Flexible OLED panel and electronic equipment comprising same
By setting up dual isolation areas in the flexible OLED panel, the problem of easy to break and cracks in the thin -film packaging layer boundary is solved, and the effective width and insulation of the packaging are improved, reducing the risk of production costs and packaging failure.
Patent Information
- Application Number
- CN202421175590.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-05-27
AI Technical Summary
Existing flexible OLED panels are prone to problems such as breakage and cracks at the boundary of the film packaging layer, resulting in packaging failure. The market requirements for panel frame width are getting higher and higher, compressing the effective width of the film packaging layer.
By setting a dual isolation area buffer on the outside of the display area of the flexible OLED panel, and extending the film packaging layer to the second isolation area, it covers the cross -section of the first circuit layer exposed in the penetrating slot to form a stress partition slot to avoid cracking extension Essence
Effectively increase the width of the thin film packaging layer, reduce the risk of packaging failure, increase the product's production qualification rate and insulation, and reduce production costs.
Smart Images
Figure CN222424629U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of display devices, in particular to a flexible OLED panel and an electronic device comprising the same. Background Art
[0002] Flexible AMOLED screens have excellent properties such as being light, foldable, drop-resistant and impact-resistant, but the market requires narrower and narrower panel borders, resulting in the effective width of thin-film encapsulation being continuously compressed.
[0003] In the prior art, in order to avoid problems such as undercuts and cracks in the thin film packaging layer when cutting the panel material, the packaging layer boundary is deliberately retracted to avoid the cutting path, thereby reducing the width of the thin film packaging layer and increasing the risk of packaging failure.
[0004] In view of the above defects, the present invention proposes a new flexible OLED panel and an electronic device including the same. Utility Model Content
[0005] The purpose of the utility model is to provide a flexible OLED panel and an electronic device comprising the same, which increases the width of the thin film package of the flexible OLED panel, thereby avoiding package failure caused by insufficient package width and package failure caused by extension of cracks generated during cutting, thereby improving the production qualification rate of the product and reducing the production cost.
[0006] The utility model solves the above technical problems through the following technical solutions:
[0007] The utility model provides a flexible OLED panel, comprising:
[0008] A flexible substrate having a display area, a first isolation area surrounding the display area, and a second isolation area surrounding the first isolation area;
[0009] A first circuit layer formed on a first side of the flexible substrate;
[0010] A plurality of undercut isolation grooves are patterned on the surface of the first side of the first isolation region of the flexible substrate, and the first circuit layer has a through groove exposing the undercut isolation groove corresponding to each of the undercut isolation grooves;
[0011] A thin film encapsulation layer is deposited on a side of the first circuit layer facing away from the flexible substrate, the thin film encapsulation layer is partially disconnected on a surface of the first circuit layer facing away from the flexible substrate by the through groove, and the thin film encapsulation layer partially deposited on a side wall of the through groove encapsulates a cross section of the first circuit layer exposed from the through groove.
[0012] In the present technical solution, a double isolation area buffer is arranged outside the display area of the flexible substrate, so that defects that may occur when cutting the flexible OLED panel cannot affect the display area; the thin film encapsulation layer extends to the second isolation area, which greatly extends the effective encapsulation length and reduces the risk of encapsulation failure; the thin film encapsulation layer covers the cross-section of the first circuit layer exposed in the through groove, so that the first circuit layer is completely encapsulated, thereby improving its insulation and avoiding interference with its internal signal transmission.
[0013] Preferably, a width of the second isolation region is smaller than a width of the first isolation region.
[0014] In this technical solution, the width of the second isolation area is smaller than that of the first isolation area, thereby minimizing the border width of the flexible OLED panel.
[0015] Preferably, the undercut isolation groove and the through groove are combined to form a stress isolation groove, and the first circuit layer and the thin film encapsulation layer are disconnected by the stress isolation groove.
[0016] In this technical solution, the stress isolation groove completely disconnects the first circuit layer and the thin film encapsulation layer in the first isolation area, avoiding defects such as cracks and breaks that may occur when cutting the flexible OLED panel from affecting the display area, thereby improving the product qualification rate.
