Heat dissipation device based on semiconductor water treatment BI management system

Abstract

The utility model belongs to the technical field of heat dissipation devices, and particularly relates to a heat dissipation device based on a semiconductor water treatment BI management system, which comprises a server body and a heat dissipation assembly arranged on the outer side of the end part of the server body, the heat dissipation assembly comprises heat dissipation holes, a motor and a first rotating rod, the heat dissipation holes are formed in the outer side of the end of the server body, the motor is installed on the outer side of one section of the server body, and the first rotating rod is fixedly connected to the outer side of a main shaft of the motor; the cleaning plate is driven by the motor to move, dust on the outer sides of the heat dissipation holes can be cleaned and collected, smooth air circulation in the server body is ensured, therefore, the heat dissipation efficiency is improved, performance reduction or hardware damage caused by overheating is prevented, corrosion of the dust to the hardware in the server body can be reduced by cleaning the heat dissipation holes, and the service life of the server body is prolonged. Therefore, the service life of the server is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation devices, and in particular relates to a heat dissipation device based on a semiconductor water treatment BI management system. Background Art

[0002] The semiconductor water treatment BI management system is an information management system for the water treatment process in the semiconductor industry. The BI system can process and analyze large amounts of water treatment data to help identify potential problems, trends, and opportunities for efficiency improvement. The management system is usually deployed on a server. When the server is working at high power, it will dissipate the heat generated by itself through the radiator. However, the vents of traditional heat dissipation devices are easily clogged. If this problem is not solved in time, the heat dissipation effect of the server will be reduced, affecting the server's work efficiency.

[0003] Therefore, a heat dissipation device based on semiconductor water treatment BI management system is designed to solve the above problems. Utility Model Content

[0004] To solve the problems raised in the above background technology. The utility model provides a heat dissipation device based on a semiconductor water treatment BI management system. The cleaning plate is driven by a motor to move, and the dust on the outside of the heat dissipation hole can be cleaned and collected to ensure smooth air circulation inside the server body, thereby improving the heat dissipation efficiency and preventing performance degradation or hardware damage caused by overheating. Cleaning the heat dissipation holes can reduce the erosion of dust on the hardware inside the server body, thereby extending the service life of the server. At the same time, the dust dropped by the first brush can be collected by the second brush to prevent it from accumulating on the inner side of the end of the server body for a long time, which is convenient for later manual maintenance and cleaning, and increases the practicality of the device.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat dissipation device based on a semiconductor water treatment BI management system, comprising a server body, and also comprising a heat dissipation component arranged outside the end of the server body;

[0006] The heat dissipation assembly includes a heat dissipation hole, a motor and a first rotating rod. The outer side of the end of the server body is provided with a heat dissipation hole. A motor is installed on the outer side of a section of the server body. The outer side of the main shaft of the motor is fixedly connected to the first rotating rod. The outer side of the end of the first rotating rod is rotatably connected to the second rotating rod. The outer side of the end of the second rotating rod is rotatably connected to a rotating block. The outer side of the end of the server body is fixedly connected to a rotating sleeve. The inner side of the end of the rotating sleeve is provided with a sliding groove. The outer sides of both ends of the rotating block are respectively fixedly connected to the first sliding rod and the second sliding rod. The outer sides of the ends of the first sliding rod and the second sliding rod are connected to the inner wall surface of the sliding groove opened by the rotating sleeve. The outer side of the end of the rotating block is fixedly connected to a cleaning plate. The outer side of one end of the cleaning plate is fixedly connected to a plurality of first bristles. The outer side of the end of the first brush contacts the outer side of one end of the server body.

[0007] As a preferred heat dissipation device based on semiconductor water treatment BI management system of the utility model, a second brush is fixedly connected to the outer side of the end of the cleaning plate.

[0008] As a preferred heat dissipation device based on semiconductor water treatment BI management system of the utility model, a plurality of ventilation grooves are opened on the inner side of one end of the cleaning plate.

[0009] As a preferred heat dissipation device based on semiconductor water treatment BI management system of the utility model, a leak-proof plate is fixedly connected to the outer side of the end of the server body.

[0010] As a preferred heat dissipation device based on semiconductor water treatment BI management system of the utility model, a dust collecting box is fixedly connected to the lower surface of one end of the server body.

