Die bonder
By integrating the transmission module, solid crystal module and transport module in the solid crystal machine, the integration of solid crystal and sorting functions is achieved, and the cost and low efficiency caused by the independent solid crystal machine and sorting line in the traditional production line is solved. The problem is to achieve a more compact structure and a more efficient production process.
Patent Information
- Application Number
- CN202420195766.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-26
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-01-26
AI Technical Summary
In traditional solid crystal production lines, solid crystal machine and sorting line are independent equipment, resulting in high production costs, large space occupancy and low production efficiency, requiring additional manpower and time for material transfer and coordination.
Design an integrated crystal solid machine, including a transmission module, a solid crystal module and a transport module, to realize the integration of solid crystal and sorting functions, integrate the transmission module through the rack, reduce docking processes, simplify production processes, and introduce identification modules and Multi-axis robots for increased efficiency.
It reduces production costs, saves production space, improves the efficiency of solid crystal production process, realizes the efficiency of substrate transfer and coordination, simplifies the debugging process, and improves the flexibility and resource utilization of the production line.
Smart Images
Figure CN222365553U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of crystal bonding equipment, in particular to a crystal bonding machine. Background Art
[0002] A die bonder is a mechanical device for fixing crystals and semiconductor packages. It can transfer and bond the wafer on the blue film to the substrate to complete chip mounting.
[0003] In traditional die bonding production lines, the die bonding machine and the sorting line are independent devices. Traditional die bonding machines are only responsible for bonding, and are generally equipped with an additional sorting line for transferring substrates. The die bonding machine and the sorting line need to be purchased and installed separately. This not only increases the cost of the die bonding production line, but also takes up valuable production space. In addition, since the material transfer and coordination between the die bonding machine and the sorting line requires additional manpower and time, the efficiency of the entire die bonding production process is also limited to a certain extent. Utility Model Content
[0004] The main purpose of the utility model is to provide a crystal bonding machine, aiming to reduce the production cost of the entire line.
[0005] The technical solution of the utility model provides a die bonding machine for fixing a wafer on a substrate, and the die bonding machine comprises:
[0006] frame;
[0007] A conveying module, disposed on the frame and extending along the X-axis direction, the conveying module is used to convey the substrate along the X-axis direction;
[0008] A crystal bonding module is provided on the frame, the crystal bonding module comprises a crystal bonding table and a crystal bonding assembly, the crystal bonding table is used to place the substrate for crystal bonding by the crystal bonding assembly;
[0009] The transfer module is arranged on the frame and is capable of transferring the substrate on the conveying module to the crystal bonding table.
[0010] In one embodiment, the crystal bonding component includes a crystal supply unit, a top crystal unit and a bonding head assembly, the crystal supply unit is used to supply the wafer and can transfer the wafer to the top of the top crystal unit, the top crystal unit is used to poke out the wafer, the bonding head assembly includes a fixed seat provided on the frame and a swing arm provided on the fixed seat, and the swing arm is used to transfer the wafer after being poked out to the crystal bonding table.
[0011] In one embodiment, the die-fixing assembly further comprises a first lens assembly, wherein the first lens assembly is disposed on the fixing seat and above the top die unit;
[0012] And / or, the crystal bonding module further includes a second lens assembly, and the second lens assembly is disposed on the fixing seat and above the crystal bonding table.
[0013] In one embodiment, the crystal bonding module also includes a first movable component extending along the X-axis direction and a second movable component extending along the Y-axis direction, the second movable component is arranged on the first movable component and can move along the Y-axis direction, the crystal bonding table is arranged on the second movable component and can move along the X-axis direction, the crystal bonding module is provided with two crystal bonding components, and the two crystal bonding components are arranged on the side of the first movable component away from the conveying module.
[0014] In one embodiment, the conveying module includes two support frames and two conveying components, the two support frames are arranged at intervals and extend along the X-axis direction, and the two conveying components are installed on the two support frames one by one, so that the substrate can move along the X-axis direction.
[0015] In one embodiment, the conveying module also includes a stop assembly and an in-position sensing assembly, the stop assembly includes a stop block arranged between the two support frames, the in-position sensing assembly is arranged between the two support frames and upstream of the stop assembly, and when the in-position sensing assembly senses the substrate, the stop block can move along the Z-axis direction.
