Packaging steel mesh for implanting microspheres on IC (integrated circuit) carrier plate

Abstract

The utility model discloses an IC carrier plate implanted microsphere packaging steel mesh which comprises a supporting frame, vertical sliding grooves are formed in the left side and the right side of the top of the supporting frame, transverse sliding grooves are formed in the front face and the back face of the top of the supporting frame, a packaging mesh is arranged in an inner cavity of the supporting frame, a plurality of vertical sliding blocks are arranged in inner cavities of the vertical sliding grooves, supporting rods are arranged at the tops of the vertical sliding blocks, and the supporting rods are connected with the supporting frame. A fixing groove is formed in the left side of the supporting rod, a fixing piece is arranged in an inner cavity of the fixing groove, and a transverse sliding block is arranged in an inner cavity of the transverse sliding groove. Before packaging, through holes corresponding to the clamping holes can be formed in the IC carrier plate in advance, in the packaging process, the clamping rods can penetrate through the through holes and are clamped into the clamping holes, the IC carrier plate and the packaging net can be fixed through the fixing pieces, meanwhile, the supporting rods can be driven by the vertical sliding blocks to move front and back according to actual needs, the multiple fixing pieces are moved to proper fixing point positions, and therefore the IC carrier plate and the packaging net can be fixed. Compared with a common screw and nut fixing mode, the structure is more convenient to install and more convenient to disassemble during later maintenance.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to an IC carrier board implanted microsphere packaging steel mesh. Background Art

[0002] Semiconductor packaging microspheres usually refer to microscopic spheres used to connect between chips and substrates. They are key components for chip interconnection. Microsphere implantation technology is a method for manufacturing high-density interconnection packages, which allows a large number of small and reliable circuit connections to be established between chips and printed circuit boards or other types of substrates. IC substrates refer to a key dedicated base material used for IC card module packaging. They mainly protect the chip and serve as an interface between the integrated circuit chip and the outside world. They can be used as a carrier for microsphere implantation.

[0003] After the IC substrate is implanted with microspheres, it needs to be covered with a steel mesh to encapsulate it. After encapsulation, the steel mesh and the IC substrate are generally fixed by screws, nuts and other structures. The installation of screws and nuts is cumbersome due to the large number of screws and nuts used. After long-term use, the screws are prone to rust or stripping, which makes it very inconvenient to disassemble during later maintenance. For this reason, we provide a steel mesh for IC substrate implantation and microsphere encapsulation. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the utility model provides an IC substrate microsphere encapsulation steel mesh, which solves the problem of inconvenience in installation and disassembly caused by fixing the steel mesh and the IC substrate with structures such as screws and nuts during current encapsulation.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an IC carrier microsphere encapsulation steel mesh, comprising a support frame, vertical slide grooves are opened on the left and right sides of the top of the support frame, horizontal slide grooves are opened on the front and back sides of the top of the support frame, the inner cavity of the support frame is provided with a packaging mesh, the inner cavity of the vertical slide groove is provided with a plurality of vertical sliders, the top of the vertical slider is provided with a support rod, a fixed groove is opened on the left side of the support rod, the inner cavity of the fixed groove is provided with a fixing piece, the inner cavity of the horizontal slide groove is provided with a horizontal slider, and a brush is connected between the two horizontal sliders.

[0008] Preferably, vertical card slots are provided on both left and right sides of the inner wall of the vertical slide slot, and vertical card strips are provided on both left and right sides of the vertical slide block, and the vertical card strips are slidably connected to the inner cavity of the vertical card slot.

[0009] Preferably, transverse slots are provided on the front and back sides of the inner wall of the transverse slot, and transverse clamping strips are provided on the front and back sides of the transverse sliding block, and the transverse clamping strips are slidably clamped in the inner cavity of the transverse slot.

[0010] Preferably, the fixing member includes a sliding rod, the top and bottom of the sliding rod are respectively fixedly connected to the top and bottom of the inner wall of the fixing groove, the outer ring of the sliding rod is provided with a support plate and a spring, the spring is located between the support plate and the bottom of the inner wall of the fixing groove, and a clamping rod is provided on the top of the support plate.

[0011] Preferably, the brushing member comprises a fixed rod, the front and back sides of the fixed rod are fixedly connected to the transverse slider, the outer ring of the fixed rod is rotatably sleeved with a roller, and the outer ring of the roller is evenly provided with a plurality of bristles.