[0011] Compared with the prior art, the beneficial effects of the utility model are: a heat dissipation component is added to the present application, and the cleaning plate is driven by a motor to move, so that the dust on the outside of the heat dissipation hole can be cleaned and collected, ensuring smooth air circulation inside the server body, thereby improving the heat dissipation efficiency and preventing performance degradation or hardware damage caused by overheating. The cleaning of the heat dissipation holes can reduce the erosion of dust on the internal hardware of the server body, thereby extending the service life of the server. At the same time, the dust dropped by the first brush can be collected by the second brush to prevent it from accumulating on the inner side of the end of the server body for a long time, which is convenient for later manual maintenance and cleaning, and increases the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 It is a cross-sectional view in the utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the first bristles and the second bristles in the utility model;

[0016] Figure 4 It is a structural schematic diagram of the motor and the first rotating rod in the utility model;

[0017] In the figure:

[0018] 1. Server body;

[0019] 2. Heat dissipation assembly; 21. Heat dissipation hole; 22. Motor; 23. First rotating rod; 24. Second rotating rod; 25. Rotating sleeve; 26. Dust collecting box; 27. Rotating block; 28. Sliding groove; 29. ​​First sliding rod; 210. Second sliding rod; 211. Cleaning plate; 212. First brush; 213. Second brush; 214. Ventilation groove; 215. Leakage-proof plate. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] like Figure 1 As shown;

[0022] A heat dissipation device based on a semiconductor water treatment BI management system includes a server body 1.

[0023] In this implementation scheme: The semiconductor water treatment BI management system is an information management system for the water treatment process in the semiconductor industry. The BI system can process and analyze a large amount of water treatment data to help identify potential problems, trends and opportunities for efficiency improvement. The management system is usually deployed on a server. When the server is working at high power, it will dissipate the heat generated by itself through the radiator. However, the vents of traditional heat dissipation devices are easily clogged. If not solved in time, the heat dissipation effect of the server will be reduced, affecting the work efficiency of the server. In order to solve this technical problem, a heat dissipation component 2 is added on this basis.

[0024] More specifically:

[0025] like Figures 1 to 4As shown:

[0026] In combination with the above content: the heat dissipation assembly 2 includes a heat dissipation hole 21, a motor 22 and a first rotating rod 23. The heat dissipation hole 21 is opened on the outer side of the end of the server body 1. The motor 22 is installed on the outer side of a section of the server body 1. The first rotating rod 23 is fixedly connected to the outer side of the main shaft of the motor 22. The second rotating rod 24 is rotatably connected to the outer side of the end of the first rotating rod 23. The rotating block 27 is rotatably connected to the outer side of the end of the second rotating rod 24. The rotating sleeve 25 is fixedly connected to the outer side of the end of the server body 1. The sliding groove 2 is opened on the inner side of the end of the rotating sleeve 25. 8. The outer sides of both ends of the rotating block 27 are respectively fixedly connected with the first sliding rod 29 and the second sliding rod 210. The outer sides of the ends of the first sliding rod 29 and the second sliding rod 210 are connected with the inner wall surface of the sliding groove 28 opened by the rotating sleeve 25. The outer side of the end of the rotating block 27 is fixedly connected with a cleaning plate 211. The outer side of one end of the cleaning plate 211 is fixedly connected with a plurality of first bristles 212. The outer side of the end of the first bristles 212 contacts with the outer side of one end of the server body 1. The outer side of the end of the cleaning plate 211 is fixedly connected with the second bristles 213.

