Silicon wafer etching bearing disc

Abstract

The utility model discloses a silicon wafer etching bearing disc which comprises a bottom plate, a heat dissipation plate is arranged on the top of the bottom plate, handles are fixedly installed on the two sides of the heat dissipation plate, three heat conduction strips are arranged on the top of the heat dissipation plate at equal intervals, and a bearing disc body is arranged on the tops of the three heat conduction strips. Three mounting grooves matched with the heat conduction strips are formed in the bottom of the bearing disc at equal intervals. The bearing disc slides on the heat conduction strips through the installation grooves to be connected with the heat dissipation plate, and when the heat conduction strips do not penetrate through the backs of the inner cavities of the installation grooves and slide to a certain position, the positions of the backs of the inner cavities of the installation grooves abut against the heat dissipation plate. Then two threaded fixing rods are rotated clockwise in inner cavities of threaded grooves in pairs to positions where the threaded fixing rods cannot rotate, and then the bearing disc and the heat dissipation plate can be fixed through heat conduction strips, so that a user can conveniently disassemble, replace or clean the bearing disc and install and use the bearing disc; and convenience is brought to users.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer carrier plates, in particular to a silicon wafer etching carrier plate. Background Art

[0002] Silicon is a semiconductor material and does not conduct electricity very well on its own. However, its resistivity can be precisely controlled by adding appropriate dopants. Before semiconductors can be manufactured, silicon must be converted into wafers. This starts with the growth of silicon ingots. Single crystal silicon is a solid formed by atoms in a three-dimensional spatial pattern that runs through the entire material. Polycrystalline silicon is formed individually from many small single crystals with different crystal orientations and cannot be used to make semiconductor circuits. Polycrystalline silicon must be melted into single crystals before it can be processed into wafers used in semiconductor applications. Usually, a carrier plate is needed to carry the silicon wafer for etching.

[0003] However, most silicon wafer etching carrier plates are often just a single plate when in use. The carrier plate cannot be disassembled and separated, so when it needs to be cleaned or replaced, only the entire carrier plate can be replaced, which leads to inconvenience and high cost of use. In addition, the silicon wafer will generate temperature during etching, and most carrier plates cannot dissipate the heat of the silicon wafer when in use, so the silicon wafer is easily damaged by over-high temperature during use. Utility Model Content

[0004] The purpose of the utility model is to provide a silicon wafer etching carrier plate to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a silicon wafer etching carrier plate, comprising a base plate, a heat sink is arranged on the top of the base plate, handles are fixedly installed on both sides of the heat sink, three thermal conductive strips are arranged at equal distances on the top of the heat sink, a carrier plate is arranged on the top of the three thermal conductive strips, and three installation grooves matching the thermal conductive strips are opened at equal distances on the bottom of the carrier plate.

[0006] Preferably, a plurality of heat dissipation slots are formed at equal distances through one side of the heat dissipation plate.

[0007] Preferably, the thermally conductive strips are all made of copper.

[0008] Preferably, the carrier plate can slide back and forth in the mounting groove and does not penetrate the back of the inner cavity of the mounting groove.

[0009] Preferably, the handle is fixedly connected to the heat sink and the middle portion of the handle is made of rubber material.

[0010] Preferably, two thread grooves are formed at equal distances on one side of the carrier plate and the heat conducting strip, and a threaded fixing rod is threadedly connected in the inner cavity of each of the two thread grooves.

[0011] Preferably, a plurality of connection grooves are provided at equal distances on the top of the carrier plate, and heat dissipation blocks are provided in the inner cavities of the connection grooves.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The silicon wafer etching carrier plate is connected to the heat sink by sliding the carrier plate on the heat conductive strip through the mounting groove, and the heat conductive strip is arranged to not penetrate the back of the inner cavity of the mounting groove. When the carrier plate slides to a certain position, the back of the inner cavity of the mounting groove blocks the carrier plate. Subsequently, two threaded fixing rods are rotated clockwise in the inner cavity of the threaded grooves in groups of two to a position where the two rods cannot rotate. Then, the carrier plate can be fixed to the heat sink through the heat conductive strip, thereby facilitating the user to disassemble, replace, clean, and install the carrier plate, thereby bringing convenience to the user.

[0014] 2. The silicon wafer etching carrier plate can quickly absorb the temperature generated by the carrier plate when etching by making the heat-conducting strips made of copper material, and then conduct the heat to the heat sink, and dissipate the heat through the heat sink. The heat sink can be exposed to a large amount of air through a plurality of heat dissipation slots, so that the heat dissipation of the heat can be quickly dissipated, and the three heat dissipation blocks arranged in the inner cavities of the three connecting slots can dissipate the heat when the carrier plate is used for etching the silicon wafer, thereby preventing the unnecessary influence of excessive heat on the etching of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the heat sink of the utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the carrier plate of the utility model;

[0018] Figure 4 It is a partial structural schematic diagram of the utility model.

[0019] In the figure: 1. bottom plate; 2. heat sink; 3. heat sink; 4. handle; 5. heat conducting strip; 6. carrier plate; 7. mounting slot; 8. threaded slot; 9. threaded fixing rod; 10. connecting slot; 11. heat sink. DETAILED DESCRIPTION

[0020] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention but cannot be used to limit the scope of the present invention.

[0021] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0022] Example: See Figure 1 — Figure 4 The utility model provides a technical solution: a silicon wafer etching carrier plate, comprising a bottom plate 1, a heat sink 2 is arranged on the top of the bottom plate 1, handles 4 are fixedly installed on both sides of the heat sink 2, three heat conducting strips 5 are arranged at equal distances on the top of the heat conducting strips 2, a carrier plate 6 is arranged on the top of the three heat conducting strips 5, and three installation grooves 7 adapted to the heat conducting strips 5 are opened at equal distances on the bottom of the carrier plate 6.

