Semiconductor lead frame processing injection molding device

Abstract

The utility model provides a semiconductor lead frame processing injection molding device which comprises a fixed mold body and a movable mold body, the lower end of a connecting frame is provided with the movable mold body, the right side of the upper end face of a working table is provided with an air blowing assembly, and the left side of the upper end face of the working table is provided with an auxiliary fixing assembly. The double-thread lead screw can drive the air guide shell to move leftwards through the first supporting plate to abut against the right end face of the movable mold body and the right end face of the fixed mold body, then the axial flow fan is started, external air can rapidly pass through the multiple upper air guide through holes and the multiple lower air guide through holes, and therefore the movable mold body and the fixed mold body are rapidly ventilated and cooled at the same time; the double-thread lead screw rotating forwards can drive the second supporting plate to synchronously move towards the right side, so that the second supporting plate drives the positioning seats to be clamped in the upper positioning groove and the lower positioning groove through the extension rods, and the mold closing stability of the movable mold body and the fixed mold body is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor lead frame processing, in particular to a semiconductor lead frame processing injection molding device. Background Art

[0002] The semiconductor lead frame is the chip carrier of the integrated circuit. It is a key structural component that uses bonding materials such as gold wire, aluminum wire and copper wire to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. Injection molding equipment is required in the processing of semiconductor lead frames.

[0003] Publication number "CN220409555U" provides a semiconductor lead frame processing injection molding device, which starts a water pump to draw coolant from the inside of a condensate tank into a condensate tube, so that the condensate tube transfers the coolant through a lower mold to the lead frame on the upper side of the lower mold, thereby facilitating cooling of the lead frame.

[0004] However, the above technical solutions and the prior art have the following defects:

[0005] Although the injection molding device can cool the lead frame on the upper inner side of the lower mold by passing the coolant through the condensate pipe, this cooling structure can only cool the lower mold and cannot cool the upper mold at the same time. The cooling range needs to be improved. In addition, the upper mold in the injection molding device does not have a corresponding auxiliary fixing structure after being closed with the lower mold, which easily leads to looseness at the connection between the upper mold and the lower mold after closing. The stability of the closing mold needs to be improved. Utility Model Content

[0006] The utility model aims to provide a semiconductor lead frame processing injection molding device to solve the problems raised in the above background technology.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A semiconductor lead frame processing injection molding device comprises a workbench, a fixed mold body, a support frame, a movable mold body, a connecting frame and an electric push rod, the upper end surface of the workbench is fixedly connected to the support frame, the electric push rod is installed at the middle position of the upper end surface of the support frame, the connecting frame is installed at the lower end of the electric push rod, and the movable mold body is installed at the lower end of the connecting frame, the fixed mold body is installed at the middle position of the upper end surface of the workbench, and the fixed mold body and the movable mold body are used for injection molding of external semiconductor lead frames, the upper end surface inlet of the movable mold body is connected to an injection molding hose, a blowing assembly is arranged on the right side of the upper end surface of the workbench, and the blowing assembly is used for ventilating and cooling the movable mold body and the fixed mold body, so that the cooling and molding speed of the external semiconductor lead frame after injection molding is faster, an auxiliary fixing assembly is arranged on the left side of the upper end surface of the workbench, and the auxiliary fixing assembly is used for auxiliary fixing of the movable mold body and the fixed mold body after mold closing, so as to ensure the mold closing stability of the movable mold body and the fixed mold body.

[0009] Preferably, the blowing assembly includes a lower air guide hole, an air guide shell, an upper air guide hole, an axial flow fan and a first support plate. The first support plate is installed on the right side of the workbench, a diverter shell is provided on the upper end of the first support plate, an axial flow fan is installed on the right side of the air guide shell, an upper air guide hole is opened on the upper side of the movable mold body, and a lower air guide hole is opened on the lower side of the fixed mold body.

[0010] Preferably, a low-speed motor is installed on the right side of the workbench, and a double-threaded screw is installed on the left end of the low-speed motor. The rotation direction of the left external thread of the annular side of the double-threaded screw is opposite to that of the right external thread of the annular side.

[0011] Preferably, the auxiliary fixing assembly includes a positioning seat, an extension rod, a lower positioning groove, an upper positioning groove and a second support plate, a second support plate is installed on the left side of the workbench, an extension rod is provided on the upper side of the right end surface of the second support plate, a positioning seat is provided on the right end of the extension rod, an upper positioning groove is provided on the left end surface of the movable mold body, and a lower positioning groove is provided on the left end surface of the fixed mold body.

