LED packaging structure and lamp

Abstract

The utility model discloses an LED packaging structure, comprising a circuit substrate, a plurality of LED chips and a support, the circuit substrate is arranged in a sheet shape, the plurality of LED chips are welded on one side of the circuit substrate at intervals, the support is connected with one side of the circuit substrate provided with the LED chips, the support is provided with a plurality of through holes in a penetrating manner, the through holes are in one-to-one correspondence with the LED chips, and the LED chips are welded on the support. Each LED chip is located in the corresponding through hole, the inner wall of each through hole, each LED chip and the surface of the circuit substrate located in each through hole are coated with a corrosion-resistant coating, and packaging glue is injected into each through hole. According to the arrangement, the surface of each LED chip is coated with the corrosion-resistant coating, so that when the LED lamp is used for a long time in a corrosive environment with high salt and high humidity and rich sulfur, phosphorus and the like, even if cured packaging glue is aged and a gap is formed between the cured packaging glue and the LED chips, external air does not directly contact with the LED chips and a surface plating layer of the circuit substrate to cause corrosion to the LED chips and the surface plating layer, and the service life of the LED lamp is prolonged. And the service life of the LED chip is further ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an LED packaging structure and a lamp. Background Art

[0002] The LED chip is the core component of the LED device and directly determines the luminous effect and performance of the LED; the LED package can protect the LED chip in the packaging material to prevent the influence of corrosive air, dust, moisture and mechanical damage on the LED chip, so as to extend the service life of the LED.

[0003] When packaging existing LED chips, liquid glue is generally used directly for filling. When LED lamps are used in a long-term high-salt, high-humidity, sulfur- and phosphorus-rich corrosive environment, the liquid glue after filling and curing will shrink due to aging and produce a gap between the LED chip and the LED chip. In this way, the corrosive air rich in sulfur, phosphorus and other external environments will penetrate into the LED chip and the surface coating of the circuit substrate, causing corrosion, thereby affecting the service life of the LED chip. Therefore, improvement is urgently needed. Utility Model Content

[0004] The main purpose of the utility model is to provide an LED packaging structure to solve the problem in the related art that gaps appear in the packaged LED chips after long-term use, and external air penetrates through the gaps to affect the LED chips.

[0005] To achieve the above-mentioned purpose, the utility model proposes an LED packaging structure, comprising: a circuit substrate, a plurality of LED chips and a bracket, the circuit substrate is arranged in a sheet shape, the plurality of LED chips are welded at intervals on one side of the circuit substrate, the bracket is connected to the side of the circuit substrate where the LED chips are arranged, the bracket is penetrated by a plurality of through holes, each of the through holes corresponds to each of the LED chips one by one, each of the LED chips is located in the corresponding through hole, the inner wall of each of the through holes, each of the LED chips and the surface of the circuit substrate located in each of the through holes are coated with a corrosion-resistant coating, and each of the through holes is also injected with packaging glue.

[0006] In some embodiments, an annular boss is protruding from a side of the bracket facing away from the circuit substrate, and the annular boss is protruding along an edge of the bracket.

[0007] In some embodiments, an annular rib is protruding from one side of the annular boss away from the circuit base, and the annular rib is extended toward the middle of the area enclosed by the annular boss.

[0008] In some embodiments, a mounting groove is recessed on a side of the bracket facing the circuit substrate, and the circuit substrate is mounted in the mounting groove.

[0009] In some embodiments, the circuit substrate is flush with the notch of the mounting slot, and snap-in ribs are protruding from opposite sides of the notch of the mounting slot. The LED packaging structure also includes a heat sink, and both ends of the heat sink are snap-connected with two snap-in ribs.

[0010] In some embodiments, the diameter of each through hole is gradually increased from close to the circuit substrate to away from the circuit substrate.

[0011] In some embodiments, the LED packaging structure further includes a plurality of base films, each of the base films is affixed to the circuit substrate at intervals, each of the LED chips is laid on a corresponding base film, and then welded to the circuit substrate.

[0012] In some embodiments, the packaging glue is made of transparent silicone glue material and is injected into the through hole.

[0013] In some embodiments, the corrosion-resistant coating is coated with an epoxy resin material.

[0014] The utility model also provides a lamp, which comprises a shell and the LED packaging structure as described above, wherein the LED packaging structure is installed in the shell.

[0015] The beneficial effects of the technical solution of the utility model are:

[0016] The LED packaging structure of the present invention is provided with a bracket on a circuit substrate, the bracket having a plurality of through holes corresponding to each LED chip one by one, and the inner wall of each through hole, each LED chip and the surface of the circuit substrate located in each through hole are coated with a corrosion-resistant coating, and then packaging glue is injected into the through hole. In this arrangement, since the surface of each LED chip is coated with the corrosion-resistant coating, when the LED lamp is used for a long time in a corrosive environment such as high salt and humidity and rich in sulfur and phosphorus, even if the cured packaging glue ages and creates a gap with the LED chip, the external air will not directly contact the LED chip and the surface coating of the circuit substrate to cause corrosion thereto, thereby ensuring the service life of the LED. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural explosion diagram of the LED packaging structure of an embodiment of the utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the LED packaging structure of an embodiment of the utility model;

[0019] Figure 3 A cross-sectional view of an LED packaging structure according to an embodiment of the present utility model;

[0020] Figure 4 for Figure 1 Structural cross-section of the middle bracket.

