Back incidence high saturation detector chip testing device
By designing a back-illuminated high-saturation detector chip testing device that includes fixed components, heat dissipation components and coupling components, the problem of difficulty in testing chips of different sizes and irregular shapes with the existing technology is solved, achieving wider applicability and more High test reliability.
Patent Information
- Application Number
- CN202420850352.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-04-23
AI Technical Summary
The prior art is difficult to test back incident high-saturation detector chips of different sizes and irregular shapes, and lacks universality.
A back-illuminated high saturation detector chip testing device is designed, including a base, a placement table, a heat dissipation component and a coupling component. The placement platform is equipped with fixed components, which can adapt to chips of different sizes and shapes through rotatable fixed pressure plates and adjusting bolts. The heat dissipation components and coupling components ensure the stable operation of the chip during the test process.
It achieves effective testing of chips of different sizes and irregular shapes, improves the universality of the equipment, and ensures the reliability and stability of the chip during the testing process through an efficient heat dissipation system.
Smart Images
Figure CN222379833U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip testing, in particular to a back-incident high-saturation detector chip testing device. Background Art
[0002] Back-incidence high-saturation detector chip testing refers to the process of testing and evaluating a special type of detector chip. This chip uses back-incidence technology and has high saturation, which can be used for high-energy particle detection and measurement. During the test, the chip's performance indicators such as sensitivity, resolution, and saturation are evaluated to ensure its reliability and stability in practical applications. This chip is often used in physics experiments, nuclear physics research, and other experiments and projects in other scientific fields.
[0003] In the process of back-incident high-saturation detector chip testing, a two-inch wafer mold placement table is currently commonly used to fix the chip to be tested, but this cannot cover the testing of chips of different sizes and irregular shapes and is not universal. Utility Model Content
[0004] The main purpose of the utility model is to provide a back-incident high-saturation detector chip testing device, aiming to enable the chip testing device to meet the testing requirements of chips of different sizes and irregular shapes.
[0005] To achieve the above-mentioned purpose, the utility model provides a back-incident high-saturation detector chip testing device, comprising:
[0006] Base;
[0007] A placement table, the placement table is arranged on the base, the placement table forms a placement plane for placing the chip, the placement table is provided with a fixing component, the fixing component includes a fixed pressing plate rotatably arranged on the placement table, the fixed pressing plate is used to press the chip onto the placement plane;
[0008] A heat dissipation component, which is disposed on one side of the placement platform and is used to dissipate heat for the chip; and
[0009] A coupling component is provided through the heat dissipation component and the placement platform, and is used for coupling the chip.
[0010] In one embodiment, the fixing assembly further comprises:
[0011] A rotating shaft, the rotating shaft is arranged at one side of the placing table, and the fixed pressing plate is rotatably arranged on the rotating shaft; and
[0012] An adjusting bolt is arranged at one end of the fixed pressing plate close to the rotating shaft, and the adjusting bolt is used to adjust the fixed pressing plate so that the fixed pressing plate abuts against or disengages from the chip.
[0013] In one embodiment, the heat dissipation component includes:
[0014] A refrigerator, the refrigerator being arranged on a side of the placement table facing away from the placement plane; and
[0015] The heat sink is arranged on the base and located on a side of the refrigerator facing away from the placement table, and the heat sink is in close contact with the refrigerator.
[0016] In one embodiment, the refrigerator comprises a cold surface substrate and a hot surface substrate, and the cold surface substrate and the hot surface substrate are respectively attached to the placement table and the heat dissipation seat.
[0017] In one embodiment, the heat sink is formed with a plurality of heat exchange slots.
[0018] In one embodiment, the placement plane is formed with heat dissipation holes, and the heat dissipation holes are respectively connected to the chip and the cooler.
[0019] In one embodiment, the placing table is made of silver.
[0020] In one embodiment, the heat sink and the base are an integrally formed structure.
[0021] In one embodiment, the base is made of copper.
[0022] In one embodiment, the base is formed with a plurality of heat dissipation slots.
[0023] The technical solution of the utility model proposes a back-incident high-saturation detector chip testing device, which includes a base, a placement table, a heat dissipation component and a coupling component. The placement table forms a placement plane for placing the chip, and is provided with a fixing component. The chip to be tested is placed on the placement plane and the fixed pressure plate on the fixing component is rotated so that one end of the fixed pressure plate is pressed against the chip to be tested to press the chip against the placement plane, thereby achieving the fixation of the chip. Whether it is a chip of different sizes or a chip of irregular shape, it can be tested, thereby improving the universality of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0025] Figure 1 A schematic structural diagram of an embodiment of a back-incident high-saturation detector chip testing device provided by the utility model;
[0026] Figure 2 for Figure 1 A partial enlarged view of the middle A;
[0027] Figure 3 This is a structural schematic diagram of another angle of the back-incident high-saturation detector chip testing device provided by the utility model;
[0028] Figure 4 A schematic diagram of the structure of the back-incident high-saturation detector chip testing device provided by the utility model from another angle;
[0029] Figure 5 for Figure 1 Schematic diagram of the location of the mounting holes on the center base.