[0016] In one embodiment, the die bonding machine further includes an identification module, which is disposed on the frame or the support frame, and is capable of identifying information of the substrate.
[0017] In one embodiment, the conveying module also includes a positioning assembly, which includes a second mounting bracket, a second driving member positioning baffle, and a positioning push plate. The second mounting bracket is arranged on one of the support frames, the second driving member is arranged on the second mounting bracket and drives the positioning push plate. The positioning baffle is arranged on the other support frame corresponding to the positioning push plate. The positioning push plate can move along the Y-axis direction and push the substrate to abut against the positioning baffle.
[0018] In one embodiment, the transfer module includes a third mounting bracket and a transfer assembly, the third mounting bracket is formed with a passage for the conveying module to pass through, and the transfer assembly is arranged above the third mounting bracket;
[0019] And / or, the transfer module is configured as a four-axis robot, a five-axis robot or a six-axis robot.
[0020] In one embodiment, the crystal bonding machine also includes a cache table arranged on the frame, and the conveying module, the cache table, the crystal bonding table and the crystal bonding assembly are arranged in sequence in the Y-axis direction, and the transfer module can also transfer the substrate on the conveying module to the cache table, and can transfer the substrate on the cache table to the crystal bonding table.
[0021] The technical solution of the utility model integrates the bonding module, the transmission module and the transfer module on the frame, thereby realizing the integration of the bonding and sorting functions, avoiding the problem of the need to purchase and install an independent sorting line in the traditional bonding production line, and reducing the production cost of the entire line. At the same time, the structure of the bonding machine is compact, saving production space. In addition, the substrate transfer and coordination of the bonding machine are more efficient, which improves the efficiency of the bonding production process. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0023] Figure 1 This is a schematic structural diagram of a die bonding machine according to an embodiment of the present invention;
[0024] Figure 2 for Figure 1 Top view of the die bonder;
[0025] Figure 3 for Figure 1 The structural diagram of the die-bonding module;
[0026] Figure 4 for Figure 1 A schematic diagram of the structure of the transmission module;
[0027] Figure 5 for Figure 4 A top view of a portion of a transmission module;
[0028] Figure 6 for Figure 4 A schematic diagram of the structure of the stop block assembly;
[0029] Figure 7 for Figure 4 Schematic diagram of the structure of the positioning component.
[0030] Description of Figure Numbers:
[0031]
[0032]
[0033] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if the meaning of "and / or" appearing in the full text is to include three parallel schemes, taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0037] Please refer to Figure 1 and Figure 2 The utility model proposes a crystal bonding machine 10 for fixing a wafer on a substrate. The crystal bonding machine 10 includes a frame 100, a conveying module 200, a crystal bonding module 400 and a transfer module 300. The conveying module 200 is arranged on the frame 100 and extends along the X-axis direction. The conveying module 200 is used to convey the substrate along the X-axis direction; the crystal bonding module 400 is arranged on the frame 100, and the crystal bonding module 400 includes a crystal bonding table 410 and a crystal bonding component 420. The crystal bonding table 410 is used to place the substrate for crystal bonding by the crystal bonding component 420; the transfer module 300 is arranged on the frame 100, and can transfer the substrate on the conveying module 200 to the crystal bonding table 410.
[0038] Specifically, the frame 100 is the main supporting structure of the crystal bonder 10, which is used to fix and support other modules. The function of the conveying module 200 is to convey the substrate along the X-axis direction so that the substrate can be circulated. The crystal bonder module 400 is used to fix the wafer on the substrate. The crystal bonder module 400 includes a crystal bonder table 410 and a crystal bonder assembly 420. The crystal bonder table 410 is an operating platform for placing the substrate for the crystal bonder assembly 420 to perform a crystal bond operation. The crystal bonder assembly 420 is the core component of the crystal bonder 10. It can perform a crystal bond operation as needed to firmly fix the wafer on the substrate. The transfer module 300 can transfer the substrate on the conveying module 200 to the crystal bonder table 410. The transfer module 300 can realize the transfer of the substrate through a robot, a mechanical arm, a conveyor belt, a motor, a cylinder or other means, so that the substrate on the conveying module 200 can be directly transferred to the crystal bonder table 410 without the need for additional manpower and time to coordinate the transfer of the substrate. The die bonder 10 integrates the conveying module 200 into the frame 100 , and does not need to be equipped with an additional sorting line body, so that the space occupied by the entire line is smaller and the cost of the entire line is lower.
