SERS (Surface Enhanced Raman Scattering) sensing chip packaging structure

Abstract

The utility model relates to the technical field of sensing chips, and discloses an SERS (Surface Enhanced Raman Scattering) sensing chip packaging structure which comprises a glass substrate, a groove is formed in the inner wall of the glass substrate, a supporting spring is arranged at the groove, a supporting plate is fixedly connected above the supporting spring, an SERS sensing chip is movably mounted above the supporting plate, and the SERS sensing chip is arranged in the groove. The SERS sensing chip is provided with a nano hole array capable of enhancing Raman scattering signals, a placement groove is fixedly formed in the outer wall of the glass substrate, the SERS sensing chip is arranged in the placement groove, and a sealing gasket is fixedly mounted on the outer wall of the placement groove. Therefore, when the access cover is tightly covered, the placement groove is attached and sealed to the outer wall of the access cover through the sealing gasket on the upper portion, a sealed space is formed in the placement groove, a sample can only enter the placement groove from the material dropping groove, and the situation that the sample leaks into the base plate to damage the whole is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of SERS sensor chips, in particular to a SERS sensor chip packaging structure. Background Art

[0002] SERS (surface enhanced Raman scattering) sensor chip is a highly sensitive sensor used to detect and analyze trace substances. It uses special surface structure and enhancement effect to increase the intensity of Raman scattering signal, thereby realizing the detection of extremely low concentration molecules. SERS (surface enhanced Raman scattering) sensor chip usually has a complex packaging structure to ensure accurate and stable optical detection in practical applications, and to protect the chip from the influence of the external environment.

[0003] For example, the Chinese patent "CN216433912U" discloses a portable detection substrate with a detachable SERS chip, which proposes that the liquid pool is concave on the substrate and the bottom of the pool is flat, the plate body of the substrate is provided with a receiving groove, the card tray can be detachably inserted into the receiving groove, and the card tray is provided with a card tray groove for placing the SERS chip. When the card tray is inserted into the substrate, the SERS chip is horizontally placed on the bottom of the liquid pool. Since the card tray is detachable, only the SERS chip in it needs to be replaced, and the operation is very simple; and the chip surface can be ensured to be flat, thereby ensuring the accuracy of the detection and facilitating the repeated use of the substrate; since the chip is placed in the receiving groove, the chip is a distance away from the upper surface of the substrate, which can effectively prevent accidental touch during transportation and detection.

[0004] It can be seen from the above-mentioned device that although it is proposed to provide a detachable card holder on the SERS chip substrate to facilitate the disassembly of the chip, the applicant believes that the following defects still exist:

[0005] When packaging a SERS sensor chip, the existing packaging structure only opens a groove the same size as the chip on the glass substrate, places the chip in the groove, and then installs the upper cover plate. No additional placement groove is added to install the chip in the placement groove. The sealing of the chip during detection cannot be guaranteed, and the entire chip needs to be replaced when it is damaged. The packaging structure is wasted, resulting in increased costs and a short service life. Utility Model Content

[0006] (I) Technical problems solved: In view of the deficiencies in the prior art, the present invention provides a SERS sensor chip packaging structure, which has the advantages that when the SERS sensor chip is damaged or needs to be replaced, only the inspection panel needs to be opened, and the entire chip does not need to be scrapped. In addition, a placement groove that matches the chip size is provided to place the chip, which protects the chip and provides sealing. This solves the problem that when the existing packaging structure packages the SERS sensor chip, only a groove that matches the chip size is opened on the glass substrate, the chip is placed in the groove, and then the upper cover is installed, but no placement groove is added to install the chip in the placement groove, so the sealing of the chip during detection cannot be guaranteed, and when the chip is damaged, the entire chip needs to be replaced, and the packaging structure is wasted, resulting in increased costs and a short service life.