[0030] Description of Figure Numbers:
[0031] 1000. Back-incident high-saturation detector chip test device; 1. base; 11. heat sink; 12. mounting hole; 2. placement table; 21. fixing assembly; 211. fixing pressure plate; 212. rotating shaft; 213. adjusting bolt; 2a. placement plane; 2b. heat sink; 2c. fixing hole; 3. heat sink assembly; 31. refrigerator; 311. cold surface substrate; 312. hot surface substrate; 32. heat sink; 321. heat exchange slot; 4. coupling assembly.
[0032] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0034] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0035] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0036] Back-incidence high-saturation detector chip testing refers to the process of testing and evaluating a special type of detector chip. This chip uses back-incidence technology and has high saturation, which can be used for high-energy particle detection and measurement. During the test, the chip's performance indicators such as sensitivity, resolution, and saturation are evaluated to ensure its reliability and stability in practical applications. This chip is often used in physics experiments, nuclear physics research, and other experiments and projects in other scientific fields.
[0037] In the process of back-incident high-saturation detector chip testing, a two-inch wafer mold placement table is currently commonly used to fix the chip to be tested, but this cannot cover the testing of chips of different sizes and irregular shapes and is not universal.
[0038] In order to solve the above problems, the utility model proposes a back-incident high-saturation detector chip testing device, which aims to enable the chip testing device to meet the testing requirements of chips of different sizes and irregular shapes. Figures 1 to 5 The present invention is a schematic structural diagram of an embodiment of the back-incident high-saturation detector chip testing device provided by the present invention.
[0039] Please refer to Figures 1 to 5The utility model proposes a back-incident high-saturation detector chip testing device 1000, comprising a base 1, a placement table 2, a heat dissipation component 3 and a coupling component 4, wherein the placement table 2 is arranged on the base 1, the placement table 2 forms a placement plane 2a for placing a chip, the placement table 2 is provided with a fixing component 21, the fixing component 21 comprises a fixing pressure plate 211 rotatably arranged on the placement table 2, the fixing pressure plate 211 is used to press the chip on the placement plane 2a, the heat dissipation component 3 is arranged on one side of the placement table 2, the coupling component 4 is penetrated through the heat dissipation component 3 and the placement table 2, and the coupling component 4 is used to couple the chip;
[0040] In the technical solution of the utility model, the back-incident high-saturation detector chip testing device 1000 is provided with a fixing component 21 on the placement table 2, the chip to be tested is placed on the placement plane 2a and the fixing pressure plate 211 on the fixing component 21 is rotated so that one end of the fixing pressure plate 211 is pressed against the chip to be tested to press the chip against the placement plane 2a, thereby achieving the fixation of the chip, and both chips of different sizes and chips of irregular shapes can be tested, thereby improving the universality of the equipment.
[0041] It should be noted that the fixing assembly 21 can be an elastic pressing structure composed of a spring, a pressure block and a rotating shaft 212. When the chip needs to be fixed, the pressure block is moved away, the chip is placed on the placement plane 2a and the pressure block is released so that the chip is pressed by the elastic force of the spring; in addition, the fixing assembly 21 can also adopt a rotating pressing structure. In one embodiment of the utility model, the fixing assembly 21 includes a rotating shaft 212, a fixed pressure plate 211 and an adjusting bolt 213. For details, please refer to Figure 1 and Figure 2 When the chip needs to be fixed, the fixed pressure block is rotated so that it is located on one side of the placement plane 2a, and then the chip is placed on the placement plane 2a. The fixed pressure block is rotated so that it is directly above the chip, and the adjusting bolt 213 is screwed. The fixed pressure block slowly moves downward under the action of the bolt until one end of it is crimped with the chip, thereby achieving the fixation of the chip to be tested. Furthermore, in order to prevent the fixed pressure plate 211 from damaging the chip during the crimping process with the chip, a flexible buffer layer is provided at the abutting end of the fixed pressure plate 211, and a layer of silicone is coated on the abutting end. In this way, when the chip is crimped, the flexible buffer layer at the end of the fixed pressure plate 211 will first contact the chip, thereby preventing the fixed pressure plate 211 from scratching the surface of the chip.