[0012] Preferably, the positioning seat is concave in shape, and the positioning seat matches the upper positioning groove and the lower positioning groove respectively.

[0013] Preferably, sealing frames are bonded to both upper and lower sides of the left end surface of the air guide shell, and the sealing frames are made of silicone rubber. A diverter block is fixedly connected to the left side of the inside of the air guide shell, and the diverter block is triangular in shape.

[0014] Preferably, the upper end surface of the workbench has limit cavities symmetrically opened on both sides, the lower end surface of the movable mold body has limit holes symmetrically opened on both sides, the upper end surface of the fixed mold body has limit blocks symmetrically arranged on both sides, and the limit blocks match the limit holes, and the fixed mold body matches the movable mold body.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. After the movable mold body and the fixed mold body are molded together, the device controls the low-speed motor to rotate forward, so that the double-threaded screw drives the air guide shell to move to the left side through the first support plate and lean against the right end surface of the movable mold body and the fixed mold body, and then starts the axial flow fan, so that the external air can quickly pass through the multiple upper air guide holes and the lower air guide holes, so as to quickly ventilate and cool the movable mold body and the fixed mold body at the same time, so that the semiconductor lead frame inside the fixed mold body can be cooled and formed faster;

[0017] 2. In this device, when the double-threaded screw drives the first support plate to move to the left, the forward-rotating double-threaded screw drives the second support plate to move to the right synchronously, so that the second support plate drives the positioning seat to be respectively clamped in the upper positioning groove and the lower positioning groove through the extension rod, and the movable mold body and the fixed mold body after mold closing are auxiliary fixed, so as to ensure the stability of the movable mold body and the fixed mold body. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the main structure of the utility model;

[0019] Figure 2 This is a structural diagram of the movable mold body and the fixed mold body after mold opening in the utility model;

[0020] Figure 3 It is a front cross-sectional view of the blowing assembly and the auxiliary fixing assembly in the utility model in the use state;

[0021] Figure 4 It is a front cross-sectional view of the blowing assembly and the auxiliary fixing assembly of the utility model in an unused state;

[0022] Figure 5 It is a partial structural diagram of the blowing component and the auxiliary fixing component in the utility model.

[0023] In the figure: 1. workbench; 11. limit cavity; 2. fixed mold body; 21. limit block; 3. blowing assembly; 31. lower air guide hole; 32. air guide shell; 321. diverter block; 322. sealing frame; 33. upper air guide hole; 34. axial flow fan; 35. double-threaded screw; 36. first support plate; 37. low-speed motor; 4. support frame; 5. movable mold body; 51. limit hole; 6. connecting frame; 7. electric push rod; 8. injection hose; 9. auxiliary fixing assembly; 91. positioning seat; 92. extension rod; 93. lower positioning groove; 94. upper positioning groove; 95. second support plate. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-5 , the utility model provides a technical solution:

[0026] Embodiment 1:

[0027] A semiconductor lead frame processing injection molding device includes a workbench 1, a fixed mold body 2, a support frame 4, a movable mold body 5, a connecting frame 6 and an electric push rod 7. The upper end surface of the workbench 1 is fixedly connected with the support frame 4, and the support frame 4 is connected to the workbench 1 by welding. The support frame 4 will support the electric push rod 7. The electric push rod 7 is installed at the middle position of the upper end surface of the support frame 4. When working, the electric push rod 7 will drive the movable mold body 5 to move up and down through the connecting frame 6. The lower end of the electric push rod 7 is installed with a connecting frame 6. The connecting frame 6 facilitates the connection between the electric push rod 7 and the movable mold body 5. The lower side of the connecting frame 6 is installed with fixing screws, and the fixing screws are convenient for the staff At a later stage, the movable mold body 5 is disassembled and assembled separately, and the movable mold body 5 is installed at the lower end of the connecting frame 6, and the fixed mold body 2 is installed at the middle position of the upper end surface of the workbench 1, and the fixed mold body 2 matches the movable mold body 5. The matching fixed mold body 2 and movable mold body 5 are used for injection molding of the external semiconductor lead frame, and the limiting holes 51 are symmetrically provided on the left and right sides of the lower end surface of the movable mold body 5, and the limiting blocks 21 are symmetrically provided on the left and right sides of the upper end surface of the fixed mold body 2, and the limiting blocks 21 are matched with the limiting holes 51, and the limiting blocks 21 and the fixed mold body 2 are an integrated structure, and the matching limiting blocks 21 and the limiting holes 51 prevent the movable mold body 5 and the fixed mold body 2 from being misaligned during the mold closing process.

