Multichannel optical emission spectrum end point detection equipment

Abstract

The utility model provides multichannel optical emission spectrum end point detection equipment which comprises a plurality of signal acquisition modules which are correspondingly connected with a plurality of etching cavities respectively and correspondingly acquire optical signals in the etching cavities respectively, transmitting the light signals to a plurality of spectrum modules to correspondingly receive the light signals and generate corresponding spectrum data; the signal processing module is connected with the plurality of signal acquisition modules through cables and is used for receiving the spectral data transmitted by the signal acquisition modules and synchronously processing the spectral data; a plurality of signal acquisition modules are integrated on one piece of optical emission spectrum equipment, so that one piece of equipment is used for carrying out etching end point detection on a plurality of etching cavities at the same time; the detection efficiency of a single device is effectively improved, and the space occupancy rate of the device is greatly reduced by improving the integration level of the device.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor detection, in particular to a multi-channel optical emission spectrum endpoint detection device. Background Art

[0002] Etching endpoint detection equipment is a device used to monitor and detect the endpoint of the etching process in the semiconductor manufacturing process. Etching is one of the key steps in manufacturing semiconductor chips, mainly removing specific material layers from the surface of the wafer by chemical or physical means. In this process, it is crucial to accurately detect the endpoint of etching, as over-etching or under-etching will affect the quality of the final product. The role of the etching endpoint detection equipment is to detect the progress of etching in real time during the etching process, and accurately determine when the etching reaches the target layer, ensuring that the timing of stopping etching is accurate. Among them, the OES etching endpoint detection equipment is a device that uses optical emission spectroscopy technology to detect the endpoint of the etching process.

[0003] The etching machine in the prior art generally has multiple etching chambers. In order to meet the real-time monitoring of the etching endpoints of multiple etching chambers, it is usually necessary to equip multiple OES etching endpoint detection devices, which is not ideal from the perspective of detection efficiency, equipment investment cost, and production space utilization. This application is dedicated to proposing a multi-channel optical emission spectroscopy endpoint detection device to achieve simultaneous detection of multiple chambers by one device. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a multi-channel optical emission spectrum endpoint detection device for realizing simultaneous detection of multiple etching cavities by one device.

[0005] To achieve the above object, the utility model provides a multi-channel optical emission spectrum endpoint detection device, comprising:

[0006] A plurality of signal acquisition modules are respectively arranged on different etching cavities, and the plurality of signal acquisition modules are used to respectively acquire optical signals in the corresponding etching cavities;

[0007] A plurality of spectral modules are connected to the corresponding signal acquisition modules through optical fibers; the spectral modules are used to receive the corresponding optical signals and generate the corresponding spectral data;

[0008] The signal processing module is connected to the plurality of spectral modules via cables, and the signal processing module is used to receive the plurality of spectral data and synchronously process the plurality of spectral data.

[0009] The technical effect achieved through the above technical scheme is: by integrating multiple signal acquisition modules, multiple spectrum modules, and signal processing modules on an optical emission spectroscopy device, it is possible to use one device to perform etching endpoint detection on multiple etching cavities at the same time; the detection efficiency of a single device is effectively improved, and at the same time, by increasing the integration of the device, the space occupancy rate of the device is greatly reduced.

[0010] Preferably, the spectrum module includes:

[0011] substrate;

[0012] A light splitting system is arranged on the substrate and connected to the signal acquisition module through the optical fiber; the light splitting system is used to collimate and split the optical signal;

[0013] The signal detection system is arranged on the substrate and located on the optical path of the optical signal; the signal detection system is used to convert the collimated and split optical signal into an electrical signal.

[0014] Through the above technical scheme, the technical effect achieved is: by setting the spectroscopic system, the collimation and splitting of the optical signal can be achieved, and by setting the signal detection system, the collimated and split optical signal can be converted into an electrical signal for subsequent signal processing module analysis and processing.

[0015] Preferably, the spectroscopic system comprises:

[0016] A slit, arranged on the substrate and located on the optical path of the optical signal, for screening and collimating the optical signal;

[0017] A reflector, disposed on the substrate and located on the optical path of the optical signal, and used for changing the optical path direction of the optical signal;

[0018] A grating, arranged on the substrate and located on the optical path of the optical signal, and used for cooperating with the reflector to split the optical signal;

[0019] A focusing mirror is arranged on the substrate and located on the optical path of the optical signal, and is used for focusing the optical signal.

