Laser

Abstract

The utility model provides a laser, and the laser comprises a first housing, two opposite sides of the first housing are provided with a first groove and a second groove, and the outer side wall of the first housing is provided with a plurality of fins; the first cover is arranged on the side, provided with the first groove, of the first shell, and a first containing cavity is defined by the first cover and the first shell; the second cover is arranged on the side, provided with the second groove, of the first shell, and a second containing cavity is defined by the second cover and the first shell; the laser emitting device is located in the first containing cavity and connected with the inner surface of the first groove. And the circuit board is positioned in the second accommodating cavity and is connected with the first shell. According to the laser, heat dissipation is more efficient, and the heat dissipation requirement and the size miniaturization requirement of the laser can be met.

Description

Technical Field

[0001] The utility model relates to the field of lasers, in particular to a laser. Background Art

[0002] A laser is a non-contact processing device that uses laser as a medium. In laser processing processes such as laser engraving and laser cutting, the laser emitted by a laser that is kept at a certain distance from the workpiece is used to act on the surface of the workpiece to engrave or cut the workpiece, thereby achieving the processing purpose.

[0003] The interior of the laser includes a laser emitting device and other components (such as circuit devices, sensors, etc.). The laser emitting device will generate heat during operation. In order to prevent the laser from damaging other components due to excessive heat, the laser is usually equipped with a structure to dissipate heat for the laser emitting device. The common solution in the industry is to increase the heat dissipation area. Although this solution can solve the heat dissipation problem, it will lead to an increase in the overall volume and weight of the laser, and the cost is relatively high. Utility Model Content

[0004] One purpose of the utility model is to provide a laser with more efficient heat dissipation, which can take into account both the heat dissipation requirements and the miniaturization requirements of the laser.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] The technical solution of one aspect of the utility model proposes a laser, including: a first shell, a first groove and a second groove are arranged on opposite sides of the first shell, and a plurality of fins are arranged on the outer side wall of the first shell; a first cover is arranged on a side of the first shell where the first groove is arranged, and forms a first cavity with the first shell; a second cover is arranged on a side of the first shell where the second groove is arranged, and forms a second cavity with the first shell; a laser emitting device is located in the first cavity and connected to the inner surface of the first groove; a circuit board is located in the second cavity and connected to the first shell.

[0007] According to some technical solutions of the present application, a bottom wall is provided in the first shell, and the first groove and the second groove are located on opposite sides of the bottom wall, wherein the second groove has an opening at one end away from the bottom wall, the circuit board covers the opening of the second groove, and the area around the opening of the second groove is connected to the circuit board, and a plurality of fins are provided on the bottom wall, the fins on the bottom wall are located in the second grooves, and the fins on the bottom wall are distributed at intervals between the circuit board.

[0008] According to some technical solutions of the present application, the laser also includes: a fan connected to the first shell, the fan is connected to the first cavity, and is connected to the position where at least a part of the fins are located, so that the fan can drive the airflow to flow through the first cavity and at least a part of the fins.

[0009] According to some technical solutions of the present application, the fan is located at one end of the extension direction of the multiple fins, and the air outlet direction of the fan is parallel to the extension direction of the multiple fins.

[0010] According to some technical solutions of the present application, the laser also includes: a semiconductor refrigeration component, located in the first cavity and between the laser emitting device and the inner bottom surface of the first groove, the semiconductor refrigeration component having a cold end and a hot end, the cold end contacts the laser emitting device, and the hot end contacts the inner bottom surface of the first groove.

[0011] According to some technical solutions of the present application, an air inlet connected to the fan is provided on the inner bottom surface of the first groove, and the air inlet is located on a side of the semiconductor refrigeration component close to the fan.

[0012] According to some technical solutions of the present application, the second cover forms a containing groove, the side of the circuit board facing away from the second groove is opposite to the containing groove, the containing groove is connected to the fan, the laser also includes a ranging sensor, and the ranging sensor is penetrated by the second cover, wherein the second cover is provided with a penetrating first air outlet, and a plurality of the first air outlets are distributed around the ranging sensor along the circumferential interval, and at least one of the containing groove and the second groove is connected to the plurality of the first air outlets.

[0013] According to some technical solutions of the present application, the laser further includes: a second shell connected to the first shell and located at an end of the first shell away from the fan, the second shell being provided with a ventilation chamber and a closed chamber arranged adjacently; a focusing device accommodated in the closed chamber, the first cavity corresponding to the closed chamber in position and the two being separated by a wall of the second shell, the wall of the second shell being provided with a light inlet at a position corresponding to the first cavity, the light inlet being used for allowing the laser or the emission end of the laser emitting device to enter the closed chamber, the second shell being further provided with a light outlet for laser emission and a light outlet window lens covering the light outlet, the ventilation chamber being communicated with the fan or the first shell, and the second shell being provided with a second air outlet communicated with the ventilation chamber.

[0014] According to some technical solutions of the present application, the first shell has the outer side walls on opposite sides, wherein the outer side wall on one side is the first side wall, and the outer side wall on the other side is the second side wall, and a plurality of fins are arranged on the first side wall and the second side wall; the laser further comprises a side cover and a partition, wherein the side cover is located on the side of the first side wall facing away from the second side wall and between the fan and the second shell, and the partition is arranged between the side cover and the first side wall, wherein a first gap is formed between the partition and the side cover, and a second gap is formed between the partition and the first side wall, the fins of the first side wall are accommodated in the second gap and are extended along the direction of the fan toward the second shell, and the second shell is provided with a ventilation hole connected to the ventilation chamber, a part of the ventilation hole is opposite to the first gap, and another part of the ventilation hole is opposite to the second gap; the fins of the second side wall are exposed to the outside of the laser.

[0015] According to some technical solutions of the present application, the laser direction of the output end of the laser emitting device is parallel to the air outlet direction of the fan.

