Ultra-thin high-precision FPC impedance board

Abstract

The utility model discloses an ultra-thin high-precision FPC (flexible printed circuit) impedance board, which comprises a double-sided flexible substrate, the double-sided flexible substrate is fixedly connected with flexible heat dissipation pieces which are arranged at equal intervals, the upper surface of the double-sided flexible substrate is fixedly connected with a plurality of groups of connecting wires, and the connecting wires and the flexible heat dissipation pieces are arranged at intervals. According to the utility model, the flexible heat dissipation pieces are distributed on the upper surface of the double-sided flexible substrate, the gaps between the connecting lines and the flexible heat dissipation pieces are sealed and filled by the upper film, and the flexible heat dissipation pieces are neatly distributed along the double-sided flexible substrate, so that the double-sided flexible substrate can be smoothly bent into a required shape when the double-sided flexible substrate needs to be bent; and the flexible heat dissipation piece can realize multi-point combined heat dissipation on the double-sided flexible substrate, so that the device has the advantages that the heat dissipation modules are distributed and embedded on the surface of an impedance plate by using the design of fitting the FPC impedance plate, and the overall flexibility of the device is ensured while heat dissipation is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC impedance plates, in particular to an ultra-thin high-precision FPC impedance plate. Background Art

[0002] Conventional FPC impedance boards use double-sided flexible boards as substrates. The body of the double-sided flexible board is made of PI material, and both sides of the double-sided flexible board are covered with copper. The impedance signal line is etched on the copper sheet on one side of the double-sided flexible board, and the copper sheet on the other side of the double-sided flexible board is used as the reference layer, while the PI material of the double-sided flexible board body is used as the dielectric layer.

[0003] For example, the utility model patent with application number 2021227230695 discloses an ultra-thin, high-precision FPC impedance board, which belongs to the field of circuit boards and solves the problems in the prior art: the FPC impedance board generates a lot of heat when working and it is time-consuming and labor-intensive to clean the FPC impedance board; this solution includes a circuit board, and a conversion component is provided on the side of the circuit board. The conversion component is used to collect the wind force generated by the air flow when the circuit board moves with the external device to dissipate heat for the circuit board, and at the same time collect and store dust in the external device.

[0004] However, while adding a heat dissipation design to the FPC impedance board in the prior art, its flexibility and thickness are affected. In addition, since the FPC impedance board itself is soft, it is difficult to support the addition of more heat dissipation mechanisms, which will affect its own application effect. Utility Model Content

[0005] In view of the problems existing in the prior art, the purpose of the utility model is to provide an ultra-thin high-precision FPC impedance board, which has the advantage of using a design that fits the FPC impedance board to distribute and embed the heat dissipation module on the surface of the impedance board, while achieving heat dissipation and ensuring the overall flexibility of the device.

[0006] To achieve the above purpose, the utility model adopts the following technical solution.

[0007] An ultra-thin high-precision FPC impedance board comprises a double-sided flexible substrate, to which flexible heat sinks arranged at equal distances are fixedly connected, a plurality of groups of connecting wires are fixedly connected to the upper surface of the double-sided flexible substrate, the connecting wires and the flexible heat sinks are arranged at intervals from each other, and the upper surface of the double-sided flexible substrate is covered with an upper film.

[0008] As a further description of the above technical solution: the flexible heat dissipation component includes equally spaced card blocks and heat dissipation strips, the card blocks are fixed to the inside of the double-sided flexible substrate, the top of the card blocks is fixedly connected to the heat dissipation strip, and the top of the heat dissipation strip is plugged into the top of the upper film.

[0009] As a further description of the above technical solution: three parallel cutouts are opened on the top of the heat dissipation strip.

[0010] As a further description of the above technical solution: a plurality of groups of concave holes are provided on the top of the heat dissipation strip.

[0011] As a further description of the above technical solution: the card block and the heat dissipation strip are both flexible ultra-thin heat dissipation silicone.

[0012] As a further description of the above technical solution: the lower surface of the double-sided flexible substrate is covered with a lower film.

[0013] Compared with the prior art, the advantages of the present invention are:

[0014] This solution achieves the advantage of using a design that fits the FPC impedance board by distributing the flexible heat sink on the double-sided flexible substrate to embed the heat sink module on the surface of the impedance board, thereby achieving heat dissipation while ensuring the overall flexibility of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view cross-sectional structural schematic diagram of the utility model;

[0016] Figure 2 It is a partial three-dimensional structural schematic diagram of the utility model;

[0017] Figure 3 for Figure 2 A schematic diagram of the enlarged structure of the middle part A;

[0018] Figure 4 It is a schematic diagram of the top structure of the utility model.

[0019] Description of the numbers in the figure:

[0020] 1. Double-sided flexible substrate; 2. Flexible heat sink; 21. Block; 22. Heat dissipation strip; 221. Cutout; 222. Concave hole; 3. Connecting wire; 4. Upper film; 5. Lower film. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0022] See also Figures 1 to 4 In the utility model, an ultra-thin high-precision FPC impedance board includes a double-sided flexible substrate 1, on which flexible heat sinks 2 arranged at equal distances are fixedly connected, a plurality of groups of connecting wires 3 are fixedly connected to the upper surface of the double-sided flexible substrate 1, the connecting wires 3 and the flexible heat sinks 2 are arranged at intervals from each other, and the upper surface of the double-sided flexible substrate 1 is covered with an upper film 4.