[0020] The technical effect achieved by the above technical solution is: in the spectroscopic system, the width of the light entering the spectrometer can be limited by setting a slit, thereby improving the resolution and accuracy of the spectrum. By adjusting the width of the slit, the intensity and resolution of the light entering the spectrometer can be controlled, thereby realizing the screening and collimation of the light signal; the reflector cooperates with the grating to realize spectroscopic analysis, wherein the reflector can reflect the light signal onto the grating, and the grating can diffract the light signal into different angles and decompose it into light of different wavelengths, so as to realize the measurement of the spectrum; the focusing mirror can focus the split light signal onto the image sensor, thereby facilitating the image sensor to receive the light signal.

[0021] Preferably, the signal detection system comprises:

[0022] An image sensor, disposed on the substrate, for receiving the optical signal focused by the focusing lens and converting the optical signal into an electrical signal;

[0023] The signal acquisition and conversion module is arranged on the substrate and is electrically connected to the image sensor, and is used for acquiring and amplifying the electrical signal.

[0024] Through the above technical scheme, the technical effect achieved is: by setting up an image sensor, the optical signal can be converted into an electrical signal, thereby facilitating the subsequent signal processing module to process it; by setting up a signal acquisition conversion module to collect and amplify the electrical signal, on the one hand, it is beneficial to improve the signal strength to meet the processing requirements of the subsequent signal processing module, and on the other hand, it can reduce the impact of external interference, thereby improving the signal quality and being more conducive to the subsequent signal analysis and processing.

[0025] Preferably, the signal acquisition and conversion module includes an A / D converter, and the A / D converter is used to amplify the collected electrical signal.

[0026] Through the above technical solution, the technical effect achieved is: the A / D converter in the signal acquisition module can amplify the collected electrical signal for subsequent processing by the digital system (signal processing module).

[0027] Preferably, it further comprises a main box, wherein the spectrum module and the signal processing module are arranged in the main box, and the signal acquisition module is connected to the main box via the optical fiber.

[0028] Through the above technical solution, the technical effect achieved is: the main chassis can effectively avoid external interference, especially electromagnetic interference, which is conducive to the normal operation of the internal spectrum module and the signal processing module.

[0029] Preferably, the main chassis includes a front panel, and a plurality of plug holes for connecting the optical fibers are arranged on the front panel, and each of the plug holes is respectively connected to a corresponding spectral module.

[0030] The technical effect achieved by the above technical solution is: by setting a front panel and setting a plurality of plug holes on the front panel, the optical fiber and the spectrum module are quickly connected to improve the connection efficiency.

[0031] Preferably, the main chassis is provided with a plurality of heat dissipation areas, and the heat dissipation areas are provided with a plurality of rows of heat dissipation holes arranged at equal intervals.

[0032] Through the above technical scheme, the technical effect achieved is: setting up multiple heat dissipation zones on the main chassis is conducive to quickly dissipating the heat inside the main chassis, improving the heat dissipation efficiency of the equipment, and further facilitating the stable operation of various electronic devices inside the main chassis.

[0033] Preferably, the main chassis is provided with a grounding wire jack for connecting a grounding wire.

[0034] Through the above technical scheme, the technical effect achieved is: by setting a socket for connecting the grounding wire on the main box, it is convenient to plug in the grounding wire; further, static electricity can be discharged in time through the grounding wire to prevent static electricity accumulation, thereby protecting the safety of the equipment; in addition, the grounding wire can provide a safe channel for accidental leakage current, introduce the current into the earth, and thus protect personal safety.

[0035] Preferably, the signal acquisition module is an optical probe.

[0036] The technical effect achieved by the above technical solution is: in this solution, the signal form to be collected is the optical signal in the etching cavity, and the optical signal can be collected by using an optical probe.

[0037] The beneficial effect of the utility model is that by integrating multiple signal acquisition modules, multiple spectrum modules, and signal processing modules on an optical emission spectrum device, it is possible to use one device to perform etching endpoint detection on multiple etching cavities at the same time; the detection efficiency of a single device is effectively improved, and at the same time, by increasing the integration of the device, the space occupancy rate of the device is greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 This is a schematic diagram of the connection of various modules of the multi-channel optical emission spectroscopy endpoint detection device according to an embodiment of the utility model;

[0039] Figure 2 This is a schematic diagram of a first viewing angle of a multi-channel optical emission spectroscopy endpoint detection device according to an embodiment of the utility model;

[0040] Figure 3 This is a schematic diagram of the structure of the spectrum module in the embodiment of the utility model;

[0041] Figure 4 This is a second viewing angle schematic diagram of the multi-channel optical emission spectroscopy endpoint detection device according to an embodiment of the utility model;

[0042] Figure 5 This is a schematic diagram from a third viewing angle of the multi-channel optical emission spectroscopy endpoint detection device according to an embodiment of the utility model.

