Silicon wafer rod temporary storage device and silicon wafer processing system
By using a water spray pipe in the silicon wafer rod cache device to flush and clean the silicon wafer rods, the problem of dry silicon powder on the surface of the silicon wafer rods is solved, the silicon wafer yield rate and the cleaning efficiency of the next process are improved, and the cleaning and maintenance time is reduced. and safety hazards.
Patent Information
- Application Number
- CN202420870848.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-04-24
AI Technical Summary
During the buffer position, the surface moisture evaporates the silicon powder to dry bond and adheres, affecting subsequent cleaning, causing quality problems of the silicon wafer, and unstick fragments and silicon wafers fall off during the next process, resulting in equipment failure and inconvenient cleaning. , poses safety risks.
Design a silicon wafer rod caching device, which uses the waiting time of the silicon wafer rod in the cache position to rinse and clean its surface through a water spray pipe to reduce silicon powder residue, and set up a conveyor belt assembly, cache rack, sensing unit and waste water collection The tank body realizes automated cleaning and debris collection.
Through water spray cleaning, the silicon powder attached to the surface of the silicon wafer rod is reduced, the silicon wafer yield is improved, the cleaning process of the next process is simplified, the cleaning and maintenance time is reduced, and safety hazards are reduced.
Smart Images
Figure CN222380561U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer bar buffer processing, in particular to a silicon wafer bar buffer device and a silicon wafer processing system. Background Art
[0002] After the crystal rod is cut into silicon wafers, it becomes a silicon wafer rod, which is sent to the buffer position by the feeding device to remain stationary before being docked by the next process device.
[0003] When the cut silicon wafer sticks are left in the cache, the surface moisture of the silicon wafers will evaporate due to long-term standing, causing the surface silicon powder mixture to dry and adhere to the surface of the silicon wafers, affecting the subsequent silicon wafer cleaning, thus causing silicon wafer quality problems. The silicon wafer sticks are attached to the resin plate on the crystal tray. After cutting, the silicon wafer sticks are mixed with fragments and silicon wafers that have not fallen off the resin plate. When they are transferred from the cache to the next process, the fragments and silicon wafers that are not firmly attached fall off in the middle, which will cause the failure of the equipment in the next process and the inconvenience of on-site cleaning. There will also be more safety hazards when personnel clean up the fragments between equipment. Utility Model Content
[0004] The utility model aims to provide a silicon wafer rod caching device, which can utilize the waiting time of the silicon wafer rod in the cache position to clean it, improve the silicon wafer yield, and also improve the efficiency of the cleaning of the next process and reduce the cleaning and maintenance time.
[0005] Another object of the utility model is to provide a silicon wafer processing system, which utilizes the silicon wafer rod to clean it during the static time in the buffer position, thereby improving the silicon wafer yield, and can also improve the efficiency of the cleaning of the next process and reduce the cleaning and maintenance time.
[0006] The technical solution of the utility model is achieved in this way:
[0007] A silicon wafer bar caching device comprises a frame, a conveyor belt assembly, a caching rack, a water spray pipe and a first sensor unit;
[0008] The conveyor belt assembly comprises a mesh conveyor belt, a driven conveyor roller, a driving conveyor roller and a driving assembly, wherein the mesh conveyor belt is installed on the frame through the driving conveyor roller and a plurality of the driven conveyor rollers, and the output end of the driving assembly is drivingly connected to one end of the driving conveyor roller;
[0009] The cache rack is provided with at least one cache position for placing silicon wafer bars, each of the cache positions is provided with a water spray pipe for washing the silicon wafer bars, and the water spray pipe is provided with a plurality of water spray ports corresponding to the silicon wafer bars;
[0010] At least one of the first sensing units is disposed on the cache rack. The first sensing units are disposed in one-to-one correspondence with the cache positions. The first sensing unit can sense the silicon wafer rods placed in the cache positions.
[0011] Furthermore, it also includes a wastewater collection tank body, which is arranged on the rack and located below the cache position, and is used to collect wastewater generated by washing silicon wafer rods.