[0023] A plurality of heat dissipation slots 3 are formed at equal intervals on one side of the heat dissipation plate 2 .

[0024] The heat conducting strips 5 are all made of copper.

[0025] In the present embodiment, the heat conducting strip 5 is made of copper material, which can quickly absorb the temperature generated by the carrier plate 6 during etching, and then conduct the heat to the heat sink 2, and the heat is dissipated through the heat sink 2. In addition, a plurality of heat dissipation slots 3 are provided, which can bring the heat sink 2 into contact with the air to quickly dissipate heat, thereby quickly dissipating the heat of the carrier plate 6 and preventing unnecessary influence on the etching of the silicon wafer caused by excessive heat.

[0026] The carrier plate 6 can slide back and forth in the installation slot 7 and does not penetrate the back of the inner cavity of the installation slot 7 .

[0027] There are two thread grooves 8 at equal distances on one side of the carrier plate 6 and the heat conducting strip 5 , and a threaded fixing rod 9 is threadedly connected in the inner cavity of each of the two thread grooves 8 .

[0028] In this embodiment, the carrier plate 6 is connected to the heat sink 2 by sliding it on the thermally conductive strip 5 through the mounting groove 7, and the thermally conductive strip 5 is arranged to not penetrate the back of the inner cavity of the mounting groove 7. When it slides to a certain position, the back of the inner cavity of the mounting groove 7 blocks it. Then, the two threaded fixing rods 9 are rotated clockwise in the inner cavity of the threaded grooves 8 in groups of two to a position where they cannot be rotated. Then, the carrier plate 6 can be fixed to the heat sink 2 through the thermally conductive strip 5, thereby facilitating the user to disassemble, replace, clean, and install the carrier plate 6, thereby bringing convenience to the user.

[0029] The handle 4 is fixedly connected to the heat sink 2 and the middle part of the handle 4 is made of rubber material.

[0030] In this embodiment, the handles 4 are provided to facilitate the user to pick up the carrying plate 6, and at the same time, the middle parts of the two handles 4 are made of rubber material, which can prevent the user's hands from being worn out after long-term use, thereby bringing comfort to the user.

[0031] A plurality of connection grooves 10 are equidistantly provided on the top of the carrier plate 6 , and heat dissipation blocks 11 are disposed in the inner cavities of the connection grooves 10 .

[0032] In this embodiment, three heat sinks 11 arranged in the inner cavities of the three connection grooves 10 can dissipate heat when the carrier plate 6 is used for etching the silicon wafer, thereby preventing the silicon wafer from being damaged due to over-high temperature.

[0033] Working principle: First, slide the carrier plate 6 on the heat-conducting strip 5 through the installation groove 7 to connect with the heat sink 2, and set the heat-conducting strip 5 to the back of the inner cavity that does not penetrate the installation groove 7. When it slides to a certain position, the position of the back of the inner cavity of the installation groove 7 blocks it. Then, the two threaded fixing rods 9 are rotated clockwise in the inner cavity of the threaded grooves 8 in pairs to a position where they cannot be rotated. Then, the carrier plate 6 can be fixed to the heat sink 2 through the heat-conducting strip 5, so that the user can easily disassemble, replace, clean, and install the carrier plate 6. When the installation is completed, it can be used When in use, the heat conducting strip 5 is made of copper material, which can quickly absorb the temperature generated by the carrier plate 6 during etching, and then conduct the heat to the heat sink 2, and the heat is dissipated through the heat sink 2. The heat sink 2 is exposed to a large amount of air through the plurality of heat dissipation slots 3, so that the heat dissipation of the carrier plate 6 can be quickly dissipated, and the three heat dissipation blocks 11 arranged in the inner cavities of the three connecting slots 10 can dissipate heat when the carrier plate 6 is used for etching the silicon wafer, so that multiple heat dissipation can be performed to prevent the silicon wafer from being damaged due to excessive temperature when it is used for etching.

[0034] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer etching carrier, comprising a bottom plate (1), characterized in that: A heat sink (2) is arranged on the top of the base plate (1), handles (4) are fixedly mounted on both sides of the heat sink (2), three heat-conducting strips (5) are arranged at equal distances on the top of the heat sink (2), a carrying plate (6) is arranged on the top of the three heat-conducting strips (5), and three mounting grooves (7) matching the heat-conducting strips (5) are arranged at equal distances on the bottom of the carrying plate (6).

2. A silicon wafer etching carrier according to claim 1, characterized in that: A plurality of heat dissipation slots (3) are provided at equal intervals through one side of the heat dissipation plate (2).

3. The silicon wafer etching carrier according to claim 1, characterized in that: The heat conducting strips (5) are all made of copper.

4. The silicon wafer etching carrier according to claim 1, characterized in that: The carrying plate (6) can slide back and forth in the installation groove (7) and does not penetrate the back of the inner cavity of the installation groove (7).

5. The silicon wafer etching carrier according to claim 1, characterized in that: The handle (4) is fixedly connected to the heat dissipation plate (2), and the middle part of the handle (4) is made of rubber material.

6. The silicon wafer etching carrier according to claim 1, characterized in that: Two thread grooves (8) are arranged at equal distances on one side of the carrier plate (6) and the heat conducting strip (5), and a threaded fixing rod (9) is threadedly connected in the inner cavity of each of the two thread grooves (8).

7. The silicon wafer etching carrier according to claim 1, characterized in that: A plurality of connection grooves (10) are provided at equal distances on the top of the carrier plate (6), and a heat sink (11) is provided in the inner cavity of each of the connection grooves (10).

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