[0016] In the present application, a first groove and a second groove are arranged on opposite sides of the first shell, and a plurality of fins are arranged on the outer side wall of the first shell. The laser emitting device is accommodated in a first cavity surrounded by the first shell and the first cover, and is connected to the inner surface of the first groove of the first shell. The circuit board is accommodated in a second cavity surrounded by the first shell and the second cover, and is connected to the first shell. In this way, both the laser emitting device and the circuit board can dissipate heat to the outside through the fins of the first shell, thereby solving the problem of heat dissipation requirements of the laser emitting device and the circuit board, and realizing the reuse of the fins of the first shell, which is beneficial to saving the volume of the product, lowering the cost, and is also more suitable for miniaturized and lightweight laser application scenarios.

[0017] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.

[0019] Figure 1 It is a schematic diagram of the decomposed structure of the heat dissipation structure described in one embodiment of the present application.

[0020] Figure 2 It is a three-dimensional structural schematic diagram of the heat dissipation structure described in an embodiment of the present application.

[0021] Figure 3 yes Figure 1 Schematic diagram of the main structure of the heat dissipation structure (excluding the second shell).

[0022] Figure 4 yes Figure 3 Schematic diagram of the three-dimensional structure of the heat dissipation structure (excluding the second shell).

[0023] Figure 5 yes Figure 1 A schematic diagram of the cross-sectional structure of a part of the heat dissipation structure (excluding the second shell and the fan).

[0024] Figure 6 It is a schematic diagram of the three-dimensional structure of the first shell in one embodiment of the present application.

[0025] Figure 7 It is a schematic diagram of the three-dimensional structure of the second cover in one embodiment of the present application.

[0026] Figure 8 It is a schematic diagram of the three-dimensional structure of a shell in one embodiment of the present application.

[0027] Fig. 9 It is a schematic diagram of the right side structure of the laser described in one embodiment of the present application.

[0028] Fig.10 yes Fig. 9 Schematic diagram of the structure of the AA section.

[0029] Fig.11 yes Fig. 9 Schematic diagram of the structure of the BB section.

[0030] Fig.12 yes Fig. 9 Schematic diagram of the structure of the CC section.

[0031] Fig.13 It is a schematic diagram of the main structure of the laser described in one embodiment of the present application.

[0032] Fig.14 yes Fig.13 Schematic diagram of the structure of the DD section.

[0033] The reference numerals are as follows:

[0034] 100. Heat dissipation structure;

[0035] 10. first shell; 11. bottom wall; 12. air inlet; 13. first side wall; 14. second side wall; 15. first fin; 16. second fin;

[0036] 20. First cover;

[0037] m1, first groove; m2, second groove;

[0038] 30. Fan;

[0039] 40. Semiconductor refrigeration components;

[0040] 50. second cover; 51. containing slot; 52. containing hole; 53. first air outlet; 54. side outlet;

[0041] 60. second shell; 61. panel; 611. second air outlet; 62. shell; 621. light inlet; 622. light outlet; 623. ventilation hole; 624. separation rib; 625. gas channel; 63. closed compartment; 64. ventilation compartment; 65. light outlet window lens;

[0042] 70. Side cover; 71. Connecting frame;

[0043] 80. Partition;

[0044] 90. Gas nozzle;

[0045] n1, first gap; n2, second gap;

[0046] 200, laser emitting device; 201, emission end;

[0047] 300. Circuit board;

[0048] 400, ranging sensor;

[0049] 500, focusing device; 501, focusing lens; 502, motor; 503, lead screw; 504, lead screw nut; 505, guide rod; 506, lens base;

[0050] 600. Reflector. DETAILED DESCRIPTION

[0051] Although the present invention can be easily embodied in different forms of embodiments, only some of the specific embodiments are shown in the drawings and described in detail in this specification. It should be understood that this description should be regarded as an exemplary description of the principles of the present invention and is not intended to limit the present invention to that described herein.

[0052] Thus, a feature indicated in this specification will be used to illustrate one of the features of an embodiment of the utility model, rather than implying that each embodiment of the utility model must have the described feature. In addition, it should be noted that this specification describes many features. Although some features can be combined together to illustrate possible system designs, these features can also be used in other combinations that are not explicitly described. Thus, unless otherwise stated, the described combinations are not intended to be limiting.

[0053] In the embodiments shown in the drawings, the indications of directions (such as up, down, etc.) used to explain the structure and movement of various elements of the present invention are not absolute but relative. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions also change accordingly.

[0054] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that the description of the utility model will be more comprehensive and complete, and the concepts of the example embodiments will be fully conveyed to those skilled in the art. The accompanying drawings are only schematic illustrations of the utility model and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.

[0055] See also Figures 1 to 14 Some embodiments of the utility model provide a laser and a heat dissipation structure 100 thereof, wherein the laser is specifically used to emit laser light to process (such as engraving, cutting, punching, etc.), clean, etc. a workpiece using the laser light. The heat dissipation structure 100 is used to dissipate heat from the laser to prevent high temperature damage to its components when the laser is working.

[0056] Specifically, the laser includes a laser emitting device 200, a circuit board 300, a distance sensor 400, a focusing device 500, a heat dissipation structure 100, etc. The heat dissipation structure 100 is used for heat dissipation of at least one of the laser emitting device 200, the circuit board 300, the distance sensor 400, and the focusing device 500 of the laser. Hereinafter, the heat dissipation structure 100 is used for heat dissipation of the laser emitting device 200, the circuit board 300, the distance sensor 400, and the focusing device 500 as an example for exemplary description.