[0012] Furthermore, a drain pipe is provided at the bottom of the wastewater collecting tank, and the drain pipe leads to a wastewater recovery device.
[0013] Further, it also includes a second sensor unit and a waste collection vehicle;
[0014] The waste collection vehicle is correspondingly arranged at the front end unloading position of the mesh belt conveyor, and the waste on the mesh belt conveyor can be unloaded into the bucket of the waste collection vehicle;
[0015] The second sensor unit is arranged on the frame to sense whether the waste collection vehicle is in place.
[0016] Furthermore, a collection vehicle parking space for parking the waste collection vehicle is provided at the front end of the frame.
[0017] Furthermore, the driving assembly includes a driving motor and a transmission assembly, and the output shaft of the driving motor is drivingly connected to the active conveying roller through the transmission assembly.
[0018] Furthermore, the water spray pipes are respectively arranged on at least two opposite sides of each of the cache locations.
[0019] Furthermore, the water spray pipes are respectively arranged on the front and rear sides of each cache position, so as to flush the front and rear sides of the silicon wafer rod.
[0020] Furthermore, two cache positions are sequentially arranged on the cache rack along the front-to-back direction.
[0021] A silicon wafer processing system comprises a feeding device and the silicon wafer rod buffering device;
[0022] The feeding device is used to feed the silicon wafer rods to the cache position.
[0023] Compared with the prior art, the beneficial effects of the utility model are:
[0024] The present application utilizes the waiting time of the silicon wafer rod in the cache position to rinse and clean the surface of the silicon wafer rod through a water spray pipe, thereby reducing the silicon powder attached to the surface and maintaining the moistening effect. By spraying water on the silicon wafer rod in the cache position, the silicon powder residue carried to the next process is reduced, the cleaning efficiency of the next process is improved, and the debris is collected in a centralized manner to reduce the cleaning and maintenance time. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0026] Figure 1 This is an axonometric diagram of the silicon wafer rod buffer device of the utility model;
[0027] Figure 2 This is a right side view of the silicon wafer rod buffer device of the utility model;
[0028] Figure 3 It is a schematic diagram of the top view of the cache rack of the utility model.
[0029] In the figure:
[0030] 1-water spray pipe; 2-silicon wafer rod; 3-conveyor belt assembly; 301-mesh belt conveyor; 302-conveyor roller; 4-waste collection vehicle; 5-second sensor unit; 6-drain pipe; 7-cache rack; 701-cache position; 702-cache slot; 8-rack; 9-wastewater collection tank. DETAILED DESCRIPTION
[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0034] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0035] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0036] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0037] In conjunction with the accompanying drawings, some embodiments of the present invention are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0038] Example 1
[0039] Reference Figure 1-Figure 3 , this embodiment provides a silicon wafer bar caching device, including a frame 8, a conveyor belt assembly 3, a caching rack 7, a water spray pipe 1 and a first sensor unit (not shown in the figure);
[0040] The conveyor belt assembly 3 includes a mesh belt conveyor 301, a conveyor roller 302 and a driving assembly, wherein the mesh belt conveyor 301 is installed on the frame 8 via a plurality of conveyor rollers 302, wherein the plurality of conveyor rollers 302 include an active conveyor roller and a plurality of driven conveyor rollers, that is, one of the plurality of conveyor rollers 302 is an active conveyor roller, and the rest are driven conveyor rollers.
[0041] The output end of the driving component is in transmission connection with one end of the active conveying roller, and the active conveying roller is driven to rotate by the driving component, and then the mesh belt conveyor 301 is used to drive the other driven conveying rollers to rotate.
[0042] The driving assembly includes a driving motor and a transmission assembly. The driving motor is electrically connected to the control center. The output shaft of the driving motor is connected to the driving roller through the transmission assembly. The transmission assembly can adopt a gear transmission assembly, a sprocket transmission assembly or a pulley transmission assembly to respectively realize the transmission mode of gear transmission, sprocket transmission or belt transmission. The specific structure will not be described in detail, which belongs to the prior art.
