Silicon wafer transfer equipment

Abstract

The utility model is suitable for the technical field of silicon wafer circulation processing, and provides silicon wafer circulation equipment, in the silicon wafer circulation equipment, a feeding end and a discharging end are arranged at two opposite ends of a rack, a feeding conveying assembly and a discharging conveying assembly are sequentially arranged in the direction from the feeding end to the discharging end, and in the process of conveying silicon wafers, the feeding end and the discharging end of the silicon wafer circulation equipment are separated from each other. The rotating assembly is used for sucking the silicon wafers, rotating the silicon wafers by 180 degrees in a plane parallel to the silicon wafers and then placing the silicon wafers on the feeding conveying assembly or the discharging conveying assembly. Thus, in the circulation process, the rotating assembly can perform 180-degree rotating operation on the silicon wafers, the wafer inserting direction of the silicon wafers in the feeding basket can be kept consistent with the wafer inserting direction of the silicon wafers in the discharging basket, and the wafer inserting direction of the silicon wafers in the discharging basket can be kept consistent with the wafer inserting direction of the silicon wafers in the discharging basket. And the discharging flower basket can be directly conveyed to the next process equipment for processing without turning the direction of the silicon wafer, so that the process procedures are saved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer circulation processing, in particular to a silicon wafer circulation device. Background Art

[0002] In the field of solar cell technology, in order to detect the quality of silicon wafers or perform process processing such as welding on silicon wafers, it is usually necessary to circulate the silicon wafers through equipment for inspection, coating or welding. During the circulation process, silicon wafers usually come out of the feed basket, and after inspection or process processing, they are transported to the outlet basket.

[0003] In the related art, the inlet and outlet of silicon wafers are usually set at opposite ends of the whole equipment. During the circulation of silicon wafers, silicon wafers enter from one side and flow out directly from the other side after detection or processing (i.e., direct-out circulation). Such circulation mode will cause the insertion direction of silicon wafers relative to the flower basket at the inlet to be different from the insertion direction of silicon wafers relative to the flower basket at the outlet. That is, in the inlet flower basket, one end of the silicon wafer faces the outlet of the flower basket, and in the outlet flower basket, the same end of the silicon wafer faces away from the outlet of the flower basket. In such a case, when performing subsequent processing, the direction needs to be reversed before entering the equipment for use, resulting in a more complicated process. Utility Model Content

[0004] The utility model provides a silicon wafer circulation device, aiming to solve the technical problem in the prior art equipment that the insertion direction of the silicon wafer relative to the flower basket at the feed inlet is different from the insertion direction of the silicon wafer relative to the flower basket at the discharge outlet, which leads to a technical problem that the subsequent process is more complicated.

[0005] The utility model is implemented in this way. The silicon wafer transfer equipment of the utility model embodiment includes:

[0006] A rack, wherein the rack has a feed end and a discharge end, the feed end and the discharge end are located at opposite ends of the rack, the feed end is used to place a feed basket, and the discharge end is used to place a discharge basket, and both the feed basket and the discharge basket are used to store silicon wafers;

[0007] A feed conveying assembly, an installation station, and a discharge conveying assembly are sequentially arranged on the frame along the direction from the feed end to the discharge end, the installation station is used to install a functional device, and the feed conveying assembly is used to convey the silicon wafers in the feed basket so that the silicon wafers flow through the functional device;

[0008] A rotating assembly is mounted on the frame, and is used to absorb silicon wafers during the conveying process of silicon wafers, and rotate the silicon wafers 180° in a plane parallel to the silicon wafers and place them on the feed conveying assembly or the discharge conveying assembly, and the discharge conveying assembly is used to convey the silicon wafers rotated by the rotating assembly and insert them into the discharge basket.

[0009] Furthermore, the rotating assembly is located above the feed conveying assembly and is used to absorb the silicon wafer on the feed conveying assembly, rotate the silicon wafer 180° in a plane parallel to the silicon wafer, and then place it back on the feed conveying assembly; or

[0010] The rotating assembly is located above the discharge conveying assembly and is used to absorb the silicon wafer on the discharge conveying assembly, rotate the silicon wafer 180° in a plane parallel to the silicon wafer, and then place it back on the discharge conveying assembly; or

[0011] The rotating assembly is located between the installation station and the discharge conveying assembly. The rotating assembly is used to absorb the silicon wafers flowing out of the functional device, rotate the silicon wafers 180° in a plane parallel to the silicon wafers, and then transfer them to the discharge conveying assembly.

[0012] Furthermore, the silicon wafer circulation equipment also includes a feed lifting mechanism located at the feed end and a discharge lifting mechanism located at the discharge end, the feed lifting mechanism is used to drive the feed basket to move up and down, and the discharge lifting mechanism is used to drive the discharge basket to move up and down.

[0013] Furthermore, the feed conveying assembly includes a material taking mechanism and a feed conveying mechanism;

[0014] The material taking mechanism is located between the feeding conveying mechanism and the feeding end, and the material taking mechanism is used to take out the silicon wafers in the feeding basket and convey them to the feeding conveying mechanism;

[0015] The feed conveying mechanism is located between the material taking mechanism and the material discharging conveying assembly, and the feed conveying mechanism is used to convey the silicon wafers to the functional device and allow the silicon wafers to flow through the functional device.

[0016] Furthermore, the material taking mechanism includes a first seat body, a material taking plate, a material taking drive mechanism, a first drive motor, a first wheel train set and a material taking conveyor belt;

[0017] The first seat body is mounted on the frame, the material taking plate is slidably connected to the first seat body, the first wheel train set is arranged on the first seat body, the material taking plate is provided with a first pulley, and the material taking conveying belt is wound around the first wheel train set and the first pulley;

[0018] When picking up materials, the first driving motor is used to drive the picking up conveyor belt to move through the first wheel system group, and the picking up driving mechanism is used to drive the picking up plate to slide so that the picking up plate extends into the feeding basket, and the picking up plate is used to synchronously drive the picking up conveyor belt through the first pulley to extend into the feeding basket, thereby conveying the silicon wafers out of the feeding basket through the picking up conveyor belt and conveying the silicon wafers to the feeding conveying mechanism.

[0019] Furthermore, the silicon wafer circulation equipment further comprises a feed deviation correction mechanism, and the feed deviation correction mechanism is located between the installation station and the feed end;

[0020] The feed deviation correction mechanism is used to guide the silicon wafers during the process of the silicon wafers being transported by the material taking mechanism and / or the feed conveying mechanism.

[0021] Furthermore, the feed deviation correction mechanism includes a first mounting seat, two first roller assemblies spaced apart on both sides of the first mounting seat, a first motor and a first synchronous drive mechanism;

[0022] The first motor is mounted on the first mounting seat, the first synchronous drive mechanism is mounted on the first mounting seat and connected to the first motor, the two first roller assemblies are connected to the first synchronous drive mechanism, the first motor can drive the two first roller assemblies to move closer to or away from each other through the first synchronous drive mechanism, and the material picking mechanism and / or the feed conveying mechanism can drive the silicon wafer to flow through the area between the two first roller assemblies.

[0023] Furthermore, the first synchronous driving mechanism includes a first driving wheel, a first driven wheel and a first synchronous belt;

[0024] The first driving wheel and the first driven wheel are respectively arranged on two sides of the first mounting seat, and the first synchronous belt is wound around the first driving wheel and the first driven wheel;

[0025] The first motor is connected to the first driving wheel, one of the two first roller assemblies is fixedly connected to a portion of the first synchronous belt located on one side of the first driving wheel and the first driven wheel, and the other is fixedly connected to a portion of the first synchronous belt located on the other side of the first driving wheel and the first driven wheel, and the first motor is used to drive the first driving wheel to rotate to drive the first synchronous belt to move, thereby driving the two first roller assemblies to move closer to or away from each other.

[0026] Furthermore, the silicon wafer circulation equipment also includes a feed temporary storage mechanism, which is located between the installation station and the feed end, and is used to store the silicon wafers on the material picking mechanism, and the material picking mechanism can transport the silicon wafers on the feed temporary storage mechanism to the feed conveying mechanism.

[0027] Furthermore, the feed temporary storage mechanism includes a feed buffer device and a first lifting mechanism, the first lifting mechanism is installed on the frame, the first lifting mechanism is used to drive the feed buffer device to move up and down, the feed buffer device has a plurality of feed temporary storage units along the up and down directions, and each of the feed temporary storage units corresponds to storing a silicon wafer.

[0028] Furthermore, the discharging conveying assembly includes a discharging mechanism and a discharging conveying mechanism;

[0029] The discharge mechanism is located between the discharge conveying mechanism and the discharge end, the discharge conveying mechanism is located between the installation station and the discharge mechanism, the discharge conveying mechanism is used to transfer the silicon wafers flowing out of the functional device to the discharge mechanism, and the discharge mechanism is used to insert the silicon wafers into the discharge basket.

