be noted that there are multiple possible connection methods for the components in the electronic atomization device. In some embodiments, the atomization component 6, the power supply component 7 and the liquid storage component are packaged as an integral whole; in other embodiments, the atomization component 6 and the liquid storage component are packaged as an integral whole, and the power supply component 7 is detachably connected to the atomization component 6; in yet other embodiments, the atomization component 6 and the power supply component 7 are packaged as an integral whole, and the liquid storage component is detachably connected to the atomization component 6 to facilitate replacement of the liquid storage component.

[0033] In addition, the electronic atomization device also includes a housing 1, a circuit board 2 and a radiator 3. The circuit board 2 is used to drive the radiator 3 to work, and the radiator 3 is used to send or receive wireless signals. The radiator 3, the atomization component 6, the power supply component 7, the liquid storage component, etc. are all arranged in the housing 1. In the related art, the radiator 3 is usually integrated on the circuit board 2. On the one hand, interference will be formed between the electronic devices on the circuit board 2 and the radiator 3, affecting the communication of the radiator 3, or increasing the design difficulty of the circuit board 2. On the other hand, the radiator 3 is far away from the outside of the housing 1, and the signal is easily blocked by the housing 1, which further affects the signal transmission of the radiator 3, resulting in poor wireless communication quality.

[0034] Therefore, the present application also provides an electronic component, referring to Figure 2 and Figure 3The electronic component includes a shell 1, a circuit board 2 and a radiator 3. The shell 1 is formed with a receiving space 11; the circuit board 2 is arranged in the receiving space 11; the radiator 3 is electrically connected to the circuit board 2, the radiator 3 is flexibly arranged to adapt to the inner contour of the shell 1, and the radiator 3 is spaced apart from the circuit board 2.

[0035] In the embodiment of the present application, the shell 1 has a variety of possible structural forms, such as a block structure, a pie structure, a columnar structure, etc. For example, the shell 1 is a columnar structure, and the radial cross-section of the shell 1 can be circular, diamond-shaped, square, triangular, elliptical, etc., and the embodiment of the present application does not limit this.

[0036] In an embodiment of the present application, the accommodating space 11 is located on the inner side of the outer shell 1. The accommodating space 11 can be used to accommodate the atomization component 6, the power supply component 7, the liquid storage component, the circuit board 2, the radiator 3, etc. The contour of the accommodating space 11 can be the same as or different from the outer contour of the outer shell 1.

[0037] In the embodiment of the present application, the circuit board 2 is arranged in the accommodating space 11. The circuit board 2 can be connected to the housing 1 by means of snap-on, fastener connection, bonding, etc. A control chip, interactive components, etc. can be set on the circuit board 2. The control chip is used to control the working state of the atomization component 6. The interactive components may include buttons, touch pads, display screens, indicator lights, etc. The interactive components are used to receive user instructions or transmit information sent by the control chip to the user to achieve human-computer interaction.

[0038] In the embodiment of the present application, the radiator 3 is an electronic device for converting electrical signals into electromagnetic waves and radiating them to the outside, or receiving electromagnetic waves and converting them into electrical signals. Here, the radiator 3 can be an omnidirectional antenna or a directional antenna; the radiator 3 can be a long-wave antenna, a medium-wave antenna, a short-wave antenna, etc. For example, the radiator 3 is a Bluetooth radio frequency antenna, which can be used in functions such as child locks and monitoring.

[0039] In the embodiment of the present application, the radiator 3 is flexibly arranged to adapt to the inner contour of the shell 1, that is, when the inner wall of the shell 1 is a curved surface, the surface of the side of the radiator 3 away from the circuit board 2 is also the same curved surface; when the inner wall of the shell 1 is a plane, the surface of the side of the radiator 3 away from the circuit board 2 is also a plane.

[0040] In the electronic component of the embodiment of the present application, the circuit board 2 and the radiator 3 are both arranged in the accommodating space 11 of the shell 1, and the shell 1 provides protection and installation basis for the circuit board 2, the radiator 3, etc. The radiator 3 is used to send or receive wireless signals. The circuit board 2 is electrically connected to the radiator 3 to drive the circuit board 2 to send wireless signals and process the wireless signals received by the radiator 3.

