Automatic welding device for integrated circuit chip

Abstract

The utility model discloses an automatic welding device for an integrated circuit chip, and relates to the technical field of electronic component production equipment. The device comprises a welding frame and a material changing frame arranged at the front end of the welding frame, an annular frame is installed on the upper surfaces of the welding frame and the material changing frame, conveying rollers are evenly arranged in the annular frame at intervals, installation bases are evenly placed on the upper surfaces of the conveying rollers at intervals, and self-elastic grooves are formed in the centers of the upper surfaces of the installation bases. A clamping assembly is arranged in the moving groove, and a self-bouncing assembly is arranged in the self-bouncing groove. The integrated circuit chip can be rapidly clamped and limited through the clamping assembly and the self-elastic assembly, meanwhile, the welded integrated circuit chip can be rapidly taken, the discharging efficiency after welding is improved, continuous welding and feeding and discharging of the integrated circuit chip can be achieved through the annular frame, the conveying rollers and the installation base, and the welding efficiency is improved. And the welding efficiency of the integrated circuit chip is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic component production equipment, in particular to an automatic welding device for integrated circuit chips. Background Art

[0002] With the development of society and technology, equipment in various fields has been greatly improved. Integrated circuits are microelectronic devices or components that use a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit. They are made on a small piece or several small pieces of semiconductor crystals or dielectric substrates, and then packaged in a tube shell to become a microstructure with the required circuit functions. In the production of integrated circuits, automatic welding equipment is required to weld components to the integrated circuit board, which can improve welding efficiency and quality.

[0003] After searching, the publication number CN218799684U, the application date 2022.09.29 discloses an integrated circuit chip welding device. The technical problem to be solved by the utility model is to provide an integrated circuit chip welding device that can realize flexible welding methods in horizontal and vertical directions, oblique directions and multiple angles, and can perform multi-axis and multi-angle welding. The utility model provides such an integrated circuit chip welding device, including a working platform, a welding table, a first slide rail, a second slide rail, a first slider, a rotating block, etc.; a welding table is provided on the working platform, and a pair of parallel upward curved rods are installed at both ends of the working platform, and the top of each pair of curved rods is connected to a first slide rail, and a second slide rail is slidably connected between the two first slide rails. By installing a second slide rail that can move forward and backward, the utility model can complete the front and rear position welding of the chip during welding, and complete the lateral welding of the chip by the first slider that can move left and right.

[0004] However, it still has the following disadvantages in actual use:

[0005] The above-mentioned integrated circuit chip welding device clamps and limits the chip through a fixed plate and a spring when in use, but this method is cumbersome, complicated, time-consuming and labor-intensive when operated by the staff, and also affects the efficiency of chip loading and unloading;

[0006] 2. The above-mentioned integrated circuit chip welding device realizes the movement of the welding table through the guide rail when in use, and this method requires manual adjustment of the position of the welding table, and cannot realize automatic continuous welding operation, resulting in low welding efficiency. To this end, we provide an integrated circuit chip automatic welding device to solve the above problems. Utility Model Content

[0007] The purpose of the utility model is to provide an automatic welding device for integrated circuit chips. By setting a clamping component and a self-elastic component, the integrated circuit chip can be quickly clamped and limited, and the working efficiency is high. At the same time, under the elastic performance of the spring, it is convenient for the staff to quickly take the integrated circuit chip after welding, and the unloading efficiency after welding is improved. In addition, the continuous welding and loading and unloading of the integrated circuit chip can be realized by using a ring frame, a conveying roller and a mounting seat, thereby improving the welding efficiency of the integrated circuit chip.

[0008] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0009] The utility model is an automatic welding device for integrated circuit chips, comprising a welding frame and a material changing frame arranged at the front end thereof, an annular frame is installed on the upper surface of the welding frame and the material changing frame, conveying rollers are evenly arranged inside the annular frame, mounting seats are evenly arranged on the upper surface of the conveying rollers, a self-elastic groove is arranged at the center position of the upper surface of the mounting seat, moving grooves are arranged at both the front and rear ends of the upper surface of the mounting seat, a clamping component is arranged inside the moving groove, and a self-elastic component is arranged inside the self-elastic groove;

[0010] The clamping assembly includes a fixed plate and a motor installed at the center of the outer wall of one side of the fixed plate, and the output shaft of the motor passes through the bearing on the outer wall of one side of the fixed plate and is connected to the threaded rod through a coupling;

[0011] The self-elastic component comprises a telescopic rod and a spring plate installed at the telescopic end thereof, and a spring is sleeved on the outer side of the outer wall of the telescopic rod.