[0030] Furthermore, the rotating assembly is located above the discharge conveying mechanism, and is used to absorb the silicon wafer on the discharge conveying mechanism and rotate the silicon wafer 180° in a plane parallel to the silicon wafer and then place it back on the discharge conveying mechanism.

[0031] Furthermore, the material discharge mechanism includes a second seat body, a material discharge plate, a material discharge drive mechanism, a second drive motor, a second wheel train set and a material discharge conveyor belt;

[0032] The second seat body is mounted on the frame, the unloading plate is slidably connected to the second seat body, the second wheel train set is arranged on the second seat body, the unloading plate is provided with a second pulley, and the unloading conveying belt is wound around the second wheel train set and the second pulley;

[0033] During unloading, the second driving motor is used to drive the unloading conveyor belt to move through the second wheel system, and the unloading driving mechanism is used to drive the unloading plate to slide so that the unloading plate extends into the unloading basket, and the unloading plate is used to synchronously drive the unloading conveyor belt through the second pulley to extend into the unloading basket, thereby inserting the silicon wafer into the unloading basket through the unloading conveyor belt.

[0034] Furthermore, the silicon wafer circulation equipment further comprises a discharge deviation correction mechanism, and the discharge deviation correction mechanism is located between the installation station and the discharge end;

[0035] The discharging deviation correcting mechanism is used to guide the silicon wafers during the process of the discharging conveying mechanism and / or the unloading mechanism conveying the silicon wafers.

[0036] Furthermore, the material discharging deviation correction mechanism includes a second mounting seat, two second roller assemblies spaced apart on both sides of the second mounting seat, a second motor and a second synchronous driving mechanism;

[0037] The second motor is mounted on the second mounting seat, the second synchronous drive mechanism is mounted on the second mounting seat and connected to the second motor, the two second roller assemblies are connected to the second synchronous drive mechanism, the second motor can drive the two second roller assemblies to approach each other or move away from each other through the second synchronous drive mechanism, and the discharge mechanism and / or the discharge conveying mechanism can drive the silicon wafer to flow through the area between the two second roller assemblies.

[0038] Furthermore, the second synchronous driving mechanism includes a second driving wheel, a second driven wheel and a second synchronous belt;

[0039] The second driving wheel and the second driven wheel are respectively arranged on two sides of the second mounting seat, and the second synchronous belt is wound around the second driving wheel and the second driven wheel;

[0040] The second motor is connected to the second driving wheel, one of the two second roller assemblies is fixedly connected to a portion of the second synchronous belt located on one side of the second driving wheel and the second driven wheel, and the other is fixedly connected to a portion of the second synchronous belt located on the other side of the second driving wheel and the second driven wheel, and the second motor is used to drive the second driving wheel to rotate to drive the second synchronous belt to move, thereby driving the two second roller assemblies to move closer to or away from each other.

[0041] Furthermore, the silicon wafer circulation equipment also includes a discharge temporary storage mechanism, which is located between the installation station and the discharge end, and is used to store the silicon wafers taken off the discharge conveying mechanism by the discharge mechanism, and the discharge mechanism can insert the silicon wafers on the discharge temporary storage mechanism into the discharge basket.

[0042] Furthermore, the material discharging temporary storage mechanism includes a material discharging buffer device and a second lifting mechanism, the second lifting mechanism is installed on the frame, the second lifting mechanism is used to drive the material discharging buffer device to move up and down, and the material discharging buffer device has a plurality of material discharging temporary storage units along the up and down directions, and each of the material discharging temporary storage units corresponds to storing a silicon wafer.

[0043] Furthermore, the rotating assembly comprises:

[0044] A mounting seat, the mounting seat is mounted on the frame;

[0045] A suction cup component, which is rotatably mounted on the mounting seat and is used to absorb the silicon wafer;

[0046] A rotating motor is mounted on the mounting seat, the rotating motor is connected to the suction cup component and is used to drive the suction cup component to rotate relative to the mounting seat in a plane parallel to the silicon wafer.

[0047] Furthermore, the rotating assembly comprises:

[0048] Fixed seat;

[0049] A rotating arm rotatably connected to the fixing seat;

[0050] A first suction cup component and a second suction cup component installed at two ends of the rotating arm, wherein the first suction cup component and the second suction cup component are both used for sucking silicon wafers; and

[0051] A rotating motor is mounted on the fixing base, the rotating motor is located in the middle of the rotating arm and is connected to the rotating arm, the rotating motor is used to drive the rotating arm to rotate relative to the fixing base in a plane parallel to the silicon wafer to drive the first suction cup component and the second suction cup component to rotate in a plane parallel to the silicon wafer.

[0052] In the silicon wafer circulation equipment in the embodiment of the utility model, the feed end and the discharge end are located at opposite ends of the frame, and the feed conveying assembly, the installation station, and the discharge conveying assembly are arranged in sequence along the direction from the feed end to the discharge end. The conveying directions of the feed conveying assembly and the discharge conveying assembly are consistent. When feeding, the feed conveying assembly conveys the silicon wafer to the functional device, and then conveys and inserts it into the discharge basket through the discharge conveying assembly. During the conveying process of the silicon wafer, the rotating assembly is used to absorb the silicon wafer, and rotate the silicon wafer 180° in a plane parallel to the silicon wafer and place it on the feed conveying assembly or the discharge conveying assembly. In this way, in the silicon wafer circulation equipment, the silicon wafer circulates in a straight-out manner during the circulation process. During the circulation process, the rotating assembly can absorb the silicon wafer and rotate it 180° and place it on the feed conveying assembly or the discharge conveying assembly, and then insert it into the discharge basket through the discharge conveying assembly. That is, one end of the silicon wafer in the feed basket close to the outlet of the feed basket is the same end as the end of the silicon wafer in the discharge basket close to the outlet of the discharge basket. In this way, when performing subsequent processes, the discharge basket can be directly transported to the next process equipment for processing without turning the direction of the silicon wafer, saving process steps.

[0053] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a structural schematic diagram of a silicon wafer circulation device provided by an embodiment of the utility model;

[0055] Figure 2 It is a schematic diagram of the component orientation and circulation process of the silicon wafer circulation equipment provided by the embodiment of the utility model;

[0056] Figure 3 It is a structural schematic diagram of the feeding basket lifting mechanism provided by an embodiment of the utility model;

[0057] Figure 4 It is a structural schematic diagram of the feeding flower basket conveying mechanism provided by an embodiment of the utility model;

[0058] Figure 5 It is another component orientation and flow process diagram of the silicon wafer flow device provided by the embodiment of the utility model;

[0059] Figure 6 It is a structural schematic diagram of a material taking mechanism and a material discharging mechanism provided by an embodiment of the utility model;

[0060] Figure 7 It is a structural schematic diagram of a feed deviation correction mechanism and a discharge deviation correction mechanism provided by an embodiment of the utility model;

[0061] Figure 8 It is a structural schematic diagram of a temporary storage mechanism for feeding materials and a temporary storage mechanism for discharging materials provided in an embodiment of the utility model;

[0062] Fig. 9 yes Figure 1 A schematic diagram of the structure of the rotating assembly of the silicon wafer transfer device;

[0063] Fig.10 It is another structural schematic diagram of the silicon wafer circulation equipment provided by the embodiment of the utility model;

[0064] Fig.11 yes Fig.10 Schematic diagram of the structure of the rotating component of the silicon wafer transfer equipment.

[0065] Description of main component symbols:

[0066] Wafer circulation equipment 100, frame 10, feed end 11, discharge end 12, installation station 13, feed conveying assembly 20, pick-up mechanism 21, feed conveying mechanism 22, rotating assembly 30, discharge conveying assembly 40, discharge mechanism 41, discharge conveying mechanism 42, feed lifting mechanism 50, discharge lifting mechanism 60, feed deviation correction mechanism 70, discharge deviation correction mechanism 80, feed temporary storage mechanism 90, discharge temporary storage mechanism 110;

[0067] Functional device 200. DETAILED DESCRIPTION

[0068] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model. In addition, it should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.

[0069] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "top", "bottom", "lateral", "longitudinal", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0070] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0071] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0072] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0073] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the utility model. In addition, the utility model may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the utility model provides examples of various specific processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use scenarios of other materials.

[0074] Embodiment 1

[0075] See also Figure 1 and Figure 2 The silicon wafer transfer device 100 in the embodiment of the utility model may include a frame 10 , a feed conveying assembly 20 , a rotating assembly 30 and a discharge conveying assembly 40 .