[0043] Reference numerals:

[0044] Main chassis 1, front panel 11, rear panel 12, left side panel 13, right side panel 14, top panel 15, bottom panel 16, plug hole 111, heat dissipation area 17, ground wire plug hole 18, mounting plate 19,

[0045] a first optical probe 21, a second optical probe 22, a third optical probe 23, a fourth optical probe 24,

[0046] Optical fiber 3,

[0047] Spectral module 4, substrate 41, slit 42, reflector 43, grating 44, focusing lens 45, image sensor 46, first spectral module 401, second spectral module 402, third spectral module 403, fourth spectral module 404,

[0048] Signal processing module 5. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be the usual meanings understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Unless otherwise specified, the "connection" described in this article can be a direct connection or an indirect connection, that is, a connection through an intermediate.

[0050] See also Figure 1 , Figure 2 The utility model provides a multi-channel optical emission spectrum endpoint detection device, including: a main box 1, a plurality of signal acquisition modules, a plurality of spectrum modules 4, and a signal processing module 5.

[0051] Wherein, a plurality of signal acquisition modules are respectively arranged on different etching cavities, and the plurality of signal acquisition modules are used to respectively acquire optical signals in the corresponding etching cavities;

[0052] The multiple spectrum modules are connected to the corresponding signal acquisition modules through optical fibers; the spectrum modules are used to receive the corresponding optical signals and generate the corresponding spectrum data;

[0053] The signal processing module is connected to the multiple spectrum modules via cables, and the signal processing module is used to receive the multiple spectrum data and synchronously process the multiple spectrum data.

[0054] Specifically, in this embodiment, the multi-channel expanded optical emission spectroscopy device is provided with four signal acquisition modules, and the four signal acquisition modules are respectively connected to four etching cavities. The four signal acquisition modules respectively collect optical signals in the four etching cavities, and transmit the optical signals to the corresponding spectral modules through the optical fibers. The spectral modules process the optical signals and generate corresponding spectral data. Among them, the four etching cavities can be four etching cavities of the same etcher, or they can be four etching cavities distributed in different etchers. In other embodiments, the number of integrated signal acquisition modules can be changed according to actual needs, and is not limited to the four in this embodiment.

[0055] The signal processing module 5 is connected to the four spectral modules via cables, and is used to receive the spectral data transmitted by the four spectral modules, and synchronously process the spectral data. In this embodiment, the signal processing module 5 includes a data processing system (software system), and the data processing system uses the logic of collecting spectral change trends and the algorithm of determining the end point to realize the detection and control of the process. Further, the data processing system is provided with four data processing units, which can realize the synchronous processing of four groups of spectral data respectively.

[0056] In the above design, multiple signal acquisition modules are integrated on an optical emission spectroscopy device to realize etching endpoint detection of multiple etching chambers at the same time using one device, which effectively improves the detection efficiency of a single device. At the same time, by improving the integration of the device, the space occupied by the device is greatly reduced.

[0057] See also Figure 1 , Figure 2In this embodiment, the signal acquisition module uses an optical probe, which is arranged on the etching cavity (not shown in the figure) to collect the optical signal in the etching cavity; further, the etching cavity is provided with an observation window, and the observation window is provided with high-transmittance glass; the optical probe is fixedly arranged on the etching cavity at a position convenient for receiving the optical signal from the observation window. In this embodiment, the optical probe is specifically arranged on the side of the observation window.

[0058] The optical probe is connected to an optical fiber; the other end of the optical fiber is connected to the spectrum module 4, and the spectrum module 4 is used to receive the optical signal and generate the spectrum data. In the above design, the optical probe is set to collect the optical signal in the etching cavity, and the collected optical signal is transmitted to the spectrum module 4 through the optical fiber, and the spectrum module 4 processes the optical signal and generates corresponding spectrum data.

[0059] The four signal acquisition modules in this embodiment include: a first optical probe 21, a second optical probe 22, a third optical probe 23, and a fourth optical probe 24; the four spectrum modules include: a first spectrum module 401, a second spectrum module 402, a third spectrum module 403, and a fourth spectrum module 404. Each optical probe is connected to the corresponding spectrum module through an optical fiber 3.

[0060] Furthermore, by providing a mounting plate 19 for mounting the spectrum module 4 in the main chassis 1 , the spectrum module 4 is fixedly connected in the main chassis 1 , and the spectrum module 4 is disposed on the mounting plate 19 .

