Transfer platform

Abstract

The utility model provides a transfer platform which comprises a first frame body, a second frame body and an adsorption disc, the first frame body, the second frame body and the adsorption disc are sequentially arranged in a sleeving mode from outside to inside in the radial direction, the second frame body is used for bearing a supporting ring, and the adsorption disc is used for bearing and adsorbing a wafer; the second frame body and the adsorption disc can move up and down relative to the first frame body so that the wafer and the supporting ring can be aligned to the same height plane. The second frame body and the adsorption disc can move relatively in the transverse direction so that the wafer and the supporting ring can be aligned to the concentric position. According to the transfer platform provided by the invention, the position error between the support ring and the wafer can be effectively eliminated.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor equipment, and more specifically, to a transfer platform. Background Art

[0002] In the semiconductor chip manufacturing process, the support ring (Frame) is an important tool in the wafer packaging and testing process. Generally, the wafer and the support ring are bonded together by dicing tape to protect the wafer during the process, assist in positioning during processing, and support during transportation, thereby reducing the probability of wafer damage.

[0003] In the aforementioned process of using the cutting film to bond the wafer and the support ring together, in the related technology, after the wafer and the support ring are placed on the transfer platform, due to the limitations of placement accuracy and possible variations in thickness of different wafers, the film cannot simultaneously and well adhere to the surfaces of the wafer and the support ring, and the eccentric position error between the wafer and the support ring leads to accuracy problems in subsequent process flows such as wafer dicing, chip picking and placement, thereby affecting the operation yield. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a transfer platform to solve the technical problem of position error between the support ring and the wafer in the prior art.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present application is to provide a transfer platform, which includes:

[0006] A first frame, a second frame and a suction plate are sequentially sleeved on each other from outside to inside in radial direction, wherein the second frame is used to carry a support ring, and the suction plate is used to carry and suction a wafer;

[0007] The second frame and the suction plate can both be moved up and down relative to the first frame so that the wafer and the support ring are aligned to the same height plane; the second frame and the suction plate can be relatively moved horizontally so that the wafer and the support ring are aligned to a concentric position.

[0008] Optionally, a positioning column is fixedly provided on at least one side of the second frame; a positioning assembly is provided on at least the other two sides of the second frame, the positioning assembly includes a positioning groove, a positioning rod and a driving device provided on the side of the second frame, and the driving device is used to drive the positioning rod to move in the positioning groove to press against the support ring.

[0009] Optionally, the second frame includes a frame and a cover plate, the cover plate is detachably arranged on the frame, and the cover plate is used to carry the support ring; adsorption holes are arranged on the cover plate.

[0010] Optionally, a lock is provided between the frame and the cover.

[0011] Optionally, a positioning member is provided between the frame and the cover plate.

[0012] Optionally, a first lifting device is provided on the first frame, a slide rail assembly is provided between the first frame and the second frame along the longitudinal direction, and the first lifting device is used to drive the second frame to move longitudinally relative to the first frame.

[0013] Optionally, a third frame is arranged on the second frame, and the adsorption plate is arranged on the third frame.

[0014] Optionally, a second lifting device is provided on the third frame, and the adsorption plate is provided at a driving end of the second lifting device.

[0015] Optionally, the third frame includes a first movable disk and a second movable disk stacked in the height direction; the first movable disk is slidably arranged on the second frame along a first direction; the second movable disk is slidably arranged on the first movable disk along a second direction perpendicular to the first direction; a linear drive device is arranged between the second frame and the first movable disk, and between the first movable disk and the second movable disk.

[0016] Optionally, a sliding block is provided at the bottom of the first frame.

[0017] The transfer platform provided in the embodiment of the present application has at least the following beneficial effects:

[0018] By movably arranging the first frame, the second frame and the adsorption plate, and making the second frame and the adsorption plate both able to be raised and lowered relative to the first frame, the second frame can be raised and lowered after carrying the support ring, and the adsorption plate can be raised and lowered after carrying the wafer so that the upper surface heights between the two are flush, thereby eliminating the influence of the wafer thickness on the film pasting accuracy; and the second frame and the adsorption plate can be moved horizontally, so that the support ring and the wafer can be moved to a concentric position, thereby eliminating the placement error of the two in the horizontal position caused by the precise position of the transfer equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figures 1 to 4A three-dimensional diagram of a transfer platform in some embodiments of the present application;

[0021] Figures 5 to 8 A three-dimensional diagram of a partial structure of a transfer platform in some embodiments of the present application;

[0022] Fig. 9 This is a three-dimensional diagram of the cover plate in some embodiments of the present application. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0024] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or indirectly on the other element.