[0042] During the chip testing process, since the chip is in a high-power working state for a long time, the RF output power will be significantly affected by the heat dissipation effect. In order to keep the chip in a good working condition during the test process and thus measure better experimental data, a heat dissipation component 3 is provided in the technical solution. The heat dissipation component 3 includes a refrigerator 31 and a heat dissipation seat 32. For details, please refer to Figure 4 The refrigerator 31 is arranged on the back side of the placement table 2, that is, the side facing away from the chip. The refrigerator 31 includes a cold surface substrate 311 and a hot surface substrate 312. The cold surface substrate 311 is arranged close to the placement table 2, and the hot surface substrate 312 is arranged close to the heat sink 32. In this way, it can be ensured that the heat generated by the chip during operation is conducted from the chip to the heat sink 32. Furthermore, the refrigerator 31 can be temperature-adjusted. During the actual test process, the refrigerator 31 is cooled and adjusted to 0°C to achieve the best working state.
[0043] In order to facilitate the heat dissipation of the chip, the placement plane 2a is formed with heat dissipation holes 2b. For details, please refer to Figure 1 and Figure 2 The heat dissipation hole 2b further increases the heat exchange area between the chip and the refrigerator 31. The air in the heat dissipation hole 2b will be cooled by the cooling effect of the refrigerator 31 and will never be transferred to the chip to achieve cooling. It should be noted that the material of the placement table 2 can be silver or copper. The utility model does not limit this. In one embodiment of the utility model, the placement table 2 is made of silver. The thermal conductivity of silver is very high, which is several times or even higher than that of common copper. This means that silver can more effectively transfer heat from the heat source to the heat sink 32 or the surrounding environment, which helps to reduce the chip temperature. In addition, silver has a high corrosion resistance, which means that the silver heat sink can maintain good performance in long-term use and is not easily affected by oxidation or corrosion.
[0044] To further realize heat extraction, the heat sink 32 is formed with a plurality of heat exchange slots 321, and the base 1 is formed with a plurality of heat dissipation slots 11. For details, please refer to Figure 1 The heat exchange slot 321 and the heat dissipation slot 11 expand the heat exchange area between the heat dissipation component 3 and the surrounding air, so that the heat dissipation component 3 can be discharged to the surrounding air more quickly after absorbing heat, thereby maintaining efficient heat dissipation performance.
[0045] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A back-incident high-saturation detector chip testing device (1000), characterized in that: include: Base (1); A placement platform (2), the placement platform (2) being arranged on the base (1), the placement platform (2) forming a placement plane (2a) for placing a chip, the placement platform (2) being provided with a fixing component (21), the fixing component (21) comprising a fixing pressure plate (211) rotatably arranged on the placement platform (2), the fixing pressure plate (211) being used for pressing the chip onto the placement plane (2a); A heat dissipation component (3), the heat dissipation component (3) being arranged on one side of the placement platform (2) and being used to dissipate heat for the chip; as well as A coupling component (4), wherein the coupling component (4) is inserted through the heat dissipation component (3) and the placement platform (2), and the coupling component (4) is used to couple the chip.
2. The back-incident high-saturation detector chip testing device (1000) according to claim 1, characterized in that: The fixing assembly (21) further comprises: A rotating shaft (212), the rotating shaft (212) being disposed on one side of the placement platform (2), and the fixed pressing plate (211) being rotatably disposed on the rotating shaft (212); and An adjusting bolt (213) is arranged at one end of the fixed pressing plate (211) close to the rotating shaft (212), and the adjusting bolt (213) is used to adjust the fixed pressing plate (211) so that the fixed pressing plate (211) abuts against or disengages from the chip.
3. The back-incident high-saturation detector chip testing device (1000) according to claim 2, characterized in that: The heat dissipation component (3) comprises: A refrigerator (31), the refrigerator (31) being arranged on a side of the placement table (2) facing away from the placement plane (2a); and A heat sink (32) is arranged on the base (1) and is located on a side of the refrigerator (31) facing away from the placement table (2), and the heat sink (32) is in close contact with the refrigerator (31).
4. The back-incident high-saturation detector chip testing device (1000) according to claim 3, characterized in that: The refrigerator (31) comprises a cold surface substrate (311) and a hot surface substrate (312), and the cold surface substrate (311) and the hot surface substrate (312) are respectively attached to the placement table (2) and the heat dissipation seat (32).
5. The back-incident high-saturation detector chip testing device (1000) according to claim 3, characterized in that: The heat sink (32) is formed with a plurality of heat exchange grooves (321).
6. The back-incident high-saturation detector chip testing device (1000) according to claim 3, characterized in that: The placement plane (2a) is formed with heat dissipation holes (2b), and the heat dissipation holes (2b) are respectively connected to the chip and the refrigerator (31).
7. The back-incident high-saturation detector chip testing device (1000) according to claim 6, characterized in that: The material of the placement table (2) is silver.
8. The back-incident high-saturation detector chip testing device (1000) according to claim 3, characterized in that: The heat sink (32) and the base (1) are an integrally formed structure.
9. The back-incident high-saturation detector chip testing device (1000) according to claim 1, characterized in that: The base (1) is made of copper.
10. The back-incident high-saturation detector chip testing device (1000) according to claim 1, characterized in that: The base (1) is formed with a plurality of heat dissipation grooves (11).