PCB copper deposition wire cleaning device

Abstract

The utility model discloses a PCB copper deposition wire cleaning device which comprises an ultrasonic cleaning pool, and an installation frame is fixedly arranged in the middle of the upper end of the ultrasonic cleaning pool. The ultrasonic cleaning device further comprises a fixed net cover which is arranged on the upper portion of the interior of the ultrasonic cleaning pool, hydraulic telescopic devices are arranged on the two sides of the upper end of the mounting frame transverse plate, and the telescopic ends of the hydraulic telescopic devices extend to the position below the mounting frame transverse plate and are fixedly connected with the fixed net cover. The liquid inlet pipe is arranged above the middle position of the mounting frame transverse plate, a liquid distribution pipe is arranged at the lower end of the liquid inlet pipe and communicates with the liquid inlet pipe, three liquid injection pipes are arranged at the lower end of the liquid distribution pipe, the lower ends of the liquid injection pipes extend to the position below the mounting frame transverse plate, and the liquid injection pipes communicate with the liquid distribution pipe; the structure solves the problems that the cleaning effect of the PCB copper deposition wire is not good enough, and cleaning liquid is easy to remain after the PCB copper deposition wire is cleaned.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB copper wires, in particular to a PCB copper wire cleaning device. Background Art

[0002] PCB copper deposition is a process used in PCB manufacturing. This process is mainly used to chemically deposit a thin layer of chemical copper on the non-conductive hole wall substrate that has been drilled, so as to serve as the base for subsequent copper electroplating. The main steps of the copper deposition process include pre-impregnation, degumming and copper deposition, among which the main purpose of pre-impregnation is to protect the palladium tank from contamination, and degumming is to remove the stannous ions wrapped around the colloidal palladium particles, so that the palladium core in the colloidal particles is exposed, thereby catalyzing and starting the chemical copper deposition reaction. The copper deposition process uses activated palladium as the copper bonding medium layer of the hole wall, and embeds the copper ions into the hole wall so that they are firmly connected to the hole wall resin and the inner copper layer, thereby increasing the anti-peel strength. It needs to be cleaned when the PCB is copper deposited.

[0003] For example, the Chinese patent "A PCB copper wire cleaning device" with announcement number CN219087422U includes a water tank and a motor, the motor is fixedly mounted on the side wall of the water tank, the output end of the motor is fixedly connected to a rotating rod, the rotating rod is rotatably connected to the side wall of the water tank, the end of the rotating rod away from the motor is fixedly connected to a connecting block, the inner wall of the water tank is fixedly connected to four springs, the top ends of the four springs are fixedly connected to a rectangular frame, the side of the rectangular frame close to the rotating rod is fixedly connected to a round rod, the inner card of the rectangular frame contains a mesh frame, a printed circuit board is provided inside the mesh frame, a copper wire group is provided on the end face of the printed circuit board, long plates are fixedly connected on both sides of the mesh frame, the long plates are located above the rectangular frame, a plurality of protrusions are fixedly connected to the inner wall of the mesh frame, the protrusions are semicircular in shape, the round rod is located on one side of the connecting block, and the four springs are evenly distributed on the bottom surface of the rectangular frame.

[0004] Although the above-mentioned prior art can realize the cleaning of PCB copper wire, in actual use, on the one hand, the cleaning effect of PCB copper wire is not good enough. After the PCB copper wire is cleaned, it is taken out from the cleaning liquid, resulting in the stains on the upper layer of the cleaning liquid adhering to the PCB copper wire when it is taken out, thereby affecting the cleaning effect of the PCB copper wire. On the other hand, after the PCB copper wire is cleaned, it is easy to have residual cleaning liquid. When the PCB copper wire enters the next process, it will bring moisture in together, resulting in the moisture possibly interfering with the normal progress of these processes, thereby affecting the product quality. Therefore, it does not meet the existing needs. In this regard, we propose a PCB copper wire cleaning device. Utility Model Content

[0005] The utility model aims to provide a PCB copper wire cleaning device to solve the problems that the PCB copper wire cleaning effect is not good enough and cleaning liquid is likely to remain after the PCB copper wire cleaning is completed.

