Sensor and electronic device

Abstract

The utility model belongs to the technical field of sensing devices, and particularly relates to a sensor and electronic equipment. The sensor comprises a shell assembly and a sensing chip, the shell assembly comprises a substrate and a shell arranged on the substrate, the shell and the substrate define a containing cavity, a conductive adhesive layer is arranged between the shell and the substrate, the conductive adhesive layer is used for connecting the substrate and the shell, and the sensing chip is arranged in the containing cavity. The sensing chip is located in the containing cavity and arranged on the side, facing the containing cavity, of the substrate. According to the sensor provided by the utility model, the shell and the substrate are connected through the conductive adhesive layer, the conductive adhesive layer is stable in conduction, and local high-temperature reaction is not easy to generate during a backflow process, so that the generation of bubbles is reduced, the bubbles enter the accommodating cavity, the detection of the sensor is not influenced, the detection result is more accurate, and the reliability is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of sensor devices, and in particular relates to a sensor and an electronic device. Background Art

[0002] Waterproof pressure sensors use the pressure characteristics of atmospheric pressure to directly convert pressure input into changes in electrical signals. Integrated circuit technology is used to amplify, denoise, and convert digital to analog / analog to digital signals. Temperature drift, nonlinearity, sensitivity, etc. are corrected electrically or digitally to obtain a linear input-output relationship with little temperature correlation. Currently, the main bottleneck process of waterproof pressure sensors is gel-filled waterproofing. During the reflow process, the solder paste between the substrate and the shell will produce bubbles and be fixed in the gel, resulting in abnormal pressure values ​​and affecting the accuracy of sensor detection. Utility Model Content

[0003] The purpose of the utility model is to at least solve the problem of poor accuracy of detection of existing air pressure sensors. This purpose is achieved through the following technical solutions:

[0004] The first aspect of the utility model provides a sensor, comprising:

[0005] A housing assembly, comprising a substrate and a shell provided on the substrate, wherein the shell and the substrate together form a receiving cavity, and a conductive adhesive layer is provided between the shell and the substrate, and the conductive adhesive layer is used to connect the substrate and the shell;

[0006] The sensor chip is located in the accommodating cavity and is arranged on a side of the substrate facing the accommodating cavity.

[0007] According to the sensor of the utility model, the shell and the substrate are connected by a conductive adhesive layer. The conductive adhesive layer is stably conductive and is not prone to local high-temperature reaction during the reflow process, thereby reducing the generation of bubbles and their entry into the accommodating cavity, which will not affect the detection of the sensor, making the detection result more accurate and improving reliability.

[0008] In addition, the sensor according to the utility model may also have the following additional technical features:

[0009] In some embodiments of the present utility model, the inner wall surface of one end of the shell body connected to the substrate has a first chamfered structure, and the first chamfered structure is bonded to the conductive adhesive layer.

[0010] In some embodiments of the present invention, an outer wall surface of one end of the shell body connected to the substrate has a second chamfered structure, and the second chamfered structure is bonded to the conductive adhesive layer.

[0011] In some embodiments of the present invention, the housing and the conductive adhesive layer are a hot-pressed integrally formed structure.

[0012] In some embodiments of the present invention, the accommodating cavity is filled with sealant, and the sealant covers the sensor chip.

[0013] In some embodiments of the present invention, a projection of the housing toward the conductive adhesive layer is located within the conductive adhesive layer.

[0014] In some embodiments of the present invention, the sensor chip includes a MEMS chip and an ASIC chip electrically connected to each other, the MEMS chip is arranged on a side of the substrate facing the accommodating cavity, the ASIC chip is arranged on a side of the MEMS chip facing away from the substrate, and the ASIC chip is electrically connected to the substrate.

[0015] In some implementations of the present invention, the MEMS chip and the ASIC chip, as well as the ASIC chip and the substrate are all bonded together.

[0016] In some implementations of the present invention, the conductive adhesive layer is a HAF adhesive layer.

[0017] A second aspect of the utility model provides an electronic device having the above-mentioned sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0019] Figure 1 The cross-sectional structure diagram of the sensor according to the embodiment of the utility model is schematically shown;

[0020] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure of the sensor in the AA direction;

[0021] Figure 3 for Figure 1 A combined cross-sectional view of the housing and the conductive adhesive layer of the sensor;

[0022] Figure 4 for Figure 3 Schematic diagram of the structure of the conductive adhesive layer.

[0023] The reference numerals in the accompanying drawings represent the following:

[0024] 10. Shell assembly; 11. Base plate; 12. Shell; 121. Accommodating cavity; 1211. Sealant; 122. First chamfer structure; 123. Second chamfer structure; 13. Conductive adhesive layer;

[0025] 20. Sensor chip; 21. MEMS chip; 22. ASIC chip. DETAILED DESCRIPTION

[0026] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0027] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0028] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0029] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both above and below orientations.