[0057] Combined with Figure 1 , Figure 2 , Figure 3 It can be understood that the heat dissipation structure 100 of the laser specifically includes a first shell 10, a second shell 60, a first cover 20, a second cover 50, a side cover 70, a partition 80, a fan 30, a semiconductor cooling component 40, an air nozzle 90, etc. The following further illustrates the position relationship and shape of the components of the heat dissipation structure 100 in combination with the spatial coordinate system xyz (where the x direction, the y direction, and the z direction are mutually perpendicular in pairs):

[0058] The first shell 10 is provided with a first groove m1 and a second groove m2 on opposite sides thereof. The outer side wall of the first shell 10 (the outer side wall can refer to the attached Figure 3A plurality of second fins 16 are arranged on the first side wall 13 and / or the second side wall 14 shown in the figure; the first cover 20 is arranged on the side of the first shell 10 where the first groove m1 is provided, and the first cover 20 and the first shell 10 form a first cavity; the second cover 50 is arranged on the side of the first shell 10 where the second groove m2 is provided, and the second cover 50 and the first shell 10 form a second cavity; the laser emitting device 200 is located in the first cavity, and the laser emitting device 200 is connected to the inner surface of the first groove m1; the circuit board 300 is located in the second cavity, and the circuit board 300 is connected to the first shell 10.

[0059] A first groove m1 and a second groove m2 are provided on opposite sides of the first shell 10, and a plurality of second fins 16 are provided on the outer side wall of the first shell 10. The laser emitting device 200 is accommodated in a first cavity surrounded by the first shell 10 and the first cover 20, and is connected to the inner surface of the first groove m1 of the first shell 10. The circuit board 300 is accommodated in a second cavity surrounded by the first shell 10 and the second cover 50, and is connected to the first shell 10. In this way, the laser emitting device 200 and the circuit board 300 are connected to the first shell 10, so that both can dissipate heat to the outside through the second fins 16 of the first shell 10, thereby solving the heat dissipation requirement problem of the laser emitting device 200 and the circuit board 300, and realizing the reuse of the second fins 16 of the first shell 10, that is, the second fins 16 of the first shell 10 are reused for the heat dissipation of the laser emitting device 200 and the circuit board 300, which is conducive to saving the volume of the product, lowering the cost, and is also more suitable for miniaturized and lightweight laser application scenarios.

[0060] The fan 30 is connected to the first shell 10 , and is communicated with the first cavity and at least a portion of the second fins 16 , so that the fan 30 can drive airflow through the first cavity and at least a portion of the second fins 16 .

[0061] A fan 30 is provided to drive airflow through the first cavity and at least a portion of the second fin 16, the heat dissipation area is expanded through the second fin 16, and forced convection heat exchange of the laser emitting device 200 in the first cavity is achieved through the fan 30, and forced convection heat dissipation of the second fin 16 is achieved through the fan 30. In this way, the heat dissipation efficiency of the laser emitting device 200 and the circuit board 300 is higher, and the required heat dissipation area is smaller, which can make the laser more integrated and compact, lower the cost, and more suitable for miniaturized and lightweight laser application scenarios.

[0062] Alternatively, if Figure 6As shown, a plurality of second fins 16 are arranged at intervals on the outer side wall of the first shell 10, and gaps are formed between adjacent second fins 16 in the same direction as the extension of the second fins 16. The fan 30 is located at one end of the extension direction of the second fins 16, and the air outlet direction of the fan 30 is parallel to the extension direction of the second fins 16. In this way, the airflow driven by the fan 30 can efficiently pass through the gaps between adjacent second fins 16, so that the airflow can fully cover the surface of each second fin 16, thereby improving the heat dissipation efficiency of the second fins 16.

[0063] Optionally, combined Figure 3 , Figure 5 , Fig.10 , Fig.11 It can be understood that the first shell 10 is provided with a bottom wall 11, and the first groove m1 and the second groove m2 are located on opposite sides of the bottom wall 11. In this way, the structure of the first shell 10 is more compact, which is conducive to the miniaturization and compactness of the product, and is more suitable for miniaturized laser products.

[0064] Optionally, a plurality of first fins 15 are provided on the bottom wall 11, and the first fins 15 on the bottom wall 11 are located in the second groove m2. In this way, since the laser emitting device 200 is connected to the inner surface of the first groove m1, by providing a plurality of first fins 15 on the side of the bottom wall 11 facing away from the first groove m1, without additionally increasing the volume of the first shell 10, the laser emitting device 200 can further dissipate heat through the bottom wall 11 and the first fins 15 on the bottom wall 11, thereby further improving the heat dissipation efficiency of the laser emitting device 200.

[0065] The second groove m2 has an opening at one end away from the bottom wall 11, the circuit board 300 covers the opening of the second groove m2, the area around the opening of the second groove m2 is connected to the circuit board 300, and the first fins 15 on the bottom wall 11 are spaced apart from the circuit board 300. The circuit board 300 is arranged at the opening of the second groove m2 away from the bottom wall 11, and the heat of the circuit board 300 can be transferred to the second fins 16 by heat conduction through the area around the opening of the second groove m2, and dissipated outward through the second fins 16, wherein the circuit board 300 is spaced apart from the first fins 15 on the bottom wall 11, and the circuit board 300 will not directly contact the first fins 15, thereby reducing the thermal impact of the first fins 15 on the circuit board, and the heat in the second groove m2 is conducted outward through the side wall of the second groove m2 and dissipated through the second fins 16. Thus, the heat dissipation efficiency of the circuit board 300 is ensured.

[0066] Optionally, the fan 30 is connected to the position where at least a portion of the first fins 15 are located, so that the fan 30 can drive the airflow to flow through the first cavity and at least a portion of the first fins 15. The forced convection heat dissipation of the first fins 15 is achieved by the fan 30, so that the heat dissipation efficiency of the laser emitting device 200 and the circuit board 300 is higher, and the required heat dissipation area is smaller, which can make the laser more integrated and compact, lower in cost, and more suitable for miniaturized and lightweight laser application scenarios.

