Dispensing device for chip of electronic component

Abstract

The utility model discloses an electronic component chip dispensing device which comprises a bottom box, a sliding mechanism, a driving mechanism, a pressing mechanism, a supporting frame, a dispensing mechanism, a controller and a pressure sensor, and the supporting frame is installed on the bottom box; the sliding mechanism is installed on the bottom box and connected with the driving mechanism. The pressing mechanism is installed on the sliding mechanism, the pressing mechanism comprises a pressing block, a clamping block, a second strip groove, a clamping groove and a compression spring, and the pressing block is installed on the sliding mechanism; a second strip groove is formed in the middle of the pressing block, and clamping grooves are oppositely formed in the two sides of the pressing block; and the compression spring is mounted in the clamping groove. Therefore, the glue can be ensured to accurately cover the preset contact area between the chip and the PCB or other substrates, so that the risk of element falling caused by infirm bonding is reduced, the problem of electrical performance reduction or direct short circuit caused by wrong filling of the glue is avoided, and the working stability and safety of a circuit are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a chip dispensing device for electronic components. Background Art

[0002] Electronic component chips are the core components of modern electronic devices. They integrate circuits, transistors, resistors, capacitors and other components, and are the basis for realizing the functions of electronic devices. In the production process, in order to achieve reliable connection between chips and other components, glue dispensing operations are often required.

[0003] The chip dispensing device for electronic components is an automated or semi-automated device used to accurately apply glue on the surface of the chip. However, inaccurate control of the motion trajectory of the dispensing head or inaccurate chip positioning during the dispensing process can easily produce a skewed surface. This will cause the glue point position to deviate from the predetermined target area, that is, skew. This skew will not only directly affect the mechanical connection strength between the chip and the PCB (Printed Circuit Board) or other substrates, but may also cause the risk of electrical short circuits, affecting the reliability and service life of the entire electronic product. Utility Model Content

[0004] The utility model aims to solve one of the technical problems in the related art at least to a certain extent.

[0005] To this end, the purpose of the utility model is to propose an electronic component chip dispensing device, which can ensure that the glue accurately covers the preset contact area between the chip and the PCB board or other substrate, thereby reducing the risk of component falling off due to weak bonding, avoiding electrical performance degradation or direct short circuit problems caused by incorrect glue filling, and ensuring the stability and safety of circuit operation.

[0006] In order to achieve the above-mentioned purpose, the utility model proposes a dispensing device for electronic component chips, comprising a bottom box, a sliding mechanism, a driving mechanism, a pressing mechanism, a support frame, a dispensing mechanism, a controller and a pressure sensor, wherein the support frame is installed on the bottom box; the sliding mechanism is installed on the bottom box, and the driving mechanism is connected to the sliding mechanism; the pressing mechanism is installed on the sliding mechanism, and the pressing mechanism includes a pressing block, a clamping block, a second groove, a clamping groove and a compression spring, wherein the pressing block is installed on the sliding mechanism; a second groove is opened in the middle of the pressing block, and clamping grooves are opened on both sides of the pressing block ; The compression spring is installed inside the engaging groove, the engaging block is installed inside the engaging groove, and the compression spring is installed between the engaging block and the engaging groove; the dispensing mechanism is installed on the bottom box; a frame groove is provided on the support frame, and the position of the frame groove corresponds to the position of the sliding mechanism, and a first groove and a pressing groove are provided on the inner wall of the support frame; the position of the pressing groove corresponds to the position of the pressing mechanism, and the pressing groove is at the bottom of the first groove; the controller is installed on the support frame, and the pressure sensor is installed on the inner side of the pressing groove; the controller and the pressure sensor are connected.

[0007] The electronic component chip dispensing device of the utility model can ensure that the glue accurately covers the preset contact area between the chip and the PCB board or other substrates, thereby enhancing the mechanical bonding force between the two, thereby reducing the risk of component falling off due to weak bonding, avoiding electrical performance degradation or direct short circuit problems caused by incorrect glue filling, and ensuring the stability and safety of circuit operation.

[0008] In addition, the electronic component chip dispensing device proposed in the application may also have the following additional technical features:

[0009] Specifically, the sliding mechanism includes a base plate, a slide bar, two racks and a slide groove, wherein the slide groove is provided on the base box; the slide bar is installed on the base plate, and the slide bar and the slide groove are slidably connected; racks are installed on both sides of the base plate.

