Electroplating device for electroplating copper on grid line of solar cell panel

Abstract

The utility model discloses an electroplating device for electroplating copper on a grid line of a solar cell panel, which comprises at least one group of electroplating units, the electroplating units are intermittently connected with a conductive conveyor belt, the electroplating units are connected with the positive pole of a power supply, and the negative pole of the power supply is connected with the conductive conveyor belt; when the electroplating liquid of the electroplating unit is in contact with the conductive conveyor belt, the electroplating unit and the conductive conveyor belt form a closed loop through the power supply; a solar cell panel is adsorbed on the surface, facing the electroplating unit, of the conductive conveying belt; the device realizes electroplating of the HJT solar cell panel, has the characteristics of economy, environmental protection, simple structure, high electroplating efficiency and good electroplating quality, and is suitable for large-scale popularization and application.

Description

Technical Field

[0001] The utility model belongs to the technical field of copper plating of solar cell panel grid lines, and in particular relates to an electroplating device used for electroplating copper of solar cell panel grid lines. Technical Background

[0002] There are two main types of photovoltaic cells on the market: P-type and N-type. N-type cells have the characteristics of high conversion efficiency and high bifaciality. Cell preparation technologies include TopCon, HJT and IBC. Among them, TopCon has begun large-scale mass production, and N-type HJT has the technical advantages of low energy consumption, high conversion efficiency and bifacial power generation. However, the mass production of HJT cells requires a large amount of silver paste, which is very costly, thus limiting large-scale mass production. In the HJT production process, the copper electroplating process can ultimately remove silver and greatly reduce economic costs. In recent years, a large number of manufacturers and scholars have actively developed corresponding electroplating copper equipment, and the entire process flow mainly includes: 1) seed layer preparation: the specific process is to plate the seed layer, which is mainly to increase the adhesion between the copper plating layer and the transparent conductive film to prevent the electrode from falling off; 2) patterning: the specific process includes spraying the photosensitive resin layer, exposing, developing, and showing the pattern on the photosensitive resin; 3) electroplating: the metallization part, inserting the battery cell into the electrolytic cell to reduce the copper ions in the solution to copper metal, and completing the precipitation of copper; 4) post-processing: including removing the photosensitive resin, etching the seed layer, plating the solder layer or the anti-oxidation layer and other processes; however, the mask patterning must be carried out in the entire process, and the mask must be removed after the electroplating is completed, which will complicate the entire process and also cause environmental pollution. Summary of the invention

[0003] In order to overcome the shortcomings of the above-mentioned prior art, the purpose of the utility model is to provide an electroplating device for copper electroplating of solar panel grid lines. By setting an electroplating unit, the electroplating unit and the conductive conveyor belt are connected through a power supply to form a closed loop, which can realize the electroplating of the HJT solar cell panel adsorbed on the surface of the conductive conveyor belt facing the electroplating unit. The device has the characteristics of economy and environmental protection, simple structure, high electroplating efficiency and good electroplating quality, and is suitable for large-scale promotion and application.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0005] A plating device for copper plating of solar panel grid lines, comprising at least one group of plating units, wherein the plating units are intermittently connected to a conductive conveyor belt 8, the plating units are connected to the positive pole of a power source 9, and the negative pole of the power source 9 is connected to the conductive conveyor belt 8; when the plating solution of the plating unit contacts the conductive conveyor belt 8, the plating unit and the conductive conveyor belt 8 form a closed loop through the power source 9; a solar cell panel 6 is adsorbed on the surface of the conductive conveyor belt 8 facing the plating unit.

[0006] The electroplating unit includes a liquid storage tank 1 for storing electroplating liquid, the liquid inlet of the liquid storage tank 1 is connected to one end of the liquid return pipe 2, and the liquid outlet of the liquid storage tank 1 is connected to one end of the liquid inlet pipe 3; the other end of the liquid return pipe 2 is connected to the liquid outlet of the electroplating tank 7; the other end of the liquid inlet pipe 3 is connected to a nozzle 5 arranged in the electroplating tank 7; the electroplating tank 7 is intermittently connected to the conductive conveyor belt 8 through the elevator 10; the surface of the nozzle 5 is covered with an anode coating, the nozzle 5 covered with the anode coating is connected to the positive pole of the power supply 9, and the negative pole of the power supply 9 is connected to the conductive conveyor belt 8.

[0007] The conductive conveyor belt 8 is made of conductive silicone.

[0008] The signal input ends of the lift 10 and the nozzle 5 are connected to the signal output end of the displacement controller 4, and the signal input end of the displacement controller 4 is connected to the signal output end of the computer through wireless communication.