[0017] Preferably, the distance between two adjacent parts of the first circuit layer disconnected by the stress isolation groove is L1, the width of the part of the first circuit layer disconnected by the stress isolation groove is L2, and 0.5≤L1 / L2≤1.
[0018] In the present technical solution, the ratio between L1 and L2 is appropriate, which can avoid the stress isolation groove being too wide to waste the material of the first circuit layer, and also avoid the distance between the two disconnected sections of the first circuit layer being too narrow to affect the insulation.
[0019] Preferably, the distance between two adjacent parts of the thin film encapsulation layer disconnected by the stress isolation groove is L3, the width of the part of the thin film encapsulation layer disconnected by the stress isolation groove is L4, and 0.1≤L3 / L4≤0.5.
[0020] In the present technical solution, the ratio between L3 and L4 is appropriate, which can avoid the stress isolation groove being too wide to waste the material of the thin film packaging layer, and also avoid the distance between the two disconnected sections of the thin film packaging layer being too narrow to affect the insulation.
[0021] Preferably, the flexible OLED panel further comprises an isolation column, and the isolation column is arranged in the display area and between the thin film encapsulation layer and the first circuit layer.
[0022] In the technical solution, the isolation column is arranged between the thin film encapsulation layer and the first circuit layer to further isolate the display area from the influence of defects that may be generated during cutting.
[0023] Preferably, the thin film encapsulation layer comprises a first thin film encapsulation layer and a second thin film encapsulation layer, and an organic encapsulation layer is provided between the first thin film encapsulation layer and the second thin film encapsulation layer on a side of the isolation column away from the first isolation region.
[0024] In the technical solution, the organic encapsulation layer is fluid before processing, and the isolation column cooperates with the first thin film encapsulation layer and the second thin film encapsulation layer to block the flow of the organic encapsulation layer and keep it in a set position.
[0025] Preferably, a second circuit layer is provided between the isolation column and the first circuit layer on a side of the isolation column away from the first isolation region, and the second circuit layer extends in a direction away from the first isolation region.
[0026] In the technical solution, the isolation column and the first circuit layer cooperate to encapsulate the second circuit layer, maintain the insulation of the second circuit layer, and avoid interfering with signal transmission.
[0027] Preferably, each of the undercut isolation grooves and the through grooves are parallel to each other.
[0028] In this technical solution, multiple undercut isolation grooves and through grooves achieve multiple barriers, so that defects such as cracks and breaks generated when cutting the flexible OLED panel cannot affect the display area.
[0029] The utility model also provides an electronic device, comprising the flexible OLED panel as described in any one of the above items.
[0030] In the present technical solution, the electronic device includes the above-mentioned flexible OLED panel, which reduces the risk of packaging failure, improves the insulation of the flexible OLED panel, and avoids interference with its internal signal transmission, thereby improving the qualification rate and user experience of the electronic device.
[0031] On the basis of conforming to the common sense in the art, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present utility model.
[0032] The positive and progressive effects of the utility model are:
[0033] The utility model provides a flexible OLED panel and an electronic device including the same, wherein a double isolation area buffer is arranged outside the display area of the flexible substrate of the flexible OLED panel, so that defects that may occur when cutting the flexible OLED panel cannot affect the display area; the thin film encapsulation layer extends to the second isolation area, which greatly prolongs the effective encapsulation length and reduces the risk of encapsulation failure; the thin film encapsulation layer covers the cross-section of the first circuit layer exposed in the through groove, thereby improving its insulation and avoiding interference with the signal transmission inside it, thereby improving the qualification rate and use experience of the electronic device.
[0034] To further understand the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the detailed description and drawings here are only used to illustrate the present application and do not impose any limitations on the scope of the claims of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] The above and other features and advantages of the present application will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.
[0036] Figure 1 It is a partial cross-sectional schematic diagram of a flexible OLED panel according to an embodiment of the utility model.
