Wafer tester and testing equipment
By increasing the increased device in the wafer tester, the distance between the light source input module and the probe test module solves the problem of light source reflection interference, and improves the effect and accuracy of the wafer test.
Patent Information
- Application Number
- CN202420697780.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-07
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-04-07
AI Technical Summary
When performing wafer testing, when the light source passes through the window set on the PCB board, due to the distance between the window and the light source, the light sources passing through different windows will cause interference due to reflection, affecting the test effect.
Design a wafer tester to increase the structure of an increased device between the light source input module and the probe test module, reduce the distance between the light source input module and the probe test module, thereby reducing the reflection of the light source.
By reducing the reflection of light sources, the effect of wafer testing is improved, and the accuracy and reliability of testing are enhanced.
Smart Images
Figure CN222420436U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor testing, in particular to a wafer tester and testing equipment. Background Art
[0002] The semiconductor manufacturing process generally includes integrated circuit design, wafer manufacturing, wafer testing, wafer cutting, chip packaging, and finished chip testing. Among them, wafer testing can select chips with functional defects in the wafer in advance to prevent these chips from entering the later chip packaging steps. The technical testing of wafers is very strict, mainly to verify whether the product circuit is good and whether the function of the wafer meets the needs of the terminal application.
[0003] At present, when performing wafer testing, it is necessary to use a light source to test the photosensitive coupling components on the wafer. When the light source passes through the window set on the PCB board, due to the distance between the window and the light source, the light sources passing through different windows will cause interference due to reflection, affecting the test effect. Utility Model Content
[0004] In view of this, an object of the present invention is to provide a wafer tester and a testing device, which can reduce the reflection of the light source, thereby improving the wafer testing effect.
[0005] In the first aspect, an embodiment of the utility model provides a wafer tester, comprising: a light source input module, a probe test module and a test module; the light source input module is arranged above the probe test module; the test module is arranged below the probe test module; the test module is used to place the wafer to be tested; the probe test module includes a heightening device; the heightening device is arranged on a side of the probe test module close to the light source input module to reduce the reflection of the light source passing through the probe test module; the light source input module is used to provide a light source for the wafer to be tested; the probe test module is used to perform wafer testing on the wafer to be tested.
[0006] Furthermore, the probe test module is a PCB substrate.
[0007] Furthermore, a plurality of windows are arranged on the PCB substrate according to a preset PCB layout, and the windows are used for light sources to illuminate the wafer to be tested.
[0008] Furthermore, the bottom of the heightening device is connected to the window; each window corresponds to a heightening device; the circumference of the heightening device is equal to the circumference of the window; and the height of the heightening device is less than the distance between the light source input module and the probe test module.
[0009] Furthermore, the inner side of the height-enhancing device is coated with an anti-reflection material.
[0010] Furthermore, a plurality of needle card probes are arranged on the PCB substrate; the needle card probes are arranged at intervals on the periphery of each window; and the bottom of the needle card probes is connected to a side of the PCB substrate close to the test module.
[0011] Furthermore, the test module is a carrier platform for placing the wafer to be tested; the wafer to be tested is arranged below the window.
[0012] Furthermore, the wafer tester also includes a supporting module; the supporting module includes a first supporting module and a second supporting module; the first supporting module is respectively connected to the light source input module and the probe testing module; the second supporting module is respectively connected to the probe testing module and the testing module.
[0013] Furthermore, the light source input module includes a control unit and at least one incandescent lamp; the control unit is connected to the incandescent lamp.
[0014] In the second aspect, an embodiment of the utility model provides a testing device, including a box and a host computer, and also includes any of the above-mentioned wafer testers; the wafer tester is arranged inside the box; the wafer tester is communicatively connected to the host computer; the host computer is used to receive and save the wafer test results sent by the wafer tester.
[0015] The embodiment of the utility model provides a wafer tester and testing equipment, including: a light source input module, a probe test module and a test module; the light source input module is arranged above the probe test module; the test module is arranged below the probe test module; the test module is used to place the wafer to be tested; the probe test module includes a heightening device; the heightening device is arranged on a side of the probe test module close to the light source input module to reduce the reflection of the light source passing through the probe test module; the light source input module is used to provide a light source for the wafer to be tested; the probe test module is used to perform wafer testing on the wafer to be tested. In this method, by adding a heightening device structure between the light source input module and the probe test module, the distance between the light source input module and the probe test module can be shortened, thereby reducing the reflection of the light source, and thus improving the wafer testing effect.
[0016] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by practicing the utility model. The purpose and other advantages of the utility model are realized and obtained by the structures specifically pointed out in the description, claims and drawings.