[0007] (II) Technical solution: To achieve the above-mentioned purpose, the utility model provides the following technical solution: a SERS sensor chip packaging structure, comprising a glass substrate, the inner wall of the glass substrate is provided with a groove, the groove is provided with a support spring, a support plate is fixedly connected above the support spring, a SERS sensor chip is movably installed above the support plate, the SERS sensor chip is provided with a nanohole array to enhance the Raman scattering signal, a placement groove is fixedly installed on the outer wall of the glass substrate, the SERS sensor chip is arranged inside the placement groove, and a sealing gasket is fixedly installed on the outer wall of the placement groove.

[0008] Preferably, a plurality of connecting rods are disposed on the outer wall of the glass substrate, the connecting rods are fixedly connected to a protective cover, and the glass substrate and the protective cover are sealed and connected.

[0009] Preferably, a thumb groove is provided on the outer wall of the protective cover, and the thumb groove is a thumb-sized concave shape.

[0010] Preferably, the inner wall of the protection cover is fixedly connected with a rotating shaft, the outer wall of the rotating shaft is movably mounted with an inspection cover, a drip groove is provided above the inspection cover, and the drip groove is convexly attached to the upper surface of the SERS sensor chip.

[0011] Preferably, a limiting groove is provided on the outer wall of the glass substrate, a buckle slide groove is provided on the outer wall of the inspection cover, and a buckle assembly is provided inside the buckle slide groove.

[0012] Preferably, the buckle assembly includes a tension spring, the tension spring is fixedly installed inside the buckle slide groove, the outer wall of the tension spring is fixedly connected with a buckle, and the buckle is fixedly connected with a paddle.

[0013] Preferably, the upper part of the buckle is slidably installed inside the buckle sliding groove, and the lower part of the buckle is slidably installed inside the limiting groove, and the limiting groove is provided with a groove that meshes with the buckle protrusion.

[0014] (III) Beneficial effects: Compared with the prior art, the present invention provides a SERS sensor chip packaging structure, which has the following beneficial effects:

[0015] 1. The SERS sensor chip packaging structure sets the SERS sensor chip in the placement groove, so that when the inspection cover is closed, the placement groove is sealed with the outer wall of the inspection cover through the sealing gasket above, so that a sealed space is formed inside the placement groove, and the sample can only enter from the drip groove, preventing the sample from leaking into the substrate and causing damage to the whole.

[0016] 2. The SERS sensor chip packaging structure cooperates with the support spring and the inspection cover so that when the inspection cover is opened after the buckle is pushed, the elasticity of the support spring drives the support plate to push open the warranty cover, which is convenient for opening the cover and taking out the SERS sensor chip, and for inspectors to check the damage degree of the SERS sensor chip.

[0017] 3. The SERS sensor chip packaging structure can control the sealing installation degree of the protective cover above the glass substrate through the cooperation between the buckle assembly and the limit groove. When the SERS is damaged, there is no need to replace the entire chip. The chip can be repaired or replaced separately by just turning the buckle to open the inspection cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the explosion structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the opening structure of the protective cover of the utility model;

[0021] Figure 4 This is a schematic diagram of the limit groove structure of the utility model;

[0022] Figure 5 This is a schematic diagram of the structure of the buckle assembly of the utility model.

[0023] The numbers in the figure are:

[0024] 1. Glass substrate; 2. Protective cover; 3. Thumb groove; 4. Inspection cover; 5. Drip groove; 6. Rotating shaft; 7. Buckle assembly; 71. Tension spring; 72. Buckle; 73. Pick; 8. Buckle slide groove; 9. Limiting groove; 10. Support spring; 11. Support plate; 12. SERS sensor chip; 13. Placement groove; 14. Sealing pad; 15. Connecting rod. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-3 A SERS sensor chip packaging structure includes a glass substrate 1, a groove is formed on the inner wall of the glass substrate 1, a support spring 10 is arranged at the groove, a support plate 11 is fixedly connected above the support spring 10, a SERS sensor chip 12 is movably installed above the support plate 11, and the SERS sensor chip 12 is formed with a nanohole array to enhance the Raman scattering signal. The nanohole array will lead to an enhancement effect of the local electric field. When the molecules of the object to be detected enter the surrounding area of ​​the hole, they interact with the local electric field on the surface of the nanostructure, thereby enhancing the Raman scattering signal. This enhancement effect can enhance the signal by thousands of times or even more. A placement groove 13 is fixedly installed on the outer wall of the glass substrate 1. The SERS sensor chip 12 is arranged inside the placement groove 13. The placement groove 13 is designed to match the size of the sensor chip to ensure the stable placement of the sensor chip. A sealing gasket 14 is fixedly installed on the outer wall of the placement groove 13. The sealing gasket 14 installed on the outer wall of the placement groove 13 is used to provide sealing and prevent external liquid or gas from penetrating into the placement groove 13, which helps to protect the SERS sensor chip 12 from the influence of the external environment, especially for applications where liquid or gas sample analysis is required. The outer wall of the glass substrate 1 is provided with a plurality of connecting rods 15, and the connecting rods 15 are fixedly connected with a protective cover 2 to protect the SERS sensor chip 12 from the external environment. The protective cover 2 is located on the glass substrate 1 and is used to encapsulate and protect the SERS sensor chip 12 and other groups. The protective cover 2 is made of transparent or light-transmitting material so that the SERS sensor chip 12 can be observed or manipulated through the protective cover 12. The glass substrate 1 and the protective cover 2 are sealed and connected. The outer wall of the protective cover 2 is provided with a thumb groove 3. The thumb groove 3 is a thumb-sized concave shape. The concave shape of the thumb groove 3 may make the grip more comfortable and provide better grip stability, especially when the protective cover needs to be opened and closed frequently. The inner wall of the protective cover 2 is fixedly connected with a rotating shaft 6, and the outer wall of the rotating shaft 6 is movably installed with an inspection cover 4. A drip groove 5 is provided above the inspection cover 4, and the drip groove 5 is convex and fits the upper surface of the SERS sensor chip 12.

[0027] See also Figure 3-5The outer wall of the glass substrate 1 is provided with a limiting groove 9 for limiting and positioning the position of the inspection cover 4. The design of the limiting groove 9 can ensure that the inspection cover 4 is correctly aligned and installed on the glass substrate 1, so that the inspection cover 4 is in the correct position. The inspection cover 4 cooperates with the limiting groove 9. The outer wall of the inspection cover 4 is provided with a buckle slide groove 8. The buckle slide groove 8 is provided with a buckle assembly 7. The buckle assembly 7 includes a tension spring 71. The tension spring 71 is fixedly installed inside the buckle slide groove 8. The outer wall of the tension spring 71 is fixedly connected with a buckle 72. The buckle 72 is fixedly connected with a paddle 73. The upper part of the buckle 72 is slidably installed inside the buckle slide groove 8. The lower part of the buckle 72 is slidably installed inside the limiting groove 9. The limiting groove 9 is provided with a groove that meshes with the protrusion of the buckle 72. The buckle assembly 7 can slide inside the buckle slide groove 8 and mesh with the groove inside the limiting groove 9. This can ensure that the inspection cover 4 is correctly connected to the glass substrate 1, while providing stable fixation and convenience of operation.