[0010] Specifically, the driving mechanism includes two gears, a connecting shaft, two transmission belts, a driving motor and a plurality of support seats, wherein the support seats are installed on both sides of the bottom box, the two gears are respectively installed on the support seats, and the gears are meshingly connected with the racks; the driving motor is installed on the side of the bottom box; the transmission belt is installed between the output shaft of the driving motor and the center of the gear; and a connecting shaft is installed between the two gears.

[0011] Specifically, the dispensing mechanism includes a push rod motor, a connecting rod, a support plate, a dispensing head and a locking slider, wherein the push rod motor is installed on the support frame; the connecting rod is installed on the output shaft of the push rod motor, and the support plate is connected to the output shaft of the push rod motor; a plurality of the dispensing heads are installed on the support plate, and the locking slider is installed on one side of the support plate.

[0012] Specifically, the positions of the first groove and the second groove correspond to each other, and the sizes of the second groove and the engaging sliding block match each other.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0015] Figure 1 This is a schematic diagram of the structure of an electronic component chip dispensing device according to an embodiment of the utility model;

[0016] Figure 2 This is a structural schematic diagram of a bottom plate of an electronic component chip dispensing device according to an embodiment of the utility model;

[0017] Figure 3 The present invention is a schematic structural diagram of a pressing mechanism of an electronic component chip dispensing device according to an embodiment of the present invention.

[0018] As shown in the figure:

[0019] 1. Bottom box;

[0020] 2. Sliding mechanism; 21. Bottom plate; 22. Sliding bar; 23. Rack; 24. Sliding groove;

[0021] 3. Driving mechanism; 31. Gear; 32. Connecting shaft; 33. Transmission belt; 34. Driving motor; 35. Support seat;

[0022] 4. Pressing mechanism; 41. Pressing block; 42. Clamping block; 43. Second groove; 44. Clamping groove; 45. Compression spring;

[0023] 5. Support frame; 51. Frame slot; 52. First slot; 53. Pressing slot;

[0024] 6. Glue dispensing mechanism; 61. Push rod motor; 62. Connecting rod; 63. Support plate; 64. Glue dispensing head; 65. Engaging slider;

[0025] 7. Controller; 8. Pressure sensor. DETAILED DESCRIPTION

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention. On the contrary, the embodiments of the present invention include all changes, modifications, and equivalents that fall within the spirit and connotation of the appended claims.

[0027] The electronic component chip dispensing device according to the embodiment of the utility model is described below in conjunction with the accompanying drawings.

[0028] like Figure 1-Figure 3 As shown, the electronic component chip dispensing device of the embodiment of the utility model may include a bottom box 1, a sliding mechanism 2, a driving mechanism 3, a pressing mechanism 4, a support frame 5, a dispensing mechanism 6, a controller 7 and a pressure sensor 8.

[0029] The support frame 5 is installed on the bottom box 1, the sliding mechanism 2 is installed on the bottom box 1, and the driving mechanism 3 is connected to the sliding mechanism 2.

[0030] It can be understood that the provided driving mechanism 3 can drive the sliding mechanism 2 to move, thereby driving the electronic component chips placed on the surface of the sliding mechanism 2 to move.

[0031] The pressing mechanism 4 is installed on the sliding mechanism 2 , and the pressing mechanism 4 may include a pressing block 41 , a clamping block 42 , a second groove 43 , a clamping groove 44 and a compression spring 45 .

[0032] The pressing block 41 is installed on the sliding mechanism 2 , a second groove 43 is formed in the middle of the pressing block 41 , and engaging grooves 44 are formed on opposite sides of the pressing block 41 .

[0033] It should be noted that, in this embodiment, when the pressing block 41 and the pressing groove 53 match each other, the tail of the first groove 52 can overlap with the top of the second groove 43, so that the push rod motor 61 can drive the support plate 63 and the dispensing head 64 to move, making the dispensing of the dispensing head 64 more stable.

[0034] The compression spring 45 is installed inside the engaging groove 44 , the engaging block 42 is installed inside the engaging groove 44 , and the compression spring 45 is installed between the engaging block 42 and the engaging groove 44 .