[0043] It should be noted that: in order to facilitate the description of the orientation of the device, the conveying direction of the belt is defined as the forward direction, and the reverse direction is defined as the backward direction (i.e. the front-to-back direction), and the width direction of the belt is defined as the left-right direction, such as Figure 1 shown.
[0044] At least one cache position 701 for placing silicon wafer rods 2 is arranged on the cache rack 7, and each cache position 701 is provided with a water spray pipe 1 for flushing the silicon wafer rods 2, and the water spray pipe 1 is provided with multiple water spray outlets corresponding to the silicon wafer rods 2; the cache positions 701 on the cache rack 7 can be arranged in a matrix, that is, M cache positions 701 are arranged in sequence in the front-to-back direction and N cache positions are arranged in sequence in the left-to-right direction, where M≥1, N≥1.
[0045] At least one first sensing unit is disposed on the cache rack 7 . The first sensing unit is disposed in one-to-one correspondence with the cache position 701 . The first sensing unit can sense the silicon wafer rod 2 placed in the cache position 701 .
[0046] In a preferred implementation of this embodiment, M=2, N=1, two cache positions 701 are sequentially arranged on the cache rack 7 along the front-to-back direction. Specifically, the cache rack 7 includes a left bracket and a right bracket, and two cache slots 702 arranged opposite to each other are respectively provided on the inner sides of the left bracket and the right bracket. The position between the two opposite cache slots 702 is the cache position 701 for placing the silicon wafer rod 2. Specifically, the left and right ends of the silicon wafer rod 2 are respectively placed in the cache slots 702 on the left and right sides, and the silicon wafer rod 2 is placed therein. Figure 1 As shown, only the structure in which the silicon wafer rod 2 is placed in one of the cache positions 701 is shown.
[0047] As for the setting of the water spray pipe 1, the water spray pipe 1 can be set in at least one direction above, below, left, right, front and back of the silicon wafer rod 2 to spray and rinse the silicon wafer rod 2.
[0048] In a preferred implementation of this embodiment, a water spray pipe 1 is respectively arranged in front and rear of each cache position 701, the axial direction of the water spray pipe 1 is the left-right direction, and a plurality of water spray ports are arranged on the water spray pipe 1, and all the water spray ports are arranged corresponding to the silicon wafer rod 2. Two water spray pipes 1 arranged relative to the cache position 701 form a water spray pipe 1 assembly, one end of the water spray pipe 1 is a water inlet, and the other end is a blind structure; or, both ends of the water spray pipe 1 are blind structures, and a water inlet is opened in the middle of the water spray pipe 1; the water spray end of the water spray mechanism is connected to the water inlet, which is used to supply water to the water spray pipe 1.
[0049] There are two types of water spraying mechanisms:
[0050] The first type: the water spray mechanism and the water spray pipe 1 component are arranged one by one, that is, one water spray mechanism controls one water spray pipe 1 component;
[0051] The second type: two water spray main pipes are arranged at the water spray end of the water spray mechanism, and electronic valves are respectively arranged on the two water spray main pipes. Two water spray branch pipes are arranged at the water spray end of the two water spray main pipes, and the two water spray branch pipes are respectively connected to the water inlets of the two water spray pipes 1 in the water spray pipe 1 assembly, that is, one water spray main pipe controls one water spray pipe 1 assembly.
[0052] It should be noted that the water spray mechanism of this embodiment is preferably the second type mentioned above, and the second type is used as an example for explanation. The water spray mechanism is electrically connected to the control center, and all electronic valves are electrically connected to the control center. The water spray mechanism is also called a water supply mechanism, which is a supplementary content of this device, and the specific structure is not repeated here.
