LED packaging structure and lamp

Abstract

The utility model discloses an LED packaging structure and a lamp. The LED packaging structure comprises a first substrate and a second substrate, wherein a step part is arranged on the first substrate; the LED chip is arranged on the step part, and the LED chip is arranged on the step part; and the second substrate is arranged on the first substrate, the second substrate is provided with a groove part corresponding to the step part, and the groove part is used for wrapping the step part and the LED chip. According to the LED packaging structure provided by the utility model, the LED chip is arranged on the step part of the first substrate, and the LED chip is raised, so that a height difference exists between the splicing part between the first substrate and the second substrate and the LED chip; according to the LED packaging structure, the UV light emitted by the LED chip cannot irradiate the glue at the splicing position of the first substrate and the second substrate, the service life of the glue in the LED packaging structure is prolonged, the first substrate and the second substrate are not prone to being separated, and the effects that the risk that the substrates fall off is reduced, and the service life of an LED product is prolonged are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, in particular to an LED packaging structure and a lamp. Background Art

[0002] UVC ultraviolet LED products are lighting products that use UVC (ultraviolet-C band) LED technology. UVC ultraviolet rays are part of the ultraviolet spectrum and have a shorter wavelength, usually between 200 and 280 nanometers. Ultraviolet rays of this wavelength have a killing effect on bacteria, viruses and other microorganisms, so they are widely used in air and water disinfection, surface disinfection, medical device disinfection and other fields.

[0003] At present, UVC ultraviolet LED products are composed of a ceramic substrate and a quartz glass cover plate. Glue is usually used to bond the ceramic substrate and the quartz glass substrate. However, since the glue is an organic matter, the glue will age and turn black and yellow after long-term UVC light exposure, causing the substrate to fall off and affecting the life of the UVC lamp bead product.

[0004] Therefore, the existing technology needs to be improved and developed. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the utility model is to provide an LED packaging structure and a lamp, aiming to solve the problem in the prior art that the glue of UVC ultraviolet LED products will age and turn black and yellow after long-term UVC light exposure, thereby causing the substrate to fall off and affecting the life of the UVC lamp bead product.

[0006] The technical solution of the utility model is as follows: an LED packaging structure is provided, which includes: a first substrate, on which a step portion is arranged; an LED chip, which is arranged on the step portion; a second substrate arranged on the first substrate, the second substrate having a groove portion corresponding to the step portion, wherein the groove portion is used to wrap the step portion and the LED chip.

[0007] In a further configuration of the present invention, the first substrate is a ceramic substrate.

[0008] In a further configuration of the present invention, the second substrate is a quartz glass substrate.

[0009] In a further configuration of the utility model, the first substrate further includes: a first splicing surface, and the first splicing surface is arranged around the periphery of the step portion.

[0010] In a further configuration of the utility model, the second substrate further includes: a second splicing surface, the second splicing surface is arranged around the periphery of the groove portion, and the first splicing surface is spliced ​​with the second splicing surface.

[0011] A further configuration of the utility model is that the depth of the groove portion is greater than the height of the step portion.

[0012] In a further configuration of the present invention, the LED chip is an LED chip of model CFAS20A.

[0013] Furthermore, the present invention also provides a lamp, which comprises: a lamp body and one or more of the above-mentioned LED packaging structures arranged in the lamp body.

[0014] Beneficial effects: The utility model discloses an LED packaging structure and a lamp. The LED packaging structure comprises: a first substrate, on which a step portion is arranged; the LED chip, on which the LED chip is arranged; a second substrate arranged on the first substrate, the second substrate having a groove portion corresponding to the step portion, wherein the groove portion is used to wrap the step portion and the LED chip.

[0015] The LED packaging structure provided by the utility model sets the LED chip on the step portion of the first substrate, raises the LED chip, so that the joint between the first substrate and the second substrate has a height difference with the LED chip, and the UV light emitted by the LED chip cannot irradiate the glue at the joint between the first substrate and the second substrate, thereby improving the life of the glue in the LED packaging structure and making it difficult for the first substrate and the second substrate to be separated, thereby achieving the effect of reducing the risk of the substrate falling and improving the life of the LED product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of the external structure of an LED packaging structure provided by the utility model;

[0018] Figure 2 for Figure 1 A schematic cross-sectional structure diagram of the LED packaging structure in one direction;

[0019] Figure 3 for Figure 1 A schematic cross-sectional structure diagram of the LED packaging structure in another direction;

[0020] Figure 4 A schematic diagram of a three-dimensional structure in which an LED chip is arranged on a first substrate in an LED packaging structure provided by the utility model;

[0021] Figure 5 for Figure 4 A top view of the LED chip as described in the above-mentioned figure arranged on the first substrate;

[0022] Figure 6 for Figure 4 A side view of the LED chip disposed on the first substrate;

[0023] Figure 7 A schematic diagram of the three-dimensional structure of the first substrate in an LED packaging structure provided by the utility model

[0024] Figure 8 for Figure 7 a top view of the first substrate described in;

[0025] Fig. 9 A schematic diagram of the three-dimensional structure of a second substrate in an LED packaging structure provided by the utility model;

[0026] Fig.10 for Fig. 9 A top view of the second substrate described in.