[0076] like Figure 1 As shown, the rack 10 has a feed end 11 and a discharge end 12, which are respectively located at opposite ends of the rack 10. The feed end 11 is used to place a feed basket 300, and the discharge end 12 is used to place a discharge basket (not shown). Both the feed basket 300 and the discharge basket are used to store silicon wafers.

[0077] At the same time, the rack 10 also has an installation station 13 for installing the functional device 200 , that is, the silicon wafer transfer equipment 100 can achieve different functions by installing different functional devices 200 .

[0078] For example, in some embodiments, the functional device 200 may be a photoluminescence (PL) detection device, which can perform PL detection on a silicon wafer so as to detect the properties of the silicon wafer such as cracks and impurities. For another example, in some embodiments, the functional device 200 may also be a welding device, which can perform welding on a silicon wafer. For another example, in other embodiments, the functional device 200 may also be an electroluminescence (EL), a coating device, a drying device, and other components, which are not specifically limited here.

[0079] The "silicon wafer" referred to in the present invention can be understood as a bare silicon wafer, or as a silicon wafer processed by one or more processes (for example, diffusion, coating, electrode printing, etc., which are not specifically limited here).

[0080] See also Figure 1 In the present invention, the feed conveying assembly 20, the installation station 13 and the discharge conveying assembly 40 are sequentially arranged on the frame 10 along the direction from the feed end 11 to the discharge end 12. The feed conveying assembly 20 is used to convey the silicon wafers in the feed basket 300 so that the silicon wafers flow through the functional device 200. That is to say, taking the functional device 200 as a PL detection device as an example, the feed conveying assembly 20 can remove the silicon wafers from the feed basket 300 and convey them to the functional device 200 for PL detection, and convey them out of the functional device 200 after the detection is completed.

[0081] The rotating assembly 30 is installed on the frame 10. The rotating assembly 30 is used to absorb the silicon wafers during the conveying process of the silicon wafers, and rotate the silicon wafers 180° in a plane parallel to the silicon wafers and place them on the feed conveying assembly 20 or the discharge conveying assembly 40. The discharge conveying assembly 40 is used to convey the silicon wafers rotated by the rotating assembly 30 and insert them into the discharge basket.

[0082] In the silicon wafer circulation device 100 in the embodiment of the utility model, the feed end 11 and the discharge end 12 are located at opposite ends of the frame 10, and the feed conveying assembly 20, the installation station 13, and the discharge conveying assembly 40 are arranged in sequence along the direction from the feed end 11 to the discharge end 12. The conveying directions of the feed conveying assembly 20 and the discharge conveying assembly 40 are consistent. When feeding, the feed conveying assembly 20 conveys the silicon wafer to the functional device 200, and then conveys and inserts it into the discharge basket through the discharge conveying assembly 40. In the process of conveying the silicon wafer, the rotating assembly 30 is used to absorb the silicon wafer, and the silicon wafer is rotated 180° in a plane parallel to the silicon wafer and then placed on the feed conveying assembly 20 or the discharge conveying assembly 40. Thus, in the silicon wafer circulation device 100, the silicon wafer is circulated in a straight-out manner during the circulation process. During the circulation process, the rotating assembly 30 can suck the silicon wafer and rotate it 180° and place it on the feed conveying assembly 20 or the discharge conveying assembly 40, and then insert it into the discharge basket through the discharge conveying assembly 40. That is, the rotating assembly 30 can reverse the directions of the two ends of the silicon wafer, and then insert it into the discharge basket through the discharge conveying assembly 40, so that the insertion direction of the silicon wafer in the feed basket 300 can be consistent with the insertion direction of the silicon wafer in the discharge basket. That is, the end of the silicon wafer in the feed basket 300 close to the outlet of the feed basket 300 is the same end as the end of the silicon wafer in the discharge basket close to the outlet of the discharge basket. In this way, when performing the subsequent process, the discharge basket can be directly transported to the next process equipment for processing without turning the direction of the silicon wafer, saving process steps.

[0083] Specifically, Figure 1 and Figure 2 As shown, Figure 2 Shown are the positions and orientations of the various components of the silicon wafer transfer equipment 100 and a schematic diagram of silicon wafer transfer. In the silicon wafer transfer equipment 100, the feed end 11, the feed conveying assembly 20, the discharge conveying assembly 40 and the discharge end 12 are arranged in sequence, and the rotating assembly 30 is used to rotate the silicon wafer.

[0084] In the present utility model, "the rotating assembly 30 is used to suck the silicon wafer during the conveying process of the silicon wafer, and rotate the silicon wafer 180° in a plane parallel to the silicon wafer and then place it on the feed conveying assembly 20 or the discharge conveying assembly 40" includes the following situations:

[0085] The first type is: the rotating component 30 is located above the feed conveying component 20, which can be specifically arranged between the installation station 13 and the feed end 11 and located above the feed conveying component 20. The rotating component 30 is used to absorb the silicon wafer on the feed conveying component 20, and rotate the silicon wafer 180° in a plane parallel to the silicon wafer and then place it back on the feed conveying component 20, and then flow through the functional device 200 and be inserted into the discharge basket through the discharge conveying component 40.

[0086] The second type is: the rotating component 30 is located above the discharge conveying component 40, which can be specifically arranged between the installation station 13 and the discharge end 12 and located above the discharge conveying component 40. The rotating component 30 is used to absorb the silicon wafer flowing out of the functional device 200 on the discharge conveying component 40, and rotate the silicon wafer 180° in a plane parallel to the silicon wafer and then place it back on the discharge conveying component 40, and then insert it into the discharge basket through the discharge conveying component 40.

[0087] The third type is: the rotating component 30 is located between the installation station 13 and the discharge conveying component 40, the rotating component 30 is used to absorb the silicon wafer flowing out from the functional device 200, and rotate the silicon wafer 180° in a plane parallel to the silicon wafer so that the silicon wafer is rotated to the top of the discharge conveying component 40 while changing direction, and the silicon wafer is placed on the discharge conveying component 40, that is, the feed conveying component 20 and the discharge conveying component 40 are not continuously conveyed, but the silicon wafer is transferred through the rotating component 30, and the rotating component 30 can simultaneously realize the function of transferring the silicon wafer on the feed conveying component 20 to the discharge conveying component 40.

[0088] It is easy to understand that in the first and second cases, the rotating assembly 30 can only realize a simple rotation function. In the third case, the rotating assembly 30 can realize the transfer of the silicon wafer while rotating the silicon wafer, that is, the rotating assembly 30 is set between the feed conveying assembly 20 and the discharge conveying assembly 40, and the rotating assembly 30 can absorb the silicon wafer on the feed conveying assembly 20, and then rotate the silicon wafer so that the silicon wafer turns 180 degrees and rotates to the top of the discharge conveying assembly 40, and then the silicon wafer is placed on the discharge conveying assembly 40.

[0089] In addition, in the present invention, as a possible situation, the feed conveyor assembly 20 and the discharge conveyor assembly 40 can be considered as a continuous conveying mechanism passing through the functional device 200, and both can continuously convey silicon wafers.

[0090] In the present utility model, taking the functional device 200 as a PL detection device and the rotating component 30 installed above the discharge conveying component 40 as an example, in this case, the PL detection device can be installed on the installation station 13 of the frame 10, and during the silicon wafer detection process, the feed basket 300 storing silicon wafers and the discharge basket not storing silicon wafers can be placed on the feed end 11 and the discharge end 12 respectively, the feed conveying component 20 can remove the silicon wafers in the feed basket 300 and convey them to the PL detection device for PL detection, after the detection is completed, the silicon wafers flow to the discharge conveying component 40, the rotating component 30 can absorb the silicon wafers on the discharge conveying component 40 and rotate it 180° and then place it back on the discharge conveying component 40, and the discharge conveying component 40 conveys the silicon wafers and inserts them into the discharge basket.

[0091] It is not difficult to understand that since the rotating component 30 can rotate the silicon wafer 180°, during the circulation of the silicon wafer, the silicon wafer changes direction after rotation. In this way, the insertion direction of the silicon wafer in the discharge basket is consistent with the insertion direction of the silicon wafer in the feed basket 300, that is, the placement direction of the silicon wafer in the feed basket 300 is consistent with the placement direction of the silicon wafer in the discharge basket.

[0092] See also Figure 1 In the embodiment of the present utility model, the silicon wafer transfer device 100 may further include a feed lifting mechanism 50 (only a partial structure is shown) and a discharge lifting mechanism 60. The feed lifting mechanism 50 is used to carry and drive the feed basket 300 to rise and fall, and the discharge lifting mechanism 60 is used to carry and drive the discharge basket to rise and fall. In this article, "up and down lifting" refers to lifting up and down along the vertical direction of the entire silicon wafer transfer device 100, that is, the up and down direction is the vertical direction of the silicon wafer transfer device 100. If there is the same description below, it can be understood by referring to this.