[0053] In order to keep the cleaning after water spraying, a wastewater collection tank 9 is set on the rack 8 and below the two cache positions 701 to collect the wastewater generated by washing the silicon wafer rods 2 in the two cache positions 701. The silicon powder and fragments washed away by the water spray pipe 1 after spraying the silicon wafer rods 2 automatically fall onto the mesh belt conveyor 301, and the wastewater can directly fall into the wastewater collection tank 9 through the mesh holes on the mesh belt conveyor 301 for collection. It should be noted that the wastewater collection tank 9 is set corresponding to all cache positions 701. When there are more than two cache positions 701, the wastewater collection tank 9 is set below all cache positions 701 to collect the wastewater generated by all cache positions 701 when washing the silicon wafer rods 2.
[0054] In order to prevent the wastewater collection tank 9 from being filled and overflowing, the wastewater collection tank 9 is preferably designed to be conical, and a drain pipe 6 is provided at the bottom of the wastewater collection tank 9. The drain pipe 6 can discharge the wastewater into the sewage ditch, or in order to recycle the wastewater, a wastewater recovery device is provided to connect the drain outlet of the drain pipe 6 with the water inlet of the wastewater recovery device.
[0055] In order to collect silicon powder, debris and other residues after the silicon wafer rods 2 are sprayed and rinsed, a waste collection vehicle 4 is provided at the front end of the mesh belt conveyor 301, and the waste on the mesh belt conveyor 301 can be discharged into the bucket of the waste collection vehicle 4. The waste collection vehicle 4 can be a manual cart (with a handlebar and a bucket, and can be moved by manual pushing and pulling), or an intelligent transport vehicle (containing a communication module and a wheel drive device, and establishing a communication connection with a control center or a remote controller through the communication module, and remotely controlling the intelligent transport vehicle to realize intelligent driving).
[0056] Since the cost of the intelligent transport vehicle is too high, this embodiment uses a manual cart to collect the residue.
[0057] In order to improve automation, a second sensor unit 5 is provided on the frame 8 at a position corresponding to the position where the waste collection vehicle 4 is placed, for sensing whether the waste collection vehicle 4 is in place.
[0058] Specifically, a collection vehicle parking position for parking the waste collection vehicle 4 is provided at the front end of the frame 8. When the waste collection vehicle 4 is manually pushed to the collection vehicle parking position, the second sensor unit 5 can sense that the waste collection vehicle 4 is in place, and the control center drives the driving unit to drive the mesh belt conveyor 301 to run. The silicon crushed pieces on the mesh belt conveyor 301 fall from the front end into the bucket of the waste collection vehicle 4 to realize residue collection.
[0059] The first sensing unit and the second sensing unit 5 may both be sensors, and all sensors are electrically connected to the control center respectively.
[0060] Working principle: After the crystal rod is cut, the silicon wafer rod 2 is placed in the cache position 701 of the cache rack 7. After the first sensor unit senses the presence of the silicon wafer rod 2 material in the corresponding cache position 701, it feeds back a signal to the control center. The control center sends a signal to the water spray mechanism and opens the electronic valve on the corresponding water spray main pipe (when all the first sensor units sense the presence of the material, all the water spray mechanisms are in operation, and all the electronic valves on the liquid spray main pipes are opened). The water spray pipe 1 sprays water, and the fragments on the silicon wafer rod 2 and the silicon wafers that are not well glued will slide. The waste water will fall onto the mesh conveyor belt 301, and will flow down through the mesh holes of the mesh conveyor belt 301, and then will be collected into the drain pipe 6 through the conical waste water collection tank 9 and discharged into the workshop sewage ditch or waste water recovery device. When the second sensor unit 5 senses the presence of a manual cart, it will send a signal to the control center, and the control center will drive the driving motor to drive the mesh conveyor belt 301 to move. The fragments that fall onto the mesh conveyor belt 301 will be sent to the manual cart, and the operator can transport the fragments and collect and recycle them according to the actual situation.
[0061] Example 2
[0062] This embodiment provides a silicon wafer processing system, including a feeding device, and also includes the silicon wafer rod buffer device;
[0063] The feeding device is used to feed the silicon wafer rod 2 to the buffer position 701 .