[0039] The integration of the transmission module 200 into the frame 100 can reduce the docking process between the die bonding module 400 and the transmission module 200. In the traditional die bonding production line, the die bonding module 400 and the transmission module 200 need to be docked and debugged tediously, which increases the complexity and process difficulty of the production line. By directly integrating the transmission module 200 into the frame 100, the seamless connection between the die bonding module 400 and the transmission module 200 can be achieved, the docking process can be reduced, the production process can be simplified, and the production efficiency can be improved.
[0040] In addition, the integration of the transmission module 200 into the rack 100 makes it easier to debug the production line. Due to the close integration of the die bonding module 400 and the transmission module 200, the debugging personnel can more easily debug and optimize the entire line, and can debug directly on the rack 100 without frequently disassembling and installing components. This not only saves debugging time, but also reduces the impact of human factors on the quality of die bonding, and improves the accuracy and stability of debugging.
[0041] The feed end of the conveyor module 200 of each crystal bonder 10 can be adapted and connected to the discharge end of the conveyor module 200 of other crystal bonders 10, so that an efficient production line is formed between multiple conveyor modules 200 to realize multiple crystal bonders 10 working in series and improve production efficiency. By having multiple crystal bonders 10 working in series, flexible scheduling and resource optimization of the production line can be achieved. According to changes in production demand, certain equipment can be started or stopped according to actual conditions to achieve flexible scheduling of the production line and optimal use of resources.
[0042] The crystal bonder 10 of the utility model realizes the integration of crystal bonding and sorting functions, avoids the problem of needing to purchase and install an independent sorting line in the traditional crystal bonding production line, and reduces the production cost of the whole line. At the same time, the structure of the crystal bonder 10 is compact, saving production space. In addition, the substrate transfer and coordination of the crystal bonder 10 are more efficient, which improves the efficiency of the crystal bonding production process.
[0043] In one embodiment, the crystal bonding component 420 includes a crystal supply unit 421, a top crystal unit 422 and a bonding head assembly 423. The crystal supply unit 421 is used to supply wafers and can transfer the wafers to the top of the top crystal unit 422. The top crystal unit 422 is used to poke out the wafers. The bonding head assembly 423 includes a fixed seat 4231 provided on the frame 100 and a swing arm 4232 provided on the fixed seat 4231. The swing arm 4232 is used to transfer the wafers that have been poked out to the crystal bonding table 410.
[0044] Please refer to Figures 1 to 3 , the crystal supply unit 421 includes a wafer ring and a crystal supply moving module. The wafer ring is used to support the wafer, and the crystal supply moving module is used to drive the wafer ring to move so as to transfer the wafer on the wafer ring to the top of the top crystal unit 422. The crystal supply moving module can drive the wafer ring to move along the X-axis direction and the Y-axis direction, and can drive the wafer ring to move circumferentially. The top crystal unit 422 includes a top crystal moving module and a top crystal moving pin. The top crystal moving module is used to move the top crystal moving pin upward to poke the wafer away. The top crystal moving pin can be replaced as needed to adapt to wafers of different sizes and shapes. The top crystal moving module can drive the top crystal moving pin to move along the X-axis direction and the Y-axis direction. The bonding head assembly 423 includes a fixed seat 4231 provided on the frame 100 and a swing arm 4232 provided on the fixed seat 4231. The swing arm 4232 is used to transfer the wafer after being poked away to the crystal bonding table 410. The crystal bonding table 410 is used to support the wafer for subsequent crystal bonding operations. During use, the crystal supply unit 421 transfers the wafer to the top of the top crystal unit 422, the top crystal unit 422 pokes the wafer away, and then the swing arm 4232 transfers the wafer to the crystal bonding table 410. The entire process can be automated through control circuits and programs to improve production efficiency and quality.
[0045] In one embodiment, the crystal bonding assembly 420 also includes a first lens assembly 424, which is disposed on the fixing seat 4231 and above the top crystal unit 422; and / or, the crystal bonding module 400 also includes a second lens assembly 450, which is disposed on the fixing seat 4231 and above the crystal bonding platform 410.