[0093] Thus, during the feeding process, the feeding basket 300 can be lifted and lowered by the feeding lifting mechanism 50 to achieve wafer-by-wafer feeding. During the discharging process, the discharging basket can be lifted and lowered by the discharging lifting mechanism 60 to achieve wafer-by-wafer discharging.

[0094] Optionally, in such an embodiment, the feed lifting mechanism 50 and the discharge lifting mechanism 60 have the same structure. Taking the feed conveying mechanism 50 as an example, Figure 3 As shown, the feed lifting mechanism 50 may include a frame 501 and a lifting linear module 502 . The frame 501 is used to carry the feed basket 300 , and the lifting linear module 502 can drive the frame 501 to move up and down relative to the frame 10 .

[0095] In the utility model, as a possible method, when feeding, the feeding basket 300 can be first raised to the top by the feeding lifting mechanism 50 so that the silicon wafer at the bottom of the feeding basket 300 corresponds to the feeding conveying component 20, and the feeding conveying component 20 removes the silicon wafer at the bottom of the feeding basket 300 and conveys it to the functional device 200. Then, when feeding next time, the feeding lifting mechanism 50 descends a certain distance so that the next silicon wafer can be removed by the feeding conveying component 20.

[0096] Similarly, when discharging, the discharging lifting mechanism 60 can first align the top of the discharging basket with the discharging conveying assembly 40, and the discharging conveying assembly 40 inserts the silicon wafer into the top of the discharging basket. Then, the discharging lifting mechanism 60 raises the discharging basket a certain distance so that the next silicon wafer can be inserted into the next position of the discharging basket by the discharging conveying assembly 40.

[0097] Also, see Figure 1 In some embodiments, the silicon wafer circulation equipment 100 may further include a feed basket conveying mechanism 51 and a discharge basket conveying mechanism 61. The feed basket conveying mechanism 51 may convey the corresponding feed basket 300 to the corresponding position of the feed end 11 and convey the feed basket 300 to the feed lifting mechanism 50. The discharge basket conveying mechanism 61 may convey the discharge basket that is full of silicon wafers.

[0098] Specifically, Figure 1 As shown, the structures of the feeding basket conveying mechanism 51 and the discharging basket conveying mechanism 61 are basically the same, and they are only different in conveying direction. Figure 4 As shown, the feed flower basket conveying mechanism 51 may be a synchronous belt conveying mechanism, which may include a drive motor 511, a synchronous conveyor belt 512, a roller 513 and a stopper 514. The drive motor 511 may drive the synchronous conveyor belt 512 to move so as to drive the feed flower basket 300 placed on the synchronous conveyor belt 512 to move, so that it can be conveyed to the feed lifting mechanism 50. The roller 513 and the stopper 514 may guide the movement of the feed flower basket 300.

[0099] Similarly, the structure of the discharge flower basket conveying mechanism 61 is also basically the same. The difference between the two is the conveying direction. One is to convey the feed flower basket 300 to the feed end 11, and the other is to convey the discharge flower basket out from the discharge end 12.

[0100] In addition, if Figure 3 As shown, the feeding lifting mechanism 50 may also include a conveying device 503 disposed at the bottom of the frame 501. In the initial position, the conveying device 503 corresponds to the feeding basket conveying mechanism 51. When the feeding basket conveying mechanism 51 conveys the feeding basket 300 to the feeding lifting mechanism 50, the conveying device 503 can drive the feeding basket 300 to move further into the frame 501 of the feeding lifting mechanism 50 so that the feeding basket 300 moves into place. In other words, the conveying device 503 of the feeding lifting mechanism 50 is used to continuously convey the feeding basket 300 from the feeding basket conveying mechanism 51 to the frame 501 of the lifting mechanism 50. Similarly, for the discharging lifting mechanism 60, it also has a conveying device, and the conveying device of the discharging lifting mechanism 60 is used to convey the discharging basket to the discharging basket conveying device 61 to realize the output of the discharging basket.

[0101] Embodiment 2

[0102] See also Figure 1 and Figure 5 , in some embodiments, the feed conveying assembly 20 may include a material taking mechanism 21 and a feed conveying mechanism 22;

[0103] The material taking mechanism 21 is located between the feeding conveying mechanism 22 and the feeding end 11, and the material taking mechanism 21 is used to take out the silicon wafers in the feeding basket 300 and convey them to the feeding conveying mechanism 22;

[0104] The feed conveyor mechanism 22 is located between the material taking mechanism 21 and the material discharging conveyor assembly 40 . The feed conveyor mechanism 22 is used to convey the silicon wafers to the functional device 200 and allow the silicon wafers to flow through the functional device 200 .

[0105] In this way, the material taking mechanism 21 can automatically take the silicon wafers on the feeding basket 300 and transport them to the feeding conveying mechanism 22 , and the feeding conveying mechanism 22 can transport the silicon wafers to the functional device 200 .

[0106] In such an embodiment, in a possible case, the rotating assembly 30 can be arranged between the feed end 11 and the functional device 200 and above the feed conveying mechanism 22. The rotating assembly 30 can absorb the silicon wafer on the feed conveying mechanism 22 and rotate it 180° and then place it back on the feed conveying mechanism 22 to achieve the reversal of the direction of the silicon wafer. That is, in such a case, before the silicon wafer enters the functional device 200, the rotating assembly 30 has reversed the direction of the silicon wafer by 180°.

[0107] For further information, see Figure 6 In some embodiments, the material picking mechanism 21 may include a first seat body 211, a material picking plate 212, a material picking driving mechanism 213, a first driving motor 214, a first wheel train group 215 and a material picking conveying belt 216.

[0108] The first seat body 211 is installed on the frame 10, the material taking plate 212 is slidably connected to the first seat body 211, and the first wheel group 215 is arranged on the first seat body 211. Specifically, a material taking conveying belt 216 and a first wheel group 215 are arranged on both sides of the material taking plate 212. A first pulley 217 is arranged on the material taking plate 212, and the material taking conveying belt 216 is wound around the first wheel group 215 and the first pulley 217.

[0109] When picking up materials, the first driving motor 214 is used to drive the picking conveyor belt 216 to move through the first wheel group 215, and the picking drive mechanism 213 is used to drive the picking plate 212 to slide so that the picking plate 212 extends into the feeding basket 300. The picking plate 212 is used to synchronously drive the picking conveyor belt 216 to extend into the feeding basket 300 through the first pulley 217, thereby transporting the silicon wafers out of the feeding basket 300 through the picking conveyor belt 216 and transporting the silicon wafers to the feeding conveyor mechanism 22.

[0110] That is to say, while the material taking driving mechanism 213 drives the material taking plate 212 to move, the first driving motor 214 can simultaneously drive the material taking conveying belt 216 to move. When taking materials, the first driving motor 214 drives the material taking conveying belt 216 to move through the first gear train group 215, and the material taking driving mechanism 213 pushes out the material taking plate 212, and the material taking plate 212 extends to the feeding basket 300 to drive the material taking conveying belt 216 to extend into the feeding basket 300 synchronously, and then the silicon wafer is transported out of the feeding basket 300 by the material taking conveying belt 216, and is transported to the feeding conveying mechanism 22 by the material taking conveying belt 216.

[0111] In such an embodiment, the material picking drive mechanism 213 may preferably be a cylinder assembly, and the cylinder assembly may be a rodless cylinder or a rod cylinder, which is not specifically limited here. Of course, the material picking drive mechanism 213 may also be other drive mechanisms, such as a screw nut drive mechanism, a gear rack drive mechanism, which is not specifically limited here.

[0112] In such an embodiment, the feed conveyor mechanism 22 can be a synchronous belt conveyor mechanism, and the material picking conveyor belt 216 of the material picking mechanism 21 can take the silicon wafer out of the feed basket 300 and convey the silicon wafer to the feed conveyor mechanism 22, and then the feed conveyor mechanism 22 conveys the silicon wafer to the functional device 200 for the next process, for example, PL detection.

[0113] Please continue reading Figure 1 and Figure 5 , in some embodiments, the discharge conveying assembly 40 may include a discharge mechanism 41 and a discharge conveying mechanism 42;

[0114] The discharge mechanism 41 is located between the discharge conveying mechanism 42 and the discharge end 12, and the discharge conveying mechanism 42 is located between the installation station 13 and the discharge mechanism 41. The discharge conveying mechanism 42 is used to transfer the silicon wafers flowing out of the functional device 200 to the discharge mechanism 41, and the discharge mechanism 41 is used to insert the silicon wafers into the discharge basket.