[0061] Please refer to Figure 3 In this embodiment, the spectrum module 4 includes: a substrate 41, a spectroscopic system and a signal detection system; the spectroscopic system is arranged on the substrate 41 and connected to the optical probe through the optical fiber; the spectroscopic system is used to collimate and split the optical signal. The signal detection system is arranged on the substrate 41 and is located on the optical path of the optical signal; the signal detection system is used to convert the collimated and split optical signal into an electrical signal. By setting the spectroscopic system, the collimation and splitting of the optical signal can be achieved, and by setting the signal detection system, the collimated and split optical signal can be converted into an electrical signal for subsequent analysis and processing by the signal processing module 5.

[0062] Please refer to Figure 3 In this embodiment, the spectroscopic system includes a slit 42 , a reflector 43 , a grating 44 and a focusing mirror 45 .

[0063] The slit 42 is provided on the substrate 41 and located on the optical path of the optical signal, and is used to filter and collimate the optical signal. The reflector 43 is provided on the substrate 41 and located on the optical path of the optical signal, and is used to change the optical path direction of the optical signal. The grating 44 is provided on the substrate 41 and located on the optical path of the optical signal, and is used to cooperate with the reflector 43 to split the optical signal. The focusing mirror 45 is provided on the substrate 41 and located on the optical path of the optical signal, and is used to focus the optical signal.

[0064] In the spectroscopic system of the above design, the width of the light entering the spectrometer can be limited by setting the slit 42, thereby improving the resolution and accuracy of the spectrum. By adjusting the width of the slit 42, the intensity and resolution of the light entering the spectrometer can be controlled, thereby realizing the screening and collimation of the light signal; the reflector 43 cooperates with the grating 44 to realize spectroscopic analysis, wherein the reflector 43 can reflect the light signal onto the grating 44, and the grating 44 can decompose the light signal into light of different wavelengths to realize the measurement of the spectrum. Specifically, the surface of the grating 44 is usually engraved with a large number of parallel slits 42 of equal width and equal spacing, and these slits 42 can diffract and interfere with the light signal, thereby realizing the spectroscopic analysis of the light signal; the focusing mirror 45 can focus the split light signal onto the image sensor 46, thereby facilitating the image sensor 46 to receive the light signal.

[0065] Please refer to Figure 3 In this embodiment, the signal detection system includes: an image sensor 46 and a signal acquisition conversion module.

[0066] The image sensor 46 is disposed on the substrate 41, and is used to receive the optical signal focused by the focusing lens 45, and convert the optical signal into an electrical signal;

[0067] The signal acquisition conversion module is disposed on the substrate 41 and is electrically connected to the image sensor 46 for acquiring and amplifying the electrical signal. In this embodiment, the image sensor is a CMOS detector, and other types of image sensors may also be used in other embodiments.

[0068] In the above design, by setting up an image sensor 46, the optical signal can be converted into an electrical signal, thereby facilitating the subsequent signal processing module 5 to process it; by setting up a signal acquisition conversion module to collect and amplify the electrical signal, on the one hand, it is beneficial to improve the signal strength to meet the processing requirements of the subsequent signal processing module 5, and on the other hand, it can reduce the impact of external interference, thereby improving the signal quality and being more conducive to the subsequent signal analysis and processing.

[0069] In this embodiment, the signal acquisition and conversion module includes an A / D converter, and the A / D converter is used to amplify the acquired electrical signal so as to facilitate subsequent processing by a digital system (signal processing module 5).

[0070] In this embodiment, the spectrum module 4 and the signal processing module 5 are arranged in the main box 1, and the optical probe is connected to the main box 1 through the optical fiber. In this design, the main box 1 can effectively avoid external interference, especially electromagnetic interference, which is conducive to the normal operation of the internal spectrum module 4 and the signal processing module 5.

[0071] Please refer to Figure 1 , Figure 4 , Figure 5 In this embodiment, the main chassis 1 includes a front panel 11, a rear panel 12, a left side panel 13, a right side panel 14, a top panel 15 and a bottom panel 16; wherein, the front panel 11 is provided with a plurality of plug holes 111 for connecting the optical fiber, and each of the plug holes 111 is respectively connected to the corresponding spectrum module 4. The plug holes 111 support hot plugging. In this design, by providing the front panel 11 and providing a plurality of plug holes 111 on the front panel 11, the optical fiber is conveniently connected to the spectrum module 4 quickly, thereby improving the connection efficiency.