[0041] On this basis, the radiator 3 is flexibly arranged to adapt to the inner contour of the shell 1, and the radiator 3 and the circuit board 2 are arranged at intervals. On the one hand, the flexibly arranged radiator 3 can be deformed to adapt to the inner contour of the shell 1, thereby facilitating the layout of the radiator 3. On the other hand, the radiator 3 is adapted to the shell 1, which is convenient for reducing the distance between the radiator 3 and the outside of the shell 1, which is beneficial for the wireless signal of the radiator 3 to pass through the shell 1 for transmission, and the radiator 3 and the circuit board 2 are arranged at intervals, which reduces the mutual interference between the radiator 3 and the electronic devices on the circuit board 2, thereby improving the wireless communication quality of the radiator 3, and further improving the wireless communication quality.

[0042] Compared with the solution in the related art in which the radiator 3 is integrated on the circuit board 2, the radiator 3 and the circuit board 2 of the present application are arranged at intervals and adapted to the inner contour of the shell 1, which can effectively reduce the wireless signal interference of the electronic devices on the circuit board 2 and the shell 1 to the radiator 3, improve the quality of wireless communication, and facilitate the layout of the radiator 3.

[0043] To facilitate the installation of radiator 3, refer to Figure 1 , Figure 3 and Figure 4 In some possible embodiments of the present application, the electronic component further includes a bracket 4 , which is disposed in the accommodating space 11 , and the bracket 4 is located between the circuit board 2 and the radiator 3 , and the radiator 3 is connected to the bracket 4 .

[0044] In the embodiment of the present application, the bracket 4 can also be used to support the circuit board 2, the atomizer assembly 6, the power supply assembly 7, etc. For example, a mounting space is formed on one side of the bracket 4 away from the radiator 3, the circuit board 2, the power supply assembly 7, etc. are all located in the mounting space and connected to the bracket 4, the atomizer assembly 6 and the liquid storage assembly are arranged at one end of the bracket 4, and the atomizer assembly 6 and the power supply assembly 7 are electrically connected to the circuit board 2 respectively.

[0045] In the embodiment of the present application, the bracket 4 can be used to support the radiator 3, and the connection between the radiator 3 and the bracket 4 can be abutment, clamping, bonding, etc. In addition, the outer side of the bracket 4 is connected to the inner wall of the housing 1, and the two can be connected by clamping, fasteners, etc. to facilitate disassembly and maintenance.

[0046] The electronic component of the embodiment of the present application is provided with a bracket 4, which is arranged between the circuit board 2 and the radiator 3. On the one hand, the two are isolated, and on the other hand, the bracket 4 provides support for the radiator 3, so that the radiator 3 can be more stable.

[0047] In order to facilitate the electrical connection between the radiator 3 and the circuit board 2, refer to Figure 2 , Figure 5 and Figure 6In some possible embodiments of the present application, the radiator 3 includes a radiating portion 31 and a connecting portion 32 , and the connecting portion 32 extends between the circuit board 2 and the bracket 4 to electrically connect the circuit board 2 .

[0048] In the embodiment of the present application, the radiator 3 may be a block structure, a columnar structure, a sheet structure, etc. For example, the radiator 3 is a sheet structure. One side of the radiator 3 is attached to the housing 1, and the other side is attached to the bracket 4, that is, the radiator 3 is clamped between the bracket 4 and the housing 1.

[0049] In the embodiment of the present application, the radiation portion 31 is used to convert electrical signals and electromagnetic waves. The radiation portion 31 may have a variety of shapes, such as circular, square, diamond, triangle, elliptical, etc. Figure 5 and Figure 6 In a possible embodiment of the present application, the radiation portion 31 is a square structure.

[0050] In the embodiment of the present application, the connecting part 32 is used to electrically connect the radiating part 31 and the circuit board 2. The connecting part 32 can be a wire, a flexible printed circuit 2 (flexible printed circuit, FPC), etc. The connecting part 32 and the radiating part 31 can be integrally formed, and the connection between the connecting part 32 and the circuit board 2 can be welding, abutment, etc.

[0051] In the embodiment of the present application, the connecting portion 32 can be arranged in the middle of the radiation portion 31, or can be arranged at the edge of the radiation portion 31. Figure 2 In a possible embodiment of the present application, the connecting portion 32 is disposed on a side edge of the radiation portion 31 and is disposed close to an edge of the bracket 4 so that the connecting portion 32 extends between the circuit board 2 and the bracket 4 .

[0052] In the electronic component of the embodiment of the present application, the radiator 3 includes a radiating portion 31 and a connecting portion 32. The radiating portion 31 is used to send or receive wireless signals, and the connecting portion 32 extends between the circuit board 2 and the bracket 4, thereby being electrically connected to the circuit board 2. The structure is simple and easy to implement.