[0115] In such an embodiment, in a possible case, the rotating assembly 30 may also be located above the discharge conveying mechanism 42, and the rotating assembly 30 is used to absorb the silicon wafer on the discharge conveying mechanism 42 and rotate the silicon wafer 180° in a plane parallel to the silicon wafer and then re-place it on the discharge conveying mechanism 42, and the discharge conveying mechanism 42 is used to transfer the silicon wafer to the discharge mechanism 41, and the discharge mechanism 41 is used to insert the silicon wafer into the discharge basket. That is, in such a case, the silicon wafer first enters the functional device 200, and then the rotating assembly 30 turns the direction of the silicon wafer flowing out of the functional device 200 by 180°.

[0116] In this way, the rotating component 30 can reverse the direction of the silicon wafers on the discharge conveyor mechanism 42 so that the insertion direction of the silicon wafers in the discharge basket is consistent with the insertion direction in the feed basket 300, and the discharge mechanism 41 can automatically insert the silicon wafers on the discharge conveyor mechanism 42 into the discharge basket.

[0117] In such an embodiment, the structure of the material discharging mechanism 41 may be similar to that of the material taking mechanism 21. For details, see Figure 6 In some embodiments, the unloading mechanism 41 may include a second seat body 411 , a unloading plate 412 , a unloading driving mechanism 413 , a second driving motor 414 , a second wheel train set 415 and an unloading conveying belt 416 .

[0118] The second seat body 411 is installed on the frame 10, the unloading plate 412 is slidably connected to the second seat body 411, and the second wheel group 415 is arranged on the second seat body 411. Specifically, an unloading conveying belt 416 and a second wheel group 415 are arranged on both sides of the unloading plate 412. A second pulley 417 is arranged on the unloading plate 412, and the unloading conveying belt 416 is wound around the second wheel group 415 and the second pulley 215.

[0119] During material discharge, the second driving motor 414 is used to drive the material discharge conveyor belt 416 to move through the second wheel group 415, and the material discharge driving mechanism 413 is used to drive the material discharge plate 412 to slide relative to the second base body 411 so that the material discharge plate 412 extends into the material discharge basket, and the material discharge plate 412 is used to synchronously drive the material discharge conveyor belt 416 through the second pulley 417 to extend into the material discharge basket, thereby inserting the silicon wafer into the material discharge basket through the material discharge conveyor belt 416.

[0120] That is to say, while the unloading drive mechanism 413 drives the unloading plate 412 to move, the second drive motor 414 can simultaneously drive the unloading conveyor belt 416 to move. When unloading, the second drive motor 414 drives the unloading conveyor belt 416 to move through the second gear train 415, and the unloading drive mechanism 413 pushes out the unloading plate 412, and the unloading plate 412 extends to the unloading basket to synchronously drive the unloading conveyor belt 416 to extend into the unloading basket, and then the silicon wafer is inserted into the unloading basket through the unloading conveyor belt 416.

[0121] In such an embodiment, the discharge drive mechanism 413 may also preferably be a cylinder assembly, and the cylinder assembly may be a rodless cylinder or a rod cylinder, which is not specifically limited here. Of course, the discharge drive mechanism 413 may also be other drive mechanisms, such as a screw nut drive mechanism, a gear rack drive mechanism, which is not specifically limited here.

[0122] In such an embodiment, the discharging conveyor mechanism 42 can also be a synchronous belt conveyor mechanism. During discharging, the discharging conveyor mechanism 42 conveys the silicon wafers to the discharging conveyor belt 416 of the discharging mechanism 41. During discharging, since the discharging plate 412 extends into the discharging basket, a part of the discharging conveyor belt 416 will also extend into the discharging basket, so that the discharging conveyor belt 416 can insert the silicon wafers into the discharging basket.

[0123] Embodiment 3

[0124] See also Figure 1 , Figure 5 and Figure 7 In some embodiments, the silicon wafer transfer equipment 100 may further include a feed correction mechanism 70, which is located between the installation station 13 and the feed end 11. The feed correction mechanism is used to guide the silicon wafers during the process of the silicon wafers being transported by the material picking mechanism 21 and / or the feed conveying mechanism 22.

[0125] For example, in some embodiments, the material picking mechanism 21 can transport the silicon wafers to the feed correction mechanism 70, and then transport the silicon wafers to the feed conveying mechanism 22. For example, in other embodiments, the feed correction mechanism 70 can correct the direction of the silicon wafers on the feed conveying mechanism 22. No specific limitation is made here.

[0126] In this way, during the feeding process, the feeding deviation correction mechanism 70 can correct the direction of the silicon wafer to prevent the silicon wafer from deviating during the transportation process.

[0127] Furthermore, if Figure 7 As shown, in such an embodiment, the feed deviation correction mechanism 70 may include a first mounting seat 71 , two first roller assemblies 72 spaced apart on both sides of the first mounting seat 71 , a first motor 74 and a first synchronous drive mechanism 73 .

[0128] The two first roller assemblies 72 can move relative to the mounting seat 71 to move closer to or away from each other. The first motor 74 is installed on the first mounting seat 71. The first synchronous drive mechanism 73 is also installed on the first mounting seat 71 and connected to the first motor 74. The two first roller assemblies 72 are both connected to the first synchronous drive mechanism 73.

[0129] The first motor 74 can drive the two first roller assemblies 72 to move closer to or away from each other through the first synchronous drive mechanism 73. The material picking mechanism 21 and / or the feed conveying mechanism 22 can drive the silicon wafer to flow through the area between the two first roller assemblies 72. The two first roller assemblies 72 are used to correct the angle of the silicon wafer.

[0130] Specifically, in some embodiments, the material picking mechanism 21 drives the silicon wafer to flow through the area between the two first roller assemblies 72. In this case, during the feeding process, the material picking mechanism 21 removes the silicon wafer from the feeding basket 300. During the conveying process, the silicon wafer passes through the area between the two first roller assemblies 72. The two first roller assemblies 72 can correct the angle of the silicon wafer so that the silicon wafer can be conveyed to the feeding conveying mechanism 22 at an accurate angle, thereby avoiding angle deviation of the silicon wafer.

[0131] In other embodiments, the feed conveyor mechanism 22 drives the silicon wafers to flow through the area between the two first roller assemblies 72. In this case, during the feeding process, the material picking mechanism 21 removes the silicon wafers from the feed basket 300 and then transports them to the feed conveyor mechanism 22. During the process of transporting the silicon wafers by the feed conveyor mechanism 22, the silicon wafers pass through the area between the two first roller assemblies 72. The two first roller assemblies 72 can correct the angle of the silicon wafers so that the silicon wafers can be transported to the feed conveyor mechanism 22 at an accurate angle, thereby avoiding angle deviation of the silicon wafers.

[0132] In addition, a feed deviation correction mechanism 70 may be provided on the conveying paths of the feed conveying mechanism 22 and the material taking mechanism 21 , so as to correct the direction of the silicon wafer twice, and the details are not limited here.

[0133] It is understandable that, since the two first roller assemblies 72 can be relatively close to or away from each other to change the distance therebetween, the distance between the two first roller assemblies 72 can be adjusted so that the silicon wafers of different sizes can be corrected.

[0134] Please continue reading Figure 7 In some embodiments, the first synchronous driving mechanism 73 may include a first driving wheel 731, a first driven wheel 732 and a first synchronous belt 733;

[0135] The first driving wheel 731 and the first driven wheel 732 are respectively arranged on both sides of the first mounting seat 71, the first synchronous belt 733 is wound around the first driving wheel 731 and the first driven wheel 732, the first motor 74 is connected to the first driving wheel 731, one of the two first roller assemblies 72 is fixedly connected to the part of the first synchronous belt 733 located on one side of the first driving wheel 731 and the first driven wheel 732, and the other is fixedly connected to the part of the first synchronous belt 733 located on the other side of the first driving wheel 731 and the first driven wheel 732, the first motor 74 is used to drive the first driving wheel 731 to rotate to drive the first synchronous belt 733 to move, thereby driving the two first roller assemblies 72 to approach or move away from each other.

[0136] In this way, by setting two pulleys and a synchronous belt, and connecting the two first roller assemblies 72 to the two sides of the first synchronous belt 733 respectively, the first synchronous belt 733 can drive the two first roller assemblies 72 to move closer to and away from each other.

[0137] Of course, it is understandable that in other embodiments, the first synchronous drive mechanism 73 may also be a gear rack transmission mechanism, for example, two racks may be provided on both sides of the gear, the two racks are respectively fixedly connected to the two first roller assemblies 72, and the first motor 74 drives the gear to rotate to drive the two racks to move in opposite directions to achieve the approach or separation of the two first roller assemblies 72. Of course, in other embodiments, the first synchronous drive mechanism 73 may also adopt other driving modes, as long as it can achieve the synchronous approach or separation of the two first roller assemblies 72, and there is no specific limitation here.