[0012] Preferably, a plurality of clamping holes are provided at equal distances on the left and right sides of the bottom of the support frame, and the top of the clamping rod is clamped into the inner cavity of the corresponding clamping hole.

[0013] (III) Beneficial effects

[0014] The utility model provides an IC substrate microsphere packaging steel mesh, which has the following beneficial effects:

[0015] 1. Before packaging, through holes corresponding to the card holes can be pre-opened on the IC carrier. During packaging, the card rod can be passed through the through hole and inserted into the card hole. The IC carrier and the packaging net can be fixed by the fixing parts. At the same time, according to actual needs, the support rod can be driven to move back and forth through the vertical slider to move multiple fixing parts to suitable fixing points. Compared with the general screw and nut fixing method, this structure is more convenient to install and more convenient to disassemble during later maintenance.

[0016] 2. When in use, the fixed rod can be driven to move left and right through the horizontal slider, and the roller can be driven to roll left and right on the packaging net. During this process, the bristles can wipe off the dust on the surface of the packaging net to keep its surface clean and prevent dust from contaminating the IC carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the bottom structure of the support frame of the utility model;

[0019] Figure 3 It is a structural schematic diagram of the support rod and the fixing member of the utility model;

[0020] Figure 4 For this utility model Figure 1 A in the enlarged view;

[0021] Figure 5 For this utility model Figure 1 Enlarged view of point B in .

[0022] In the figure: 1. support frame; 11. vertical slide groove; 12. horizontal slide groove; 13. vertical clamping slot; 14. horizontal clamping slot; 15. clamping hole; 2. packaging net; 3. vertical slider; 31. vertical clamping strip; 4. support rod; 41. fixed groove; 5. fixing part; 51. slide rod; 52. support plate; 53. spring; 54. clamping rod; 6. horizontal slider; 61. horizontal clamping strip; 7. brush wiping part; 71. fixed rod; 72. roller; 73. bristles. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] like Figure 1-4 As shown, the utility model provides a technical solution: an IC carrier board microsphere encapsulation steel mesh, comprising a support frame 1, the inner cavity of the support frame 1 is provided with an encapsulation mesh 2, when encapsulating, the encapsulation mesh 2 can be covered on the IC carrier board implanted with microspheres, and the encapsulation mesh 2 can encapsulate the IC carrier board.

[0025] Among them, vertical slide grooves 11 are opened on the left and right sides of the top of the supporting frame 1, horizontal slide grooves 12 are opened on the front and back sides of the top of the supporting frame 1, vertical clamping grooves 13 are opened on the left and right sides of the inner wall of the vertical slide groove 11, and horizontal clamping grooves 14 are opened on the front and back sides of the inner wall of the horizontal slide groove 12. A plurality of clamping holes 15 are opened on the left and right sides of the bottom of the supporting frame 1 at equal distances.

[0026] Specifically, the inner cavity of the vertical slide groove 11 is provided with multiple vertical sliders 3, and the vertical sliders 3 can slide back and forth in the vertical slide groove 11. Vertical clamping strips 31 are provided on the left and right sides of the vertical sliders 3. The vertical clamping strips 31 are slidably clamped in the inner cavity of the vertical clamping groove 13. The vertical clamping strips 31 can slide back and forth in the vertical clamping groove 13 and can limit the vertical slider 3 in the vertical slide groove 11.

[0027] Specifically, a support rod 4 is disposed on the top of the vertical slider 3 , and a fixing groove 41 is provided on the left side of the support rod 4 . When the vertical slider 3 slides forward and backward, the support rod 4 can be driven to move forward and backward.

[0028] Furthermore, the inner cavity of the fixing groove 41 is provided with a fixing member 5, and the fixing member 5 includes a slide bar 51, and the top and bottom of the slide bar 51 are fixedly connected to the top and bottom of the inner wall of the fixing groove 41 respectively. The outer ring of the slide bar 51 is provided with a support plate 52 and a spring 53, and the spring 53 is located between the support plate 52 and the bottom of the inner wall of the fixing groove 41. The top of the support plate 52 is provided with a clamping rod 54, and the top of the clamping rod 54 is clamped into the inner cavity of the corresponding clamping hole 15. Before packaging, a through hole corresponding to the clamping hole 15 can be pre-opened on the IC carrier board. When packaging, the support plate 52 can be pushed downward to pull the clamping rod 54 out of the clamping hole. Hole 15, at this time, the spring 53 is elastically deformed due to the squeezing of the support plate 52, and then the packaging net 2 can be covered on the IC carrier, and the support plate 52 is loosened at the same time. At this time, the spring 53 returns to its original state and drives the clamping rod 54 to move upward. The clamping rod 54 can pass through the through hole and be clamped into the clamping hole 15 to fix the IC carrier and the packaging net 2. At the same time, according to actual needs, the support rod 4 can be moved back and forth to move the multiple fixing members 5 to a suitable fixing position. Compared with the general screw and nut fixing method, this structure is more convenient to install and more convenient to disassemble during later maintenance.