[0027] In this embodiment: in the heat dissipation device, the heat dissipation hole 21 at the end of the server body 1 can help the server body 1 to dissipate heat, but after a long period of heat dissipation, dust is easily accumulated on the inner side of the heat dissipation hole 21, resulting in blockage of the heat dissipation hole 21, which in turn causes the heat dissipation effect of the server body 1 to be poor. A motor 22 is installed on the inner side of the end of the server body 1, and the rotating sleeve 25 is a rectangular shell with a hollow interior. A sliding groove 28 is opened on the inner side of the end of the rotating sleeve 25. The trajectory of the sliding groove 28 consists of a vertical and arc-shaped structure. At the same time, the outer surfaces of the first sliding rod 29 and the second sliding rod 210 are in contact with the inner wall surface of the sliding groove 28. When the staff needs to clean the heat dissipation hole 21, they only need to start the motor 22. The motor 22 drives the first rotating rod 23 to rotate, and then drives the second rotating rod 24 at the end of the first rotating rod 23 to move, so that one end of the second rotating rod 24 makes a circular motion, which in turn drives the rotating block 27 rotatably connected to the second rotating rod 24 to make reciprocating motion in the vertical direction. When the first rotating rod 23 is rotated as shown in the figure Figure 3When the upper part rotates in the direction shown, the second rotating rod 24 will be driven to move vertically downward. When the first rotating rod 23 rotates to a horizontal state, the rotating block 27 is located at the bottom of the rotating sleeve 25, and the outer side of the end of the second sliding rod 210 abuts against the inner side of the end of the vertical part of the sliding groove 28. The first rotating rod 23 starts to rotate downward, which will apply an oblique thrust to the second rotating rod 24. The thrust is transmitted to the end of the rotating block 27 rotatably connected to the second rotating rod 24, and then a horizontal component force is applied to the first sliding rod 29 on the outer side of the end of the rotating block 27, so that the first sliding rod 29 When the first rotating rod 23 enters the arc-shaped part of the sliding groove 28 and blocks the first rotating rod 23 from rotating to the vertical state, the outer side of the end of the first sliding rod 29 abuts against the inner side of the end of the arc-shaped structure of the sliding groove 28. At this time, the first rotating rod 23 starts to rotate upward from the bottom end, which will exert a vertical upward component force on the rotating block 27, thereby driving the first sliding rod 29 to slide along the inner wall surface of the arc-shaped structure of the sliding groove 28. When the first rotating rod 23 rotates to the horizontal state again, the first sliding rod 29 slides out from the arc-shaped structure of the sliding groove 28. At this time, the first rotating rod 23 continues to rotate, driving the rotating block 27 to move vertically upward until it reaches the horizontal state. When the first rotating rod 23 returns to the highest point again, the rotating block 27 is located at the top of the rotating sleeve 25. The reciprocating motion can drive the cleaning plate 211 fixedly connected to the rotating block 27 to move. When the cleaning plate 211 moves in the vertical direction, the first brush 212 can be used to clean the heat dissipation hole 21. When the first sliding rod 29 enters the arc portion of the sliding groove 28, the cleaning plate 211 can be driven to rotate ninety degrees, and then the dust can be further cleaned by the second brush 213 at the end of the cleaning plate 211 to prevent dust from accumulating on the inner side of the end of the server body 1. The motor 22 drives the cleaning plate 211 to move, so as to clean and collect the dust on the outside of the heat dissipation hole 21, thereby ensuring smooth air circulation inside the server body 1, thereby improving the heat dissipation efficiency and preventing performance degradation or hardware damage caused by overheating. The cleaning of the heat dissipation hole 21 can reduce the erosion of dust on the internal hardware of the server body 1, thereby extending the service life of the server. At the same time, the second brush 213 can collect the dust cleaned by the first brush 212 to prevent it from accumulating on the inner side of the end of the server body 1 for a long time, which is convenient for later manual maintenance and cleaning, thereby increasing the practicality of the device.

[0028] It should be noted that the device can be used when the heat dissipation intensity of the server body 1 is low or when the server body 1 is stopped, so as to facilitate the collection of dust. The Z structure of the cleaning plate 211 ensures that the cleaning plate 211 will not interfere with the server body 1.

[0029] Going further:

[0030] In an optional embodiment, a plurality of ventilation slots 214 are formed on the inner side of one end of the cleaning plate 211 .

[0031] In the present embodiment: a plurality of ventilation slots 214 are provided on the inner side of the end of the cleaning plate 211. The ventilation slots 214 can ensure that the cleaning plate 211 will not affect the heat dissipation and ventilation of the server body 1. The hot air exhausted from the server body 1 can be discharged through the ventilation slots 214, so that the device will not affect the heat dissipation effect of the server body 1.

[0032] Going further:

[0033] In an optional embodiment, a leak-proof plate 215 is fixedly connected to the outer side of the end of the server body 1 .