[0006] To achieve the above object, the utility model provides the following technical solutions: a PCB copper wire cleaning device, comprising an ultrasonic cleaning tank, wherein a mounting frame is fixedly arranged at the middle position of the upper end of the ultrasonic cleaning tank; and further comprising:

[0007] A fixed mesh cover is arranged above the inside of the ultrasonic cleaning tank, and hydraulic telescopic devices are arranged on both sides of the upper end of the horizontal plate of the mounting frame, and the telescopic ends of the hydraulic telescopic devices extend to the bottom of the horizontal plate of the mounting frame and are fixedly connected to the fixed mesh cover;

[0008] A liquid inlet pipe is arranged above the middle position of the horizontal plate of the mounting frame, a liquid distributing pipe is arranged at the lower end of the liquid inlet pipe, and the liquid distributing pipe is connected with the liquid inlet pipe, and three liquid injection pipes are arranged at the lower end of the liquid distributing pipe, the lower end of the liquid injection pipe extends to the bottom of the horizontal plate of the mounting frame, and the liquid injection pipe is connected with the liquid distributing pipe.

[0009] Preferably, a spray head is provided at the lower end of the liquid injection pipe located below the horizontal plate of the mounting frame, and the spray head is fixedly connected to the liquid injection pipe by means of threads.

[0010] Preferably, motors are fixedly provided on both sides of the interior of the mounting frame, and the output shaft of the motor extends to the outside below the horizontal plate of the mounting frame, and fan blades are fixedly provided outside the output shaft of the motor below the horizontal plate of the mounting frame.

[0011] Preferably, positioning grooves are provided at the front and rear ends on both sides of the ultrasonic cleaning tank, a mounting plate is provided below the inside of the ultrasonic cleaning tank, and limiting rods are fixedly provided at the front and rear ends on both sides of the mounting plate, the limiting rods extend into the interior of the positioning grooves, and the limiting rods are slidably matched with the positioning grooves.

[0012] Preferably, filters are fixedly provided at the upper and lower ends inside the mounting plate, and handles are fixedly provided at the upper ends of both sides of the mounting plate.

[0013] Preferably, a drain pipe is provided at the lower end of the ultrasonic cleaning tank, and the drain pipe is communicated with the ultrasonic cleaning tank, and a valve is provided outside the drain pipe.

[0014] Preferably, bases are fixedly provided at the four corners of the lower end of the ultrasonic cleaning tank, and the bases are equidistantly distributed.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. The utility model can spray cleaning liquid on the PCB copper wire that has been cleaned through the hydraulic telescopic device and the fixed mesh cover. When the PCB copper wire is cleaned in the ultrasonic cleaning tank, the hydraulic telescopic device is turned on to shrink the telescopic end of the hydraulic telescopic device. When the telescopic end of the hydraulic telescopic device shrinks, the fixed mesh cover is driven to move upward until the fixed mesh cover is separated from the ultrasonic cleaning tank. At this time, clean cleaning liquid is poured from the liquid inlet pipe and flows to different liquid injection pipes through the liquid distribution pipe, and then the clean cleaning liquid is sprayed onto the PCB copper wire by the spray head. At this time, the cleaning liquid rinses the surface of the PCB copper wire to avoid stains from being attached to the PCB copper wire during the removal of the PCB copper wire from the ultrasonic cleaning tank, thereby improving the cleaning effect of the PCB copper wire.

[0017] 2. The utility model can accelerate the airflow through the interior of the fixed mesh cover through the motor and the fan blades. When the PCB copper wire is sprayed and flushed, the motor is turned on at this time so that the output shaft of the motor drives the fan blades to rotate. During the rotation of the fan blades, the air flow near the fan blades is accelerated and an airflow is formed. At the same time, the formed airflow blows toward the fixed mesh cover and enters the interior of the fixed mesh cover through the mesh holes on the fixed mesh cover. The airflow entering the interior of the fixed mesh cover takes away the moisture on the PCB copper wire, promotes the evaporation of moisture, and avoids the PCB copper wire being in a wet state when entering the next process.

[0018] 3. The utility model can filter the cleaning liquid after use through the mounting plate and the filter. When the PCB copper wire is cleaned, the valve is opened, the drain pipe is opened through the valve, and the cleaning liquid in the ultrasonic cleaning tank is discharged through the drain pipe. When the cleaning liquid is discharged, it first passes through the filter on the mounting plate. At this time, the filter intercepts the larger solid particles in the cleaning liquid. When the cleaning liquid is discharged, the handle is grasped and pulled upward, and the mounting plate is moved upward through the handle until the mounting plate is detached from the ultrasonic cleaning tank. Then the operator centrally processes the filtered solid particles to avoid the solid particles being discharged together with the cleaning liquid, thereby reducing the risk of blockage. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view of the internal structure of the utility model;

[0020] Figure 2 It is a side view of the internal structure of the utility model;

[0021] Figure 3 It is a top view of the internal structure of the utility model;

[0022] Figure 4 For the utility model Figure 3 A partial enlarged view of area A.