[0035] It can be understood that the size of the chip can be adjusted and stably engaged by means of the provided clamping block 42 and the compression spring 45 .

[0036] The dispensing mechanism 6 is installed on the bottom box 1, and a frame groove 51 is opened on the support frame 5. The position of the frame groove 51 corresponds to the position of the sliding mechanism 2. The inner wall of the support frame 5 is opened with a first groove 52 and a pressing groove 53. The position of the pressing groove 53 corresponds to the position of the pressing mechanism 4. The pressing groove 53 is at the bottom of the first groove 52. The controller 7 is installed on the support frame 5, and the pressure sensor 8 is installed on the inner side of the pressing groove 53.

[0037] It should be noted that when the pressing mechanism 4 moves, the pressing block 41 can engage with the pressing groove 53 , and then control the push rod motor 61 to drive the dispensing mechanism 6 to move up and down.

[0038] The controller 7 is connected to the pressure sensor 8 .

[0039] It should be noted that, in this embodiment, the controller 7 is connected to the push rod motor 61 and the drive motor 34 .

[0040] Specifically, when it is necessary to dispense glue on the chip, first place the chip between the two blocks 42, and compress the block 42 with the compression spring 45 so that the two blocks 42 engage the chip. Then, turn on the drive motor 34, and the drive motor 34 will drive the transmission belt 33 to move, thereby driving the gear 31 and another gear 31 connected to the connecting shaft 32 to rotate, so that the gear 31 can mesh with the rack 23, so that the bottom plate 21 can move on the slide groove 24 through the slide bar 22.

[0041] When the bottom plate 21 moves to the side of the support frame 5, the pressing block 41 moves to the inside of the pressing groove 53 and exerts pressure on the pressure sensor 8. After that, the pressure sensor 8 transmits a signal to the push rod motor 61 and the drive motor 34, controls the drive motor 34 to stop rotating, and controls the push rod motor 61 to move downward. During the downward movement of the push rod motor 61, the engaging slider 65 slides from the first groove 52 and the second groove 43 in sequence, thereby making the glue dispensing mechanism 6 more stable. When the glue dispensing is completed, the drive motor 34 is controlled to rotate counterclockwise so that the bottom plate 21 drives the pressing mechanism 4 to return. When the pressure sensor 8 is not under pressure, it controls the push rod motor 61 to move upward.

[0042] In this way, it can be ensured that the glue accurately covers the preset contact area between the chip and the PCB board or other substrate, thereby reducing the risk of component falling off due to weak bonding, avoiding electrical performance degradation or direct short circuit problems caused by incorrect glue filling, and ensuring the stability and safety of circuit operation.

[0043] In one embodiment of the present invention, Figure 1 As shown, the sliding mechanism 2 may include a bottom plate 21 , a slide bar 22 , two racks 23 and a slide groove 24 .

[0044] A slide groove 24 is provided on the bottom box 1 , a slide bar 22 is installed on the bottom plate 21 , the slide bar 22 and the slide groove 24 are slidably connected, and racks 23 are installed on both sides of the bottom plate 21 .

[0045] It can be understood that the provided sliding mechanism 2 can facilitate the bottom plate 21 to move to the bottom of the glue dispensing mechanism 6 .

[0046] In one embodiment of the present invention, Figure 1 As shown, the driving mechanism 3 may include two gears 31 , a connecting shaft 32 , two transmission belts 33 , a driving motor 34 and a plurality of supporting seats 35 .

[0047] Among them, the support seat 35 is installed on both sides of the bottom box 1, the two gears 31 are respectively installed on the support seat 35, the gear 31 and the rack 23 are meshed and connected, the drive motor 34 is installed on the side of the bottom box 1, the transmission belt 33 is installed between the output shaft of the drive motor 34 and the center of the gear 31, and a connecting shaft 32 is installed between the two gears 31.

[0048] It should be noted that when the driving mechanism 3 drives the gear 31 to rotate, it will drive the connecting shaft 32 connected to the gear 31, and then drive the gear 31 on the other side to rotate. The gears 31 on both sides are meshed with the rack 23 at the same time, driving the base plate 21 forward.

[0049] In one embodiment of the present invention, Figure 1 As shown, the glue dispensing mechanism 6 may include a push rod motor 61 , a connecting rod 62 , a support plate 63 , a glue dispensing head 64 and a locking slider 65 .