[0034] In the present embodiment: a leak-proof plate 215 is fixedly connected to the outer side of the end of the server body 1. The leak-proof plate 215 is an arc-shaped structure. The leak-proof plate 215 can limit the position of the first brush 212 to clean the fallen dust. When dust falls on the inner wall of the leak-proof plate 215, the dust will slide down along the inner wall of the leak-proof plate 215, which is convenient for subsequent cleaning and increases the practicality of the device.

[0035] Going further:

[0036] In an optional embodiment, a dust collecting box 26 is fixedly connected to the lower surface of one end of the server body 1 .

[0037] In this embodiment: a dust box 26 is fixedly connected to the lower surface of the end of the server body 1, and the dust box 26 is communicated with the inner side of the end of the server body 1. When the cleaning plate 211 rotates, the dust will be swept directly into the dust box 26 by the second brush 213. The collection of dust by the dust box 26 greatly increases the sustainability of the device. The staff only needs to clean the dust box 26 regularly, which increases the practicality of the device while reducing the cost of later manual cleaning and maintenance.

[0038] Working principle: In the heat dissipation device, the heat dissipation hole 21 at the end of the server body 1 can help the server body 1 to dissipate heat. However, after a long period of heat dissipation, dust is easily accumulated on the inner side of the heat dissipation hole 21, causing the heat dissipation hole 21 to be blocked, thereby causing the heat dissipation effect of the server body 1 to be poor. A motor 22 is installed on the inner side of the end of the server body 1. The rotating sleeve 25 is a rectangular shell with a hollow interior. A sliding groove 28 is opened on the inner side of the end of the rotating sleeve 25. The track of the sliding groove 28 consists of a vertical and arc-shaped structure. At the same time, the outer surfaces of the first sliding rod 29 and the second sliding rod 210 are in contact with the inner wall surface of the sliding groove 28. When the staff needs to clean the heat dissipation hole 21, they only need to start the motor 22, and the motor 22 drives the first rotating rod 23 to rotate. This will drive the second rotating rod 24 at the end of the first rotating rod 23 to move, so that one end of the second rotating rod 24 makes a circular motion, which will drive the rotating block 27 rotatably connected to the second rotating rod 24 to make a reciprocating motion in the vertical direction. When the first rotating rod 23 rotates at the upper part in the direction shown in the figure, it will drive the second rotating rod 24 to move vertically downward. When the first rotating rod 23 rotates to a horizontal state, the rotating block 27 is located at the bottom of the rotating sleeve 25. The outer side of the end of the second sliding rod 210 abuts against the inner side of the end of the vertical part of the sliding groove 28. The first rotating rod 23 starts to rotate downward, which will apply an oblique thrust to the second rotating rod 24. The thrust is transmitted to the end of the rotating block 27 rotatably connected to the second rotating rod 24. , and then apply a horizontal component force to the first sliding rod 29 on the outer side of the end of the rotating block 27, so that the first sliding rod 29 enters the arc-shaped part of the sliding groove 28, and blocks the first rotating rod 23 from rotating to a vertical state. At this time, the outer side of the end of the first sliding rod 29 abuts against the inner side of the end of the arc-shaped structure of the sliding groove 28. At this time, the first rotating rod 23 starts to rotate upward from the bottom, and will apply a vertical upward component force to the rotating block 27, thereby driving the first sliding rod 29 to slide along the inner wall surface of the arc-shaped structure of the sliding groove 28. When the first rotating rod 23 rotates to a horizontal state again, the first sliding rod 29 slides out from the inside of the arc-shaped structure of the sliding groove 28. At this time, the first rotating rod 23 continues to rotate, driving the rotating block 27 to move vertically upward until the first rotating rod 2 When the rotating block 27 returns to the highest point again, the rotating block 27 is located at the top of the rotating sleeve 25. The reciprocating motion can drive the cleaning plate 211 fixedly connected to the rotating block 27 to move. When the cleaning plate 211 moves in the vertical direction, the first brush 212 can be used to clean the heat dissipation hole 21. When the first sliding rod 29 enters the arc portion of the sliding groove 28, the cleaning plate 211 can be driven to rotate ninety degrees, and then the second brush 213 at the end of the cleaning plate 211 can be used to further clean the dust, so as to prevent the dust from gathering on the inner side of the end of the server body 1. The cleaning plate 211 is driven by the motor 22 to move, so as to clean and collect the dust outside the heat dissipation hole 21, so as to ensure the smooth air circulation inside the server body 1.Thereby, the heat dissipation efficiency is improved, and the performance degradation or hardware damage caused by overheating is prevented. The cleaning of the heat dissipation hole 21 can reduce the erosion of dust on the internal hardware of the server body 1, thereby extending the service life of the server. At the same time, the dust dropped by the first brush 212 can be collected by the second brush 213 to prevent it from accumulating on the inner side of the end of the server body 1 for a long time, which is convenient for later manual maintenance and cleaning, and increases the practicality of the device. A plurality of ventilation slots 214 are provided on the inner side of the end of the cleaning plate 211. The ventilation slots 214 can ensure that the cleaning plate 211 will not affect the heat dissipation and ventilation of the server body 1. The hot air discharged from the server body 1 can be discharged through the ventilation slots 214, so that the device will not affect the heat dissipation effect of the server body 1. The outer side of the end of the server body 1 is fixed It is connected with a leak-proof plate 215, which is an arc-shaped structure. Through the leak-proof plate 215, the position of the dust cleaned by the first brush 212 can be limited. When dust falls on the inner wall of the leak-proof plate 215, the dust will slide down along the inner wall of the leak-proof plate 215, which is convenient for subsequent cleaning, increasing the practicality of the device. The lower surface of the end of the server body 1 is fixedly connected with a dust collecting box 26, and the dust collecting box 26 is connected to the inner side of the end of the server body 1. When the cleaning plate 211 rotates, the dust will be directly swept into the dust collecting box 26 through the second brush 213. The dust collection by the dust collecting box 26 greatly increases the sustainability of the device. The staff only needs to clean the dust collecting box 26 regularly, which increases the practicality of the device while reducing the cost of manual cleaning and maintenance in the later stage.

