Bowl frame for sintering electronic element ceramic body

Abstract

The utility model relates to the technical field of sintering of electronic component ceramic bodies, in particular to a bowl frame for sintering of electronic component ceramic bodies, which overcomes the problems of large resistance change and low yield of the ceramic bodies when the ceramic bodies are sintered by the existing sintering sagger, the bowl frame is in the shape of a frame enclosed by side walls, and the bowl frame is provided with an upward upper opening and a downward lower opening. A plurality of upper grooves are formed in the circumferential side wall of the upper opening, and a plurality of lower grooves are formed in the circumferential side wall of the lower opening; the bowl frame is provided with a lower groove and an upper groove, the lower groove becomes a lower airflow channel when the bowl frame is placed on a turnover bottom plate of a sintering furnace, the upper groove becomes an upper airflow channel when the bowl frame is covered with the cover plate, the bowl frame is a rectangular frame body, and the side walls forming the frame shape are provided with end side walls at the two ends and side walls on the two sides. And the upper grooves and the lower grooves are formed in the end side walls and the side walls.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component ceramic body sintering, in particular to a bowl frame for electronic component ceramic body sintering. Background Art

[0002] The ceramic body of electronic components is sintered from composite materials. The composition of the composite material and the sintering process determine the electrical properties of the ceramic chip. When only the sintering process is studied, in order to mass produce and obtain the required sintering atmosphere, the ceramic blanks will be placed in a sintering bowl in the form of stacking or in-line arrangements. The bowl is covered and placed in a sintering furnace for baking. The general requirement for the bowl is that there must be appropriate atmosphere flow in the bowl to ensure that the ceramic chip is heated evenly.

[0003] Chinese patent publication number CN204902598U discloses a coated PTC thermistor ceramic sintering sagger, which has a bottom, two end side walls and two side side walls. In order to achieve air flow, recesses are set on the upper parts of the two end side walls and the two side side walls. During sintering, the atmosphere near the recess will be different from the atmosphere not near the recess, resulting in different resistance values ​​of thermistors in the same batch, affecting the yield of the product. At the same time, the resistance dispersion rate of the product, i.e., the Rcv value, is high. A high Rcv value indicates a large change in resistance and unstable quality.

[0004] Chinese Patent Publication No. CN201779996U discloses a sagger for sintering ceramic capacitor dielectrics, with transparent slots arranged on the lower bottom surface and the surrounding side surfaces. In the case where the commonly used sintering furnace is a continuous production furnace with open ends, this sagger with transparent slots sometimes causes excessive air convection between the inside and outside of the sagger, resulting in excessive atmosphere loss. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a sintering sagger for electronic component ceramic bodies, so as to overcome the problems of large change in resistance value and low yield of ceramic bodies caused by sintering ceramic bodies in existing sintering saggers.

[0006] The technical solution adopted by the utility model to solve its technical problems is: a bowl frame for sintering electronic component ceramic bodies, the bowl frame is a frame shape surrounded by side walls, the bowl frame has an upper opening facing upward and a lower opening facing downward, a plurality of upper grooves are arranged on the circumferential side walls at the upper opening, and a plurality of lower grooves are arranged on the circumferential side walls at the lower opening; the lower grooves become lower airflow channels when the bowl frame is placed on a rotating bottom plate of a sintering furnace, and the upper grooves become upper airflow channels when a cover plate is placed on the bowl frame.

[0007] Specifically, the bowl frame is a rectangular frame, and the side walls forming the frame include end side walls at both ends and side side walls at both sides, and the upper groove and the lower groove are arranged on the end side walls and the side side walls.

[0008] The beneficial effects of the utility model are as follows: the bowl frame for sintering the ceramic body of the electronic component of the utility model structure cancels the frame bottom and sets an upper groove at the upper mouth and sets a lower groove at the lower mouth. From the technical scheme of the utility model, the bowl frame is equivalent to providing a sintering method of the ceramic body at the same time. The bowl frame without a frame bottom is placed on the turnover bottom plate of the sintering furnace, and the turnover bottom plate of the sintering furnace also serves as the frame bottom. The ceramic body is placed in the bowl frame and is directly supported by the turnover bottom plate of the sintering furnace, thereby producing the following advantages:

[0009] 1. During the sintering process, the atmosphere can flow moderately, so that the upper and lower atmospheres of each stack of products are close, the sintering resistance yield is increased by about 10%, especially the resistance dispersion rate Rcv value is reduced by about 50%, the resistance of the sintered products is concentrated, and the quality is more stable;

[0010] 2. Because the bowl frame has grooves on the top and bottom, it is easy to observe the position relationship between the ceramic blank and the bowl frame when placed on the production line, and will not cause the stacked ceramic blank to shift;

[0011] 3. Since the frame bottom is eliminated, more products can be placed in the bowl frame, that is, on the turnover bottom plate of the sintering furnace, and the production capacity is increased by more than 15%. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional diagram of the utility model;

[0013] Figure 2 It is a schematic diagram of the utility model being placed on a sintering furnace turnover bottom plate and additionally equipped with a cover plate.

[0014] In the figure: 1, upper opening, 2, lower opening, 3, upper groove, 4, lower groove, 5, cover plate, 6, upper air flow channel, 7, sintering furnace turnover bottom plate, 8, lower air flow channel, 9, end side wall, 10, side side wall. DETAILED DESCRIPTION

[0015] The present invention will now be further described in detail in conjunction with the accompanying drawings and preferred embodiments. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0016] As attached Figure 1A bowl frame for sintering a ceramic body of an electronic component, the bowl frame is a frame-shaped frame surrounded by side walls, the bowl frame is a rectangular frame, the side walls surrounding the frame shape have end side walls 9 at both ends and side side walls 10 on both sides, the bowl frame has an upper opening 1 facing upward and a lower opening 2 facing downward, each end side wall 9 is provided with an upper groove 3 at the upper opening 1, each side side wall 10 is provided with two upper grooves 3, each end side wall 9 is provided with a lower groove 4 at the lower opening 2, each side side wall 10 is provided with two lower grooves 4, as shown in the attached Figure 2 The lower groove 4 becomes a lower air flow channel 8 when the bowl frame is placed on the rotating bottom plate 7 of the sintering furnace, and the upper groove 3 becomes an upper air flow channel 6 when the cover plate 5 is covered on the bowl frame.

[0017] When the utility model is used, it is placed on the turnover bottom plate 7 of the sintering furnace, and the cover plate 5 is covered after the ceramic blanks are stacked or arranged in the pot frame. A plurality of turnover bottom plates 7 of the sintering furnace are continuously arranged on the conveying platform, and the pushing device outside the furnace pushes the turnover bottom plates 7 of the sintering furnace into the sintering furnace.

[0018] Taking the bowl frame of the utility model as an example and the sagger with a frame bottom and only an upper groove as a comparative example, 50 thermistor ceramic bodies were sintered for product performance comparison. The comparison is shown in Table 1 below.

[0019] Table 1: Comparison of the measured and calculated data of the sintered thermistors of the utility model and the existing sagger

[0020]

[0021] By comparison, it is found that the yield of the product sintered by the utility model can be increased by 12 percentage points, and the discrete value of the resistance value is reduced by more than 50%.

[0022] The above description only describes the specific implementation methods of the utility model. Various examples do not limit the essential content of the utility model. Ordinary technicians in the relevant technical field can modify or deform the specific implementation methods described above after reading the description without departing from the essence and scope of the utility model.

Claims

1. A bowl frame for sintering a ceramic body of an electronic component, characterized in that: The bowl frame is in the shape of a frame surrounded by side walls, and has an upper opening (1) facing upward and a lower opening (2) facing downward, a plurality of upper grooves (3) are arranged on the peripheral side wall at the upper opening (1), and a plurality of lower grooves (4) are arranged on the peripheral side wall at the lower opening (2).

2. The pot frame for sintering a ceramic body of an electronic component according to claim 1, characterized in that: The lower groove (4) becomes a lower airflow channel (8) when the bowl frame is placed on the rotating bottom plate (7) of the sintering furnace, and the upper groove (3) becomes an upper airflow channel (6) when the cover plate (5) is placed on the bowl frame.

3. The pot frame for sintering a ceramic body of an electronic component according to claim 1, characterized in that: The bowl frame is a rectangular frame, and the side walls forming the frame include end side walls (9) at both ends and side side walls (10) at both sides. The end side walls (9) and side side walls (10) are both provided with the upper groove (3) and the lower groove (4).

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