[0053] In order to facilitate the radiator 3 to pass through the bracket 4 to be electrically connected to the circuit board 2, refer to Figure 2 and Figure 4 In some possible embodiments of the present application, the bracket 4 is provided with an avoidance hole 41, the connecting portion 32 includes a conducting section 321 and a bending section 322, the bending section 322 is bent to pass through the avoidance hole 41, the radiating portion 31 and the conducting section 321 are respectively arranged at two ends of the bending section 322, and the conducting section 321 is in conductive contact with the circuit board 2.

[0054] In the embodiment of the present application, the avoidance hole 41 is a through hole so that the connecting portion 32 passes through the avoidance hole 41. The radial profile of the avoidance hole 41 can be square, diamond, circular, elliptical, etc. The radial profile of the avoidance hole 41 should be compatible with the connecting portion 32. For example, the radial profile of the avoidance hole 41 is a rectangle.

[0055] In the embodiment of the present application, the bending setting of the bending section 322 has various forms, and the bending section 322 can be bent once or multiple times. For example, only one end of the radiation portion 31 is bent in the bending section 322, and the bending section 322 and the radiation portion 31 form an angle so that the connecting portion 32 passes through the avoidance hole 41; for another example, the bending section 322 is bent twice, so that the radiation portion 31 and the conductive section 321 are respectively set at an angle with the bending section 322.

[0056] It should be noted that the multiple bends of the bending section 322 can be in different directions. For example, the bending section 322 can bend the conductive section 321 toward the side where the radiation portion 31 is located, so that the radiator 3 is similar to a "U"-shaped structure; or the bending section 322 can bend the conductive section 321 toward the edge of the bracket 4, so that the radiator 3 is similar to a "Z"-shaped structure. The angle formed by the bending section 322 can be a right angle, an acute angle, or an obtuse angle. Figure 5 and Figure 6 In a possible embodiment of the present application, the bending section 322 forms two right-angle or approximately right-angle bends, so that the radiator 3 resembles a "U"-shaped structure.

[0057] In addition, since the bending section 322 is bent around the edge of the avoidance hole 41, when the bending angle is too small, the bending section 322 is easily damaged. Figure 2 and Figure 4 In a possible embodiment of the present application, the edge rounding of the avoidance hole 41 is set so that the bending section 322 has a larger bending radius and can fit the inner wall of the avoidance hole 41, and the bracket 4 provides support for the connecting portion 32.

[0058] In the embodiment of the present application, the conductive section 321 is arranged in close contact with the bracket 4, and the bracket 4 provides support for the conductive section 321, and a conductive contact 323 is provided on the side of the conductive section 321 facing the circuit board 2, and the conductive contact 323 is conductively contacted with the circuit board 2, wherein the conductive contact 323 can be circular, square, diamond, triangular, etc.

[0059] The electronic component of the embodiment of the present application is provided with an avoidance hole 41 on the bracket 4, and the bending section 322 of the connecting portion 32 is bent to pass through the avoidance hole 41, so that the radiating portion 31 and the conducting section 321 at both ends of the bending section 322 are respectively located on both sides of the bracket 4, and the radiator 3 is in conductive contact with the circuit board 2 through the conducting section 321, thereby facilitating the electrical connection between the radiator 3 and the circuit board 2 on both sides of the bracket 4.

[0060] In order to improve the electrical connection stability between the radiator 3 and the circuit board 2, refer to Figure 3 and Figure 7 In some possible embodiments of the present application, an elastic conductive member 21 is provided on the circuit board 2, and the elastic conductive member 21 abuts against the connecting portion 32 through elastic force, so that the circuit board 2 and the connecting portion 32 are electrically connected.

[0061] In the embodiment of the present application, the elastic conductive member 21 may be a conductive spring, a spring pin, a conductive spring leaf, etc. The elastic conductive member 21 may be elastically deformed at least in a direction perpendicular to the conducting section 321 to move closer to or away from the conducting section 321. For example, the elastic conductive member 21 is a conductive spring leaf, one end of which is welded to the circuit board 2, and the other end is bent to form an arc-shaped contact. During the assembly process of the radiator 3 and the circuit board 2, the contact moves away from the conducting section 321 to cause the elastic conductive member 21 to be elastically deformed. After the radiator 3 and the circuit board 2 are assembled, the elastic force of the elastic conductive member 21 causes the contact to abut against the conductive contact sheet 323 of the conducting section 321.