[0064] The beneficial effects of the technical solution of the utility model are:
[0065] The present application utilizes the waiting time of the silicon wafer rod 2 in the cache position 701 to clean the surface of the silicon wafer rod 2 through the water spray pipe 1, thereby reducing the silicon powder attached to the surface, maintaining the effect of spraying and moistening, and being able to moisten the surface of the silicon wafer rod 2. By spraying water on the silicon wafer rod 2 in the cache position 701, the silicon powder residue brought to the next process is reduced, the cleaning efficiency of the next process is improved, and the cleaning and maintenance time is reduced. The silicon crushed pieces are separated from the sewage through the mesh belt conveyor, which is convenient for the recycling and collection of the fragments.
[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.
[0067] In addition, those skilled in the art will appreciate that, although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments. For example, in the above claims, any one of the claimed embodiments may be used in any combination. The information disclosed in this background technology section is intended only to deepen the understanding of the overall background technology of the present invention and should not be regarded as an admission or in any form of implication that the information constitutes prior art known to those skilled in the art.
[0068] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
[0069] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A silicon wafer bar buffer device, characterized in that: It comprises a frame (8), a conveyor belt assembly (3), a buffer rack (7), a water spray pipe (1) and a first sensor unit; The conveyor belt assembly (3) comprises a mesh conveyor belt (301), a driven conveyor roller, a driving conveyor roller and a driving assembly, the mesh conveyor belt (301) is installed on the frame (8) via the driving conveyor roller and a plurality of driven conveyor rollers, and the output end of the driving assembly is drivingly connected to one end of the driving conveyor roller; At least one cache position (701) for placing a silicon wafer rod (2) is provided on the cache rack (7), each cache position (701) is provided with a water spray pipe (1) for washing the silicon wafer rod (2), and the water spray pipe (1) is provided with a plurality of water spray ports corresponding to the silicon wafer rods (2); At least one of the first sensing units is disposed on the cache rack (7), and the first sensing units are disposed in one-to-one correspondence with the cache positions (701). The first sensing unit can sense the silicon wafer rod (2) placed in the cache position (701).
2. The silicon wafer bar buffer device according to claim 1, characterized in that: It also includes a wastewater collection tank (9), which is arranged on the frame (8) and located below the buffer position (701) and is used to collect wastewater generated by washing the silicon wafer rods (2).
3. The silicon wafer bar buffer device according to claim 2, characterized in that: A drainage pipe (6) is provided at the bottom of the wastewater collection tank (9), and the drainage pipe (6) leads to a wastewater recovery device.
4. The silicon wafer bar buffer device according to claim 1, characterized in that: Also includes a second sensor unit (5) and a waste collection vehicle (4); The waste collection vehicle (4) is correspondingly arranged at the front end unloading position of the mesh belt conveyor (301), and the waste on the mesh belt conveyor (301) can be unloaded into the bucket of the waste collection vehicle (4); The second sensor unit (5) is arranged on the frame (8) and is used to sense whether the waste collection vehicle (4) is in place.
5. The silicon wafer bar buffer device according to claim 4, characterized in that: The front end of the frame (8) is provided with a collection vehicle parking space for parking the waste collection vehicle (4).
6. The silicon wafer bar buffer device according to claim 1, characterized in that: The driving assembly comprises a driving motor and a transmission assembly, and the output shaft of the driving motor is drivingly connected to the active conveying roller via the transmission assembly.
7. The silicon wafer bar buffer device according to claim 1, characterized in that: The water spray pipes (1) are respectively arranged on at least two opposite sides of each of the cache positions (701).
8. The silicon wafer bar buffer device according to claim 7, characterized in that: The water spray pipes (1) are respectively arranged on the front and rear sides of each cache position (701) so as to be able to wash the front and rear sides of the silicon wafer rod (2).
9. The silicon wafer bar buffer device according to claim 1, characterized in that: The two cache positions (701) are arranged in sequence on the cache rack (7) along the front-to-back direction.
10. A silicon wafer processing system, comprising a feeding device, characterized in that: Also includes a silicon wafer rod caching device as described in any one of claims 1 to 9; The feeding device is used to feed the silicon wafer rod (2) to the cache position (701).