Semiconductor braid positioning device

Abstract

The utility model relates to the technical field of semiconductor production equipment, in particular to a semiconductor braid positioning device which comprises a workbench, a containing groove formed in the workbench, a pressing plate located above the containing groove, a positioning plate connected with the pressing plate through a connecting plate and a bolt used for fixing the positioning plate to the workbench. The pressing plate is connected with the connecting plate, the positioning plate is connected with the connecting plate, a kidney-shaped hole is formed among the pressing plate, the connecting plate and the positioning plate, and the bottom of the pressing plate is sunken in the direction away from the containing groove so as to form a temperature buffering area used for reducing the contact area of the pressing plate and the upper cover tape. The contact area of the pressing plate and the upper cover tape is reduced, adhesion of the upper cover tape and a product caused by too high temperature of the upper cover tape is avoided, the vacuum adsorption holes are formed in the bottom of the containing groove, the adsorption force on the carrier tape is improved, vibration of the carrier tape is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production equipment, in particular to a semiconductor tape positioning device. Background Art

[0002] In semiconductor packaging testing, a testing machine is needed to test whether the relevant performance of the product meets customer requirements. After the test is completed, the product needs to be packaged into tape to facilitate the subsequent product flow of the customer.

[0003] The existing technology is to use a stainless steel locator to cover the upper cover tape, and then use high temperature hot pressing to sew the upper cover tape and the lower cover tape together. During the upper cover tape sewing process, a 304 stainless steel braided tape locator is placed on it to cover the upper cover tape, and the upper cover tape and the lower cover tape are hot-pressed and welded together at high temperature to package the product into the carrier tape. During the hot pressing welding process, the high temperature will be conducted, which will cause the upper cover tape and the product to stick together, causing subsequent quality problems. Summary of the invention

[0004] The utility model aims to solve the above-mentioned shortcomings in the prior art and proposes a semiconductor tape positioning device.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor tape positioning device is designed, including a workbench, a receiving groove opened on the workbench, a pressing plate located above the receiving groove, a positioning plate connected to the pressing plate through a connecting plate, and bolts for fixing the positioning plate to the workbench, a waist hole is formed between the pressing plate, the connecting plate, and the positioning plate, and the bottom of the pressing plate is recessed in a direction away from the receiving groove to form a temperature buffer zone for reducing the contact area between the pressing plate and the upper cover tape.

[0007] Furthermore, a vacuum adsorption hole is provided at the bottom of the receiving tank.

[0008] Furthermore, the cross section of the temperature buffer zone is L-shaped.

[0009] Furthermore, the pressing plate is provided with a plurality of heat dissipation holes.

[0010] Furthermore, the heat dissipation holes extend from the side of the pressing plate toward the waist hole.

[0011] Furthermore, the axial axis of the heat dissipation hole and the side surface have an angle a, wherein 30°

[0012] <a<50°。

[0013] The semiconductor tape positioning device proposed by the utility model has the following beneficial effects:

[0014] The utility model increases the gap between the pressing plate and the upper cover belt, reduces the contact area between the pressing plate and the upper cover belt, avoids the upper cover belt and the product sticking together due to the upper cover belt being too hot, and increases the adsorption force on the carrier belt by opening a vacuum adsorption hole at the bottom of the accommodating groove, reduces the vibration of the carrier belt, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 It is a side view of the utility model;

[0017] Figure 3 It is a schematic diagram of an existing tape positioning device;

[0018] Figure 4 This is a schematic diagram of the use state of the utility model; DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] Reference Figure 1-4 A semiconductor tape positioning device includes a workbench 1, a receiving groove 101 opened on the workbench 1 for placing the tape, a pressing plate 2 located above the receiving groove 101, a positioning plate 4 connected to the pressing plate 2 through a connecting plate 3, and a bolt 5 for fixing the positioning plate 4 on the workbench 1. A waist hole 6 is formed between the pressing plate 2, the connecting plate 3, and the positioning plate 4. The bottom of the pressing plate 2 is recessed in a direction away from the receiving groove 101 to form a temperature buffer zone 7 for reducing the contact area between the pressing plate 2 and the upper cover tape 8.

[0021] The utility model increases the gap between the pressing plate 2 and the upper cover belt 8 and reduces the contact area between the pressing plate 2 and the upper cover belt 8 by setting the temperature buffer zone 7, thereby avoiding the upper cover belt 8 and the product from being adhered to each other due to the over-high temperature of the upper cover belt 8.

[0022] In an optional embodiment of the present invention, a vacuum adsorption hole 9 is provided at the bottom of the receiving groove 101. By opening the vacuum adsorption hole 9 at the bottom of the receiving groove 101, the adsorption force on the carrier tape 10 is increased, the vibration of the carrier tape 10 is reduced, and the production efficiency is improved.

[0023] In an optional implementation of the present invention, the cross section of the temperature buffer zone 7 is L-shaped.

[0024] In an alternative embodiment of the present utility model, a plurality of heat dissipation holes 201 are formed in the pressing plate 2. By providing the heat dissipation holes 201 in the pressing plate 2, the heat on the pressing plate 2 can be diffused, thereby reducing the heat entering the temperature buffer zone 7.

[0025] In an alternative embodiment of the present utility model, the heat dissipation holes 201 extend from the side surface 202 of the pressing plate 2 towards the waist-shaped hole 6. Such a setting enables the heat of the pressing plate 2 to be diffused towards the side surface 202 direction, thereby reducing the heat entering the temperature buffer zone 7.

[0026] In an alternative embodiment of the present utility model, the axial center line of the heat dissipation hole 201 and the side surface 202 form an included angle a, where 30° < a < 50°. Preferably, in this embodiment, the heat dissipation hole 201 inclines from the end close to the side surface 202 towards the bottom of the pressing plate 2.

[0027] The above is only a preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, makes equivalent substitutions or changes, and should be covered within the protection scope of the present utility model.

Claims

1. A semiconductor tape positioning device, comprising a workbench (1), a receiving groove (101) provided on the workbench (1), a pressing plate (2) located above the receiving groove (101), a positioning plate (4) connected to the pressing plate (2) via a connecting plate (3), and a bolt (5) for fixing the positioning plate (4) to the workbench (1), wherein a waist hole (6) is formed between the pressing plate (2), the connecting plate (3) and the positioning plate (4), characterized in that: The bottom of the pressing plate (2) is recessed in a direction away from the containing groove (101) to form a temperature buffer zone (7) for reducing the contact area between the pressing plate (2) and the upper cover belt (8).

2. The semiconductor tape positioning device according to claim 1, characterized in that: A vacuum adsorption hole (9) is provided at the bottom of the containing groove (101).

3. The semiconductor tape positioning device according to claim 1, characterized in that: The cross section of the temperature buffer zone (7) is L-shaped.

4. The semiconductor tape positioning device according to claim 1, characterized in that: The pressing plate (2) is provided with a plurality of heat dissipation holes (201).

5. The semiconductor tape positioning device according to claim 4, characterized in that: The heat dissipation hole (201) extends from the side surface (202) of the pressing plate (2) toward the waist hole (6).

6. The semiconductor tape positioning device according to claim 5, characterized in that: The axial axis of the heat dissipation hole (201) and the side surface (202) have an included angle a, wherein 30° <a<50°。

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