[0026] When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0027] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0029] In the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0030] Please also read Figures 1 to 9 , the transfer platform provided in the embodiment of the present application is now described.

[0031] refer to Figure 1It should be noted that the transfer platform of the embodiment of the present application is arranged on the frame of the wafer B film mounting machine. It is used to carry the support ring A and wafer B for loading, and to align and calibrate the support ring A and wafer B after loading. Based on this, in practical applications, a visual device is provided on the wafer B film mounting machine. The visual device is used for the transfer platform to identify the positions of wafer B and support ring A after the transfer platform carries them, or the position error between the two, so as to provide data for the position adjustment of support ring A and wafer B.

[0032] refer to Figures 2 to 9 The transfer platform described in the embodiment of the present application at least includes a first frame 100, a second frame 200 and a suction plate 310.

[0033] The second frame 200 is used to carry the support ring A, and is provided with a vacuum pipe (not shown in the figure). The upper surface of the second frame 200 is provided with adsorption holes 221 for adsorbing the support ring A. Similarly, the upper surface of the adsorption plate 310 is provided with a plurality of adsorption holes 221 for adsorbing and fixing the wafer B.

[0034] Among them, reference Figures 2 to 8 The first frame 100, the second frame 200 and the adsorption plate 310 are radially arranged one on another from the outside to the inside, and there is a gap between the first frame 100, the second frame 200 and the adsorption plate 310 in the radial and longitudinal directions, and the gap is also the moving space of the first frame 100, the second frame 200 and the adsorption plate 310.

[0035] In some embodiments, a slider is provided at the bottom of the first frame 100 so that the wafer B can be slidably arranged on a slide rail on a table of the film laminating machine, so that the wafer B can be driven by a driving mechanism to move between the loading station and the film laminating station.

[0036] Both the second frame 200 and the adsorption plate 310 can be lifted and moved relative to the first frame 100. Specifically, the second frame 200 is movably arranged on the first frame 100 along the longitudinal direction so that the second frame 200 can be lifted and lowered along the first frame 100. When the second frame 200 carries the support ring A, the placement height of the support ring A can be adjusted. There can be many movable settings for the adsorption plate 310. For example, the adsorption plate 310 can be movably arranged on the first frame 100 or on the second frame 200. The specific adjustment can be made according to the actual situation, and it is only necessary to meet the requirement that the adsorption plate 310 can adjust the height of the wafer B it carries. By setting the transfer platform in this way, the height position of the support ring A and the wafer B can be adjusted, thereby ensuring that the upper surface of the support ring A and the wafer B are at the same height position each time the film is applied.

[0037] It is understandable that the lifting and lowering drive method of the second frame 200 and the adsorption plate 310 can be realized by a linear drive mechanism such as a cylinder, a linear motor, etc., but is not limited to this.

[0038] Furthermore, the second frame 200 and the suction plate 310 can move relative to each other in the lateral direction so that the wafer B is aligned to a concentric position with the support ring A. For example, the second frame 200 can be fixedly arranged in the lateral direction on the first frame 100, and the suction plate 310 can be movably arranged in the lateral direction on the first frame 100 or the second frame 200; for another example, the suction plate 310 can be fixedly arranged in the lateral direction, and the second frame 200 can be movably arranged in the lateral direction on the first frame 100, but the specific embodiment is not limited thereto.

[0039] Likewise, it is understandable that the lateral driving device 2421 of the second frame 200 and the adsorption plate 310 can be a cylinder, a linear motor, etc., but is not limited thereto.

[0040] By arranging the second frame 200 and the suction plate 310 to be movable in the horizontal direction, after the support ring A is placed and fixed on the second frame 200 and the wafer B is placed and fixed on the suction plate 310, the support ring A and the wafer B can still be finely adjusted in height and lateral position to compensate for the position error caused by the thickness change of the wafer B or the non-concentricity of the support ring A and the wafer B, thereby achieving high-precision positioning to reduce the film defect rate.