[0021] Description of Figure Numbers:

[0022] 100. Circuit board; 200. LED chip; 210. Gold wire; 300. Bracket; 310. Through hole; 320. Annular boss; 330. Annular rib; 340. Snap-in rib; 350. Mounting groove; 400. Corrosion-resistant coating; 500. Packaging glue; 600. Heat sink; 700. Bottom film. DETAILED DESCRIPTION

[0023] The scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. In addition, the descriptions of "first", "second", etc. in the utility model are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features.

[0024] In view of the technical defects existing in the related art, the utility model provides an LED packaging structure, please refer to Figures 1 to 4 The LED packaging structure includes: a circuit substrate 100, a plurality of LED chips 200 and a bracket 300, wherein the circuit substrate 100 is arranged in a sheet shape, and the circuit substrate 100 can be arranged in a circular sheet shape, a square sheet shape, or a sheet shape of other shapes, which is not specifically limited here.

[0025] A plurality of LED chips 200 are welded at intervals on one side of the circuit substrate 100. The plurality of LED chips 200 can be welded on the circuit substrate 100 in a matrix manner or in an irregular arrangement manner according to actual needs. In this embodiment, each LED chip 200 is electrically connected to the positive and negative electrodes on the circuit substrate 100 using a gold wire 210.

[0026] Furthermore, the bracket 300 is connected to the side of the circuit substrate 100 on which the LED chip 200 is provided. The connection method between the bracket 300 and the circuit substrate 100 can be welding, bonding, or can be integrally formed with the circuit substrate 100 through secondary injection molding. The specific connection method between the bracket 300 and the circuit substrate 100 is not specifically limited here.

[0027] The bracket 300 is provided with a plurality of through holes 310, each through hole 310 corresponds to each LED chip 200, and each LED chip 200 is located in the corresponding through hole 310. In this way, the through hole 310 forms a receiving cavity with the circuit substrate 100, which is convenient for holding the packaging glue 500 during subsequent packaging.

[0028] Please continue reading Figure 3 The inner wall of each through hole 310, each LED chip 200 and the surface of the circuit substrate 100 located in each through hole 310 are coated with a corrosion-resistant coating 400. The corrosion-resistant coating 400 has low permeability and is a coating with a fast curing speed, which protects the LED chip 200, gold wire and other devices from the influence of the corrosive environment. Then, the packaging glue 500 is injected into each through hole 310. After the packaging glue 500 is cured, it protects the LED chip 200 to prevent the LED chip 200, gold wire and circuit from corrosion, moisture and dust.

[0029] Through the above technical solution, the LED packaging structure is provided with a bracket 300 on the circuit substrate 100, and the bracket 300 has a plurality of through holes 310 corresponding to each LED chip 200, and the inner wall of each through hole 310, each LED chip 200 and the surface of the circuit substrate 100 located in each through hole 310 are coated with a corrosion-resistant coating 400, and then a packaging glue 500 is injected into the through hole 310. In this way, since the surface of each LED chip 200 is coated with the corrosion-resistant coating 400, when the LED lamp is used for a long time in a corrosive environment such as high salt and humidity and rich in sulfur and phosphorus, even if the cured packaging glue 500 ages and creates a gap with the LED chip 200, the external air will not directly contact the LED chip 200 and the surface coating of the circuit substrate 100 to cause corrosion thereto, thereby ensuring the service life of the LED chip 200.

[0030] It should be noted that the corrosion-resistant coating 400 may be an epoxy coating, a fluorocarbon coating, a polymer coating, a ceramic coating or other coatings for protecting the substrate from the corrosive environment, which is not specifically limited here.

[0031] Taking into account that when too much packaging glue 500 is injected during the packaging process or the packaging glue 500 moves without being cured, the packaging glue 500 is likely to overflow from the edge of the bracket 300. In view of this, in order to avoid the glue overflowing from the edge of the bracket 300, in some embodiments, the side of the bracket 300 facing away from the circuit substrate 100 is provided with an annular boss 320, and the annular boss 320 is protruding along the edge of the bracket 300.

[0032] In addition, an annular rib 330 is protruded from one side of the annular boss 320 away from the circuit base, and the annular rib 330 extends toward the middle of the area surrounded by the annular boss 320. In this way, the packaging glue 500 is surrounded by the annular boss 320 and the annular rib 330 when it is not solidified, which can prevent the packaging glue 500 from overflowing from the edge of the bracket 300.

[0033] In order to facilitate the connection between the circuit substrate 100 and the bracket 300, in some embodiments, a mounting groove 350 is recessed on the side of the bracket 300 facing the circuit substrate 100, and the circuit substrate 100 is installed in the mounting groove 350; preferably, the size of the mounting groove 350 is adapted to the outer contour size of the circuit substrate 100 to facilitate the positioning and installation of the circuit substrate 100.