[0028] The inlet of the upper end face of the movable mold body 5 is connected to an injection hose 8, and the inlet of the injection hose 8 is connected to the outlet of the external injection molding machine. The injection hose 8 facilitates the external injection molding machine to inject into the fixed mold body 2 through the movable mold body 5, so as to perform injection molding on the external semiconductor lead frame. A blowing component 3 is arranged on the right side of the upper end face of the workbench 1, and the blowing component 3 is used to ventilate and cool the movable mold body 5 and the fixed mold body 2, so that the cooling and molding speed of the external semiconductor lead frame after injection molding is faster. An auxiliary fixing component 9 is arranged on the left side of the upper end face of the workbench 1, and the auxiliary fixing component 9 is used for auxiliary fixation of the movable mold body 5 and the fixed mold body 2 after mold closing, so as to ensure the mold closing stability of the movable mold body 5 and the fixed mold body 2. A control panel is installed on the right side of the front end surface of the workbench 1, and the control panel is connected to the electric push rod 7, the axial flow fan 34 and the low-speed motor 37 through wires. The control panel is convenient for the staff to control the electric push rod 7, the axial flow fan 34 and the low-speed motor 37 to work according to the requirements. Since the internal detailed structure and working principle of the control panel belong to the relatively mature technology in the prior art, they will not be described in detail here.

[0029] The blowing assembly 3 includes a lower air guide hole 31, an air guide shell 32, an upper air guide hole 33, an axial flow fan 34 and a first support plate 36. The first support plate 36 is installed on the right side of the workbench 1. The first support plate 36 is connected to the air guide shell 32 by welding. The first support plate 36 supports the air guide shell 32. A first internally threaded through hole is provided on the lower side of the first support plate 36, and the first internally threaded through hole is engaged with the external thread on the right side of the annular side of the double-threaded screw rod 35. The first internally threaded through hole enables the first support plate 36 to move left and right. A diverter shell is provided on the upper end of the first support plate 36. The diverter shell guides the air sucked by the axial flow fan 34 to the upper air guide through hole 33 and the lower air guide through hole 31 respectively.

[0030] An axial flow fan 34 is installed on the right side of the air guide shell 32. When the axial flow fan 34 is working, negative pressure is generated inside the air guide shell 32 to suck in air from the right side. An upper air guide hole 33 is opened on the upper side of the movable mold body 5. There are multiple upper air guide holes 33, and the specifications of the multiple upper air guide holes 33 are the same. The multiple upper air guide holes 33 facilitate external air to pass through the upper side of the movable mold body 5 for ventilation and cooling. A lower air guide hole 31 is opened on the lower side of the fixed mold body 2. There are multiple lower air guide holes 31, and the specifications of the multiple lower air guide holes 31 are the same. The multiple lower air guide holes 31 facilitate external air to pass through the lower side of the fixed mold body 2 for ventilation and cooling.

[0031] A low-speed motor 37 is installed on the right side of the workbench 1. The low-speed motor 37 will drive the double-threaded screw 35 to rotate forward and reversely. A double-threaded screw 35 is installed on the left end of the low-speed motor 37. The external thread on the left side of the annular side of the double-threaded screw 35 rotates in opposite directions to the external thread on the right side of the annular side. The double-threaded screw 35 with opposite thread rotation directions will cause the first support plate 36 and the second support plate 95 to move synchronously in opposite directions when rotating. Sealing frames 322 are bonded to the upper and lower sides of the left end surface of the air guide shell 32, and the sealing frame 322 is made of silicone rubber. The sealing frame 322 made of silicone rubber makes the air guide shell 32 and the movable mold body 5 and the fixed mold body 2 more tightly sealed, so as to avoid the air guide shell 32 from being stuck in the air guide shell 32. Air leakage occurs during the process of guiding air to the multiple upper air guiding holes 33 and the lower air guiding holes 31 respectively. A diverter block 321 is fixedly connected to the left side of the inside of the air guiding shell 32, and the diverter block 321 is triangular in shape. The triangular diverter block 321 will guide the air blown by the axial flow fan 34 to the upper and lower sides respectively. The limiting cavity 11 is symmetrically provided on the left and right sides of the upper end surface of the workbench 1. The limiting cavity 11 matches the first support plate 36 and the second support plate 95. The limiting cavity 11 will limit the first support plate 36 and the second support plate 95 respectively to prevent the first support plate 36 and the second support plate 95 from deviating or shaking during use.