[0037] Figure 2 It is a partially enlarged cross-sectional schematic diagram of the flexible OLED panel according to an embodiment of the utility model.
[0038] Reference numerals
[0039] 1 Flexible Substrate
[0040] 11 Display area
[0041] 12 The first isolation area
[0042] 13 Second Isolation Area
[0043] 14 Undercut isolation groove
[0044] 2 First circuit layer
[0045] 21 Through slot
[0046] 3 Thin film encapsulation layer
[0047] 4 Isolation columns
[0048] 5 Second circuit layer DETAILED DESCRIPTION
[0049] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the present application. The present application can also be implemented or applied through other different specific implementation methods, and the details in the present application can also be modified or changed in various ways according to different viewpoints and application systems without departing from the spirit of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.
[0050] The following is a detailed description of the embodiments of the present application with reference to the accompanying drawings so that those skilled in the art can easily implement the present application. The present application can be embodied in a variety of different forms and is not limited to the embodiments described herein.
[0051] In the representations of the present application, the representations with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the represented specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples represented in the present application and the features of the different embodiments or examples, unless they contradict each other.
[0052] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the representation of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0053] In order to clearly describe the present application, components irrelevant to the description are omitted, and the same reference symbols are given to the same or similar components throughout the specification.
[0054] Throughout the specification, when a device is said to be "connected" to another device, this includes not only the case of "direct connection" but also the case of "indirect connection" by placing other elements therebetween. In addition, when a device is said to "include" a certain component, unless otherwise stated, it does not exclude other components, but means that other components may be included.
[0055] When a device is said to be "on" another device, it may be directly on the other device, but there may also be other devices between it. In contrast, when a device is said to be "directly" on another device, there are no other devices between it.
[0056] Although the terms first, second, etc. are used to represent various elements in some examples, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, the first interface and the second interface, etc. are represented. Moreover, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising" and "including" indicate the existence of features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.
[0057] The technical terms used herein are only used to refer to specific embodiments and are not intended to limit the present application. The singular form used herein also includes the plural form unless the sentence clearly indicates the contrary meaning. The meaning of "including" used in the specification is to specify specific characteristics, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and / or components.
[0058] Although not defined differently, all terms, including technical and scientific terms used herein, have the same meaning as those generally understood by those skilled in the art to which this application belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with the relevant technical literature and the contents of the current disclosure, and unless defined, shall not be overly interpreted as ideal or very formal meanings.
[0059] like Figure 1As shown, the flexible OLED panel of this embodiment includes: a flexible substrate 1, the flexible substrate 1 has a display area 11, a first isolation area 12 surrounding the display area 11, and a second isolation area 13 surrounding the first isolation area 12; a first circuit layer 2 formed on a first side of the flexible substrate 1; four undercut isolation grooves 14 are patterned on the surface of the first side of the first isolation area 12 of the flexible substrate 1, and the first circuit layer 2 has a through groove 21 corresponding to each undercut isolation groove 14 to expose the undercut isolation groove 14; and a thin film encapsulation layer 3 deposited on a side of the first circuit layer 2 away from the flexible substrate 1, the local thin film encapsulation layer 3 located on the surface of the first circuit layer 2 away from the flexible substrate 1 is disconnected by the through groove 21, and the part of the thin film encapsulation layer 3 deposited on the side wall of the through groove 21 encapsulates the cross section of the first circuit layer 2 exposed in the through groove 21. A double isolation area buffer is arranged outside the display area 11 of the flexible substrate 1, so that defects that may occur when cutting the flexible OLED panel cannot affect the display area 11; the thin film encapsulation layer 3 extends to the second isolation area 13, which greatly extends the effective encapsulation length and reduces the risk of encapsulation failure; the thin film encapsulation layer 3 covers the cross-section of the first circuit layer 2 exposed in the through groove 21, so that the first circuit layer 2 is completely encapsulated, improves its insulation, and avoids interference with its internal signal transmission, but is not limited to this.