[0062] In the embodiment of the present application, a plurality of conductive contacts 323 may be provided according to the use requirements of the radiator 3. Accordingly, a plurality of elastic conductive members 21 are provided on the circuit board 2. The plurality of conductive contacts 323 may be arranged in a linear array, a circular array, or a directional array. The plurality of elastic conductive members 21 and the plurality of conductive contacts 323 are provided in a one-to-one correspondence.

[0063] In the electronic component of the embodiment of the present application, an elastic conductive member 21 is provided on the circuit board 2. The elastic conductive member 21 can generate elastic deformation and abut against the connecting portion 32 of the radiator 3 through elastic force, thereby making the electrical connection between the elastic conductive member 21 and the radiator 3 more stable, thereby improving the quality of wireless communication.

[0064] In order to limit the position of the radiator 3 to improve the connection stability, refer to Figure 4 In some possible embodiments of the present application, the bracket 4 is provided with a limiting hole 42 , the contour of the limiting hole 42 is adapted to the contour of the radiation portion 31 , and the radiation portion 31 is snapped into the limiting hole 42 .

[0065] In the embodiment of the present application, the contour of the limiting hole 42 is adapted to the contour of the radiating portion 31. Specifically, along the direction perpendicular to the radiating portion 31, the projection of the limiting hole 42 overlaps with the projection of the radiating portion 31, so that when the radiating portion 31 is set in the limiting hole 42, the hole wall of the limiting hole 42 abuts against the peripheral side of the radiating portion 31, limiting the movement of the radiating portion 31, thereby clamping the radiating portion 31 in the limiting hole 42. Figure 4 and Figure 5 In a possible embodiment of the present application, the radiation portion 31 is a square structure, and the limiting hole 42 is also a square structure.

[0066] The electronic component of the embodiment of the present application, by setting a limiting hole 42 on the bracket 4, on the one hand, provides space for the installation of the radiator 3, and on the other hand, the contour of the limiting hole 42 is adapted to the contour of the radiating part 31, so that the limiting hole 42 can limit the radiating part 31, thereby improving the connection stability between the radiating part 31 and the bracket 4.

[0067] In order to further improve the quality of wireless communication, refer to Figure 1 and Figure 3 In some possible embodiments of the present application, an opening portion 12 is provided at a position of the housing 1 corresponding to the radiator 3 , and the opening portion 12 is a through hole, or the opening portion 12 is made of an insulating material.

[0068] In the embodiment of the present application, when the opening portion 12 is a through hole, the radial profile of the opening portion 12 should be adapted to the profile of the radiating portion 31. For example, when the profile of the radiating portion 31 is a square, the radial profile of the opening portion 12 is also a square, and the sizes of the two are adapted.

[0069] In the embodiment of the present application, the opening portion 12 is made of insulating material. The portion of the shell 1 provided with the opening portion 12 may be made of insulating material, or the entire shell 1 may be made of insulating material. The insulating material may be plastic, ceramic, glass, etc.

[0070] In the electronic component of the embodiment of the present application, an opening portion 12 is provided at a position of the housing 1 corresponding to the radiator 3, and the opening portion 12 has little interference on the wireless signal of the radiator 3, so as to further reduce the influence of the housing 1 on the radiator 3 and improve the quality of wireless communication of the electronic component.

[0071] In order to improve the functionality of the opening portion 12, refer to Figure 1 and Figure 2 In some possible embodiments of the present application, the electronic component further includes a functional component 5 , the open portion 12 is a through hole, the functional component 5 is disposed in the through hole, and the radiator 3 is located between the functional component 5 and the circuit board 2 .

[0072] In the embodiment of the present application, the functional part 5 can be a decorative part, a sealing part, a light-transmitting part, etc. It can be understood that when the functional part 5 is set in the open part 12, the functional part should be made of insulating material to reduce interference with the wireless signal.

[0073] Reference Figure 2 In a possible embodiment of the present application, the functional part 5 includes a decorative part, which is arranged in a through hole formed by the open part 12, and the side of the decorative part facing the circuit board 2 is flat, and the radiation part 31 is clamped between the decorative part and the bracket 4.

[0074] The electronic component of the embodiment of the present application is provided with a functional part 5 in the open portion 12, so that the radiator 3 can achieve stable wireless communication through the open portion 12, and the functional part 5 can provide functions such as decoration and sealing, thereby improving the functionality of the open portion 12 and making it more practical.