[0029] Specifically, the inner cavity of the transverse slide groove 12 is provided with a transverse slider 6, which can slide left and right in the transverse slide groove 12. The front and back sides of the transverse slider 6 are provided with transverse clamping strips 61, which are slidably clamped in the inner cavity of the transverse clamping slot 14. The transverse clamping strip 61 can slide left and right in the transverse clamping slot 14 and can limit the transverse slider 6 in the transverse slide groove 12.

[0030] Furthermore, a brush wiping member 7 is connected between the two transverse sliders 6, and the brush wiping member 7 includes a fixed rod 71. The front and back sides of the fixed rod 71 are fixedly connected to the transverse slider 6. A roller 72 is rotatably sleeved on the outer ring of the fixed rod 71, and a plurality of bristles 73 are evenly arranged on the outer ring of the roller 72. When in use, the fixed rod 71 can be driven to move left and right by the transverse slider 6, and the roller 72 can be driven to roll left and right on the packaging net 2. During this process, the bristles 73 can wipe off the dust on the surface of the packaging net 2 to keep its surface clean, so as to prevent dust from contaminating the IC carrier.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0032] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An IC substrate microsphere encapsulation steel mesh, comprising a support frame (1), characterized in that: The left and right sides of the top of the support frame (1) are provided with vertical slide grooves (11), the front and back sides of the top of the support frame (1) are provided with transverse slide grooves (12), the inner cavity of the support frame (1) is provided with a packaging net (2), the inner cavity of the vertical slide groove (11) is provided with a plurality of vertical sliders (3), the top of the vertical slider (3) is provided with a support rod (4), the left side of the support rod (4) is provided with a fixing groove (41), the inner cavity of the fixing groove (41) is provided with a fixing member (5), the inner cavity of the transverse slide groove (12) is provided with a transverse slider (6), and a brushing member (7) is connected between the two transverse sliders (6).

2. The IC substrate microsphere encapsulation steel mesh according to claim 1, characterized in that: Vertical clamping grooves (13) are provided on both the left and right sides of the inner wall of the vertical sliding groove (11), and vertical clamping strips (31) are provided on both the left and right sides of the vertical sliding block (3), and the vertical clamping strips (31) are slidably clamped in the inner cavity of the vertical clamping groove (13).

3. The IC substrate microsphere encapsulation steel mesh according to claim 1, characterized in that: The front and back sides of the inner wall of the transverse sliding groove (12) are both provided with transverse clamping grooves (14), and the front and back sides of the transverse sliding block (6) are both provided with transverse clamping strips (61), and the transverse clamping strips (61) are slidably clamped in the inner cavity of the transverse clamping groove (14).

4. The IC substrate microsphere encapsulation steel mesh according to claim 1, characterized in that: The fixing member (5) comprises a sliding rod (51), the top and bottom of the sliding rod (51) are respectively fixedly connected to the top and bottom of the inner wall of the fixing groove (41), the outer ring of the sliding rod (51) is provided with a support plate (52) and a spring (53), the spring (53) is located between the support plate (52) and the bottom of the inner wall of the fixing groove (41), and the top of the support plate (52) is provided with a clamping rod (54).

5. The IC substrate microsphere encapsulation steel mesh according to claim 1, characterized in that: The brushing member (7) comprises a fixed rod (71), the front and back sides of which are fixedly connected to the transverse slider (6), a roller (72) is rotatably sleeved on the outer ring of the fixed rod (71), and a plurality of bristles (73) are evenly arranged on the outer ring of the roller (72).

6. The IC substrate microsphere encapsulation steel mesh according to claim 4, characterized in that: A plurality of clamping holes (15) are provided at equal distances on the left and right sides of the bottom of the support frame (1), and the top of the clamping rod (54) is clamped into the inner cavity of the corresponding clamping hole (15).

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