[0041] refer to Figure 3 , Figure 5 , Figure 6 and Fig. 9 In some embodiments, in addition to adsorbing and fixing the support ring A, the second frame 200 is also provided with a positioning device to enable the support ring A to be quickly positioned when it is transferred by the transfer equipment and placed on the upper surface of the second frame 200. Specifically, the positioning device includes: a positioning column 241 fixedly arranged on at least one side of the second frame 200, and a positioning assembly 242 arranged on at least the other two sides of the second frame 200. The positioning assembly 242 includes a positioning groove 2423, a positioning rod 2422 and a driving device 2421 arranged on the side of the second frame 200. The driving device 2421 is used to drive the positioning rod 2422 to move in the positioning groove 2423 to press against the support ring A.

[0042] refer to Figure 3 , Figure 5 , Figure 6 and Fig. 9It should be understood that the positioning posts 241 and the positioning components 242 are respectively arranged on three consecutive sides of the second frame 200, and a positioning strip is arranged on another side of the second frame 200. The support ring A moves to the side under the push of the positioning components 242 and abuts against each positioning post 241, so as to achieve accurate placement, and then is fixed by adsorption through the adsorption holes 221.

[0043] refer to Figure 3 , Figure 5 , Figure 6 and Fig. 9 In a specific embodiment, a receiving groove 243 is longitudinally arranged on the side of the second frame 200, and the receiving groove 243 is used to receive the positioning column 241. Meanwhile, the aforementioned driving device 2421 includes a cylinder and a driving rod 2424 arranged on the cylinder, and two positioning rods 2422 are arranged on the driving rod 2424. When the cylinder pushes the driving rod 2424 to move in the lateral direction, the two positioning rods 2422 move synchronously in the positioning groove 2423 to approach or move away from the middle of the second frame 200.

[0044] refer to Figures 3 to 6 and Fig. 9 In some embodiments, the second frame 200 includes a frame 210 and a cover plate 220. The cover plate 220 is detachably arranged on the frame 210, and is used to carry the support ring A. The cover plate 220 is provided with an adsorption hole 221. Specifically, a first flow channel (not shown in the figure) is arranged in the frame 210, and a second flow channel (not shown in the figure) that can be connected to the first flow channel is arranged on the cover plate 220, and the second flow channel is connected to the adsorption hole 221. When the cover plate 220 is covered on the frame 210, the first flow channel and the second flow channel are aligned and connected, so that negative pressure can be provided for the adsorption hole 221.

[0045] By configuring the second frame 200 in this way, the assembly of the second frame 200 can be facilitated. When the first frame 100, the second frame 200 and the adsorption plate 310 are mutually nested and assembled, after the first frame 100, the frame 210 and the adsorption plate 310 are assembled, the cover plate 220 can be covered on the frame 210.

[0046] For further reference, Figures 3 to 6 A lock buckle 230 is provided between the frame 210 and the cover plate 220. After the cover plate 220 is placed on the frame 210, the lock buckle 230 can be fastened to achieve locking and fixing between the two.

[0047] For further reference, Figure 7A positioning member is provided between the frame 210 and the cover plate 220. The positioning member may be a positioning block 240 provided on the frame 210 and a positioning hole (not shown in the figure) provided on the cover plate 220. After the cover plate 220 is covered on the frame 210, the positioning hole and the positioning block 240 between the two are relatively positioned to achieve fixation.

[0048] refer to Figure 4 and Figure 6 In some embodiments, a first lifting device 410 is disposed on the first frame 100, and a slide rail assembly 420 is disposed longitudinally between the first frame 100 and the second frame 200. The first lifting device 410 is used to drive the second frame 200 to move longitudinally relative to the first frame 100. In some specific embodiments, the first lifting device 410 is preferably a cylinder.

[0049] More specifically, two first lifting devices 410 are symmetrically arranged on the first frame 100, that is, opposite sides of the second frame 200 are driven to rise and fall by the first lifting devices 410. In this way, the lifting drive of the second frame 200 is more stable.

[0050] refer to Figure 4 , Figure 7 and Figure 8 In some embodiments, a third frame 320 is further disposed on the second frame 200, the third frame 320 is movably disposed on the first frame 100 or the second frame 200, and the suction plate 310 is fixedly disposed on the third frame 320. In this way, the transfer platform has a better modularity, which is convenient for maintenance and replacement of parts.

[0051] In some specific embodiments, the third frame 320 is fixedly disposed on the second frame 200 in the longitudinal direction, and a second lifting device 430 is disposed on the third frame 320. The second lifting device 430 is used to drive the suction plate 310 to rise or fall to adjust the height position of the wafer B, so that the wafer B can be lifted to the same height position as the support ring A. It is understandable that the second lifting device 430 is preferably a linear motor to meet the needs of fine adjustment of the wafer B.