[0060] In the present embodiment, the thin film encapsulation layer 3 is disconnected in the undercut isolation groove 14; in other embodiments, the thin film encapsulation layer 3 continuously covers the inner wall of the undercut isolation groove 14, and the thickness of the thin film encapsulation layer 3 at the side wall and the upper wall of the undercut isolation groove 14 is less than the thickness at other positions; the stress at the side wall and the upper wall of the undercut isolation groove 14 is relatively large. If an external crack extends inward during processing, a crack in the same extension direction as the undercut isolation groove 14 will appear here due to stress release. At this time, this type of crack is staggered with the external crack, thereby blocking the extension of the external crack; according to product requirements, the undercut isolation groove 14 and the through groove 21 can also be three or other numbers greater than 1.
[0061] The width of the second isolation region 13 is smaller than the width of the first isolation region 12 , which minimizes the border width of the flexible OLED panel, but is not limited thereto.
[0062] The undercut isolation groove 14 and the through groove 21 are combined to form a stress isolation groove, and the first circuit layer 2 and the thin film encapsulation layer 3 are disconnected by the stress isolation groove. The stress isolation groove completely disconnects the first circuit layer 2 and the thin film encapsulation layer 3 in the first isolation area 12, thereby preventing defects such as cracks and breaks that may occur when cutting the flexible OLED panel from affecting the display area 11, thereby improving the product qualification rate, but not limited to this.
[0063] like Figure 2As shown, the distance between two adjacent parts of the first circuit layer 2 disconnected by the stress isolation groove is L1, the width of the part of the first circuit layer 2 disconnected by the stress isolation groove is L2, and L1 / L2 is 0.78. The ratio between L1 and L2 is appropriate, which can avoid the stress isolation groove being too wide to waste the material of the first circuit layer 2, and also avoid the distance between the two disconnected sections of the first circuit layer 2 being too narrow to affect the insulation, but it is not limited to this.
[0064] In other embodiments, L1 / L2 may also be other values in the range of 0.5≤L1 / L2≤1, such as 0.7.
[0065] In this embodiment, the distance between two adjacent parts of the thin film encapsulation layer 3 disconnected by the stress isolation groove is L3, the width of the part of the thin film encapsulation layer 3 disconnected by the stress isolation groove is L4, and L3 / L4 is 0.2. The ratio between L3 and L4 is appropriate, which can avoid the stress isolation groove being too wide to waste the material of the thin film encapsulation layer 3, and also avoid the distance between the two disconnected sections of the thin film encapsulation layer 3 being too narrow to affect the insulation, but it is not limited to this.
[0066] In other embodiments, L3 / L4 may also be other values in the range of 0.1≤L3 / L4≤0.5, such as 0.3.
[0067] In this embodiment, the flexible OLED panel further includes an isolation column 4, which is disposed in the display area 11 and between the thin film encapsulation layer 3 and the first circuit layer 2. The isolation column 4 is disposed between the thin film encapsulation layer 3 and the first circuit layer 2 to further isolate the display area 11 from the effects of defects that may be generated during cutting, but the present invention is not limited thereto.
[0068] The thin film encapsulation layer 3 includes a first thin film encapsulation layer and a second thin film encapsulation layer, and an organic encapsulation layer is provided between the first thin film encapsulation layer and the second thin film encapsulation layer on the side of the isolation column 4 away from the first isolation region 12. The organic encapsulation layer is fluid before processing, and the isolation column 4 cooperates with the first thin film encapsulation layer and the second thin film encapsulation layer to block the flow of the organic encapsulation layer so that it is in a set position, but the present invention is not limited thereto.
[0069] A second circuit layer 5 is provided between the isolation column 4 and the first circuit layer 2 on a side of the isolation column 4 away from the first isolation region 12, and the second circuit layer 5 extends in a direction away from the first isolation region 12. The isolation column 4 and the first circuit layer 2 cooperate to encapsulate the second circuit layer 5, maintain the insulation of the second circuit layer 5, and avoid interfering with signal transmission, but the present invention is not limited thereto.