[0017] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 A schematic diagram of a wafer tester provided in Embodiment 1 of the present utility model;
[0020] Figure 2 A schematic diagram of a light source input module provided in Embodiment 1 of the present utility model;
[0021] Figure 3 A schematic diagram of a PCB substrate provided in Embodiment 1 of the present utility model;
[0022] Figure 4 A schematic diagram of a PCB window and a needle card probe provided in Embodiment 1 of the utility model;
[0023] Figure 5 A schematic diagram of a light source test provided in the first embodiment of the present utility model;
[0024] Figure 6 This is a schematic diagram of the testing equipment provided in Example 2 of the utility model.
[0025] Icons: 1-light source input module; 2-probe test module; 3-test module; 4-support module; 5-wafer to be tested; 11-control unit; 12-incandescent lamp; 21-heightening device; 22-PCB substrate; 23-window; 24-needle card probe; 31-carrier; 41-first support module; 42-second support module; 6-cabinet; 7-host computer; 8-wafer tester. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] To facilitate understanding of this embodiment, the embodiment of the utility model is described in detail below.
[0028] Embodiment 1:
[0029] Figure 1This is a schematic diagram of a wafer tester provided in Embodiment 1 of the present utility model.
[0030] Reference Figure 1 The wafer tester includes: a light source input module 1, a probe test module 2 and a test module 3; the light source input module 1 is arranged above the probe test module 2; the test module 3 is arranged below the probe test module 2; the test module 3 is used to place the wafer 5 to be tested; the probe test module 2 includes a heightening device 21; the heightening device 21 is arranged on a side of the probe test module 2 close to the light source input module 1 to reduce the reflection of the light source passing through the probe test module 2.
[0031] The light source input module 1 is used to provide light source for the wafer 5 to be tested.
[0032] Here, the light source may be a single light source or multiple light sources.
[0033] In one embodiment, referring to Figure 2 The light source input module 1 includes a control unit 11 and at least one incandescent lamp 12 ; the control unit 11 is connected to the incandescent lamp 12 .
[0034] The probe test module 2 is used to perform wafer test on the wafer 5 to be tested.
[0035] In one embodiment, referring to Figure 3 , the probe test module 2 is a PCB substrate 22 .
[0036] Furthermore, a plurality of windows 23 are provided on the PCB substrate 22 according to a preset PCB layout, and the windows 23 are used for light sources to illuminate the wafer 5 to be tested.
[0037] Here, the window 23 is disposed below the light source input module 1 .
[0038] The PCB layout is pre-set according to the actual measurement requirements. The window 23 can be square or circular. Figure 3 and Figure 4 , six square windows 23 are provided according to a preset PCB layout.
[0039] Further, see Figure 5 , the bottom of the heightening device 21 is connected to the window 23; each window 23 corresponds to a heightening device 21; the circumference of the heightening device 21 is equal to the circumference of the window 23; the height of the heightening device 21 is less than the distance between the light source input module 1 and the probe test module 2.
[0040] Here, when the window 23 is circular, the height increasing device 21 is a ring having a circumference equal to that of the window 23 and a height less than the distance between the light source input module 1 and the window 23 of the probe test module 2 .
[0041] When the window 23 is square, the height increasing device 21 is a square ring with a perimeter equal to that of the window 23 and a height less than the distance between the light source input module 1 and the window 23 of the probe test module 2 .
[0042] Specifically, the distance between the light source and the window 23 is a fixed value, which may be 1 cm. In order to prevent the heightening device 21 from touching the light source, the height of the heightening device 21 may be set according to actual conditions, which may be set to half the distance between the light source and the window 23, 0.5 cm.
[0043] Furthermore, the inner side of the height-enhancing device 21 is coated with an anti-reflection material. The anti-reflection material is a special coating or film used to reduce the reflection of light. In wafer testing, the anti-reflection material can reduce the interference between light sources passing through different windows 23 and improve the test accuracy.
[0044] In one embodiment, referring to Figure 3 and Figure 4 A plurality of needle card probes 24 are arranged on the PCB substrate 22 ; the needle card probes 24 are arranged at intervals on the periphery of each window 23 ; the bottom of the needle card probes 24 is connected to a side of the PCB substrate 22 close to the test module 3 .
[0045] Here, wafer testing is performed on the wafer 5 to be tested by the needle card probe 24 .
[0046] In one embodiment, referring to Figure 5 The test module 3 is a carrier platform 31 for placing the wafer 5 to be tested; the wafer 5 to be tested is arranged below the window 23 .
[0047] Here, the wafer to be tested 5 includes a plurality of bare crystals, where a bare crystal refers to a small block on the wafer, and each block is an independent circuit or chip. Each bare crystal is tested by a wafer tester.
[0048] In one implementation, referring to Figure 1 The wafer tester also includes a support module 4; the support module 4 includes a first support module 41 and a second support module 42; the first support module 41 is connected to the light source input module 1 and the probe test module 2 respectively; the second support module 42 is connected to the probe test module 2 and the test module 3 respectively.