[0012] The utility model is further configured that a moving mechanism is arranged on the upper surface of the welding frame, and a welding mechanism is arranged inside the moving mechanism.

[0013] The utility model is further configured such that the other end of the threaded rod sequentially penetrates the threaded hole on the outer wall of one side of the right U-shaped plate and the threaded hole on the outer wall of one side of the left U-shaped plate and is connected to the bearing on the inner wall of the adjacent moving groove.

[0014] The utility model is further configured that a sliding rod is arranged inside the rear ends of the right U-shaped plate and the left U-shaped plate, and two ends of the sliding rod are respectively fixed on the inner walls on both sides of the adjacent moving grooves.

[0015] The utility model is further configured that the tops of the right U-shaped plate and the left U-shaped plate are both fixedly connected with a clamping plate, and a smooth plate is provided on one side outer wall of the clamping plate.

[0016] The utility model is further configured such that the center position of the outer wall on the other side of the smooth plate is movably connected to one end of the electric push rod through a hinge, and the other end of the electric push rod is movably connected to the outer bottom side of the pressure plate through a hinge.

[0017] The utility model is further configured that the center position of the bottom of the pressing plate is movably connected to the top of the clamping plate through a hinge, and a protective pad is arranged at the inner edge of the bottom of the pressing plate.

[0018] The utility model is further configured such that the bottom end of the telescopic rod is mounted on the inner bottom end of the self-elastic groove, and the telescopic rod and the spring are both located between the inner bottom end of the self-elastic groove and the spring plate.

[0019] The utility model has the following beneficial effects:

[0020] The utility model provides a clamping assembly and a self-elastic assembly, and can quickly clamp and limit the integrated circuit chip under the action of a motor and an electric push rod, with high working efficiency. At the same time, the elastic performance of the spring makes it easy for workers to quickly take the integrated circuit chip that has been welded, thereby improving the unloading efficiency after welding. This solves the problem that the above-mentioned integrated circuit chip welding device clamps and limits the chip through a fixed plate and a spring when in use, while this method is cumbersome, complicated, time-consuming and labor-intensive when operated by workers, and also affects the loading and unloading efficiency of the chip.

[0021] The utility model provides an annular frame, conveying rollers and mounting seats. Under the action of the conveying rollers inside the annular frame, a plurality of mounting seats arranged at even intervals can be transported at a uniform speed, thereby realizing continuous welding and loading and unloading of integrated circuit chips, improving the welding efficiency of integrated circuit chips, and solving the problem that the above-mentioned integrated circuit chip welding device realizes the movement of the welding table by means of guide rails when in use, while this method requires manual adjustment of the position of the welding table and cannot realize automated continuous welding operations, resulting in low welding efficiency.

[0022] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 The present invention is a structural schematic diagram of an automatic welding device for integrated circuit chips.

[0025] Figure 2 A cross-sectional view of a welding frame.

[0026] Figure 3 This is a structural diagram of the mounting base.

[0027] Figure 4 A structural diagram of the clamping assembly.

[0028] Figure 5 This is a structural diagram of the plywood.

[0029] Figure 6 This is a structural diagram of the self-elastic component.

[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0031] 1-welding frame, 101-moving mechanism, 102-welding mechanism, 103-mounting seat, 1031-self-elastic groove, 1032-moving groove, 2-material changing rack, 3-annular frame, 301-conveying roller, 4-clamping assembly, 401-fixed plate, 402-motor, 4021-threaded rod, 403-right U-shaped plate, 404-left U-shaped plate, 405-sliding rod, 406-clamping plate, 4061-smooth plate, 4062-electric push rod, 407-pressing plate, 4071-protection pad, 5-self-elastic assembly, 501-telescopic rod, 502-spring, 503-elastic plate. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] For specific embodiment 1, please refer to Figures 1 to 6 The utility model is an automatic welding device for integrated circuit chips, comprising a welding frame 1 and a material changing frame 2 arranged at the front end thereof, a self-elastic groove 1031 is arranged at the center position of the upper surface of the mounting seat 103, and a movable groove 1032 is arranged at both the front and rear ends of the upper surface of the mounting seat 103, a clamping component 4 is arranged inside the movable groove 1032, and a self-elastic component 5 is arranged inside the self-elastic groove 1031; the clamping component 4 comprises a fixed plate 401 and a motor 402 installed at the center position of the outer wall of one side thereof, the output shaft of the motor 402 passes through the bearing on the outer wall of one side of the fixed plate 401 and is connected to the threaded rod 4021 through a coupling; the self-elastic component 5 comprises a telescopic rod 501 and a spring plate 503 installed at the telescopic end thereof, and a spring 502 is sleeved on the outer side of the outer wall of the telescopic rod 501.