[0138] Please continue reading Figure 1 , Figure 5 and Figure 7 In some embodiments, the silicon wafer transfer equipment 100 may further include a discharge correction mechanism 80, which is located between the installation station 13 and the discharge end 12. The discharge correction mechanism 80 is used to guide the silicon wafers during the process of the discharge conveying mechanism 42 and / or the discharge mechanism 41 transporting the silicon wafers.

[0139] For example, in some embodiments, the discharge conveying mechanism 42 can convey the silicon wafers to the discharge correction mechanism 80, and then convey the silicon wafers to the discharge mechanism 41. For example, in other embodiments, the discharge conveying mechanism 42 can convey the silicon wafers to the discharge mechanism 41. During the process of conveying the silicon wafers by the discharge mechanism 41, the silicon wafers flow through the feed correction mechanism 70 to correct the direction of the silicon wafers. No specific limitation is made here.

[0140] In this way, during the discharging process, the discharging correction mechanism 80 can correct the angle of the silicon wafers conveyed from the discharging conveyor mechanism 42 and / or the silicon wafers on the discharging mechanism 41 to ensure that the silicon wafers are not offset, which causes the discharging mechanism 41 to be unable to accurately insert the silicon wafers into the discharging basket.

[0141] Furthermore, if Figure 7 As shown, in such an embodiment, the structure of the material discharging correction mechanism 80 may be the same as the structure of the material feeding correction mechanism 70. Specifically, as Figure 7 As shown, the material discharging correction mechanism 80 may include a second mounting seat 81 , two second roller assemblies 82 spaced apart on both sides of the second mounting seat 81 , a second motor 84 and a second synchronous driving mechanism 83 .

[0142] The two second roller assemblies 82 can move relative to the mounting seat 81 to approach or move away from each other. The second motor 84 is mounted on the second mounting seat 81 . The second synchronous drive mechanism 83 is also mounted on the second mounting seat 81 and connected to the second motor 84 .

[0143] The second motor 84 can drive the two second roller assemblies 82 to move closer to or away from each other through the second synchronous drive mechanism 83. The discharge mechanism 41 and / or the discharge conveyor mechanism 42 can drive the silicon wafer to flow through the area between the two second roller assemblies 82. The two second roller assemblies 82 are used to correct the direction of the silicon wafer.

[0144] Specifically, in some embodiments, the unloading mechanism 41 drives the silicon wafers to flow through the area between the two second roller assemblies 82. In this case, during the unloading process, the unloading conveying mechanism 42 transports the silicon wafers to the unloading mechanism 41. During the unloading process of the silicon wafers, the silicon wafers pass through the area between the two second roller assemblies 82. The two second roller assemblies 82 can correct the angle of the silicon wafers so that the silicon wafers can be inserted into the unloading basket at an accurate angle, thereby avoiding the angle deviation of the silicon wafers, which may cause the unloading mechanism 41 to be unable to accurately insert the silicon wafers into the unloading basket.

[0145] In other embodiments, the discharge conveyor mechanism 42 drives the silicon wafer to flow through the area between the two second roller assemblies 82. In this case, during the discharge process, when the discharge conveyor mechanism 42 transports the silicon wafer to the discharge mechanism 41, the silicon wafer passes through the area between the two second roller assemblies 82, and the two second roller assemblies 82 can correct the angle of the silicon wafer.

[0146] In addition, a discharge correction mechanism 80 may be provided on the conveying paths of the discharge conveying mechanism 42 and the discharge mechanism 41 , so as to correct the directions of the silicon wafers twice, which is not specifically limited here.

[0147] Similarly, it can be understood that since the two second roller assemblies 82 of the discharge correction mechanism 80 can be relatively close to or away from each other to change the distance between them, the distance between the two second roller assemblies 82 can be adjusted so that silicon wafers of different sizes can be corrected.

[0148] Please continue reading Figure 7 In some embodiments, the second synchronous mechanism 83 has a substantially identical structure to the first synchronous drive mechanism 73 , and the second synchronous drive mechanism 83 may include a second driving wheel 831 , a second driven wheel 832 , and a second synchronous belt 833 ;

[0149] The second driving wheel 831 and the second driven wheel 832 are respectively arranged on both sides of the second mounting seat 71, the second synchronous belt 833 is wound around the second driving wheel 831 and the second driven wheel 832, the second motor 74 is connected to the second driving wheel 831, one of the two second roller assemblies 82 is fixedly connected to the part of the second synchronous belt 833 located on one side of the second driving wheel 831 and the second driven wheel 832, and the other is fixedly connected to the part of the second synchronous belt 833 located on the other side of the second driving wheel 831 and the second driven wheel 832, the second motor 74 is used to drive the second driving wheel 831 to rotate to drive the second synchronous belt 833 to move, thereby driving the two second roller assemblies 82 to approach or move away from each other.

[0150] In this way, by setting two pulleys and a synchronous belt, and connecting the two second roller assemblies 82 to the two sides of the second synchronous belt 833 respectively, the second synchronous belt 833 can drive the two second roller assemblies 82 to move closer to and away from each other.

[0151] Of course, it is understandable that in other embodiments, the second synchronous drive mechanism 83 may also be a gear rack transmission mechanism, for example, two racks may be provided on both sides of the gear, the two racks are respectively fixedly connected to the two second roller assemblies 82, and the second motor 74 drives the gear to rotate to drive the two racks to move in opposite directions to achieve the approach or separation of the two second roller assemblies 82. Of course, in other embodiments, the second synchronous drive mechanism 83 may also adopt other driving modes, as long as it can achieve the synchronous approach or separation of the two second roller assemblies 82, and there is no specific limitation here.

[0152] Embodiment 4

[0153] See also Figure 1 , Figure 5 and Figure 8 In some embodiments, the silicon wafer circulation equipment 100 may further include a feed temporary storage mechanism 90, which is located between the installation station 13 and the feed end 11. The feed temporary storage mechanism 90 is used to store the silicon wafers on the picking mechanism 21, and the picking mechanism 21 can transport the silicon wafers on the feed temporary storage mechanism 90 to the feed conveying mechanism 22.

[0154] Thus, when the suction efficiency of the rotating assembly 30 cannot meet the feeding speed or the feeding conveying mechanism 22 or the rotating assembly 30 fails, the material taking mechanism 21 can temporarily store the silicon wafers on the feeding temporary storage mechanism 90 to avoid collision and damage to the silicon wafers.

[0155] Furthermore, if Figure 8As shown, in such an embodiment, the feed temporary storage mechanism 90 includes a feed buffer device 92 and a first lifting mechanism 91. The first lifting mechanism 91 is installed on the frame 10. The first lifting mechanism 91 is used to drive the feed buffer device 92 to move up and down. The feed buffer device 92 has a plurality of feed temporary storage units 921 along the up and down directions, and each feed temporary storage unit 921 corresponds to storing a silicon wafer.

[0156] In this way, when the silicon wafers need to be temporarily stored, the material taking mechanism 21 can insert the silicon wafers into the material feeding temporary storage unit 921 to achieve temporary storage of the silicon wafers.

[0157] Specifically, in such an embodiment, the first lifting mechanism 91 can be a linear drive module. When it is necessary to re-transport the silicon wafers on the feed temporary storage mechanism 90 to the feed conveying mechanism 22, the silicon wafers on the feed temporary storage mechanism 90 can be removed one by one through the material picking mechanism 21 and transported to the feed conveying mechanism 22. During this process, the material picking mechanism 21 can first transport the lowest silicon wafer on the feed buffer device to the feed conveying mechanism 22, and then drive the feed buffer device 92 to descend a certain distance through the first lifting mechanism 91 so that the material picking mechanism 21 can remove the next silicon wafer and transport it to the feed conveying mechanism 22.

[0158] In such an embodiment, the feed temporary storage mechanism 90 and the feed deviation correction mechanism 70 can be arranged in sequence between the material picking mechanism 21 and the feed conveying mechanism 22. The position, quantity and order of the two can be adjusted according to the actual production process, and no specific limitation is made here.

[0159] Embodiment 5

[0160] See also Figure 1 , Figure 5 and Figure 8 In some embodiments, the silicon wafer circulation equipment 100 may further include a discharge temporary storage mechanism 110, which is located between the installation station 13 and the discharge end 12. The discharge temporary storage mechanism 110 is used to store the silicon wafers removed from the discharge conveying mechanism 42 by the discharge mechanism 41, and the discharge mechanism 41 can insert the silicon wafers on the discharge temporary storage mechanism 110 into the discharge basket.