[0049] Here, the first support module 41 and the second support module 42 are both support frames, which are used to fix the distance between the light source input module 1, the probe test module 2 and the test module 3. The distance between the light source input module 1 and the probe test module 2 is a fixed value, such as 1 cm. The distance between the probe test module 2 and the test module 3 is a fixed value, such as 0.8 cm.
[0050] The embodiment of the utility model provides a wafer tester, including: a light source input module, a probe test module and a test module; the light source input module is arranged above the probe test module; the test module is arranged below the probe test module; the test module is used to place the wafer to be tested; the probe test module includes a heightening device; the heightening device is arranged on a side of the probe test module close to the light source input module to reduce the reflection of the light source passing through the probe test module; the light source input module is used to provide a light source for the wafer to be tested; the probe test module is used to perform wafer testing on the wafer to be tested. In this method, by adding a heightening device structure between the light source input module and the probe test module, the distance between the light source input module and the probe test module can be shortened, thereby reducing the reflection of the light source, and thus improving the wafer testing effect.
[0051] Embodiment 2:
[0052] Figure 6 This is a schematic diagram of the testing equipment provided in Example 2 of the utility model.
[0053] Reference Figure 6 The testing equipment includes a box body 6 and a host computer 7 , and also includes the above-mentioned wafer tester 8 ; the wafer tester 8 is arranged inside the box body 6 ; the wafer tester 8 is communicatively connected with the host computer 7 .
[0054] The host computer 7 is used to receive and save the wafer test results sent by the wafer tester 8.
[0055] Here, the host computer 7 analyzes the performance of the wafer according to the wafer test result sent by the wafer tester 8 .
[0056] The embodiment of the utility model provides a testing device, which can shorten the distance between the light source input module and the probe test module by adding a heightening device between the light source input module and the probe test module, thereby reducing the reflection of the light source and improving the wafer testing effect.
[0057] The computer program product provided in the embodiment of the utility model includes a computer-readable storage medium storing program code. The instructions included in the program code can be used to execute the method described in the previous method embodiment. The specific implementation can be found in the method embodiment, which will not be repeated here.
[0058] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system and device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.
[0059] In addition, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0060] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the utility model can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the utility model. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc., which can store program codes.
[0061] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0062] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the utility model, which are used to illustrate the technical solution of the utility model, rather than to limit it. The protection scope of the utility model is not limited thereto. Although the utility model is described in detail with reference to the above-mentioned embodiments, ordinary technicians in this field should understand that any technician familiar with the technical field can still modify the technical solution recorded in the above-mentioned embodiments within the technical scope disclosed by the utility model, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiment of the utility model, and should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.
Claims
1. A wafer tester, characterized in that: include: A light source input module, a probe test module and a test module; the light source input module is arranged above the probe test module; The test module is arranged below the probe test module; the test module is used to place the wafer to be tested; the probe test module includes a heightening device; the heightening device is arranged on a side of the probe test module close to the light source input module to reduce the reflection of the light source passing through the probe test module; The light source input module is used to provide the light source for the wafer to be tested; The probe test module is used to perform wafer test on the wafer to be tested.
2. The wafer tester according to claim 1, characterized in that: The probe test module is a PCB substrate.
3. The wafer tester according to claim 2, characterized in that: A plurality of windows are arranged on the PCB substrate according to a preset PCB layout, and the windows are used for the light source to illuminate the wafer to be tested.
4. The wafer tester according to claim 3, characterized in that: The bottom of the heightening device is connected to the window; each window corresponds to one heightening device; the circumference of the heightening device is equal to the circumference of the window; the height of the heightening device is less than the distance between the light source input module and the probe test module.
5. The wafer tester according to claim 4, characterized in that: The inner side of the height-enhancing device is coated with an anti-reflection material.
6. The wafer tester according to claim 3, characterized in that: A plurality of needle card probes are arranged on the PCB substrate; the needle card probes are arranged at intervals on the periphery of each window; and the bottom of the needle card probe is connected to a side of the PCB substrate close to the test module.
7. The wafer tester according to claim 3, characterized in that: The test module is a carrier platform for placing the wafer to be tested; the wafer to be tested is arranged below the window.
8. The wafer tester according to claim 1, characterized in that: The wafer tester also includes a supporting module; the supporting module includes a first supporting module and a second supporting module; the first supporting module is respectively connected to the light source input module and the probe testing module; the second supporting module is respectively connected to the probe testing module and the testing module.
9. The wafer tester according to claim 1, characterized in that: The light source input module includes a control unit and at least one incandescent lamp; the control unit is connected to the incandescent lamp.
10. A testing device, characterized in that: It comprises a box and a host computer, and also comprises the wafer tester according to any one of claims 1 to 9; the wafer tester is arranged inside the box; the wafer tester is communicatively connected with the host computer; The host computer is used to receive and save the wafer test results sent by the wafer tester.