[0067] Alternatively, if Figure 6 As shown in FIG. 1 , a plurality of first fins 15 are arranged at intervals on the bottom wall 11, and gaps are formed between adjacent first fins 15 in the same direction as the extension direction of the first fins 15. The fan 30 is located at one end of the extension direction of the first fins 15, and the air outlet direction of the fan 30 (which can be roughly referred to in FIG. 1 ) is the same as that of the first fins 15. Fig.10 The double-dotted arrow direction shown in FIG. 3 is parallel to the extension direction of the first fin 15. In this way, the airflow driven by the fan 30 can efficiently pass through the gaps between adjacent first fins 15, so that the airflow can fully cover the surface of each first fin 15, thereby improving the heat dissipation efficiency of the first fin 15.

[0068] For example, Figure 3 , Figure 4 and Figure 5 As shown, the first shell 10 includes a bottom wall 11, a first side wall 13, and a second side wall 14. The first side wall 13 and the second side wall 14 are arranged opposite to each other with a gap therebetween. Figure 2 It can be understood that the first side wall 13 and the second side wall 14 of the first shell 10 are arranged at intervals along the x direction, and the first side wall 13 and the second side wall 14 are both extended along the y direction. The bottom wall 11 is connected between the first side wall 13 and the second side wall 14. The surface on one side of the bottom wall 11 and the first side wall 13 and the second side wall 14 enclose a first groove m1, and the surface on the other side of the bottom wall 11 and the first side wall 13 and the second side wall 14 enclose a second groove m2, so that the second groove m2 is located on the side of the bottom wall 11 that is opposite to the first groove m1. A plurality of second fins 16 are arranged on the surface of the first side wall 13 and the second side wall 14 that are opposite to each other. A plurality of first fins 15 are arranged on the surface of the bottom wall 11 used to enclose the second groove m2.

[0069] Optionally, the first fins 15 on the bottom wall 11 all extend along the y direction, and the first fins 15 are arranged at intervals along the x direction.

[0070] Optionally, the second fins 16 on the first side wall 13 and the second side wall 14 both extend along the y direction, and the second fins 16 are arranged at intervals along the z direction.

[0071] The air outlet direction of the fan 30 is substantially parallel to the y direction. Figure 3As shown, the second groove m2 of the first shell 10 is a structure that passes through both ends along the y direction, wherein one end of the second groove m2 is close to and facing the fan 30, so that the first fin 15 is located opposite to and connected to the fan 30, and one end of the second fin 16 on the two side walls is close to the fan 30 and faces the fan 30 and is connected to the fan 30, so that the airflow blown out by the fan 30 can enter the gap between the first fins 15 and the gap between the second fins 16 in parallel.

[0072] The first cover 20 is disposed at one end of the first side wall 13 and the second side wall 14, the first cover 20 is opposite to the bottom wall 11, the first fin 15 is located on the side of the bottom wall 11 facing away from the first groove m1, wherein the first cover 20, the first side wall 13, the second side wall 14 and the bottom wall 11 together enclose a first cavity, and the first cavity is used to accommodate the laser emitting device 200 of the laser. It can be understood that the laser emitting device 200 is a component that generates laser in the laser, such as a laser chip. The laser emitting device 200 is accommodated in the first cavity, so that the heat generated by the operation of the laser emitting device 200 can be transferred to the first side wall 13, the second side wall 14, the bottom wall 11 and even the first cover 20, and the heat is further dissipated by the first fins 15 and the second fins 16 on the first side wall 13, the second side wall 14 and the bottom wall 11. In the present design, the first side wall 13, the second side wall 14 and the bottom wall 11 are all provided with fins to form multi-directional heat dissipation, with a larger heat dissipation area and more efficient heat dissipation. While increasing the heat dissipation area, the fins are more concentrated and compactly distributed through the three-dimensional arrangement between the side wall and the bottom wall 11, which correspondingly reduces the overall size of the product, is more conducive to the miniaturization and lightweight of the product, and also makes the heat dissipation more uniform.

[0073] The fan 30 is connected to one end of the first shell 10, wherein the fan 30 is connected to the first groove m1, and the positions of the first fin 15 and the second fin 16 are connected to the fan 30, so that the fan 30 can drive the airflow to flow through the first groove m1, the first fin 15, and the second fin 16. This realizes a dual high-efficiency heat dissipation form of the laser emitting device 200. On the one hand, the airflow is driven into the first groove m1 by the fan 30, and the airflow can directly force convection heat exchange with the laser emitting device 200 in the first groove m1, which can achieve a lower heat dissipation temperature. At the same time, it is also conducive to the timely circulation and discharge of the high-temperature gas in the first groove m1, avoiding heat accumulation, and improving the working environment temperature of the laser emitting device 200. By driving the airflow through the fan 30 to force convection heat exchange with the first fin 15 and the second fin 16, the efficiency of heat dissipation of the laser emitting device 200 through the fins can be further improved. While meeting the purpose of heat dissipation, the heat dissipation area requirement can be reduced to a certain extent, which is more conducive to the miniaturization and lightweight of the product. The spatial three-dimensional arrangement of the two side walls and the bottom wall 11 makes the distribution of the fins more concentrated, which is conducive to the airflow fully covering the fin surface under the drive of the fan 30. The heat dissipation form of the fin composite fan 30 has the advantage of low cost.

[0074] Optionally, combined Figure 1 and Fig.10 It can be understood that the heat dissipation structure 100 of the laser also includes a semiconductor refrigeration element 40, which is located in the first groove m1 and between the laser emitting device 200 and the bottom wall 11. The semiconductor refrigeration element 40 has a cold end and a hot end, the cold end contacts the laser emitting device 200, and the hot end contacts the bottom wall 11. The semiconductor refrigeration element 40 transfers heat between the laser emitting device 200 and the bottom wall 11, so that a lower heat dissipation temperature can be achieved, and by arranging a first fin 15 on the side of the bottom wall 11 facing away from the laser emitting device 200, and using a fan 30 to drive the airflow to exchange heat with the first fin 15, so as to continuously extract heat from the hot end of the semiconductor refrigeration element 40, so that a more stable temperature difference gradient can be established between the cold end and the hot end of the semiconductor refrigeration element 40, thereby maintaining a lower heat dissipation temperature and heat dissipation stability for the laser emitting device 200.