[0070] Each undercut isolation groove 14 and through groove 21 are parallel to each other. A plurality of undercut isolation grooves 14 and through grooves 21 realize multiple blocking, so that cracks, breaks and other defects generated when cutting the flexible OLED panel cannot affect the display area 11, but the present invention is not limited thereto.
[0071] This embodiment also provides an electronic device, including the flexible OLED panel as described in any one of the above items. The electronic device includes the above flexible OLED panel, which reduces the risk of packaging failure, improves the insulation of the flexible OLED panel, and avoids interference with the signal transmission inside it, thereby improving the qualification rate and user experience of the electronic device, but is not limited thereto.
[0072] In summary, the purpose of the utility model is to provide a flexible OLED panel and an electronic device comprising the same, which increases the width of the thin film package of the flexible OLED panel, thereby avoiding both package failure caused by insufficient package width and package failure caused by extension of cracks generated during cutting, thereby improving the production qualification rate of the product and reducing production costs.
[0073] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.
Claims
1. A flexible OLED panel, characterized in that: include: A flexible substrate (1), the flexible substrate (1) comprising a display area (11), a first isolation area (12) surrounding the display area (11), and a second isolation area (13) surrounding the first isolation area (12); A first circuit layer (2) formed on a first side of the flexible substrate (1); A plurality of undercut isolation grooves (14) are patterned on the surface of the first side of the first isolation region (12) of the flexible substrate (1), and the first circuit layer (2) has a through groove (21) corresponding to each undercut isolation groove (14) that exposes the undercut isolation groove (14); as well as A thin film encapsulation layer (3) is deposited on a side of the first circuit layer (2) facing away from the flexible substrate (1); a portion of the thin film encapsulation layer (3) located on a surface of the first circuit layer (2) facing away from the flexible substrate (1) is disconnected by the through groove (21); a portion of the thin film encapsulation layer (3) deposited on a side wall of the through groove (21) encapsulates a cross section of the first circuit layer (2) exposed in the through groove (21).
2. The flexible OLED panel according to claim 1, characterized in that: The width of the second isolation region (13) is smaller than the width of the first isolation region (12).
3. The flexible OLED panel according to claim 1, wherein: The undercut isolation groove (14) and the through groove (21) are combined to form a stress isolation groove, and the first circuit layer (2) and the thin film encapsulation layer (3) are disconnected by the stress isolation groove.
4. The flexible OLED panel according to claim 3, characterized in that: The distance between two adjacent parts of the first circuit layer (2) disconnected by the stress isolation groove is L1, the width of the part of the first circuit layer (2) disconnected by the stress isolation groove is L2, and 0.5≤L1 / L2≤1.
5. The flexible OLED panel according to claim 3, characterized in that: The distance between two adjacent parts of the thin film encapsulation layer (3) disconnected by the stress isolation groove is L3, the width of the part of the thin film encapsulation layer (3) disconnected by the stress isolation groove is L4, and 0.1≤L3 / L4≤0.
5.
6. The flexible OLED panel according to claim 1, characterized in that: The flexible OLED panel further comprises an isolation column (4), wherein the isolation column (4) is arranged in the display area (11) and is located between the thin film encapsulation layer (3) and the first circuit layer (2).
7. The flexible OLED panel according to claim 6, characterized in that: The thin film encapsulation layer (3) comprises a first thin film encapsulation layer and a second thin film encapsulation layer, and an organic encapsulation layer is provided between the first thin film encapsulation layer and the second thin film encapsulation layer on a side of the isolation column (4) away from the first isolation region (12).
8. The flexible OLED panel according to claim 6, wherein: A second circuit layer (5) is provided between the isolation column (4) and the first circuit layer (2) on a side of the isolation column (4) away from the first isolation region (12), and the second circuit layer (5) extends in a direction away from the first isolation region (12).
9. The flexible OLED panel according to claim 1, characterized in that: Each of the undercut isolation grooves (14) and the through grooves (21) are parallel to each other.
10. An electronic device, characterized in that: Comprising the flexible OLED panel as claimed in any one of claims 1 to 9.