[0027] Explanation of the reference numerals: 10, first substrate; 20, second substrate; 30, LED chip; 11, step portion; 12, first joint surface; 21, groove portion; 22, second joint surface. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the solution of the utility model, the following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0030] At present, UVC ultraviolet LED products are composed of ceramic substrates and quartz glass substrates, and solder paste is usually used for welding and bonding between ceramic and glass. When solder paste is used for welding, the solder paste will cover the glass, resulting in poor appearance and affecting the light output efficiency of the LED chip.

[0031] Of course, the ceramic substrate and the quartz glass cover can also be bonded with glue, but because the glue is an organic substance, the glue will age and turn black and yellow after long-term UVC light exposure, causing the substrate to fall off and affecting the life of the UVC lamp bead product.

[0032] Based on the above technical problems, the utility model provides an LED packaging structure and a lamp. Figures 1 to 10 And specific embodiments are described in detail.

[0033] Please refer to Figures 1 to 10 The utility model provides an LED packaging structure, which can be made into UVC ultraviolet lamp beads, and the LED packaging structure includes: a first substrate 10, a second substrate 20 and an LED chip 30. A step portion 11 is provided on the first substrate 10, and the step portion 11 is used to place the chip; the LED chip 30 is arranged on the step portion 11, and the LED chip 30 is used to emit a UV beam; the second substrate 20 is arranged on the first substrate 10, and the second substrate 20 has a groove portion 21 corresponding to the step portion 11, wherein the groove portion 21 is used to wrap the step portion 11 and the LED chip 30.

[0034] Specifically, in the embodiment of the present invention, glue (not shown) is applied on the joint between the first substrate 10 and the second substrate 20 to bond the first substrate 10 and the second substrate 20 together.

[0035] In the present utility model, if Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6As shown, the second substrate 20 is spliced ​​on the first substrate 10, and a boss structure is provided on the first substrate 10, that is, the step portion 11 for placing the LED chip 30, which can raise the LED chip 30 so that the splicing between the first substrate 10 and the second substrate 20 has a height difference with the LED chip 30. The UV light emitted by the LED chip 30 cannot irradiate the splicing between the first substrate 10 and the second substrate 20, and the splicing between the first substrate 10 and the second substrate 20 is not on the light path of the LED chip 30, that is, the UV light emitted by the LED chip 30 cannot irradiate the glue between the first substrate 10 and the second substrate 20, which can greatly alleviate the situation in the prior art where the UV light irradiates the inorganic matter in the glue, causing the glue to age and causing the substrate to fall off.

[0036] Thus, in the present invention, the LED chip 30 is arranged on the step portion 11 of the first substrate 10, and the LED chip 30 is raised so that the joint between the first substrate 10 and the second substrate 20 has a height difference with the LED chip 30. The UV light emitted by the LED chip 30 cannot reach the glue at the joint between the first substrate 10 and the second substrate 20, thereby improving the life of the glue in the LED packaging structure, making it difficult for the first substrate 10 and the second substrate 20 to separate, reducing the risk of the substrate falling, and improving the life of the LED product.

[0037] Moreover, in the utility model, the first substrate 10 and the second substrate 20 are bonded together by glue, thus avoiding the technical solution of welding and bonding the substrates by solder paste, so that the solder paste will not cover the substrates, thereby achieving the effect of improving the aesthetics of the product and improving the light output efficiency of the LED chip 30.

[0038] Furthermore, in a possible implementation manner, the first substrate 10 is a ceramic substrate; and the second substrate 20 is a quartz glass substrate.

[0039] Specifically, in the present invention, the second substrate 20 of the quartz glass substrate is spliced ​​onto the first substrate 10 of the ceramic substrate, and the groove portion 21 of the second substrate 20 wraps the step portion 11 and the LED chip 30 .

[0040] Therefore, the light emitting portion of the LED chip 30 is wrapped by the second substrate 20, and the step portion 11 protrudes the LED chip 30. In this way, the LED chip 30 is arranged on the first substrate 10 in the shape of a boss to focus the light, so that the UV light emitted by the LED chip 30 is more concentrated and radiated in a specific direction, which helps to improve the radiation power and reduce the loss of light in other directions.

[0041] Moreover, the light-emitting part of the LED chip 30 is wrapped by full glass, which can serve as an optical protection measure to prevent UV light from scattering or being absorbed in other directions. This helps to ensure that as much UV light as possible escapes from the LED lamp bead and propagates to the required area, thereby achieving the effect of improving the effectiveness of the radiation power.