[0161] In this way, when the discharge mechanism 41 cannot meet the discharge speed and requirements, or the discharge mechanism 41 fails, or the discharge basket is full and needs to be replaced, the discharge conveying mechanism 42 can temporarily store the silicon wafers on the discharge temporary storage mechanism 110 to avoid collision and damage to the silicon wafers.

[0162] Furthermore, in such an embodiment, the structure of the material discharging temporary storage mechanism 110 is substantially the same as the structure of the material feeding temporary storage mechanism 90. Specifically, Figure 8As shown, the material discharging temporary storage mechanism 110 may include a material discharging buffer device 112 and a second lifting mechanism 111. The second lifting mechanism 111 is installed on the frame 10. The second lifting mechanism 111 is used to drive the material discharging buffer device 112 to move up and down. The material discharging buffer device 112 has a plurality of material discharging temporary storage units 1121 along the up and down directions. Each material discharging temporary storage unit 1121 corresponds to storing a silicon wafer.

[0163] In this way, when the silicon wafers need to be temporarily stored during the outgoing material transfer mechanism 42 , the silicon wafers can be inserted into the outgoing material temporary storage unit 1121 to achieve temporary storage of the silicon wafers.

[0164] Specifically, in such an embodiment, when it is necessary to temporarily store the silicon wafers on the discharge conveying mechanism 42, the discharge conveying mechanism 42 transports the silicon wafers to the unloading mechanism 41, and the unloading mechanism 41 inserts the silicon wafers into the discharge temporary storage unit 1121 for temporary storage. When storing the next silicon wafer, the second lifting mechanism 111 can drive the discharge buffer device 112 to rise a certain distance so that the unloading mechanism 41 can insert the next silicon wafer into the next discharge temporary storage unit 1121, and so on.

[0165] When it is necessary to transport the silicon wafers on the discharge temporary storage mechanism 110 to the discharge conveying mechanism 42 again, the silicon wafers on the discharge temporary storage mechanism 110 can be removed one by one through the discharge mechanism 41 and inserted into the discharge basket. During this process, the discharge mechanism 41 can first insert the lowest silicon wafer on the discharge buffer device 112 into the discharge basket, and then drive the discharge buffer device 112 to descend a certain distance through the second lifting mechanism 111 so that the discharge mechanism 41 can remove the next silicon wafer and insert it into the discharge basket.

[0166] Embodiment 6

[0167] See also Fig. 9 In some embodiments, the rotating assembly 30 may include a mounting seat 31, a suction cup component 32, and a rotating motor 33. The mounting seat 31 is mounted on the frame 10. The suction cup component 32 is rotatably mounted on the mounting seat 31. The suction cup component 32 is used to absorb the silicon wafer. The rotating motor 33 is mounted on the mounting seat 31. The rotating motor 33 is connected to the suction cup component 32 and is used to drive the suction cup component 32 to rotate relative to the mounting seat 31 in a plane parallel to the silicon wafer.

[0168] In this way, the silicon wafer can be adsorbed by the suction cup component 32 to ensure the reliability of the silicon wafer during the rotation process, and the silicon wafer can be driven to rotate by the rotating motor 33 to achieve the reversal of the direction of the silicon wafer.

[0169] Specifically, in such an embodiment, the suction cup component 32 may include elements such as a suction cup 321 and a cylinder. When the silicon wafer is rotated, the cylinder can be started to adsorb the silicon wafer through the suction cup 321, and then the silicon wafer can be rotated by the rotating motor 33 to change the direction of the silicon wafer. Then the cylinder stops working and the suction cup 321 releases the silicon wafer.

[0170] It can be understood that, in such an embodiment, the motor shaft of the rotating motor 33 can be connected to the central axis of the suction cup component 32 by using a coupling 34 .

[0171] Embodiment 7

[0172] See also Fig.10 and Fig.11 , Fig.10 The silicon wafer transfer equipment 100 and Figure 1 The structure of the silicon wafer transfer device 100 is only different from the structure of the rotating assembly 30. Fig.10 and Fig.11 In the illustrated embodiment, the rotating assembly 30 may include a fixing base 310 , a first suction cup component 320 , a second suction cup component 330 , a rotating motor 340 , and a rotating arm 350 .

[0173] The rotating arm 350 is rotatably connected to the fixing seat 310 . The first suction cup component 320 and the second suction cup component 330 are respectively mounted at two ends of the rotating arm 350 . The first suction cup component 320 and the second suction cup component 330 are both used for adsorbing silicon wafers.

[0174] The rotating motor 340 is installed on the fixed base 310. The rotating motor 340 is located in the middle position of the rotating arm 350 and is connected to the rotating arm 350. The rotating motor 340 is used to drive the rotating arm 350 to rotate relative to the fixed base 310 in a plane parallel to the silicon wafer to drive the first suction cup component 320 and the second suction cup component 330 to rotate in a plane parallel to the silicon wafer.

[0175] In this way, by setting up a rotating arm 350 and setting up a first suction cup component 320 and a second suction cup component 330 on the rotating arm 350, and driving the rotating arm 350 to rotate by the rotating motor 340, the first suction cup component 320 and the second suction cup component 330 can alternately adsorb and place the silicon wafer, thereby improving the transfer efficiency of the rotating component 30.

[0176] Specifically, Fig. 9As shown, in such an embodiment, the first suction cup component 320 and the second suction cup component 330 can be symmetrically arranged at both ends of the rotating arm 350 about the rotation center of the rotating arm 350, and the motor shaft of the rotating motor 340 is coaxially arranged with the center of the rotating arm 350 to keep the rotation distance of the first suction cup component 320 and the second suction cup component 330 consistent. The first suction cup component 320 and the second suction cup component 330 can both include components such as suction cups and cylinders. When rotating the silicon wafer, the cylinder can be started to absorb the silicon wafer through the suction cup, and then the rotation of the silicon wafer is realized by the rotating motor 340 to turn the direction of the silicon wafer, and then the cylinder stops working and the suction cup releases the silicon wafer.

[0177] Of course, the present application may not limit the number of suction cup components. For example, the number of the suction cup components may be 3, 4, etc.

[0178] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0179] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A silicon wafer transfer device, characterized in that: include: A rack, wherein the rack has a feed end and a discharge end, the feed end and the discharge end are located at opposite ends of the rack, the feed end is used to place a feed basket, and the discharge end is used to place a discharge basket, and both the feed basket and the discharge basket are used to store silicon wafers; A feed conveying assembly, an installation station, and a discharge conveying assembly are sequentially arranged on the frame along the direction from the feed end to the discharge end, the installation station is used to install a functional device, and the feed conveying assembly is used to convey the silicon wafers in the feed basket so that the silicon wafers flow through the functional device; A rotating assembly is mounted on the frame, and is used to absorb silicon wafers during the conveying process of silicon wafers, and rotate the silicon wafers 180° in a plane parallel to the silicon wafers and place them on the feed conveying assembly or the discharge conveying assembly, and the discharge conveying assembly is used to convey the silicon wafers rotated by the rotating assembly and insert them into the discharge basket.

2. The silicon wafer transfer equipment according to claim 1, characterized in that: The rotating assembly is located above the feed conveying assembly and is used to suck the silicon wafer on the feed conveying assembly, rotate the silicon wafer 180° in a plane parallel to the silicon wafer, and then place it back on the feed conveying assembly; or The rotating assembly is located above the discharge conveying assembly and is used to absorb the silicon wafer on the discharge conveying assembly, rotate the silicon wafer 180° in a plane parallel to the silicon wafer, and then place it back on the discharge conveying assembly; or The rotating assembly is located between the installation station and the discharge conveying assembly. The rotating assembly is used to absorb the silicon wafers flowing out of the functional device, rotate the silicon wafers 180° in a plane parallel to the silicon wafers, and then transfer them to the discharge conveying assembly.

3. The silicon wafer transfer equipment according to claim 1, characterized in that: The silicon wafer circulation equipment also includes a feed lifting mechanism located at the feed end and a discharge lifting mechanism located at the discharge end. The feed lifting mechanism is used to drive the feed basket to move up and down, and the discharge lifting mechanism is used to drive the discharge basket to move up and down.

4. The silicon wafer transfer equipment according to claim 1, characterized in that: The feed conveying assembly includes a material taking mechanism and a feed conveying mechanism; The material taking mechanism is located between the feeding conveying mechanism and the feeding end, and the material taking mechanism is used to take out the silicon wafers in the feeding basket and convey them to the feeding conveying mechanism; The feed conveying mechanism is located between the material taking mechanism and the material discharging conveying assembly, and the feed conveying mechanism is used to convey the silicon wafers to the functional device and allow the silicon wafers to flow through the functional device.