[0032] Embodiment 2:

[0033] On the basis of Example 1, the forward-rotating double-threaded screw 35 in this embodiment will drive the second support plate 95 to move synchronously to the right, so that the second support plate 95 drives the positioning seat 91 through the extension rod 92 to be respectively clamped in the upper positioning groove 94 and the lower positioning groove 93, thereby assisting in fixing the movable mold body 5 and the fixed mold body 2 after the mold is closed, thereby ensuring the stability of the movable mold body 5 and the fixed mold body 2 in the mold closing.

[0034] The auxiliary fixing assembly 9 includes a positioning seat 91, an extension rod 92, a lower positioning groove 93, an upper positioning groove 94 and a second support plate 95. The second support plate 95 is installed on the left side of the workbench 1. The second support plate 95 will support the extension rod 92. The upper side of the right end surface of the second support plate 95 is provided with an extension rod 92. The extension rod 92 is connected to the second support plate 95 and the positioning seat 91 by welding. The extension rod 92 will support the positioning seat 91. The right end of the extension rod 92 is provided with a positioning seat 91. The positioning seat 91 is concave in shape. The positioning seat 91 is respectively connected to the upper positioning groove 94. Matching the lower positioning groove 93, the concave positioning seat 91 will assist in fixing the movable mold body 5 and the fixed mold body 2 after the mold is closed after being clamped in the upper positioning groove 94 and the lower positioning groove 93, so as to ensure the stability of the clamping of the movable mold body 5 and the fixed mold body 2. The left end face of the movable mold body 5 is provided with an upper positioning groove 94, and the upper positioning groove 94 facilitates the upper side of the right end face of the positioning seat 91 to be clamped on the left end of the movable mold body 5 for positioning. The left end face of the fixed mold body 2 is provided with a lower positioning groove 93, and the lower positioning groove 93 facilitates the lower side of the right end face of the positioning seat 91 to be clamped on the left end of the fixed mold body 2 for positioning.