[0023] In the figure: 1. Ultrasonic cleaning tank; 2. Base; 3. Mounting frame; 4. Drain pipe; 5. Valve; 6. Fixed mesh cover; 7. Hydraulic telescopic device; 8. Motor; 9. Fan blades; 10. Liquid inlet pipe; 11. Liquid distribution pipe; 12. Liquid injection pipe; 13. Sprinkler head; 14. Positioning groove; 15. Mounting plate; 16. Filter; 17. Handle; 18. Limit rod. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] See also Figure 1-4 The utility model provides an embodiment: a PCB copper wire cleaning device, comprising an ultrasonic cleaning tank 1, a mounting frame 3 is fixedly arranged at the middle position of the upper end of the ultrasonic cleaning tank 1; and further comprising:

[0026] A fixed mesh cover 6 is arranged above the inside of the ultrasonic cleaning tank 1, and hydraulic telescopic devices 7 are arranged on both sides of the upper end of the horizontal plate of the mounting frame 3, and the telescopic ends of the hydraulic telescopic devices 7 extend to the bottom of the horizontal plate of the mounting frame 3 and are fixedly connected to the fixed mesh cover 6;

[0027] The liquid inlet pipe 10 is arranged above the middle position of the horizontal plate of the mounting frame 3. A liquid dispensing pipe 11 is arranged at the lower end of the liquid inlet pipe 10, and the liquid dispensing pipe 11 is connected with the liquid inlet pipe 10. Three liquid injection pipes 12 are arranged at the lower end of the liquid dispensing pipe 11. The lower ends of the liquid injection pipes 12 extend to the bottom of the horizontal plate of the mounting frame 3, and the liquid injection pipes 12 are connected with the liquid dispensing pipe 11.

[0028] During use, after the PCB copper wire is cleaned in the ultrasonic cleaning tank 1, the hydraulic telescopic device 7 is turned on to shrink the telescopic end of the hydraulic telescopic device 7. When the telescopic end of the hydraulic telescopic device 7 shrinks, the fixed mesh cover 6 is driven to move upward until the fixed mesh cover 6 is separated from the ultrasonic cleaning tank 1. At this time, the clean cleaning liquid is poured from the liquid inlet pipe 10 and flows through the liquid distribution pipe 11 to different liquid injection pipes 12, and then the clean cleaning liquid is sprayed onto the PCB copper wire by the spray head 13. At this time, the cleaning liquid rinses the surface of the PCB copper wire.

[0029] See also Figure 1 and Figure 2 A spray head 13 is provided at the lower end of the injection pipe 12 located below the horizontal plate of the mounting frame 3, and the spray head 13 is fixedly connected to the injection pipe 12 through threads, so that the cleaning liquid can be sprayed through the spray head 13.

[0030] See also Figure 1 and Figure 2A motor 8 is fixedly installed on both sides of the interior of the mounting frame 3, and the output shaft of the motor 8 extends to the outside below the horizontal plate of the mounting frame 3. The motor 8 is located below the horizontal plate of the mounting frame 3 and is fixedly installed with fan blades 9 on the outside of the output shaft, so as to accelerate the air flow inside the fixed mesh cover 6 through the fan blades 9.

[0031] See also Figure 1 and Figure 3 Positioning grooves 14 are provided at the front and rear ends on both sides of the ultrasonic cleaning tank 1, and a mounting plate 15 is provided at the lower part of the ultrasonic cleaning tank 1, and limiting rods 18 are fixedly provided at the front and rear ends on both sides of the mounting plate 15, and the limiting rods 18 extend to the inside of the positioning grooves 14, and the limiting rods 18 are slidably matched with the positioning grooves 14, so that the mounting plate 15 can be quickly positioned through the cooperation of the limiting rods 18 and the positioning grooves 14.

[0032] See also Figure 1 and Figure 2 Filter screens 16 are fixedly provided at the upper and lower ends of the interior of the mounting plate 15 , and handles 17 are fixedly provided at the upper ends of both sides of the mounting plate 15 , so that the mounting plate 15 can be easily taken out of the ultrasonic cleaning tank 1 through the handles 17 .

[0033] See also Figure 1 and Figure 2 A drain pipe 4 is provided at the lower end of the ultrasonic cleaning tank 1 , and the drain pipe 4 is connected to the ultrasonic cleaning tank 1 . A valve 5 is provided outside the drain pipe 4 to facilitate adjusting the switch of the drain pipe 4 through the valve 5 .