[0046] Please refer to Figures 1 to 3The first lens assembly 424 is disposed on the fixing seat 4231 and is located above the top crystal unit 422. Before poking out of the wafer, the first lens assembly 424 detects and positions the wafer through an optical system. The first lens assembly 424 may include one or more lenses for focusing and magnifying a specific area on the wafer for precise positioning and operation.
[0047] In addition, the die bonding module 400 may further include a second lens assembly 450, which is disposed on the fixing seat 4231 and is located above the die bonding stage 410. The function of the second lens assembly 450 is to detect and confirm the wafer through an optical system after the wafer is transferred to the die bonding stage 410. It can be used to detect parameters such as the position, shape, and surface quality of the wafer to ensure the correct fixing and processing of the wafer.
[0048] By introducing the first lens assembly 424 and / or the second lens assembly 450, the die bonding module 400 can achieve more accurate and reliable wafer positioning and detection, which helps to improve production efficiency and product quality, and reduce production costs and resource waste caused by positioning deviation or wafer damage.
[0049] In one embodiment, the crystal bonding module 400 also includes a first movable component 430 extending along the X-axis direction and a second movable component 440 extending along the Y-axis direction. The second movable component 440 is arranged on the first movable component 430 and can move along the Y-axis direction. The crystal bonding table 410 is arranged on the second movable component 440 and can move along the X-axis direction. The crystal bonding module 400 is provided with two crystal bonding components 420, and the two crystal bonding components 420 are arranged on the side of the first movable component 430 away from the transmission module 200.
[0050] Please refer to Figure 1 and Figure 2 By setting the first moving assembly 430 and the second moving assembly 440, the crystal bonding table 410 can move in the X-axis direction and the Y-axis direction, so that the crystal bonding module 400 has more flexible and diverse movement capabilities. The crystal bonding module 400 is provided with two crystal bonding assemblies 420, which can realize simultaneous crystal bonding on both sides of the substrate, thereby improving the crystal bonding efficiency. The two crystal bonding assemblies 420 are located on the side of the first moving assembly 430 away from the transmission module 200. Such a layout can make better use of space, has a more compact structure, and is convenient for operators to observe and operate.
[0051] In one embodiment, the conveying module 200 includes two support frames 210 and two conveying components 220. The two support frames 210 are arranged at intervals and extend along the X-axis direction. The two conveying components 220 are installed on the two support frames 210 one by one, so that the substrate can move along the X-axis direction.
[0052] Please refer to Figures 1 to 4 The conveying module 200 is used to convey the substrate in the production line. The conveying module 200 is composed of two support frames 210 and two conveying assemblies 220. The two support frames 210 are arranged at intervals to provide sufficient space to accommodate the movement of the substrate during the conveying process, and also to facilitate the transfer module 300 to grab the substrate. The material selection of the support frame 210 should have sufficient strength and stability to ensure safety and reliability during the conveying process. The two support frames 210 extend along the X-axis direction, and the two conveying assemblies 220 are installed one by one and connected to the two support frames 210. The substrate is placed on the conveying assembly 220, and the transmission of the substrate is realized by the transmission of the conveying assembly 220, and the substrate is moved along the X-axis direction. The conveying assembly 220 can be configured in the form of a cylinder, a conveying belt, a conveying roller, etc.
[0053] In one embodiment, the conveying module 200 also includes a stop assembly 230 and an in-position sensing assembly 250. The stop assembly 230 includes a stop block 233 disposed between two support frames 210. The in-position sensing assembly 250 is disposed between the two support frames 210 and upstream of the stop assembly 230. When the in-position sensing assembly 250 senses the substrate, the stop block 233 can move along the Z-axis direction.
[0054] Please refer to Figures 1 to 6 The conveying module 200 further includes a stopper assembly 230 for realizing a stopper function during the conveying process of the substrate. The stopper assembly 230 includes a first mounting bracket 231, a first driving member 232 and a stopper block 233. The stopper block 233 can move along the Z-axis direction to realize a stopper function for the substrate.
[0055] The stopper 233 is disposed between the two support frames 210, and can stop the substrate by rising along the Z-axis direction, or can stop the substrate by falling along the Z-axis direction. In other embodiments, the stopper 233 can also be penetrated through the support frame 210, corresponding to the plane where the substrate moves, and can move along the Y-axis direction. The first mounting bracket 231 is disposed on the outside of the support frame 210, and can also be disposed on the inside of the support frame 210.