[0075] Alternatively, if Figure 4 and Figure 6 As shown, the bottom wall 11 is provided with an air inlet 12 connected to the fan 30, and the first groove m1 is connected to the fan 30 through the air inlet 12. In this way, the fan 30 can drive the airflow along the air inlet 12 to enter the first groove m1, which is beneficial to the air circulation in the first groove m1 and improves the heat dissipation effect of the laser emitting device 200. The end of the first groove m1 away from the fan 30 along the y direction can be opened to allow the laser to be emitted.

[0076] Furthermore, if Figure 4 and Figure 6 As shown, the air inlet 12 is located on a side of the semiconductor cooling element 40 close to the fan 30, which can enhance the air circulation speed around the semiconductor cooling element 40 and avoid condensation at the cold end.

[0077] Preferably, if Figure 3 , Figure 4 and Figure 5 As shown, the first fin 15 is accommodated in the second groove m2, the fan 30 is connected to the second groove m2, and the second groove m2 has an opening at one end away from the bottom wall 11. The second cover 50 is arranged on the side of the two side walls away from the first cover 20, and the second cover 50 surrounds a receiving groove 51, which can be used to accommodate the circuit board 300 of the laser, and the receiving groove 51 is connected to the fan 30, and the opening of the second groove m2 is opposite to the receiving groove 51.

[0078] The circuit board 300 is located at one end of the first side wall 13 and the second side wall 14 away from the first cover 20, and the second cover 50 is connected to the first shell 10 from the side of the circuit board 300 facing away from the first side wall 13 and the second side wall 14. Fig.10 and Fig.11 It can be understood that when the circuit board 300 is installed between the first shell 10 and the second cover 50, one side of the circuit board 300 is opposite to the opening of the second groove m2, and the other side of the circuit board 300 is opposite to the containing groove 51. When the fan 30 drives the airflow to flow through the second groove m2 and the containing groove 51, the airflow can take away the heat on the surface of the circuit board 300, thereby realizing the heat dissipation of the circuit board 300, and the second groove m2 and the containing groove 51 can also provide the function of accommodation and avoidance, so that the components on the circuit board 300 protrude into the second groove m2 and / or the containing groove 51 to obtain protection.

[0079] Preferably, the first side wall 13 and the second side wall 14 located on the side of the second groove m2 both include an inclined section and an end wall section, the inclined section of each side wall is located between the bottom wall 11 and the end wall section, the inclined sections of the first side wall 13 and the second side wall 14 correspond to each other, so that the second groove m2 is arranged with an opening gradually expanding at the inclined section position, the first fin 15 of the bottom wall 11 is accommodated between the inclined sections of the two side walls, the end wall sections of the first side wall 13 and the second side wall 14 are hollow, and the hollow position of the second groove m2 is wider than the first groove m1, so that the circuit board 300 can obtain a larger air avoidance area, and the first fin 15 also has a larger heat dissipation space.

[0080] Preferably, for the plurality of second fins 16 of each side wall, the end of the second fin 16 away from the side wall is set to be flush. On the one hand, the product is more beautiful. For example, the ends of the second fins 16 of the external second side wall 14 are flush, making the product more beautiful. On the other hand, since the first groove m1 is narrower than the second groove m2, that is, the distance between the first side wall 13 and the second side wall 14 at the first groove m1 is narrower than the distance between the first side wall 13 and the second side wall 14 at the second groove m2, by designing the ends of the fins to be flush, the product is correspondingly made Therefore, the second fins 16 of the first side wall 13 and the second side wall 14 at the first groove m1 can be designed to be wider, so as to have a larger heat dissipation area for heat dissipation of the laser emitting device 200, while the second fins 16 of the first side wall 13 and the second side wall 14 at the second groove m2 are relatively narrow, taking into account that the heat generated by the circuit board 300 itself is less than that of the laser emitting device 200, so that the heat dissipation area is more reasonably allocated while taking into account the aesthetics and the heat dissipation needs, so as to meet the different heat dissipation needs of different components of the laser.

[0081] like Figure 7 As shown, the second cover 50 is a cavity having a bottom plate and side plates, wherein the side plates are arranged around the bottom plate, and the side plates and the bottom plate form a containing groove 51, wherein a penetrating side opening 54 is arranged on the side plate close to the fan 30, and the fan 30 is connected to the containing groove 51 through the side opening 54.

[0082] A first air outlet 53 is provided on the side of the bottom plate of the second cover 50 away from the fan 30, and the first air outlet 53 is connected to the containing groove 51, so that after the airflow enters the containing groove 51 from the side port 54, it flows from the side port 54 to the first air outlet 53 in the containing groove 51. In the process of the airflow flowing from the side port 54 to the first air outlet 53, it can flow through the surface of the circuit board 300, thereby dissipating the heat of the circuit board 300.

[0083] Furthermore, the second groove m2 is connected to the first air outlet 53 via the containing groove 51. After the airflow enters the second groove m2 driven by the fan 30, it is further discharged from the first air outlet 53, thereby ensuring the balance of air pressure inside and outside the heat dissipation structure 100 of the laser.