[0035] Working principle: During the injection molding process of the external semiconductor lead frame, the staff first controls the electric push rod 7 to extend, so that the electric push rod 7 drives the movable mold body 5 to move downward through the connecting frame 6 to close the mold with the fixed mold body 2. After closing the mold, the staff first controls the low-speed motor 37 to rotate forward, so that the low-speed motor 37 drives the double-threaded screw rod 35 to rotate forward together. At this time, the double-threaded screw rod 35 rotating forward will drive the first support plate 36 and the second support plate 95 to move inward synchronously. In this process, the first support plate 36 will drive the air guide shell 32 to move to the left together, so that the sealing frame 322 is tightly fitted on the right end surface of the movable mold body 5 and the fixed mold body 2, and the second support plate 95 will drive the positioning seat 91 to move to the right together through the extension rod 92, so that the positioning seat 91 is respectively clamped in the upper positioning groove 94 and the lower positioning groove 93 (reference Figure 1 or Figure 3), at this time, the positioning seat 91 clamped in the upper positioning groove 94 and the lower positioning groove 93 will assist in fixing the movable mold body 5 and the fixed mold body 2 after the mold is closed, so as to ensure the stability of the mold closing of the movable mold body 5 and the fixed mold body 2; then the external injection molding machine can be started, so that the external injection molding machine can inject the heated thermoplastic plastic into the fixed mold body 2 through the injection molding hose 8, so as to perform injection molding on the external semiconductor lead frame. After the injection molding is completed, the staff starts the axial flow fan 34. At this time, the working axial flow fan 34 will generate negative pressure inside the air guide shell 32 to suck the air on the right side, and the inhaled air will be respectively The air is diverted to the upper and lower sides, and then the air guide shell 32 will guide the air to the multiple upper air guide holes 33 and the lower air guide holes 31 respectively, so as to ventilate and cool the movable mold body 5 and the fixed mold body 2 at the same time, so that the external semiconductor lead frame inside the fixed mold body 2 is quickly cooled and formed; when the movable mold body 5 and the fixed mold body 2 are cooled to the required time, the staff controls the low-speed motor 37 to reverse, so that the first support plate 36 and the second support plate 95 can be moved outward synchronously, so that the positioning seat 91 and the air guide shell 32 can be moved outward synchronously, and at this time, the electric push rod 7 is controlled to perform a contraction action, so that the movable mold body 5 can be moved upward to open the mold (reference Figure 2 or Figure 4 ) so that the staff can take out the formed external semiconductor lead frame from the fixed mold body 2.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor lead frame processing injection molding device, comprising a workbench (1), a fixed mold body (2), a support frame (4), a movable mold body (5), a connecting frame (6) and an electric push rod (7), characterized in that: The upper end surface of the workbench (1) is fixedly connected to a support frame (4), an electric push rod (7) is installed at the middle position of the upper end surface of the support frame (4), a connecting frame (6) is installed at the lower end of the electric push rod (7), a movable mold body (5) is installed at the lower end of the connecting frame (6), a fixed mold body (2) is installed at the middle position of the upper end surface of the workbench (1), and an injection hose (8) is connected to the inlet of the upper end surface of the movable mold body (5); The workbench (1) is provided with a blowing assembly (3) on the right side of the upper end surface, and the blowing assembly (3) is used to ventilate and cool the movable mold body (5) and the fixed mold body (2), so that the external semiconductor lead frame after injection molding can be cooled and molded more quickly. The workbench (1) is provided with an auxiliary fixing assembly (9) on the left side of the upper end surface, and the auxiliary fixing assembly (9) is used to auxiliary fix the movable mold body (5) and the fixed mold body (2) after mold closing, so as to ensure the mold closing stability of the movable mold body (5) and the fixed mold body (2).

2. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: The blowing assembly (3) comprises a lower air guide hole (31), an air guide shell (32), an upper air guide hole (33), an axial flow fan (34) and a first support plate (36); the first support plate (36) is installed on the right side of the workbench (1); a diverter shell is provided at the upper end of the first support plate (36); the axial flow fan (34) is installed on the right side of the air guide shell (32); the upper air guide hole (33) is opened on the upper side of the movable mold body (5); and the lower air guide hole (31) is opened on the lower side of the fixed mold body (2).

3. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: A low-speed motor (37) is installed on the right side of the workbench (1), and a double-threaded screw rod (35) is installed on the left end of the low-speed motor (37). The external thread on the left side of the annular side of the double-threaded screw rod (35) rotates in opposite directions to the external thread on the right side of the annular side.

4. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: The auxiliary fixing assembly (9) comprises a positioning seat (91), an extension rod (92), a lower positioning groove (93), an upper positioning groove (94) and a second support plate (95); the second support plate (95) is installed on the left side of the inside of the workbench (1); an extension rod (92) is arranged on the upper side of the right end surface of the second support plate (95); a positioning seat (91) is arranged on the right end of the extension rod (92); an upper positioning groove (94) is provided on the left end surface of the movable mold body (5); and a lower positioning groove (93) is provided on the left end surface of the fixed mold body (2).

5. The semiconductor lead frame processing injection molding device according to claim 4, characterized in that: The positioning seat (91) is concave in shape, and the positioning seat (91) matches the upper positioning groove (94) and the lower positioning groove (93) respectively.

6. The semiconductor lead frame processing injection molding device according to claim 2, characterized in that: The upper and lower sides of the left end surface of the air guide shell (32) are bonded with sealing frames (322), and the sealing frame (322) is made of silicone rubber. The left side of the inside of the air guide shell (32) is fixedly connected with a diverter block (321), and the diverter block (321) is in a triangular shape.

7. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: The upper end surface of the workbench (1) is symmetrically provided with limit cavities (11) on both sides, the lower end surface of the movable mold body (5) is symmetrically provided with limit holes (51) on both sides, the upper end surface of the fixed mold body (2) is symmetrically provided with limit blocks (21) on both sides, and the limit blocks (21) match the limit holes (51), and the fixed mold body (2) matches the movable mold body (5).

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