[0056] The first driving member 232 may be a suitable driving device such as a motor or a cylinder. The motor may control its rotation direction and speed through an electrical signal, thereby driving the stop block 233 to move along the Z-axis direction. The cylinder may control its extension and contraction through a pneumatic signal, thereby driving the stop block 233 to move along the Z-axis direction.
[0057] In one embodiment, the stopper assembly 230 is located on the forward path of the substrate in the initial state, and can stop the substrate from continuing to move forward. When the in-position sensing assembly 250 senses the substrate, the control system determines whether the substrate is to be processed at this station. If it is to be processed, the transfer module 300 transports the substrate to the crystal bonding table 410; if it is not to be processed, the stopper assembly 230 descends, and the substrate flows out to the next assembly line. After the substrate flows out, the stopper assembly 230 automatically rises again and continues to wait for the arrival of the next substrate.
[0058] In other embodiments, the in-position sensing component 250 can also be used to trigger a stop function when the substrate is in position. When the substrate approaches the in-position sensing component 250, the in-position sensing component 250 can sense the presence of the substrate and send a signal to the control terminal of the conveying module 200 or the die bonder 10. According to the received signal, the conveying module 200 drives the stop block 233 to move along the Z-axis direction to stop the further movement of the substrate, so that the substrate stays in the correct position to facilitate the transfer module 300 to grab and transfer the substrate. When the substrate needs to continue to be transferred, the stop block 233 can be moved away to allow the substrate to continue to move along the X-axis direction.
[0059] By introducing the in-position sensing component 250, the conveying module 200 can accurately detect the in-position status of the substrate and automatically trigger the stop function, thereby improving the efficiency and stability of the production line. The in-position sensing component 250 can be a photoelectric sensor, a pressure sensor or a proximity switch.
[0060] In one embodiment, the die bonding machine 10 further includes an identification module, which is disposed on the frame 100 or the support frame 210 , and is capable of identifying information of the substrate.
[0061] The crystal bonding machine 10 also includes an identification module (not shown in the figure) for identifying the information of the substrate. The identification module can be arranged on the frame 100 or on the support frame 210. A chip, barcode, QR code, etc. with the identity information of the substrate will be provided on each substrate. The identification module has advanced optical recognition, image processing, barcode scanning and other recognition technologies, and can accurately identify and analyze the substrate. By collecting images or other relevant data of the substrate, the identification module can identify the characteristics, model, serial number and other information of the substrate. The identification module can use a machine vision system, a barcode scanner or other applicable recognition equipment.
[0062] During the movement of the substrate, when the substrate passes through the identification module, when the in-place sensing component 250 senses the substrate, the identification module will immediately start and identify the substrate. By comparing with the preset substrate information, the identification module can verify the identity information of the substrate and determine whether the substrate meets the requirements of the current crystal bonding machine 10. If it meets the requirements, the transfer module 300 transports the substrate to the crystal bonding table 410; if it does not meet the requirements, the stopper component 230 descends and the substrate flows out to the next assembly line. After the substrate flows out, the stopper component 230 automatically rises again and continues to wait for the arrival of the next substrate. By introducing the identification module, the crystal bonding machine 10 has the function of sorting substrates, and can sort the substrates on the conveying module 200, and only grab the boards required by this station, which can also improve the production efficiency of the entire line.
[0063] In one embodiment, the conveying module 200 also includes a positioning assembly 240, which includes a second mounting bracket 241, a second driving member 242, a positioning baffle 243, and a positioning push plate 244. The second mounting bracket 241 is arranged on one of the support frames 210, the second driving member 242 is arranged on the second mounting bracket 241, and drives the connected positioning push plate 244. The positioning baffle 243 corresponds to the positioning push plate 244 and is arranged on another support frame 210. The positioning push plate 244 can move along the Y-axis direction and push the substrate to abut the positioning baffle 243.
[0064] Please refer to Figure 2 , Figure 4 and Figure 7 , the positioning assembly 240 is used to ensure the accurate positioning and alignment of the substrate. The positioning assembly 240 includes a second mounting bracket 241, a second driving member 242, a positioning baffle 243 and a positioning push plate 244. The second mounting bracket 241 is arranged on one of the support frames 210, and is used to support and fix the second driving member 242 and the positioning baffle 243. The second driving member 242 is arranged on the second mounting bracket 241 and connected to the positioning push plate 244. The second driving member 242 can adopt a suitable driving device such as a motor or a cylinder. The second driving member 242 can drive the positioning push plate 244 to move along the Y-axis direction. The positioning baffle 243 is arranged on another support frame 210 corresponding to the positioning push plate 244, and is used to provide a positioning reference for the substrate, and cooperate with the positioning push plate 244 to position the substrate. When the positioning push plate 244 moves along the Y-axis direction, it will push the substrate to abut against the positioning baffle 243 to ensure the accurate positioning and alignment of the substrate.