[0042] Thus, in the present invention, the step portion 11 protrudes the LED chip 30 and the groove portion 21 wraps the LED chip 30, thereby synergistically achieving the effect of optimizing optical performance, reducing UV light loss, and improving the radiation power of the lamp bead.

[0043] Further, in a possible implementation manner, as Figure 3 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 The first substrate 10 further includes: a first splicing surface 12, which is arranged around the periphery of the step portion 11; the second substrate 20 further includes: a second splicing surface 22, which is arranged around the periphery of the groove portion 21, and the first splicing surface 12 and the second splicing surface 22 are spliced.

[0044] Specifically, for the first substrate 10 and the second substrate 20, the joint of the first substrate 10 and the second substrate 20 is the first joint surface 12 and the second joint surface 22. During the specific production, the first joint surface 12 and the second joint surface 22 will be coated with glue respectively, and then the first joint surface 12 and the second joint surface 22 will be contacted and bonded together, so that the first substrate 10 is spliced ​​on the second substrate 20. Of course, because the LED chip 30 is arranged on the raised step portion 11 of the first substrate 10, there is a height difference between the first substrate 10 and the first joint surface 12 and the second joint surface 22, so the UV light emitted by the LED chip 30 will not irradiate the glue of the first joint surface 12 and the second joint surface 22, thereby increasing the life of the glue and reducing the risk of the second substrate 20 falling off.

[0045] Of course, optionally, the glue applied on the first splicing surface 12 and the second splicing surface 22 can be one or a combination of ultraviolet curing glue, silicone rubber, organic silica gel, epoxy resin glue or optical glue, which is not limited here.

[0046] Further, in a possible implementation manner, the depth of the groove portion 21 is greater than the height of the step portion 11 .

[0047] Specifically, in order to wrap the step portion 11 and the LED chip 30, the depth of the groove portion 21 needs to be greater than the sum of the height of the step portion 11 and the height of the LED chip 30, and the depth of the groove portion 21 needs to be set to further leave space for the LED chip 30 to emit light. Specifically, the depth of the groove portion 21 needs to be at least greater than 1000um.

[0048] Furthermore, in a possible implementation manner, the LED chip 30 is an LED chip 30 of model CFAS20A.

[0049] Specifically, the LED chip 30 needs to be a chip that can emit UV light. The LED chip 30 can be a flip chip or a regular chip, and the user can choose according to the actual situation. In the embodiment of the utility model, the LED chip 30 is described as a CFAS20A LED chip 30, which is a flip-chip structure and has two electrodes, N and P, both of which are AuSn electrodes.

[0050] Furthermore, the utility model also provides a lamp, the lamp comprising: a lamp body and the above-mentioned LED packaging structure, wherein the lamp body is provided with one or more of the LED packaging structures. Since the LED packaging structure has been described in detail above, it will not be described again.

[0051] In this way, in summary, in the present invention, by setting the LED chip 30 on the step portion 11 of the first substrate 10, the LED chip 30 is raised, so that the LED chip can achieve the effect of increasing the glue life in the LED packaging structure, reducing the risk of the substrate falling, and increasing the life of the LED product.

[0052] Moreover, in the utility model, the first substrate 10 and the second substrate 20 are bonded together by glue, thus avoiding the technical solution of welding and bonding the substrates by solder paste, so that the solder paste will not cover the substrates, thereby achieving the effect of improving the aesthetics of the product and improving the light output efficiency of the LED chip 30.

[0053] In the present invention, the specific structure and working principle of the present invention are introduced by taking the LED packaging structure and the lamp as examples, but the application of the present invention is not limited to the LED packaging structure and the lamp, and can also be applied to the use of other similar workpieces.

[0054] It should be understood that the present invention is not limited to the precise structure described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. An LED packaging structure, characterized in that: include: a first substrate, on which a step portion is provided; An LED chip, wherein the LED chip is arranged on the step portion; A second substrate is disposed on the first substrate, wherein the second substrate has a groove portion corresponding to the step portion, wherein the groove portion is used to wrap the step portion and the LED chip.

2. The LED packaging structure according to claim 1, characterized in that: The first substrate is a ceramic substrate.

3. The LED packaging structure according to claim 1, characterized in that: The second substrate is a quartz glass substrate.

4. The LED packaging structure according to claim 1, characterized in that: The first substrate further includes a first joining surface, and the first joining surface is arranged around the periphery of the step portion.

5. The LED packaging structure according to claim 4, characterized in that: The second substrate further includes: a second splicing surface, the second splicing surface is arranged around the periphery of the groove portion, and the first splicing surface is spliced ​​with the second splicing surface.

6. The LED packaging structure according to claim 1, characterized in that: The depth of the groove portion is greater than the height of the step portion.

7. The LED packaging structure according to claim 1, characterized in that: The LED chip is a CFAS20A LED chip.

8. A lamp, characterized in that: A lamp body and one or more LED packaging structures according to any one of claims 1 to 7 arranged in the lamp body.

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