[0023] In the utility model, a double-sided flexible substrate 1 is used as the main body of the device, and a circuit connection is conveniently performed through a connecting line 3, and a flexible heat sink 2 is distributed on the upper surface of the double-sided flexible substrate 1, and an upper film 4 seals and fills the gap between the connecting line 3 and the flexible heat sink 2. Since the flexible heat sink 2 is neatly distributed along the double-sided flexible substrate 1, when bending is required, it can be ensured that the double-sided flexible substrate 1 can be smoothly bent into a required shape, and the flexible heat sink 2 can achieve multi-point combined heat dissipation of the double-sided flexible substrate 1, thereby achieving the device having the design of using a fitted FPC impedance board to distribute and embed the heat dissipation module on the surface of the impedance board, while achieving heat dissipation, ensuring the overall flexibility of the device, and solving the problem that the FPC impedance board in the prior art is affected by adding a heat dissipation design while affecting its own flexibility and thickness, and because the FPC impedance board itself is soft, it is difficult to support the addition of more heat dissipation mechanisms, which will affect its own application effect.

[0024] See also Figure 2 and Figure 3 , wherein: the flexible heat sink 2 includes a card block 21 and a heat dissipation strip 22 arranged equidistantly, the card block 21 is clamped and fixed to the inside of the double-sided flexible substrate 1, the top of the card block 21 is fixedly connected to the heat dissipation strip 22, and the top of the heat dissipation strip 22 is plugged into the top of the upper film 4.

[0025] In the utility model, the heat dissipation bar 22 is fixed on the upper surface of the double-sided flexible substrate 1 by the clamping block 21, and the clamping block 21 transfers the heat to the heat dissipation bar 22, and then the heat is efficiently dissipated into the air through the heat dissipation bar 22 to achieve heat dissipation.

[0026] See also Figure 1 and Figure 3 , wherein: three parallel cutouts 221 are opened on the top of the heat dissipation strip 22 .

[0027] In the present invention, the three cutouts 221 enable the heat dissipation bar 22 to have better bending performance when being bent, and can expand the surface of the heat dissipation bar 22 to enhance the heat dissipation effect.

[0028] See also Figure 1 and Figure 3 , wherein: a plurality of recessed holes 222 are formed on the top of the heat dissipation strip 22 .

[0029] In the present invention, the surface area of ​​the heat dissipation strip 22 is increased by the concave holes 222, thereby increasing the heat dissipation efficiency.

[0030] See also Figure 1 , wherein: the block 21 and the heat dissipation strip 22 are both made of flexible ultra-thin heat dissipation silicone.

[0031] In the utility model, the clamping block 21 and the heat dissipation strip 22 are both made of flexible ultra-thin heat dissipation silicone rubber, thereby achieving efficient heat dissipation effect while ensuring flexibility.

[0032] See also Figure 1 , wherein: the lower surface of the double-sided flexible substrate 1 is covered with a lower film 5 .

[0033] In the utility model, the bottom of the double-sided flexible substrate 1 is covered and protected by the lower film 5 .

[0034] The above is only a preferred specific implementation of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.

Claims

1. An ultra-thin high-precision FPC impedance board, comprising a double-sided flexible substrate (1), characterized in that: The double-sided flexible substrate (1) is fixedly connected to flexible heat sinks (2) arranged at equal distances, the upper surface of the double-sided flexible substrate (1) is fixedly connected to a plurality of groups of connecting wires (3), the connecting wires (3) and the flexible heat sinks (2) are arranged at intervals from each other, and the upper surface of the double-sided flexible substrate (1) is covered with an upper film (4).

2. The ultra-thin high-precision FPC impedance board according to claim 1, characterized in that: The flexible heat sink (2) comprises a card block (21) and a heat sink (22) arranged at equal intervals, the card block (21) being card-connected and fixed to the inside of the double-sided flexible substrate (1), the top of the card block (21) being fixedly connected to the heat sink (22), and the top of the heat sink (22) being plugged into the top of the upper film (4).

3. The ultra-thin high-precision FPC impedance board according to claim 2, characterized in that: The top of the heat dissipation strip (22) is provided with three parallel cutouts (221).

4. The ultra-thin high-precision FPC impedance board according to claim 2, characterized in that: A plurality of groups of concave holes (222) are provided on the top of the heat dissipation strip (22).

5. The ultra-thin high-precision FPC impedance board according to claim 2, characterized in that: The card block (21) and the heat dissipation strip (22) are both made of flexible ultra-thin heat dissipation silica gel.

6. The ultra-thin high-precision FPC impedance board according to claim 1, characterized in that: The lower surface of the double-sided flexible substrate (1) is covered with a lower film (5).

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