[0009] The nozzle diameter of the nozzle 5 is 3-10 um, and the distance between the nozzle tip of the nozzle 5 and the solar cell panel 6 is 10-100 um.

[0010] The anode coating is an iridium-based coating anode, a ruthenium-based coating anode, a platinum-coated electrode or a lead dioxide-coated electrode.

[0011] The liquid storage tank 1 and the electroplating tank 7 are both made of acid-resistant materials.

[0012] The liquid storage tank 1 and the electroplating tank 7 are both made of polytetrafluoroethylene or PP.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model applies voltage to the nozzle covered with an anode coating and a conductive conveyor belt, so that the nozzle acts as an anode in the entire electroplating tank, and the solar panel acts as a cathode by contacting the conveyor belt. When the electroplating liquid is sprayed out of the nozzle and contacts the solar panel, a closed loop is formed. The electroplating of the HJT solar panel can be achieved without graphic processing and will not cause environmental pollution.

[0015] 2. The utility model realizes the control of the copper plating width of the grid line by adjusting the distance between the nozzle and the solar cell panel.

[0016] 3. The utility model can accurately control the position of the electroplating tank and the spraying route of the nozzle by setting a displacement controller, thereby improving the electroplating efficiency and electroplating quality.

[0017] In summary, the utility model sets an electroplating unit, connects the electroplating unit and the conductive conveyor belt through a power supply to form a closed loop, and can realize the electroplating of the HJT solar cell panel adsorbed on the surface of the electroplating unit by the conductive conveyor belt; the device has the characteristics of economy and environmental protection, simple structure, high electroplating efficiency and good electroplating quality, and is suitable for large-scale promotion and application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The present invention is a schematic structural diagram of an electroplating device for electroplating copper on solar panel grid lines.

[0019] In the figure: liquid storage tank 1, liquid return pipe 2, liquid inlet pipe 3, displacement controller 4, nozzle 5, solar cell panel 6, electroplating tank 7, conductive conveyor belt 8, power supply 9, elevator 10. DETAILED DESCRIPTION

[0020] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0021] like Figure 1 As shown, an electroplating device for electroplating copper on solar panel grid lines includes at least one group of electroplating units. In this embodiment, two groups of electroplating units are arranged; the electroplating units are intermittently connected to a conductive conveyor belt 8, the electroplating units are connected to the positive pole of a power supply 9, and the negative pole of the power supply 9 is connected to the conductive conveyor belt 8; when the electroplating solution of the electroplating unit contacts the conductive conveyor belt 8, the electroplating unit and the conductive conveyor belt 8 form a closed loop through the power supply 9, and the surface of the conductive conveyor belt 8 facing the electroplating unit is adsorbed with a solar panel 6, so as to realize HJT solar panel 6 electroplating.

[0022] The electroplating unit includes a liquid storage tank 1 for storing electroplating liquid, the liquid inlet of the liquid storage tank 1 is connected to one end of the liquid return pipe 2, and the liquid outlet of the liquid storage tank 1 is connected to one end of the liquid inlet pipe 3; the other end of the liquid return pipe 2 is connected to the liquid outlet of the electroplating tank 7, which is used for reflowing the solution in the electroplating tank 7; the other end of the liquid inlet pipe 3 is connected to the nozzle 5 arranged in the electroplating tank 7, which is used for spraying the solution in the liquid storage tank 1 through the nozzle 5; the electroplating tank 7 is intermittently connected to the conductive conveyor belt 8 through the elevator 10; the conductive conveyor belt 8 is made of conductive silicone.

[0023] The signal input ends of the elevator 10 and the nozzle 5 are connected to the signal output end of the displacement controller 4, and the signal input end of the displacement controller 4 is connected to the signal output end of the computer through wireless communication; the displacement controller 4 accurately controls the position of the electroplating tank 7 through the computer, and the nozzle 5 moves according to the set path to achieve electroplating.

[0024] The nozzle 5 is connected to the positive pole of the power supply 9, and the negative pole of the power supply 9 is connected to the conductive conveyor belt 8; when the electroplating liquid sprayed from the nozzle 5 contacts the conductive conveyor belt 8, the nozzle 5 and the conductive conveyor belt 8 form a closed circuit through the power supply 9 to realize the electroplating of the HJT solar cell panel 6.

[0025] The nozzle diameter of the nozzle 5 is 3-10um, the distance between the nozzle tip of the nozzle 5 and the solar cell panel 6 is 10-100um, the surface of the nozzle 5 is covered with an anode coating, and the anode coating is an iridium-based coated anode (iridium-tantalum coated anode), a ruthenium-based coated anode (ruthenium-iridium-titanium coated anode), a platinum-coated electrode, and a lead dioxide-coated electrode; the liquid storage tank 1 and the electroplating tank 7 are made of acid-resistant materials, preferably polytetrafluoroethylene or PP.