[0030] The waterproof pressure sensor uses the pressure characteristics of atmospheric pressure to directly convert the pressure input into a change in electrical signals. It uses integrated circuit technology to achieve signal amplification, denoising, and digital-to-analog / analog-to-digital conversion. It performs electrical or digital corrections on temperature drift, nonlinearity, sensitivity, etc. to obtain a linear input-output relationship with low temperature correlation. At present, the main bottleneck process of waterproof pressure sensors is gel-filled waterproofing. Solder paste or silver glue is usually used to connect and seal the substrate and the shell. During the secondary reflow, due to the characteristics of solder paste or silver paste, the local temperature is too high, causing the solder paste or silver glue to sputter to the sealant in the cavity to form bubbles, which ultimately leads to performance problems in the client's use, making the pressure value abnormal and affecting the accuracy of sensor detection.

[0031] Figure 1 The cross-sectional structure diagram of the sensor according to the embodiment of the utility model is schematically shown. Figure 1 As shown, the utility model proposes a sensor and an electronic device. The sensor in the utility model includes a housing component 10 and a sensor chip 20, the housing component 10 includes a substrate 11 and a shell 12 arranged on the substrate 11, the shell 12 and the substrate 11 together form a receiving cavity 121, a conductive adhesive layer 13 is arranged between the shell 12 and the substrate 11, the conductive adhesive layer 13 is used to connect the substrate 11 and the shell 12, the sensor chip 20 is located in the receiving cavity 121, and is arranged on the side of the substrate 11 facing the receiving cavity 121.

[0032] According to the sensor of the present invention, the shell 12 and the substrate 11 are connected by a conductive adhesive layer 13. The conductive adhesive layer 13 is stably conductive and is not prone to local high-temperature reaction during the reflow process, thereby reducing the generation of bubbles and the entry of bubbles into the accommodating cavity 121, which will not affect the detection of the sensor, making the detection result more accurate and improving reliability.

[0033] Specifically, in this embodiment, if Figure 4As shown, the conductive adhesive layer 13 is a HAF adhesive layer and has a circular ring structure, which is sandwiched between the shell 12 and the substrate 11 , and can connect the shell 12 and the substrate 11 , and can also seal the accommodating cavity 121 .

[0034] In some embodiments of the present invention, Figure 3 As shown, the inner wall surface of one end of the housing 12 connected to the substrate 11 has a first chamfered structure 122, and the first chamfered structure 122 is arranged in affixed with the conductive adhesive layer 13. In this embodiment, when the housing 12 and the HAF adhesive are attached, along the direction of the housing 12 toward the substrate 11, the length of the conductive adhesive layer 13 attached to the first chamfered structure 122 is greater than the length of the conductive adhesive layer 13 attached to the middle of the housing 12, so that the conductive adhesive layer 13 can wrap the inner wall surface of one end of the housing 12. Since the attachment area between the housing 12 and the conductive adhesive layer 13 is increased, the connection strength is also increased. At the same time, the inner wall surface of one end of the housing 12 can also be wrapped, further improving the sealing performance of the accommodating cavity 121.

[0035] In some embodiments of the present invention, Figure 3 As shown, the outer wall surface of one end of the shell 12 connected to the substrate 11 has a second chamfered structure 123, and the second chamfered structure 123 is arranged in affixed with the conductive adhesive layer 13. In this embodiment, when the shell 12 and the HAF adhesive are attached, along the direction of the shell 12 toward the substrate 11, the length of the conductive adhesive layer 13 attached to the second chamfered structure 123 is greater than the length of the conductive adhesive layer 13 attached to the middle part of the shell 12, so that the conductive adhesive layer 13 can wrap the outer wall surface of one end of the shell 12. Since the attachment area of ​​the shell 12 and the conductive adhesive layer 13 is increased, the connection strength is further increased with the cooperation of the first chamfered structure 122 and the conductive adhesive layer 13. At the same time, the outer wall surface of one end of the shell 12 can also be wrapped, and with the cooperation of the first chamfered structure 122 and the conductive adhesive layer 13, the sealing performance of the accommodating cavity 121 is further improved.

[0036] In some embodiments of the utility model, the housing 12 and the conductive adhesive layer 13 are hot-pressed integrally formed structures. In this embodiment, the housing 12 and the conductive adhesive layer 13 are pre-hot-pressed, that is, the conductive adhesive layer 13 is pre-bonded to the side of the housing 12 facing the substrate 11, and the structure is integrally formed. In the assembly process of the sensor in this embodiment, the housing 12 and the conductive adhesive layer 13 are pre-hot-pressed integrally formed, and then the hot-pressed integrally formed housing 12 and the conductive adhesive layer 13 are bonded to the substrate 11. In the prior art, solder paste or silver glue is first applied to the corresponding connection between the substrate 11 and the housing 12. The utility model can simplify the manual operation steps and reduce the influence of errors caused by manual operation.

[0037] In some embodiments of the present invention, Figure 1 and 2 As shown, the accommodating cavity 121 is filled with sealant 1211, and the sealant 1211 covers the sensor chip 20. In this embodiment, the sealant 1211 is a coating glue, and after the housing 12, the conductive glue layer 13, and the sensor chip 20 are assembled with the substrate 11, the accommodating cavity 121 is filled with the coating glue, which can provide sealing protection for the sensor chip 20.