[0084] Furthermore, if Figure 5 and Figure 7As shown, the second cover 50 is also provided with a receiving hole 52, and the laser further includes a distance sensor 400, which is arranged on the circuit board 300, and the distance sensor 400 is inserted into the receiving hole 52 on the second cover 50 of the heat dissipation structure 100. Among them, the second cover 50 is provided with a plurality of first air outlets 53, and the plurality of first air outlets 53 are distributed around the receiving hole 52 at circumferential intervals, and at least one of the containing groove 51 and the second groove m2 is connected with the plurality of first air outlets 53. In this way, the fan 30 can drive the airflow to be discharged from the first air outlet 53, wherein the gas discharged from the first air outlet 53 can form a blocking effect around the lower part of the distance sensor 400, similar to forming a ring-shaped air wall surrounding the circumference of the space below the distance sensor 400, which can prevent dust from contacting the distance sensor 400, thereby ensuring the reliability and accuracy of the distance sensor 400. The distance measuring sensor 400 protrudes from the circuit board 300 and passes through the receiving hole 52 on the second cover 50 . The airflow flowing in the receiving groove 51 between the circuit board 300 and the second cover 50 can also be used to dissipate heat of the distance measuring sensor 400 .

[0085] like Figure 1 and Figure 2 As shown, the second shell 60 is located at an end of the first shell 10 away from the fan 30, and the second shell 60 is connected to the first shell 10. Fig.12 and Fig.14 It can be understood that a ventilation chamber 64 and a closed chamber 63 are provided in the second shell 60 , and the closed chamber 63 is arranged adjacent to the ventilation chamber 64 .

[0086] The laser also includes a focusing device 500, which is accommodated in a closed chamber 63 of the heat dissipation structure 100. The focusing device 500 includes a focusing mirror 501, a motor 502, and a transmission mechanism connected to the motor 502. The focusing mirror 501 is connected to the laser emitting device 200 optical path, and the transmission mechanism is connected to the focusing mirror 501. The transmission mechanism drives the focusing mirror 501 to move for focusing under the drive of the motor 502. By accommodating the focusing device 500 in the closed chamber 63, the focusing device 500 can be well protected from dust, and the user can avoid frequent disassembly and cleaning of the focusing mirror 501, which is more convenient to use. In addition, by arranging the closed chamber 63 and the ventilation chamber 64 adjacent to each other in the second shell 60, the airflow in the ventilation chamber 64 can achieve heat dissipation in the closed chamber 63, thereby further achieving heat dissipation of the focusing device 500.

[0087] Optionally, the transmission mechanism specifically includes a screw rod 503, a screw nut 504, a guide rod 505 and a mirror base 506. The extension direction of the screw rod 503 and the guide rod 505 is roughly parallel to the z direction. The motor 502 is arranged at one end of the screw rod 503 and connected to the screw rod 503, and is used to drive the screw rod 503 to rotate. The screw nut 504 is nested on the screw rod 503. The screw rod 503 drives the screw nut 504 to move along the screw rod 503 by rotating. The number of guide rods 505 is set to two. The screw nut 504 is slidingly connected to the two guide rods 505 respectively at the same time, so as to further guide the displacement movement of the screw nut 504 through the cooperation between the guide rod 505 and the screw nut 504, and limit the screw nut 504 from rotating with the screw rod 503. The focusing mirror 501 is located above the light exit window lens 65 and opposite to the light exit window lens 65 . The focusing mirror 501 is set on a lens seat 506 . The lens seat 506 is connected to the screw nut 504 and moves along with the screw nut 504 to get closer to or away from the light exit window lens 65 .

[0088] The laser further includes a reflector 600 , which is disposed in the closed chamber 63 and opposite to the emission end 201 . The reflector 600 is located above the focusing mirror 501 and is used to reflect the laser from the emission end 201 downward onto the focusing mirror 501 .

[0089] The first groove m1 corresponds to the closed chamber 63 and the two are separated by the wall of the second shell 60. The wall of the second shell 60 is provided with a light inlet 621 at the position corresponding to the first groove m1. The light inlet 621 is used for allowing the laser or the emission end 201 of the laser emitting device 200 to enter the closed chamber 63.

[0090] The second shell 60 is also provided with a light outlet 622 for laser emission and a light outlet window lens 65 covering the light outlet 622. The ventilation chamber 64 is connected to the fan 30 or the first shell 10, and the second shell 60 is provided with a second air outlet 611 connected to the ventilation chamber 64. In this way, the fan 30 can drive the airflow to flow through the ventilation chamber 64 and then be discharged along the second air outlet 611. By forming airflow in the ventilation chamber 64, a heat dissipation effect can be formed on the closed chamber 63 adjacent to the ventilation chamber 64, thereby achieving heat dissipation of the focusing device 500 in the closed chamber 63. In the present design, the closed chamber 63 is sealed to achieve dust prevention. The closed chamber 63 is used to accommodate the focusing device 500, so that the focusing device 500 can be protected from dust. The user does not need to frequently disassemble and clean the focusing device 500, and the use of the laser product is simpler and more user-friendly. The laser of the laser emitting device 200 can enter the closed chamber 63 along the light inlet 621, and after being focused by the focusing device 500 in the closed chamber 63, it is emitted through the light outlet window lens 65, thereby ensuring the connectivity of the optical path.

[0091] Optionally, combined Figure 8 and Fig.14 It can be understood that the light inlet 621 is a through hole structure, the laser emitting device 200 is accommodated in the first groove m1, the laser emitting device 200 of the laser is provided with an emission end 201, the laser is emitted from the emission end 201, and the laser direction of the laser emitting device 200 is the direction in which the laser emitting device 200 faces away from the fan 30. Among them, the emission end 201 is configured to be adapted to the light inlet 621, the emission end 201 extends out of the first groove m1 from the open end of the first groove m1, and passes through the light inlet 621 on the second shell 60 to extend into the closed chamber 63 of the second shell 60, thereby emitting the laser into the second shell 60. By using the emission end 201 to penetrate into the light inlet 621, the emission end can extend into the closed chamber 63 to emit laser, and at the same time the emission end closes and shields the light inlet 621, thereby preventing dust from entering. Alternatively, in other embodiments, the light inlet 621 can be configured as a combination of a hole and a lens, for example, the hole is covered with a lens, so that the laser emitted by the laser emitting device 200 located outside the closed chamber 63 can pass through the lens and enter the closed chamber 63 for focusing.