[0065] The position of the substrate in the X-axis direction is determined by the stopper assembly 230, and the position of the substrate in the Y-axis direction is determined by the positioning assembly 240, thereby achieving precise positioning of the substrate and ensuring the stability and accuracy of the substrate during the die bonding process.
[0066] In one embodiment, the transfer module 300 includes a third mounting bracket 310 and a transfer assembly 320 . The third mounting bracket 310 is formed with a passage for the conveying module 200 to pass through, and the transfer assembly 320 is disposed above the third mounting bracket 310 .
[0067] Please refer to Figure 1 The transfer assembly 320 is arranged above the third mounting bracket 310, that is, the transfer assembly 320 is arranged above the conveying module 200, thereby making full use of the space in the Z-axis direction of the conveying module 200, further saving the space of the entire line, and the structure of the die bonder 10 is more compact. The third mounting bracket 310 includes two side panels and a top panel connecting the two side panels, the two side panels are arranged on the outside of the conveying module 200, the top panel is arranged on the top of the conveying module 200, the two side panels and the top panel form an aisle, and the conveying module 200 passes through the aisle, so that the conveying module 200 is not affected by the transfer module 300, and the substrate can be continuously moved from the feeding end to the discharging end.
[0068] In one embodiment, the transfer module 300 is configured as a four-axis robot, a five-axis robot, or a six-axis robot.
[0069] Please refer to Figure 1 The transfer module 300 is configured as a multi-axis robot, which can realize complex transfer operations, so as to be able to move the substrate from the conveying module 200 to the crystal bonding table 410, and can be highly compatible with various production needs, making the production compatibility higher. In other embodiments, the transfer module 300 can also be a motor or a cylinder device.
[0070] In one embodiment, the crystal bonding machine 10 also includes a buffer table 500 arranged on the frame 100, and the conveying module 200, the buffer table 500, the crystal bonding table 410 and the crystal bonding assembly 420 are arranged in sequence in the Y-axis direction. The transfer module 300 can also transfer the substrate on the conveying module 200 to the buffer table 500, and can transfer the substrate on the buffer table 500 to the crystal bonding table 410.
[0071] Please refer to Figure 1 and Figure 2The crystal bonder 10 includes a buffer station 500 disposed on the frame 100, and the buffer station 500 is used to store the substrate to be processed. The transfer module 300 has the function of transferring the substrate on the transmission module 200 to the buffer station 500. When the crystal bonder 410 has processed the current substrate, the transfer module 300 can transfer the substrate on the buffer station 500 to the crystal bonder 410 for the next crystal bond operation. The setting of the buffer station 500 enables the crystal bonder 10 to have higher flexibility and efficiency when processing substrates. The substrate on the transmission module 200 can be transferred to the buffer station 500 for temporary storage through the transfer module 300. In this way, even if the crystal bonder 410 is processing other substrates, the substrate on the transmission module 200 can continue to be transferred to the buffer station 500, without causing interruption or delay in processing. At the same time, since the substrate can be transferred to the buffer station 500 to wait, the substrate does not need to stay on the transmission module 200 to wait. In this way, the transmission module 200 can continue to transport the substrate to the subsequent crystal bonder 10, thereby improving production efficiency.
[0072] Please refer to Figure 1 and Figure 2 , the conveying module 200, the buffer table 500, the crystal bonding table 410 and the crystal bonding assembly 420 of the crystal bonding machine 10 are arranged in sequence in the Y-axis direction, forming a compact and efficient structure. The buffer table 500 is arranged close to the feed section 201, which is convenient for transferring the substrate on the conveying module 200 to the buffer table 500 for storage. By arranging these components in sequence in the Y-axis direction, the space utilization of the crystal bonding machine 10 is maximized. After the substrate enters the conveying module 200 from the feed section 201, it can be processed sequentially through the buffer table 500, the crystal bonding table 410 and the crystal bonding assembly 420. This compact arrangement reduces the moving distance of the substrate during the conveying process and improves the overall processing efficiency.