[0038] In some embodiments of the present invention, Figure 1 As shown, the projection of the housing 12 toward the conductive adhesive layer 13 is located inside the conductive adhesive layer 13. In this embodiment, the above arrangement can ensure that along the radial direction of the housing 12, the length of the conductive adhesive layer 13 is greater than the length of the housing 12, so that the conductive adhesive layer 13 can be more stably connected and sealed to the housing 12, thereby improving reliability.

[0039] In some embodiments of the present invention, Figure 1 As shown, the sensor chip 20 includes a MEMS chip 21 and an ASIC chip 22 which are electrically connected to each other. The MEMS chip 21 is arranged on the side of the substrate 11 facing the accommodating cavity 121, and the ASIC chip 22 is arranged on the side of the MEMS chip 21 away from the substrate 11. The ASIC chip 22 is electrically connected to the substrate 11. In this embodiment, when the outside world applies pressure to the sensor, the MEMS chip 21 will produce a slight bending deformation, and the deformation will cause the resistance value of the MEMS chip 21 to change, thereby generating a capacitance signal. Since the MEMS chip 21 is electrically connected to the ASIC chip 22, the changed capacitance signal can be transmitted to the ASIC chip 22, and the ASIC chip 22 can convert the capacitance signal and finally output an electrical signal, that is, the conversion of air pressure and electrical signal is completed.

[0040] In some embodiments of the present invention, the MEMS chip 21 and the ASIC chip 22, as well as the ASIC chip 22 and the substrate 11 are bonded. In this embodiment, the MEMS chip 21 and the ASIC chip 22 are bonded by chip colloid, which can ensure the stability of the connection between the two. The ASIC chip 22 and the substrate 11 are bonded by chip colloid, which can ensure the stability of the connection between the two.

[0041] In some embodiments of the present invention, the sensor is an air pressure sensor.

[0042] Furthermore, in this embodiment, the assembly process of the air pressure sensor is as follows: first, one side of the shell 12 and the conductive adhesive layer 13 are hot-pressed into an integral shape (at this time, the first chamfered structure 122 and the second chamfered structure 123 will not be respectively fitted with the HAF adhesive layer), and then the integrally formed shell 12 and the conductive adhesive layer 13 are adhered to the substrate 11 (during the extrusion process, the first chamfered structure 122 and the second chamfered structure 123 will be respectively fitted with the HAF adhesive layer), and then the conductive adhesive layer 13 is waited for to solidify, and then the sensor chip is bonded to the substrate 11, and finally the sealant 1211 is poured into the accommodating cavity 121, and the sealant 1211 is waited for to solidify.

[0043] The utility model also provides an electronic device, which may be a mobile phone, a watch or other electronic device, and has the above-mentioned sensor.

[0044] According to the sensor of the electronic device of the utility model, the shell 12 and the substrate 11 are connected by a conductive adhesive layer 13. The conductive adhesive layer 13 is stably conductive and is not prone to local high-temperature reaction during the reflow process, thereby reducing the generation of bubbles and the entry of bubbles into the accommodating cavity 121, which will not affect the detection of the sensor, making the detection result more accurate and improving reliability.

[0045] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.

Claims

1. A sensor, characterized in that: include: A housing assembly, comprising a substrate and a shell provided on the substrate, wherein the shell and the substrate together form a receiving cavity, and a conductive adhesive layer is provided between the shell and the substrate, and the conductive adhesive layer is used to connect the substrate and the shell; A sensor chip is located in the accommodating cavity and is arranged on a side of the substrate facing the accommodating cavity; The accommodating cavity is filled with sealant, and the sealant covers the sensor chip; The projection of the shell toward the conductive adhesive layer is located inside the conductive adhesive layer.

2. The sensor according to claim 1, characterized in that The inner wall surface of one end of the shell body connected to the substrate has a first chamfered structure, and the first chamfered structure is bonded to the conductive adhesive layer.

3. The sensor according to claim 1, characterized in that The outer wall surface of one end of the shell body connected to the substrate has a second chamfered structure, and the second chamfered structure is bonded to the conductive adhesive layer.

4. The sensor according to claim 1, characterized in that The shell and the conductive adhesive layer are a hot-pressed integrally formed structure.

5. The sensor according to claim 1, characterized in that The sensor chip includes a MEMS chip and an ASIC chip electrically connected to each other. The MEMS chip is arranged on a side of the substrate facing the accommodating cavity, and the ASIC chip is arranged on a side of the MEMS chip away from the substrate. The ASIC chip is electrically connected to the substrate.

6. The sensor according to claim 5, characterized in that The MEMS chip and the ASIC chip, as well as the ASIC chip and the substrate are all bonded.

7. The sensor according to claim 1, characterized in that The conductive adhesive layer is a HAF adhesive layer.

8. An electronic device, characterized in that: A sensor according to any one of claims 1 to 7 is provided.

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