[0026] In this embodiment, the nozzle diameter of the nozzle 5 is 10um, and the distance between the nozzle tip of the nozzle 5 and the solar cell panel 6 is 100um; the anode coating adopts an iridium-tantalum coated anode, and the material of the liquid storage tank 1 and the electroplating tank 7 is polytetrafluoroethylene.

[0027] The electroplating solution in the liquid storage tank 1 is a mixture of copper sulfate pentahydrate, sulfuric acid, chloride ions, brightener, inhibitor, and leveler, and the current density of the electroplating solution is 10ASD.

[0028] The working principle of the utility model is:

[0029] During operation, the solar panel 6 is fixed to the surface of the conductive conveyor belt 8 by the adsorption effect of the conductive conveyor belt 8. When the solar panel 6 runs to the specified position on the conductive conveyor belt 8, the computer controls the lift 10 to move upward through the displacement controller 4, driving the electroplating tank 7 to move upward and contact the conductive conveyor belt 8. At the same time, the plating liquid in the electroplating tank 7 flows into the nozzle 5 through the liquid inlet pipe 3, and then the computer controls the nozzle 5 to move along the set path through the displacement controller 4 to electroplate the solar panel 6; after the electroplating is completed, the plating liquid in the electroplating tank 7 returns to the liquid storage tank 1 through the liquid return pipe 2, and at the same time, the computer controls the lift 10 to move downward through the displacement controller 4, driving the electroplating tank 7 to descend and separate from the conductive conveyor belt 8.

[0030] The above is only a specific implementation of the utility model, so that those skilled in the art can understand or implement the utility model. It should be understood that the utility model is not limited to the above-described content, and various modifications and changes can be made without departing from its scope.

Claims

1. An electroplating device for electroplating copper on solar panel grid lines, characterized in that: The invention comprises at least one group of electroplating units, wherein the electroplating units are intermittently connected to a conductive conveyor belt (8), the electroplating units are connected to the positive electrode of a power source (9), and the negative electrode of the power source (9) is connected to the conductive conveyor belt (8); when the electroplating solution of the electroplating unit contacts the conductive conveyor belt (8), the electroplating unit and the conductive conveyor belt (8) form a closed loop through the power source (9); and a solar cell panel (6) is adsorbed on the surface of the conductive conveyor belt (8) facing the electroplating unit.

2. The electroplating device for electroplating copper on solar panel grid lines according to claim 1, characterized in that: The electroplating unit comprises a liquid storage tank (1) for storing electroplating liquid, wherein the liquid inlet of the liquid storage tank (1) is connected to one end of a liquid return pipe (2), and the liquid outlet of the liquid storage tank (1) is connected to one end of a liquid inlet pipe (3); the other end of the liquid return pipe (2) is connected to the liquid outlet of an electroplating tank (7); the other end of the liquid inlet pipe (3) is connected to a nozzle (5) arranged in the electroplating tank (7); the electroplating tank (7) is intermittently connected to a conductive conveyor belt (8) via an elevator (10); the surface of the nozzle (5) is covered with an anode coating, the nozzle (5) covered with the anode coating is connected to the positive electrode of a power source (9), and the negative electrode of the power source (9) is connected to the conductive conveyor belt (8).

3. The electroplating device for electroplating copper on solar panel grid lines according to claim 2, characterized in that: The conductive conveyor belt (8) is made of conductive silicone.

4. The electroplating device for electroplating copper on solar panel grid lines according to claim 2, characterized in that: The signal input ends of the lift (10) and the nozzle (5) are both connected to the signal output end of the displacement controller (4), and the signal input end of the displacement controller (4) is connected to the signal output end of the computer via wireless communication.

5. The electroplating device for electroplating copper on solar panel grid lines according to claim 2, characterized in that: The nozzle diameter of the nozzle (5) is 3-10 um, and the distance between the nozzle tip of the nozzle (5) and the solar cell panel (6) is 10-100 um.

6. The electroplating device for electroplating copper on solar panel grid lines according to claim 2, characterized in that: The anode coating is an iridium-based coating anode, a ruthenium-based coating anode, a platinum-coated electrode or a lead dioxide-coated electrode.

7. The electroplating device for electroplating copper on solar panel grid lines according to claim 2, characterized in that: The liquid storage tank (1) and the electroplating tank (7) are both made of acid-resistant materials.

8. The electroplating device for electroplating copper on solar panel grid lines according to claim 7, characterized in that: The liquid storage tank (1) and the electroplating tank (7) are both made of polytetrafluoroethylene or PP.

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