[0092] Optionally, the laser direction of the output end 201 of the laser emitting device 200 is parallel to the air outlet direction of the fan 30 , so that the heat distribution on the heat dissipation structure 100 can be better combined to optimize the heat dissipation efficiency of the fan 30 .

[0093] Optionally, the second shell 60 specifically includes a panel 61 and a shell body 62, the shell body 62 is a cavity having a bottom surface and a side surface, a partition rib 624 is protrudingly provided on the bottom surface, the panel 61 is blocked at one end of the shell body 62 away from the bottom surface, a closed chamber 63 located on one side of the partition rib 624 is formed between the shell body 62 and the panel 61, and a ventilation chamber 64 located on the other side of the partition rib 624 is formed between the shell body 62 and the panel 61, that is, the closed chamber 63 and the ventilation chamber 64 are separated by the partition rib 624. A ventilation hole 623 is provided on the bottom surface of the housing 62 at a position corresponding to the ventilation chamber 64, and the ventilation hole 623 is connected to the fan 30. A second air outlet 611 is provided on the panel 61 at a position corresponding to the ventilation chamber 64, so that the airflow can enter the ventilation chamber 64 from the ventilation hole 623, and be discharged from the second air outlet 611 after passing through the ventilation chamber 64. In the process of the airflow passing through the ventilation chamber 64, the heat on the partition rib 624 can be taken away, thereby dissipating the heat of the closed chamber 63.

[0094] like Figures 3 to 5As shown, the side cover 70 is located on the side of the first side wall 13 facing away from the second side wall 14 and between the fan 30 and the second shell 60, and the partition 80 is arranged between the side cover 70 and the first side wall 13, wherein a first gap n1 is formed between the partition 80 and the side cover 70, and a second gap n2 is formed between the partition 80 and the first side wall 13, and the second fin 16 of the first side wall 13 is accommodated in the second gap n2 and is extended along the fan 30 toward the second shell 60, as shown in FIG. Fig.11 As shown, a part of the ventilation hole 623 faces the first gap n1, and another part of the ventilation hole 623 faces the second gap n2. In this way, driven by the fan 30, a part of the airflow enters the ventilation chamber 64 along the first gap n1, and a part of the airflow enters the ventilation chamber 64 along the second gap n2, so that the airflow entering the ventilation chamber 64 is distributed, ensuring that the airflow temperature in the ventilation chamber 64 will not be too high, so that the second fins 16 of the built-in first side wall 13 can dissipate heat in time, better ensuring the heat dissipation effect of the laser emitting device 200, and also meeting the exhaust demand at the second gap n2, and better balancing the internal and external air pressures of the heat dissipation structure 100 of the laser.

[0095] Optionally, the sum of the areas of the ventilation holes 623 facing the first gap n1 is greater than the sum of the areas of the ventilation holes 623 facing the second gap n2 , thereby better improving the heat dissipation effect of the closed chamber 63 .

[0096] Optionally, the second fins 16 of the second side wall 14 are externally disposed to be exposed outside the heat dissipation structure 100. In this way, the second fins 16 of the second side wall 14 can exchange heat with the external space in a timely manner, further improving the heat dissipation effect of the laser emitting device 200.

[0097] For example, the first cover 20 covers one end of the first shell 10 along the z direction, and the second cover 50 covers the other end of the first shell 10 along the z direction. A side port 54 communicating with the fan 30 is provided on a side plate of the second cover 50 on a side close to the fan 30. Both the first cover 20 and the second cover 50 extend from the second shell 60 to the fan 30, so that the first cover 20 and the second cover 50 surround the first shell 10 from both sides facing each other in the z direction.

[0098] The side cover 70 is disposed on one side of the first shell 10 along the x direction, and the side cover 70 extends from the second shell 60 to the fan 30 along the y direction, so that the side cover 70, the second shell 60, and the fan 30 roughly surround the first shell 10 from three sides, and the side of the first shell 10 facing away from the side cover 70 along the x direction is open, so that the second side wall 14 is exposed to the outside of the heat dissipation structure 100. In this way, the first cover 20, the second cover 50, the first shell 10, the second shell 60, and the side cover 70 enclose the main body of the heat dissipation structure 100 in a roughly regular rectangular shape, and the main body also serves as the outer shell of the laser.

[0099] A connecting frame 71 is also provided on the side of the side cover 70 facing away from the partition 80. The connecting frame 71 is used for connecting and assembling the heat dissipation structure 100. For example, the connecting frame 71 is connected to the end of the robot arm so that the heat dissipation structure 100 is installed on the robot arm and moves under the drive of the robot arm to process the workpiece.

[0100] The partition 80 is built inside the heat dissipation structure 100, and is located between the side cover 70 and the first side wall 13. The gap between the partition 80 and the side cover 70, and the gap between the partition 80 and the first side wall 13, are both directly opposite to and connected to the fan 30, so that the airflow driven by the fan 30 can pass through the two gaps and blow into the ventilation chamber 64 of the second shell 60, and after further passing through the ventilation chamber 64 of the second shell 60, it is discharged from the side of the ventilation chamber 64 away from the first shell 10 along the second air outlet 611. Among them, when the airflow flows from the gap between the partition 80 and the first side wall 13 to the second shell 60, it passes through the spacing position between the second fins 16 of the first side wall 13 in parallel, so that the second fins 16 can dissipate heat evenly and fully.