[0034] Specifically, the upper surface of the welding frame 1 is provided with a moving mechanism 101, and the interior of the moving mechanism 101 is provided with a welding mechanism 102. The other end of the threaded rod 4021 sequentially penetrates the threaded hole on the outer wall of one side of the right U-shaped plate 403 and the threaded hole on the outer wall of one side of the left U-shaped plate 404 and is connected to the bearing on the inner wall of the adjacent moving groove 1032. The rear ends of the right U-shaped plate 403 and the left U-shaped plate 404 are provided with a sliding rod 405. The two ends of the sliding rod 405 are respectively fixed on the inner walls of the two sides of the adjacent moving groove 1032. The tops of the right U-shaped plate 403 and the left U-shaped plate 404 are fixedly connected with a clamping plate 406. The clamping plate 406 is fixedly connected to the top of the right U-shaped plate 403 and the left U-shaped plate 404. 06 is provided with a smooth plate 4061 on one side outer wall, and the center position of the other side outer wall of the smooth plate 4061 is movably connected to one end of an electric push rod 4062 through a hinge, and the other end of the electric push rod 4062 is movably connected to the bottom outer side of a pressure plate 407 through a hinge, and the bottom center position of the pressure plate 407 is movably connected to the top of the splint 406 through a hinge, and a protective pad 4071 is provided at the bottom inner edge of the pressure plate 407, and the bottom end of the telescopic rod 501 is installed on the inner bottom end of the self-elastic groove 1031, and the telescopic rod 501 and the spring 502 are both located between the inner bottom end of the self-elastic groove 1031 and the spring plate 503.

[0035] Furthermore, the moving mechanism 101 and the welding mechanism 102 are both prior arts, so they are not described in detail here. The motor 402 drives the threaded rod 4021 to rotate under the action of the coupling, and the outer wall of the threaded rod 4021 is provided with positive threads and negative threads on both sides, and the positive threads and negative threads are respectively engaged with the internal threads in the walls of the threaded holes on the end faces of the right U-shaped plate 403 and the left U-shaped plate 404. At the same time, with the assistance of the sliding rod 405, the right U-shaped plate 403 and the left U-shaped plate 404 can be moved in opposite directions. The electric push rod 4062 can drive the pressure plate 407 to rotate under the action of the hinge, and apply force to the surface of the integrated circuit chip to limit the position. The protective pad 4071 protects the integrated circuit chip. Under the action of the smooth plate 4061, it is convenient to make the integrated circuit chip move up and down. The telescopic rod 501 limits the spring 502, and the elastic performance of the spring 502 can drive the spring plate 503 to move.

[0036] The operation process of this embodiment is as follows: first, the integrated circuit chip is placed on the surface of the mounting seat 103, and then the motor 402 is started. The output shaft of the motor 402 rotates and drives the threaded rod 4021 to rotate through the coupling. The outer wall of the threaded rod 4021 is provided with positive threads and negative threads on both sides, and the positive threads and negative threads are respectively engaged with the internal threads in the threaded hole walls on the end faces of the right U-shaped plate 403 and the left U-shaped plate 404. Therefore, during the rotation of the threaded rod 4021 and with the assistance of the sliding rod 405, the right U-shaped plate 403 and the left U-shaped plate 404 can be driven to move in opposite directions, so that the clamping plate 406 at the top of the right U-shaped plate 403 and the left U-shaped plate 404 can be moved, so that the integrated circuit chip can be clamped and limited, so that the outer wall of the integrated circuit chip is stuck between the smooth plate 4061 of the outer wall of the clamping plate 406, and then the electric push rod 4062 is started, and the telescopic end of the electric push rod 4062 pushes the outer wall of the pressing plate 407 The spring plate 503 is moved downwards and pressed against the two ends of the upper surface of the integrated circuit chip in cooperation with the protective pad 4071, so that the integrated circuit chip is forced to move downwards and squeeze the spring plate 503, and the downward movement of the spring plate 503 will push the telescopic rod 501 and the spring 502, and then the integrated circuit chip can be welded by using the moving mechanism 101 and the welding mechanism 102. After the welding is completed, it is transported to the material replacement rack 2, and then the clamping plates 406 on both sides are moved to the initial position under the action of the motor 402 and the electric push rod 4062. At this time, the limiting clamping effect on the integrated circuit chip can be cancelled, and then the elastic performance of the spring 502 is used to eject the spring plate 503 from the inside of the spring groove 1031, and the integrated circuit chip above is ejected, so that it is convenient for the staff to quickly take the integrated circuit chip after welding, improve the material unloading efficiency after welding, and at the same time, the integrated circuit chip can be quickly clamped and limited, and the work efficiency is high.