[0072] In this embodiment, the main chassis 1 is provided with four heat dissipation areas 17, and the heat dissipation areas 17 are provided with multiple rows of heat dissipation holes arranged at equal intervals. Among them, one heat dissipation area is provided on the front panel 11 and the top panel 15, and two heat dissipation areas are provided on the rear panel of the main chassis 1; in other embodiments, the number and position of the heat dissipation areas 17 can be designed according to the actual heat dissipation requirements of the device. In this design, by providing multiple heat dissipation areas 17 on the main chassis 1, it is beneficial to quickly export the heat in the main chassis 1, improve the heat dissipation efficiency of the device, and further facilitate the stable operation of various electronic devices inside the main chassis 1.

[0073] In this embodiment, the main chassis 1 is provided with a grounding wire jack 18 for connecting a grounding wire. By providing the grounding wire jack 18 on the main chassis 1, it is convenient to plug in the grounding wire; further, static electricity can be promptly discharged through the grounding wire to prevent static electricity accumulation, thereby protecting the safety of the equipment; in addition, the grounding wire can provide a safe channel for accidental leakage current, lead the current into the earth, thereby protecting personal safety.

[0074] In summary, the utility model integrates multiple signal acquisition modules, multiple spectrum modules, and signal processing modules on one optical emission spectrum device, thereby realizing the use of one device to simultaneously detect etching endpoints of multiple etching chambers, effectively improving the detection efficiency of a single device, and at the same time greatly reducing the space occupancy rate of the device by improving the integration of the device. Therefore, the utility model effectively overcomes the shortcomings and deficiencies in the prior art and has a high industrial utilization value.

[0075] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

Claims

1. A multi-channel optical emission spectroscopy endpoint detection device, characterized in that: include: A plurality of signal acquisition modules are respectively arranged on different etching cavities, and the plurality of signal acquisition modules are used to respectively acquire optical signals in the corresponding etching cavities; A plurality of spectrum modules are connected to the corresponding signal acquisition modules via optical fibers; The spectral module is used to receive the corresponding optical signal and generate corresponding spectral data; The signal processing module is connected to the plurality of spectral modules via cables, and the signal processing module is used to receive the plurality of spectral data and synchronously process the plurality of spectral data.

2. The multi-channel optical emission spectroscopy endpoint detection device according to claim 1, characterized in that: The spectrum module comprises: substrate; A light splitting system is arranged on the substrate and connected to the signal acquisition module through the optical fiber; the light splitting system is used to collimate and split the optical signal; The signal detection system is arranged on the substrate and located on the optical path of the optical signal; the signal detection system is used to convert the collimated and split optical signal into an electrical signal.

3. The multi-channel optical emission spectroscopy endpoint detection device according to claim 2, characterized in that: The optical splitting system comprises: A slit, arranged on the substrate and located on the optical path of the optical signal, for screening and collimating the optical signal; A reflector, disposed on the substrate and located on the optical path of the optical signal, and used for changing the optical path direction of the optical signal; A grating, arranged on the substrate and located on the optical path of the optical signal, and used for cooperating with the reflector to split the optical signal; A focusing mirror is arranged on the substrate and located on the optical path of the optical signal, and is used for focusing the optical signal.

4. The multi-channel optical emission spectroscopy endpoint detection device according to claim 3, characterized in that: The signal detection system comprises: An image sensor, disposed on the substrate, for receiving the optical signal focused by the focusing lens and converting the optical signal into an electrical signal; The signal acquisition and conversion module is arranged on the substrate and is electrically connected to the image sensor, and is used for acquiring and amplifying the electrical signal.

5. The multi-channel optical emission spectroscopy endpoint detection device according to claim 4, characterized in that: The signal acquisition and conversion module includes an A / D converter, and the A / D converter is used to amplify the collected electrical signal.

6. The multi-channel optical emission spectroscopy endpoint detection device according to claim 1, characterized in that: It also includes a main box, the spectrum module and the signal processing module are arranged in the main box, and the signal acquisition module is connected to the main box through the optical fiber.

7. The multi-channel optical emission spectroscopy endpoint detection device according to claim 6, characterized in that: The main box includes a front panel, and a plurality of plug holes for connecting the optical fibers are arranged on the front panel, and each of the plug holes is respectively connected to a corresponding spectrum module.

8. The multi-channel optical emission spectroscopy endpoint detection device according to claim 6, characterized in that: The main chassis is provided with a plurality of heat dissipation areas, and the heat dissipation areas are provided with a plurality of rows of heat dissipation holes arranged at equal intervals.

9. The multi-channel optical emission spectroscopy endpoint detection device according to claim 6, characterized in that: The main chassis is provided with a grounding wire jack for connecting a grounding wire.

10. The multi-channel optical emission spectroscopy endpoint detection device according to claim 1, characterized in that: The signal acquisition module is an optical probe.

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