[0075] In order to facilitate the shaping and assembly of the radiator 3 , in some possible embodiments of the present application, the radiator 3 includes a flexible bearing layer and a circuit layer, and the circuit layer is connected to the flexible bearing layer.

[0076] In an embodiment of the present application, the flexible carrier layer provides support for the circuit layer, and the circuit layer is connected to the flexible carrier layer by bonding or other means. The flexible carrier can be made of plastic materials such as polyester film, which has easy bending properties and can also have insulating isolation functions.

[0077] In the embodiment of the present application, the circuit layer can be made of metal foil or metal wire. The part of the circuit layer corresponding to the radiation part 31 is wound to form an antenna. The part of the circuit layer corresponding to the connection part 32 is formed with a conductive contact 323. The circuit layer can be bent along with the flexible bearing layer.

[0078] For example, the radiator 3 is an FPC. Compared with the ceramic antenna in the related art, the easily bendable FPC antenna is easy to process and shape, and can be easily adjusted to a suitable shape so as to fit the inner wall of the housing 1.

[0079] In the electronic component of the embodiment of the present application, the radiator 3 includes a flexible bearing layer. The flexible bearing layer carries the circuit layer, so that the radiator 3 is easier to deform, which makes it easier for the radiator 3 to adapt to the structure of the housing 1 and improves the convenience of assembling the radiator 3.

[0080] The electronic components and electronic atomization device of the embodiment of the present application, the housing 1 and the bracket 4 can be made of metal material, which has a high structural strength. The housing 1 is installed with a decorative piece made of plastic. The radiating part 31 of the radiator 3 is arranged between the bracket 4 and the decorative piece. The radiator 3 is an FPC, which is easy to deform and fit with the decorative piece. The radiator 3 also includes a bending section 322 and a conducting section 321. The bending section 322 passes through the avoidance hole 41 on the bracket 4, so that the conducting section 321 and the radiating part 31 are respectively located on the opposite sides of the bracket 4. The conducting section 321 is abutted against the elastic conductive member 21 through the conductive contact 323. The elastic conductive member 21 relies on elastic force to stabilize the electrical connection between the two, so as to electrically connect the radiating part 31 to the circuit board 2. Since the radiator 3 is far away from the circuit board 2 and fits the insulating decorative piece, the wireless signal is less interfered and a relatively good communication quality can be obtained.

[0081] The serial numbers of the embodiments of the present application are only for description and do not represent the advantages and disadvantages of the embodiments. The above are only preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electronic component, characterized in that: include: A housing is formed with a receiving space; A circuit board is arranged in the accommodation space; The radiator is electrically connected to the circuit board. The radiator is flexibly arranged to match the inner contour of the shell, and the radiator is spaced apart from the circuit board.

2. The electronic component according to claim 1, characterized in that A bracket is also included. The bracket is arranged in the accommodation space and is located between the circuit board and the radiator. The radiator is connected to the bracket.

3. The electronic component according to claim 2, characterized in that The radiator includes a radiating portion and a connecting portion, and the connecting portion extends between the circuit board and the bracket to electrically connect the circuit board.

4. The electronic component according to claim 3, characterized in that: The bracket is provided with an avoidance hole, the connecting portion includes a conducting section and a bending section, the bending section is bent to pass through the avoidance hole, the radiating portion and the conducting section are respectively arranged at two ends of the bending section, and the conducting section is in conductive contact with the circuit board.

5. The electronic component according to claim 3, characterized in that: An elastic conductive member is disposed on the circuit board, and the elastic conductive member abuts against the connecting portion through elastic force, so that the circuit board and the connecting portion are electrically connected.

6. The electronic component according to claim 3, characterized in that: The bracket is provided with a limiting hole, the contour of the limiting hole is matched with the contour of the radiating part, and the radiating part is clamped in the limiting hole.

7. The electronic component according to any one of claims 1 to 6, characterized in that: The housing is provided with an open portion at a position corresponding to the radiator, and the open portion is a through hole, or the open portion is made of insulating material.

8. The electronic component according to claim 7, characterized in that: It also includes a functional part, the open portion is a through hole, the functional part is arranged in the through hole, and the radiator is located between the functional part and the circuit board.

9. The electronic component according to any one of claims 1 to 6, characterized in that: The radiator includes a flexible bearing layer and a circuit layer, and the circuit layer is connected to the flexible bearing layer.

10. An electronic atomization device, characterized in that: include: The electronic component according to any one of claims 1 to 9; An atomization assembly is arranged in the accommodating space of the shell.

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