[0037] For specific embodiment 2, please refer to Figures 1 to 2 On the basis of the specific embodiment 1, what is different from the first embodiment is that: a ring frame 3 is installed on the upper surface of the welding frame 1 and the material changing frame 2, and conveying rollers 301 are evenly spaced inside the ring frame 3, and mounting seats 103 are evenly spaced on the upper surface of the conveying rollers 301, which solves the problem that the existing integrated circuit chip welding device realizes the movement of the welding table through the guide rail when in use, and this method requires manual adjustment of the position of the welding table, and cannot realize automated continuous welding operations, resulting in low welding efficiency.

[0038] Furthermore, a conveying roller 301 is provided inside the annular frame 3 , and the plurality of mounting seats 103 on the surface thereof can be moved under the action of the conveying roller 301 , so as to realize continuous welding and loading and unloading operations of integrated circuit chips.

[0039] The operation process of this embodiment is as follows: during the welding and transportation of the integrated circuit chip, the conveying rollers 301 inside the ring frame 3 can transport multiple mounting seats 103 evenly spaced on its surface at a uniform speed, and then the multiple mounting seats 103 can be transported sequentially and continuously, thereby realizing continuous welding and loading and unloading of the integrated circuit chip, and improving the welding efficiency of the integrated circuit chip.

[0040] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0041] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An automated welding device for integrated circuit chips, comprising a welding frame (1) and a material changing frame (2) arranged at the front end thereof, wherein an annular frame (3) is installed on the upper surface of the welding frame (1) and the material changing frame (2), and conveying rollers (301) are evenly spaced inside the annular frame (3), characterized in that: Mounting seats (103) are evenly spaced on the upper surface of the conveying roller (301); a self-elastic groove (1031) is provided at the center of the upper surface of the mounting seat (103); movable grooves (1032) are provided at both the front and rear ends of the upper surface of the mounting seat (103); a clamping assembly (4) is provided inside the movable groove (1032); and a self-elastic assembly (5) is provided inside the self-elastic groove (1031); The clamping assembly (4) comprises a fixing plate (401) and a motor (402) mounted at the center of an outer wall of one side thereof, wherein an output shaft of the motor (402) passes through a bearing on an outer wall of one side of the fixing plate (401) and is connected to a threaded rod (4021) via a coupling; The self-elastic component (5) comprises a telescopic rod (501) and a spring plate (503) mounted on the telescopic end thereof, and a spring (502) is sleeved on the outer side of the outer wall of the telescopic rod (501).

2. The integrated circuit chip automatic welding device according to claim 1, characterized in that: A moving mechanism (101) is provided on the upper surface of the welding frame (1), and a welding mechanism (102) is provided inside the moving mechanism (101).

3. The integrated circuit chip automatic welding device according to claim 1, characterized in that: The other end of the threaded rod (4021) sequentially passes through a threaded hole on an outer wall of one side of the right U-shaped plate (403) and a threaded hole on an outer wall of one side of the left U-shaped plate (404) and is connected to a bearing on an inner wall of an adjacent movable groove (1032).

4. The integrated circuit chip automatic welding device according to claim 3, characterized in that: A sliding rod (405) is provided inside the rear ends of the right U-shaped plate (403) and the left U-shaped plate (404), and two ends of the sliding rod (405) are respectively fixed on the inner walls on both sides of the adjacent moving groove (1032).

5. The integrated circuit chip automatic welding device according to claim 4, characterized in that: A clamping plate (406) is fixedly connected to the top of the right U-shaped plate (403) and the top of the left U-shaped plate (404), and a smooth plate (4061) is provided on an outer wall of one side of the clamping plate (406).

6. The integrated circuit chip automatic welding device according to claim 5, characterized in that: The center position of the outer wall on the other side of the smooth plate (4061) is movably connected to one end of the electric push rod (4062) via a hinge, and the other end of the electric push rod (4062) is movably connected to the outer side of the bottom of the pressure plate (407) via a hinge.

7. The integrated circuit chip automatic welding device according to claim 6, characterized in that: The center position of the bottom of the pressing plate (407) is movably connected to the top of the clamping plate (406) via a hinge, and a protective pad (4071) is provided at the inner edge of the bottom of the pressing plate (407).

8. The integrated circuit chip automatic welding device according to claim 1, characterized in that: The bottom end of the telescopic rod (501) is mounted on the inner bottom end of the self-elastic groove (1031), and the telescopic rod (501) and the spring (502) are both located between the inner bottom end of the self-elastic groove (1031) and the spring plate (503).

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