[0028] Working principle: First, a glass substrate 1 is used when packaging the SERS sensor chip 12. The glass substrate 1 is a base material with good optical properties. These base materials help to provide a stable support and reflective surface for the detection of SERS signals. On the base material, a layer of active base material, such as metal nanostructures, is added. The design of these nanostructures helps to enhance the Raman scattering signal, thereby improving the sensitivity and detection performance of the sensor. Secondly, a groove is opened inside the glass substrate 1, and a support spring 10 is arranged inside the groove. The SERS sensor chip 12 is fixedly connected above the support spring 10 to support and lift the SERS sensor chip 12. First, a placement groove 13 matching the size of the SERS sensor chip 12 is installed on the glass substrate 1 to ensure the stable placement of the sensor chip. The placement groove 13 is arranged above the support plate 11. A sealing gasket 14 is installed above the placement groove 13 to provide sealing and prevent external liquid or gas from penetrating into the placement groove 13. The SERS sensor chip 12 is placed on the support plate 11, and then the protective cover 2 is installed on the glass substrate 1 through a number of connecting rods 15 arranged above the glass substrate 1 for packaging. During packaging, the SERS sensor chip 12 adopts a sterile environment and is sealed in a transparent protective layer, such as a polymer or glass. This protective layer can prevent the chip from being contaminated or physically damaged.At the same time, the protective layer can also provide a stable chemical environment for the chip to ensure the accuracy and repeatability of the measurement results. Secondly, after the packaging is completed, the inspection cover 4 arranged on the outer wall of the protective cover 2 is tightly covered with the glass substrate 1. When the inspection cover 4 is tightly covered, the support plate 11 is pressed down to keep the support plate 11 and the glass substrate 1 level. The SERS chip is also fixed. The inspection cover 4 above the sealing gasket 14 is a plane, so that the inside of the placement groove 13 below the sealing gasket 14 and the inspection cover 4 are kept in a sealed state. Through the drip groove 5 arranged above the inspection cover 4, when the sample is placed in the drip groove 5, the microfluidic system is used to guide the sample to the surface of the SERS sensor chip 12, and the drip groove 5 is convenient for the input of the laser and the detection of Raman scattered light. At the same time, if the SERS sensor chip 12 needs to be repaired or replaced, the staff needs to turn the paddle 73, and the paddle 73 drives the card When the locking cam 72 is in the locked state, the locking cam 72 is locked and the locking cam 73 is locked.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A SERS sensor chip packaging structure, comprising a glass substrate (1), characterized in that: The inner wall of the glass substrate (1) is provided with a groove, a support spring (10) is arranged at the groove, a support plate (11) is fixedly connected above the support spring (10), a SERS sensor chip (12) is movably mounted above the support plate (11), the SERS sensor chip (12) is provided with a nano-hole array to enhance Raman scattering signals, a placement groove (13) is fixedly mounted on the outer wall of the glass substrate (1), the SERS sensor chip (12) is arranged inside the placement groove (13), and a sealing gasket (14) is fixedly mounted on the outer wall of the placement groove (13).

2. A SERS sensor chip packaging structure according to claim 1, characterized in that: The outer wall of the glass substrate (1) is provided with a plurality of connecting rods (15), the connecting rods (15) are fixedly connected to a protective cover (2), and the glass substrate (1) and the protective cover (2) are sealed and connected.

3. A SERS sensor chip packaging structure according to claim 2, characterized in that: The outer wall of the protective cover (2) is provided with a thumb groove (3), and the thumb groove (3) is in a thumb-sized concave shape.

4. A SERS sensor chip packaging structure according to claim 3, characterized in that: The inner wall of the protective cover (2) is fixedly connected to a rotating shaft (6), the outer wall of the rotating shaft (6) is movably mounted with an inspection cover (4), a drip groove (5) is provided above the inspection cover (4), and the drip groove (5) is in a convex shape and is attached to the upper surface of the SERS sensor chip (12).

5. A SERS sensor chip packaging structure according to claim 4, characterized in that: The outer wall of the glass substrate (1) is provided with a limiting groove (9), the outer wall of the inspection cover (4) is provided with a buckle slide groove (8), and a buckle assembly (7) is arranged inside the buckle slide groove (8).

6. A SERS sensor chip packaging structure according to claim 5, characterized in that: The buckle assembly (7) comprises a tension spring (71), the tension spring (71) being fixedly mounted inside the buckle slide groove (8), the outer wall of the tension spring (71) being fixedly connected to a buckle (72), and the buckle (72) being fixedly connected to a paddle (73).

7. A SERS sensor chip packaging structure according to claim 6, characterized in that: The upper portion of the buckle (72) is slidably mounted inside the buckle slide groove (8), and the lower portion of the buckle (72) is slidably mounted inside the limit groove (9). The limit groove (9) is provided with a groove that meshes with a protrusion of the buckle (72).

Images