[0034] In addition, considering that the LED chip 200 has a poor heat dissipation capacity after packaging, which affects the service life of the LED chip 200, in this embodiment, the circuit substrate 100 is arranged flush with the notch of the mounting groove 350, and the two opposite sides of the notch of the mounting groove 350 are convexly provided with snap-fitting ribs 340, and the LED packaging structure also includes a heat sink 600, and the two ends of the heat sink 600 are snap-fitted and connected with the two snap-fitting ribs 340. In this arrangement, the heat generated by the LED chip 200 during operation will be transferred to the heat sink 600, and the heat sink 600 is provided with a plurality of heat dissipation fins, which can increase the contact area with the external air, transfer the heat to the external air, strengthen the heat dissipation, and prevent the LED chip 200 from overheating during operation.

[0035] Furthermore, in the present embodiment, the aperture of each through hole 310 is gradually increased in a direction from close to the circuit substrate 100 to away from the circuit substrate 100; thus, the inner wall of the through hole 310 can form an optical guide wall to adjust the light beam angle of the LED chip 200, thereby optimizing the optical performance of the LED chip 200 and improving the light efficiency and light utilization rate.

[0036] In some embodiments, the LED packaging structure further includes a plurality of base films 700, each of which is applied to the circuit substrate 100 at intervals, and each LED chip 200 is laid on the corresponding base film 700 and then welded to the circuit substrate 100. In this way, the LED chip 200 can be pre-positioned on the circuit substrate 100, which facilitates the welding of the gold wire 210 of the LED chip 200 with the positive and negative electrodes of the circuit substrate 100.

[0037] In this embodiment, the packaging glue 500 is made of transparent silicone glue material and injected into the through hole 310. Transparent silicone glue has good high and low temperature resistance, weather resistance and electrical insulation performance, and is suitable for packaging the LED chip 200.

[0038] In addition, in the present embodiment, the corrosion-resistant coating 400 is coated with an epoxy resin material. The epoxy resin material has good chemical corrosion resistance and wear resistance, and cures quickly during the packaging process.

[0039] The utility model also provides a lamp, which comprises a shell and an LED packaging structure, wherein the LED packaging structure is installed in the shell.

[0040] Among them, the specific structure of the LED packaging structure refers to the above embodiments. Since the lamp adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0041] The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims

1. An LED packaging structure, characterized in that: The LED packaging structure comprises: a circuit substrate (100), a plurality of LED chips (200) and a bracket (300); the circuit substrate (100) is arranged in a sheet shape; the plurality of LED chips (200) are welded at intervals on one side of the circuit substrate (100); the bracket (300) is connected to a side of the circuit substrate (100) on which the LED chips (200) are arranged; a plurality of through holes (310) are arranged through the bracket (300); each of the through holes (310) corresponds to each of the LED chips (200) one by one; each of the LED chips (200) is located in a corresponding through hole (310); the inner wall of each of the through holes (310), each of the LED chips (200) and the surface of the circuit substrate (100) located in each of the through holes (310) are coated with a corrosion-resistant coating (400); and each of the through holes (310) is also injected with packaging glue (500).

2. The LED packaging structure according to claim 1, characterized in that: An annular boss (320) is protrudingly provided on the side of the bracket (300) facing away from the circuit substrate (100), and the annular boss (320) is protrudingly arranged along the edge of the bracket (300).

3. The LED packaging structure according to claim 2, characterized in that: An annular rib (330) is protrudingly provided on one side of the annular boss (320) away from the circuit base, and the annular rib (330) is extended toward the middle of the area enclosed by the annular boss (320).

4. The LED packaging structure according to claim 1, characterized in that: A mounting groove (350) is recessed on a side of the bracket (300) facing the circuit substrate (100), and the circuit substrate (100) is mounted in the mounting groove (350).

5. The LED packaging structure according to claim 4, characterized in that: The circuit substrate (100) is arranged flush with the notch of the installation slot, and snap-fitting ribs (340) are protrudingly provided on two opposite sides of the notch of the installation slot. The LED packaging structure also includes a heat sink (600), and two ends of the heat sink (600) are snap-fitted to the two snap-fitting ribs (340).

6. The LED packaging structure according to claim 1, characterized in that: The aperture of each through hole (310) is arranged to gradually increase in a direction from close to the circuit substrate (100) to away from the circuit substrate (100).

7. The LED packaging structure according to claim 1, characterized in that: The LED packaging structure further comprises a plurality of base films (700), each of the base films (700) being attached to the circuit substrate (100) at intervals, and each of the LED chips (200) being attached to a corresponding base film (700) and then welded to the circuit substrate (100).

8. The LED packaging structure according to claim 1, characterized in that: The packaging glue (500) is made of transparent silicone glue material and is injected into the through hole (310).

9. The LED packaging structure according to claim 1, characterized in that: The corrosion-resistant coating (400) is coated with epoxy resin material.

10. A lamp, characterized in that: The lamp comprises a housing and an LED packaging structure as claimed in any one of claims 1 to 9, wherein the LED packaging structure is installed in the housing.

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