[0050] The push rod motor 61 is mounted on the support frame 5, the connecting rod 62 is mounted on the output shaft of the push rod motor 61, and the support plate 63 is connected to the output shaft of the push rod motor 61. A plurality of dispensing heads 64 are mounted on the support plate 63, and the engaging slider 65 is mounted on one side of the support plate 63.

[0051] It should be noted that, in the present embodiment, the glue dispensing head 64 is connected to a glue supply box (not shown in the figure) via a hose for supplying glue to the glue dispensing head 64 .

[0052] In an embodiment of the present invention, the positions of the first groove 52 and the second groove 43 correspond to each other, and the sizes of the second groove 43 and the engaging slider 65 match each other.

[0053] It can be understood that, by providing the first groove 52 and the second groove 43 at positions corresponding to each other, the engaging slider 65 can maintain continuous movement.

[0054] As a possible situation, while the engaging slider 65 moves continuously, the support plate 63 and the glue dispensing head 64 can move more stably, so that the glue dispensing is more accurate.

[0055] In summary, the electronic component chip dispensing device of the embodiment of the utility model can ensure that the glue accurately covers the preset contact area between the chip and the PCB board or other substrate, thereby reducing the risk of component falling off due to loose bonding, avoiding electrical performance degradation or direct short circuit problems caused by incorrect glue filling, and ensuring the stability and safety of circuit operation.

[0056] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0057] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0058] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in this field can change, modify, replace and deform the above embodiments within the scope of the present invention.

Claims

1. An electronic component chip dispensing device, characterized in that: It includes a bottom box, a sliding mechanism, a driving mechanism, a pressing mechanism, a support frame, a dispensing mechanism, a controller and a pressure sensor, wherein: The support frame is installed on the bottom box; The sliding mechanism is installed in the bottom box, and the driving mechanism is connected to the sliding mechanism; The pressing mechanism is installed on the sliding mechanism, and the pressing mechanism includes a pressing block, a clamping block, a second groove, a clamping groove and a compression spring, wherein: The pressing block is installed on the sliding mechanism; A second groove is formed in the middle of the pressing block, and engaging grooves are formed on opposite sides of the pressing block; The compression spring is installed inside the engaging groove, the clamping block is installed inside the engaging groove, and the compression spring is installed between the clamping block and the engaging groove; The dispensing mechanism is installed on the bottom box; The support frame is provided with a frame groove, the position of the frame groove corresponds to the position of the sliding mechanism, and the inner wall of the support frame is provided with a first groove and a pressing groove; The position of the pressing groove corresponds to the position of the pressing mechanism, and the pressing groove is located at the bottom of the first groove; The controller is installed on the support frame, and the pressure sensor is installed on the inner side of the pressure groove; the controller and the pressure sensor are connected.

2. The electronic component chip dispensing device according to claim 1, characterized in that: The sliding mechanism includes a bottom plate, a slide bar, two racks and a slide groove, wherein: The bottom box is provided with a slide groove; The slide bar is mounted on the bottom plate, and the slide bar is slidably connected to the slide groove; Racks are installed on both sides of the bottom plate.

3. The electronic component chip dispensing device according to claim 2, characterized in that: The driving mechanism includes two gears, a connecting shaft, two transmission belts, a driving motor and a plurality of supporting seats, wherein: The support base is installed on both sides of the bottom box. The two gears are respectively mounted on the support seats, and the gears are meshed and connected with the racks; The driving motor is installed on the side of the bottom box; The transmission belt is installed between the output shaft of the drive motor and the center of the gear; A connecting shaft is installed between the two gears.

4. The electronic component chip dispensing device according to claim 1, characterized in that: The dispensing mechanism includes a push rod motor, a connecting rod, a support plate, a dispensing head and a clamping slider, wherein: The push rod motor is installed on the support frame; The connecting rod is installed on the output shaft of the push rod motor, and the support plate is connected to the output shaft of the push rod motor; A plurality of the dispensing heads are mounted on the support plate, and the engaging slider is mounted on one side of the support plate.

5. The electronic component chip dispensing device according to claim 4, characterized in that: The positions of the first groove and the second groove correspond to each other, and the sizes of the second groove and the engaging sliding block match each other.

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