5. The silicon wafer transfer equipment according to claim 4, characterized in that: The material taking mechanism comprises a first seat body, a material taking plate, a material taking drive mechanism, a first drive motor, a first wheel train set and a material taking conveying belt; The first seat body is mounted on the frame, the material taking plate is slidably connected to the first seat body, the first wheel train set is arranged on the first seat body, the material taking plate is provided with a first pulley, and the material taking conveying belt is wound around the first wheel train set and the first pulley; When picking up materials, the first driving motor is used to drive the picking up conveyor belt to move through the first wheel system group, and the picking up driving mechanism is used to drive the picking up plate to slide so that the picking up plate extends into the feeding basket, and the picking up plate is used to synchronously drive the picking up conveyor belt through the first pulley to extend into the feeding basket, thereby conveying the silicon wafers out of the feeding basket through the picking up conveyor belt and conveying the silicon wafers to the feeding conveying mechanism.

6. The silicon wafer transfer equipment according to claim 4, characterized in that: The silicon wafer circulation equipment further comprises a feed deviation correction mechanism, wherein the feed deviation correction mechanism is located between the installation station and the feed end; The feed deviation correction mechanism is used to guide the silicon wafers during the process of the silicon wafers being transported by the material taking mechanism and / or the feed conveying mechanism.

7. The silicon wafer transfer equipment according to claim 6, characterized in that: The feed deviation correction mechanism includes a first mounting seat, two first roller assemblies spaced apart on both sides of the first mounting seat, a first motor and a first synchronous driving mechanism; The first motor is mounted on the first mounting seat, the first synchronous drive mechanism is mounted on the first mounting seat and connected to the first motor, the two first roller assemblies are connected to the first synchronous drive mechanism, the first motor can drive the two first roller assemblies to move closer to or away from each other through the first synchronous drive mechanism, and the material picking mechanism and / or the feed conveying mechanism can drive the silicon wafer to flow through the area between the two first roller assemblies.

8. The silicon wafer transfer equipment according to claim 7, characterized in that: The first synchronous driving mechanism includes a first driving wheel, a first driven wheel and a first synchronous belt; The first driving wheel and the first driven wheel are respectively arranged on two sides of the first mounting seat, and the first synchronous belt is wound around the first driving wheel and the first driven wheel; The first motor is connected to the first driving wheel, one of the two first roller assemblies is fixedly connected to a portion of the first synchronous belt located on one side of the first driving wheel and the first driven wheel, and the other is fixedly connected to a portion of the first synchronous belt located on the other side of the first driving wheel and the first driven wheel, and the first motor is used to drive the first driving wheel to rotate to drive the first synchronous belt to move, thereby driving the two first roller assemblies to move closer to or away from each other.

9. The silicon wafer transfer equipment according to claim 4, characterized in that: The silicon wafer circulation equipment also includes a feed temporary storage mechanism, which is located between the installation station and the feed end. The feed temporary storage mechanism is used to store the silicon wafers on the material picking mechanism, and the material picking mechanism can transport the silicon wafers on the feed temporary storage mechanism to the feed conveying mechanism.

10. The silicon wafer transfer equipment according to claim 9, characterized in that: The feed temporary storage mechanism includes a feed buffer device and a first lifting mechanism, the first lifting mechanism is installed on the frame, the first lifting mechanism is used to drive the feed buffer device to move up and down, the feed buffer device has a plurality of feed temporary storage units along the up and down directions, and each of the feed temporary storage units stores a silicon wafer.

11. The silicon wafer transfer equipment according to claim 1, characterized in that: The discharging conveying assembly includes a discharging mechanism and a discharging conveying mechanism; The discharge mechanism is located between the discharge conveying mechanism and the discharge end, the discharge conveying mechanism is located between the installation station and the discharge mechanism, the discharge conveying mechanism is used to transfer the silicon wafers flowing out of the functional device to the discharge mechanism, and the discharge mechanism is used to insert the silicon wafers into the discharge basket.

12. The silicon wafer transfer equipment according to claim 11, characterized in that: The rotating assembly is located above the discharge conveying mechanism, and is used for sucking the silicon wafer on the discharge conveying mechanism and rotating the silicon wafer 180° in a plane parallel to the silicon wafer and then placing it back on the discharge conveying mechanism.

13. The silicon wafer transfer equipment according to claim 11, characterized in that: The material discharge mechanism comprises a second seat body, a material discharge plate, a material discharge drive mechanism, a second drive motor, a second wheel train set and a material discharge conveyor belt; The second seat body is mounted on the frame, the unloading plate is slidably connected to the second seat body, the second wheel train set is arranged on the second seat body, the unloading plate is provided with a second pulley, and the unloading conveying belt is wound around the second wheel train set and the second pulley; During unloading, the second driving motor is used to drive the unloading conveyor belt to move through the second wheel system, and the unloading driving mechanism is used to drive the unloading plate to slide so that the unloading plate extends into the unloading basket, and the unloading plate is used to synchronously drive the unloading conveyor belt through the second pulley to extend into the unloading basket, thereby inserting the silicon wafer into the unloading basket through the unloading conveyor belt.

14. The silicon wafer transfer equipment according to claim 11, characterized in that: The silicon wafer circulation equipment further includes a discharge deviation correction mechanism, and the discharge deviation correction mechanism is located between the installation station and the discharge end; The discharging deviation correcting mechanism is used to guide the silicon wafers during the process of the discharging conveying mechanism and / or the unloading mechanism conveying the silicon wafers.

15. The silicon wafer transfer equipment according to claim 14, characterized in that: The material discharging correction mechanism comprises a second mounting seat, two second roller assemblies spaced apart on both sides of the second mounting seat, a second motor and a second synchronous driving mechanism; The second motor is mounted on the second mounting seat, the second synchronous drive mechanism is mounted on the second mounting seat and connected to the second motor, the two second roller assemblies are connected to the second synchronous drive mechanism, the second motor can drive the two second roller assemblies to approach each other or move away from each other through the second synchronous drive mechanism, and the discharge mechanism and / or the discharge conveying mechanism can drive the silicon wafer to flow through the area between the two second roller assemblies.

16. The silicon wafer transfer equipment according to claim 15, characterized in that: The second synchronous driving mechanism includes a second driving wheel, a second driven wheel and a second synchronous belt; The second driving wheel and the second driven wheel are respectively arranged on two sides of the second mounting seat, and the second synchronous belt is wound around the second driving wheel and the second driven wheel; The second motor is connected to the second driving wheel, one of the two second roller assemblies is fixedly connected to a portion of the second synchronous belt located on one side of the second driving wheel and the second driven wheel, and the other is fixedly connected to a portion of the second synchronous belt located on the other side of the second driving wheel and the second driven wheel, and the second motor is used to drive the second driving wheel to rotate to drive the second synchronous belt to move, thereby driving the two second roller assemblies to move closer to or away from each other.

17. The silicon wafer transfer equipment according to claim 11, characterized in that: The silicon wafer circulation equipment also includes a discharge temporary storage mechanism, which is located between the installation station and the discharge end. The discharge temporary storage mechanism is used to store the silicon wafers taken from the discharge conveying mechanism by the discharge mechanism, and the discharge mechanism can insert the silicon wafers on the discharge temporary storage mechanism into the discharge basket.

18. The silicon wafer transfer equipment according to claim 17, characterized in that: The material discharging temporary storage mechanism includes a material discharging buffer device and a second lifting mechanism, the second lifting mechanism is installed on the frame, the second lifting mechanism is used to drive the material discharging buffer device to move up and down, the material discharging buffer device has a plurality of material discharging temporary storage units along the up and down directions, and each of the material discharging temporary storage units corresponds to storing a silicon wafer.

19. The silicon wafer transfer equipment according to claim 1, characterized in that: The rotating assembly comprises: A mounting seat, the mounting seat is mounted on the frame; A suction cup component, which is rotatably mounted on the mounting seat and is used to absorb the silicon wafer; A rotating motor is mounted on the mounting seat, the rotating motor is connected to the suction cup component and is used to drive the suction cup component to rotate relative to the mounting seat in a plane parallel to the silicon wafer.

20. The silicon wafer transfer equipment according to claim 1, characterized in that: The rotating assembly comprises: Fixed seat; A rotating arm rotatably connected to the fixing seat; A first suction cup component and a second suction cup component installed at two ends of the rotating arm, wherein the first suction cup component and the second suction cup component are both used for sucking silicon wafers; and A rotating motor is mounted on the fixing base, the rotating motor is located in the middle of the rotating arm and is connected to the rotating arm, the rotating motor is used to drive the rotating arm to rotate relative to the fixing base in a plane parallel to the silicon wafer to drive the first suction cup component and the second suction cup component to rotate in a plane parallel to the silicon wafer.

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