[0034] See also Figure 1 Bases 2 are fixedly arranged at the four corners of the lower end of the ultrasonic cleaning tank 1, and the bases 2 are equidistantly distributed, so that the ultrasonic cleaning tank 1 can be placed more stably through the bases 2.

[0035] Working principle: when the PCB copper wire is sprayed and rinsed, the motor 8 is turned on at this time, so that the output shaft of the motor 8 drives the fan blade 9 to rotate. During the rotation of the fan blade 9, the air flow near the fan blade 9 will be accelerated and an airflow will be formed. At the same time, the formed airflow blows to the fixed mesh cover 6 and enters the interior of the fixed mesh cover 6 from the mesh holes on the fixed mesh cover 6. The airflow entering the interior of the fixed mesh cover 6 will take away the moisture on the PCB copper wire. When the PCB copper wire is cleaned, the valve 5 is opened at this time, and the drain pipe 4 is opened through the valve 5. The cleaning liquid in the ultrasonic cleaning tank 1 is discharged through the drain pipe 4. When the cleaning liquid is discharged, it first passes through the filter 16 on the mounting plate 15. At this time, the filter 16 intercepts the larger solid particles in the cleaning liquid. When the cleaning liquid is discharged, the handle 17 is grasped and pulled upward, and the mounting plate 15 is moved upward through the handle 17 until the mounting plate 15 is separated from the ultrasonic cleaning tank 1, and then the operator centrally processes the filtered solid particles.

[0036] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A PCB copper wire cleaning device, comprising an ultrasonic cleaning tank (1), wherein a mounting frame (3) is fixedly arranged at the middle position of the upper end of the ultrasonic cleaning tank (1); Features: Also includes: A fixed mesh cover (6) is arranged above the inside of the ultrasonic cleaning tank (1), and hydraulic telescopic devices (7) are arranged on both sides of the upper end of the horizontal plate of the mounting frame (3), and the telescopic ends of the hydraulic telescopic devices (7) extend to the bottom of the horizontal plate of the mounting frame (3) and are fixedly connected to the fixed mesh cover (6); A liquid inlet pipe (10) is arranged above the middle position of the horizontal plate of the mounting frame (3); a liquid dispensing pipe (11) is arranged at the lower end of the liquid inlet pipe (10), and the liquid dispensing pipe (11) is connected to the liquid inlet pipe (10); three liquid injection pipes (12) are arranged at the lower end of the liquid dispensing pipe (11); the lower ends of the liquid injection pipes (12) extend to the bottom of the horizontal plate of the mounting frame (3), and the liquid injection pipes (12) are connected to the liquid dispensing pipes (11).

2. A PCB copper wire cleaning device according to claim 1, characterized in that: A spray head (13) is provided at the lower end of the liquid injection pipe (12) located below the horizontal plate of the mounting frame (3), and the spray head (13) is fixedly connected to the liquid injection pipe (12) via threads.

3. A PCB copper wire cleaning device according to claim 1, characterized in that: Motors (8) are fixedly arranged on both sides of the interior of the mounting frame (3), and the output shaft of the motor (8) extends to the outside below the horizontal plate of the mounting frame (3), and fan blades (9) are fixedly arranged outside the output shaft of the motor (8) below the horizontal plate of the mounting frame (3).

4. A PCB copper wire cleaning device according to claim 1, characterized in that: Positioning grooves (14) are provided at the front and rear ends of both sides of the ultrasonic cleaning tank (1), a mounting plate (15) is provided below the inside of the ultrasonic cleaning tank (1), and limiting rods (18) are fixedly provided at the front and rear ends of both sides of the mounting plate (15), the limiting rods (18) extend into the interior of the positioning grooves (14), and the limiting rods (18) are slidably matched with the positioning grooves (14).

5. A PCB copper wire cleaning device according to claim 4, characterized in that: Filter screens (16) are fixedly arranged at the upper and lower ends of the interior of the mounting plate (15), and handles (17) are fixedly arranged at the upper ends of both sides of the mounting plate (15).

6. A PCB copper wire cleaning device according to claim 1, characterized in that: A liquid discharge pipe (4) is provided at the lower end of the ultrasonic cleaning pool (1), and the liquid discharge pipe (4) is in communication with the ultrasonic cleaning pool (1), and a valve (5) is provided outside the liquid discharge pipe (4).

7. A PCB copper wire cleaning device according to claim 1, characterized in that: Bases (2) are fixedly arranged at the four corners of the lower end of the ultrasonic cleaning pool (1), and the bases (2) are distributed at equal distances.

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