[0052] Specifically, in the actual operation process, when the support ring A is carried on the second frame 200 and the wafer B is carried on the suction plate 310, the second lifting device 430 first drives the suction plate 310 to move to the same height position as the wafer B and the support ring A, and then the first lifting device 410 drives the second frame 200 to move, so that the second frame 200 and the third frame 320 are lifted at the same time so that the support ring A and the wafer B are moved to the height position of the film pasting station for the subsequent film pasting operation.

[0053] refer to Figure 4 , Figure 7 and Figure 8 In some specific embodiments, the third frame 320 includes a first movable disk 321 and a second movable disk 322 stacked in the height direction; the first movable disk 321 is slidably disposed on the second frame 200 along a first direction; the second movable disk 322 is slidably disposed on the first movable disk 321 along a second direction perpendicular to the first direction; a linear drive device 440 is disposed between the second frame 200 and the first movable disk 321, and between the first movable disk 321 and the second movable disk 322. Each linear drive device 440 is used to drive each movable disk to move along two directions perpendicular to each other.

[0054] It can be understood that the linear drive device 440 is preferably a linear motor.

[0055] By configuring the third frame 320 in this way, the concentric alignment of the wafer B and the support ring A can be completed in two independent movements. Specifically, when the center positions of the support ring A and the wafer B are not located in the driving direction of any linear drive device 440, the linear drive devices 440 of the first movable disk 321 and the second movable disk 322 are driven synchronously, so that the first movable disk 321 moves along the first direction and the second movable disk 322 moves along the second direction until the center of the wafer B is in a concentric position with the center of the support ring A; when the center positions of the support ring A and the wafer B are located in the driving direction of any linear drive device 440, it is only necessary to start the corresponding linear drive device 440, without starting both linear drive devices 440 at the same time.

[0056] By decoupling the motion control in two directions on the third frame 320, the position adjustment of the third frame 320 is more flexible and convenient. At the same time, the lateral driving device of the third frame 320 has a simple structure and can meet the needs of rapid movement and adjustment of the wafer B.

[0057] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A transfer platform, characterized in that: include: A first frame, a second frame and a suction plate are sequentially sleeved on each other from outside to inside in radial direction, wherein the second frame is used to carry a support ring, and the suction plate is used to carry and suction a wafer; The second frame and the suction plate can both be moved up and down relative to the first frame so that the wafer and the support ring are aligned to the same height plane; the second frame and the suction plate can be relatively moved horizontally so that the wafer and the support ring are aligned to a concentric position.

2. The transfer platform according to claim 1, characterized in that: A positioning column is fixedly installed on at least one side of the second frame; a positioning assembly is installed on at least the other two sides of the second frame, and the positioning assembly includes a positioning groove, a positioning rod and a driving device arranged on the side of the second frame, and the driving device is used to drive the positioning rod to move in the positioning groove to press against the support ring.

3. The transfer platform according to claim 1, characterized in that: The second frame includes a frame and a cover plate. The cover plate is detachably arranged on the frame, and the cover plate is used to carry the support ring. Adsorption holes are arranged on the cover plate.

4. The transfer platform according to claim 3, characterized in that: A lock buckle is arranged between the frame and the cover plate.

5. The transfer platform according to claim 3, characterized in that: A positioning member is arranged between the frame and the cover plate.

6. The transfer platform according to any one of claims 1 to 5, characterized in that: A first lifting device is arranged on the first frame, and a slide rail assembly is arranged longitudinally between the first frame and the second frame. The first lifting device is used to drive the second frame to move longitudinally relative to the first frame.

7. The transfer platform according to any one of claims 1 to 5, characterized in that: A third frame is arranged on the second frame, and the adsorption plate is arranged on the third frame.

8. The transfer platform according to claim 7, characterized in that: A second lifting device is arranged on the third frame, and the adsorption plate is arranged at a driving end of the second lifting device.

9. The transfer platform according to claim 7, characterized in that: The third frame includes a first movable disk and a second movable disk stacked in the height direction; the first movable disk is slidably arranged on the second frame along a first direction; the second movable disk is slidably arranged on the first movable disk along a second direction perpendicular to the first direction; a linear drive device is arranged between the second frame and the first movable disk, and between the first movable disk and the second movable disk.

10. The transfer platform according to any one of claims 1 to 5, characterized in that: A sliding block is arranged at the bottom of the first frame.

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