[0039] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A heat dissipation device based on a semiconductor water treatment BI management system, comprising a server body (1), characterized in that: It also includes a heat dissipation component (2) arranged outside the end of the server body (1); The heat dissipation assembly (2) comprises a heat dissipation hole (21), a motor (22) and a first rotating rod (23); the heat dissipation hole (21) is provided on the outer side of the end of the server body (1); the motor (22) is installed on the outer side of a section of the server body (1); the first rotating rod (23) is fixedly connected to the outer side of the main shaft of the motor (22); the second rotating rod (24) is rotatably connected to the outer side of the end of the first rotating rod (23); the second rotating rod (24) is rotatably connected to the outer side of the end of the second rotating rod (24); the rotating block (27) is fixedly connected to the outer side of the end of the server body (1); the rotating sleeve (25) is fixedly connected to the outer side of the end of the server body (1); the rotating sleeve (25) ) is provided with a sliding groove (28) on the inner side of the end of the rotating block (27), and the outer sides of the two ends of the rotating block (27) are respectively fixedly connected with a first sliding rod (29) and a second sliding rod (210), and the outer sides of the ends of the first sliding rod (29) and the second sliding rod (210) are in contact with the inner wall surface of the sliding groove (28) provided on the rotating sleeve (25), and the outer side of the end of the rotating block (27) is fixedly connected with a cleaning plate (211), and the outer side of one end of the cleaning plate (211) is fixedly connected with a plurality of first bristles (212), and the outer side of the end of the first bristles (212) contacts with the outer side of one end of the server body (1).

2. The heat dissipation device based on semiconductor water treatment BI management system according to claim 1 is characterized in that: A second brush bristle (213) is fixedly connected to the outer side of the end portion of the cleaning plate (211).

3. The heat dissipation device based on semiconductor water treatment BI management system according to claim 1 is characterized in that: A plurality of ventilation slots (214) are formed on the inner side of one end of the cleaning plate (211).

4. The heat dissipation device based on semiconductor water treatment BI management system according to claim 1 is characterized in that: A leak-proof plate (215) is fixedly connected to the outer side of the end of the server body (1).

5. The heat dissipation device based on semiconductor water treatment BI management system according to claim 1 is characterized in that: A dust collecting box (26) is fixedly connected to the lower surface of one end of the server body (1).

Images