[0101] The second housing 60 and the fan 30 may be as shown in the attached Figure 1 and Figure 2 As shown, they are all configured as rectangular blocks or squares with a certain thickness, and the fan 30 and the second shell 60 are arranged at both ends of the first shell 10 along the y direction.

[0102] The second fin 16 of the second side wall 14 is not blocked by the first cover 20 , the second cover 50 , the side cover 70 , etc., so as to form an external arrangement and be exposed to the outside of the heat dissipation structure 100 of the laser.

[0103] Optionally, the heat dissipation structure 100 of the laser also includes a gas nozzle 90, wherein the second shell 60 is also provided with a gas channel 625, and the gas channel 625 has an air outlet formed on the surface of the second shell 60, and the gas nozzle 90 integrally covers the light exit window lens 65 and the air outlet of the second shell 60. The laser emitted through the light exit window lens 65 can be further emitted through the gas nozzle 90 for processing or cleaning the workpiece, and the gas discharged from the gas guide channel can further pass through the gas nozzle 90 to purge the laser processing position on the surface of the workpiece.

[0104] The laser provided in this embodiment has internal components (such as the laser emitting device 200, the circuit board 300, the focusing device 500, etc.) that obtain good heat dissipation effect through the heat dissipation structure 100, thereby avoiding the problem of overheating and damage of the components. At the same time, the entire laser uses the heat dissipation structure 100 as the main part, and the components are built into the heat dissipation structure 100 to achieve the integration and compactness of the overall volume, which is more suitable for miniaturized and lightweight laser application scenarios. In addition, the laser has the advantages of simple structure and low cost.

[0105] Although the utility model has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the utility model can be implemented in a variety of forms without departing from the spirit or essence of the utility model, it should be understood that the above-mentioned embodiments are not limited to any of the aforementioned details, but should be widely interpreted within the spirit and scope defined by the attached claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the attached claims.

Claims

1. A laser, characterized in that: include: A first shell, wherein a first groove and a second groove are disposed on opposite sides of the first shell, and a plurality of fins are disposed on an outer side wall of the first shell; A first cover, disposed on a side of the first shell where the first groove is disposed, and forming a first cavity with the first shell; A second cover is arranged on a side of the first shell where the second groove is arranged, and forms a second cavity with the first shell; A laser emitting device, located in the first cavity and connected to the inner surface of the first groove; The circuit board is located in the second cavity and connected to the first shell.

2. The laser according to claim 1, characterized in that A bottom wall is provided in the first shell, and the first groove and the second groove are located on opposite sides of the bottom wall, wherein the second groove has an opening at one end away from the bottom wall, the circuit board covers the opening of the second groove, and the area around the opening of the second groove is connected to the circuit board, and a plurality of fins are provided on the bottom wall, the fins on the bottom wall are located in the second grooves, and the fins on the bottom wall are distributed at intervals between the circuit board.

3. The laser according to claim 1 or 2, characterized in that: Also includes: A fan is connected to the first shell, the fan is communicated with the first cavity and with the position where at least a part of the fins are located, so that the fan can drive airflow to flow through the first cavity and at least a part of the fins.

4. The laser according to claim 3, characterized in that The fan is located at one end of the extension direction of the plurality of fins, and the air outlet direction of the fan is parallel to the extension direction of the plurality of fins.

5. The laser according to claim 3, characterized in that Also includes: The semiconductor refrigeration component is located in the first cavity and between the laser emitting device and the inner bottom surface of the first groove. The semiconductor refrigeration component has a cold end and a hot end. The cold end contacts the laser emitting device, and the hot end contacts the inner bottom surface of the first groove.

6. The laser according to claim 5, characterized in that An air inlet connected to the fan is arranged on the inner bottom surface of the first groove, and the air inlet is located on a side of the semiconductor refrigeration component close to the fan.

7. The laser according to claim 3, characterized in that The second cover forms a containing groove, the side of the circuit board facing away from the second groove is opposite to the containing groove, the containing groove is connected to the fan, the laser also includes a ranging sensor, and the ranging sensor is penetrated on the second cover, wherein the second cover is provided with a penetrating first air outlet, and a plurality of the first air outlets are distributed around the ranging sensor along the circumferential interval, and at least one of the containing groove and the second groove is connected to the plurality of the first air outlets.

8. The laser according to claim 3, characterized in that Also includes: a second shell connected to the first shell and located at an end of the first shell away from the fan, wherein a ventilation chamber and a closed chamber are arranged adjacently in the second shell; A focusing device is accommodated in the closed chamber, the first cavity corresponds to the closed chamber in position and the two are separated by the wall of the second shell, the wall of the second shell is provided with a light inlet at a position corresponding to the first cavity, the light inlet is used for allowing the laser or the emission end of the laser emitting device to enter the closed chamber, the second shell is also provided with a light outlet for laser emission and a light outlet window lens covering the light outlet, the ventilation chamber is connected to the fan or the first shell, and the second shell is provided with a second air outlet connected to the ventilation chamber.

9. The laser according to claim 8, characterized in that The first shell has the outer side walls on opposite sides, wherein the outer side wall on one side is a first side wall, and the outer side wall on the other side is a second side wall, and a plurality of fins are disposed on the first side wall and the second side wall; The laser further comprises a side cover and a partition, wherein the side cover is located on a side of the first side wall facing away from the second side wall and between the fan and the second shell, and the partition is arranged between the side cover and the first side wall, wherein a first gap is formed between the partition and the side cover, and a second gap is formed between the partition and the first side wall, a fin of the first side wall is accommodated in the second gap and is extended along the fan toward the second shell, and the second shell is provided with a ventilation hole communicating with the ventilation chamber, a part of the ventilation hole is opposite to the first gap, and another part of the ventilation hole is opposite to the second gap; The fins of the second side wall are exposed to the outside of the laser.

10. The laser according to claim 3, characterized in that The laser direction of the output end of the laser emitting device is parallel to the air outlet direction of the fan.

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