[0073] In addition, the conveying module 200 has a feeding section 201 and a discharging section 202, and the buffering station 500 can be arranged near the feeding section 201, so that the transfer distance of the substrate during the conveying process is shorter. The substrate on the conveying module 200 can be directly transferred to the buffering station 500 near the feeding section 201, reducing the time and energy consumption during the transportation process. In another embodiment, the buffering station 500 can also be arranged near the discharging section 202.
[0074] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A die bonding machine, characterized in that: Used to fix the wafer on the substrate, the die bonding machine includes: frame; A conveying module, disposed on the frame and extending along the X-axis direction, the conveying module is used to convey the substrate along the X-axis direction; A crystal bonding module is provided on the frame, the crystal bonding module comprises a crystal bonding table and a crystal bonding assembly, the crystal bonding table is used to place the substrate for crystal bonding by the crystal bonding assembly; The transfer module is arranged on the frame and is capable of transferring the substrate on the conveying module to the crystal bonding table.
2. The die bonding machine according to claim 1, characterized in that: The crystal bonding component includes a crystal supply unit, a top crystal unit and a bonding head assembly. The crystal supply unit is used to supply the wafer and can transfer the wafer to the top of the top crystal unit. The top crystal unit is used to poke out the wafer. The bonding head assembly includes a fixed seat arranged on the frame and a swing arm arranged on the fixed seat. The swing arm is used to transfer the wafer after being poked out to the crystal bonding table.
3. The die bonding machine according to claim 2, characterized in that: The crystal fixing assembly further includes a first lens assembly, which is disposed on the fixing seat and above the top crystal unit; And / or, the crystal bonding module further includes a second lens assembly, and the second lens assembly is disposed on the fixing seat and above the crystal bonding table.
4. The die bonding machine according to claim 2, characterized in that: The crystal bonding module also includes a first movable component extending along the X-axis direction and a second movable component extending along the Y-axis direction, the second movable component is arranged on the first movable component and can move along the Y-axis direction, the crystal bonding table is arranged on the second movable component and can move along the X-axis direction, the crystal bonding module is provided with two crystal bonding components, and the two crystal bonding components are arranged on a side of the first movable component away from the conveying module.
5. The die bonding machine according to claim 1, characterized in that: The conveying module includes two support frames and two conveying components. The two support frames are arranged at intervals and extend along the X-axis direction. The two conveying components are installed on the two support frames in a one-to-one correspondence, so that the substrate can move along the X-axis direction.
6. The die bonding machine according to claim 5, characterized in that: The conveying module also includes a stop assembly and an in-position sensing assembly. The stop assembly includes a stop block arranged between the two support frames. The in-position sensing assembly is arranged between the two support frames and upstream of the stop assembly. When the in-position sensing assembly senses the substrate, the stop block can move along the Z-axis direction.
7. The die bonding machine according to claim 6, characterized in that: The die bonding machine further includes an identification module, which is disposed on the frame or the support frame, and can identify information of the substrate.
8. The die bonding machine according to claim 6, characterized in that: The conveying module also includes a positioning assembly, which includes a second mounting bracket, a second driving member positioning baffle, and a positioning push plate. The second mounting bracket is arranged on one of the support frames, the second driving member is arranged on the second mounting bracket and drives the positioning push plate. The positioning baffle is arranged on the other support frame corresponding to the positioning push plate. The positioning push plate can move along the Y-axis direction and push the substrate to abut against the positioning baffle.
9. The die bonding machine according to claim 1, characterized in that: The transfer module comprises a third mounting bracket and a transfer assembly, the third mounting bracket is formed with a passage for the conveying module to pass through, and the transfer assembly is arranged above the third mounting bracket; And / or, the transfer module is configured as a four-axis robot, a five-axis robot or a six-axis robot.
10. The die bonding machine according to claim 1, characterized in that: The crystal bonding machine also includes a buffer table arranged on the frame, and the conveying module, the buffer table, the crystal bonding table and the crystal bonding assembly are arranged in sequence in the Y-axis direction. The transfer module can also transfer the substrate on the conveying module to the buffer table, and can transfer the substrate on the buffer table to the crystal bonding table.