Chip removing mechanism for mold machining

Abstract

The utility model relates to a mould processing chip cleaning mechanism, which comprises a support table, a support seat, a polishing table, a mounting plate, a top plate and a polishing device, the top of the support table is provided with a cleaning mechanism, and the cleaning mechanism comprises two side baffles which are fixedly mounted on the outer wall of the top of the support table; a first baffle is fixedly installed on the outer walls of the opposite sides of the two side baffles, and a second baffle is fixedly installed on the outer walls of the opposite sides of the two side baffles. According to the chip cleaning mechanism for mold machining, waste chips generated during machining and grinding of a mold can be shielded through a side baffle, a first baffle, a second baffle, a front baffle, a mounting plate and a top plate, so that the waste chips cannot be splashed everywhere, and the waste chips on a grinding table can be conveniently pushed to the left side and the right side to be cleaned under the action of an electric telescopic rod and a cleaning push plate; and the waste chips are pushed into the waste chip collecting box, so that the waste chips are cleaned, and meanwhile, the waste chips are conveniently collected.

Description

Technical Field

[0001] The utility model relates to the technical field of mold processing, in particular to a chip cleaning mechanism for mold processing. Background Art

[0002] Mold processing is a manufacturing technology that mainly involves manufacturing molds for molding products through a series of process flows according to product design requirements. These molds can be injection molds, die-casting molds, stamping molds, etc., which are used to produce various plastic products, metal products, etc. The mold processing process usually includes multiple links such as design, material selection, cutting, rough processing, fine processing, grinding, and assembly. In this process, various processing equipment and technologies are needed, such as CNC machine tools, EDM machines, wire cutting machines, grinders, etc., to ensure the accuracy and quality of the mold. Ultimately, the molds manufactured through mold processing can achieve fast, efficient, and precise molding of products, improving production efficiency and product quality.

[0003] At present, molds need to be polished during processing. Polishing is an important processing link, which is used to remove burrs and uneven parts on the mold surface or to achieve specific surface roughness requirements. When the mold is polished, some waste chips will splash around, which is inconvenient to collect and clean later. Some waste chips will fall on the polishing table. After these waste chips fall on the polishing table, the mold will be unstable when placed, affecting the accuracy of subsequent mold processing. Therefore, a mold processing chip cleaning mechanism is proposed. Utility Model Content

[0004] In view of the shortcomings of the prior art, the utility model provides a chip cleaning mechanism for mold processing, which has the advantages of greatly reducing the spattering of waste chips, improving the efficiency of the collection box, and improving the quality of mold grinding processing. It solves the problem that the waste chips falling on the grinding table will cause the mold to be unstable when placed, affecting the accuracy of subsequent mold processing.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip cleaning mechanism for mold processing, comprising a support table, a support seat, a grinding table, a mounting plate, a top plate and a grinding device, wherein a cleaning mechanism is provided on the top of the support table;

[0006] The cleaning mechanism includes two side baffles fixedly installed on the outer wall of the top of the support platform, a first baffle fixedly installed on the outer wall on the opposite side of the two side baffles, a second baffle fixedly installed on the outer wall on the opposite side of the two side baffles, a front baffle slidably connected between the two second baffles, sliders fixedly installed on the outer walls on the left and right sides of the front baffle, an electric telescopic rod fixedly installed on the outer wall on the opposite side of the two side baffles, a connecting plate fixedly installed on the telescopic shaft of the electric telescopic rod, and a cleaning push plate fixedly installed on the outer wall on the opposite side of the two connecting plates.

[0007] Furthermore, the second baffle is located in front of the first baffle, and the second baffle and the first baffle are both fixedly mounted on the top outer wall of the support platform, and the distance between the left and right outer walls of the first baffle is greater than the distance between the left and right outer walls of the second baffle.

[0008] Furthermore, the bottom outer wall of the cleaning push plate is at the same height as the top outer wall of the grinding table, the distance between the front and rear outer walls of the cleaning push plate is the same as the distance between the front and rear outer walls of the grinding table, and the front and rear outer walls of the cleaning push plate are respectively slidably connected between the front baffle and the mounting plate.

[0009] Furthermore, a holder is fixedly mounted on the outer wall of one opposite side of the two support seats, a slot is provided on the top outer wall of the holder, a waste collection box is connected to the inside of the holder, and the waste collection box is connected to the inside of the slot and has a matching size.

[0010] Furthermore, two chip removal holes are opened on the top of the support table, the waste chip collection box is located directly below the chip removal holes, and the chip removal holes are located between the adjacent side baffles, the first baffle, the second baffle and the grinding table.

[0011] Furthermore, a sliding groove is provided on the outer wall of the two second baffles on the opposite side, and the sliding block is slidably connected inside the sliding groove and has a matching size.

[0012] Furthermore, the support seat is fixedly installed on the bottom outer wall of the support table and there are two of them, the grinding table is fixedly installed on the top outer wall of the support table, the mounting plate is fixedly installed on the top outer wall of the support table, the top plate is fixedly installed on the top outer wall of the mounting plate, and the grinding device is fixedly installed on the bottom outer wall of the top plate.

[0013] Furthermore, four reinforcement seats are fixedly mounted on the top outer wall of the support platform, and the top outer walls of two of the reinforcement seats are attached to the top outer wall of the electric telescopic rod.

[0014] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0015] This type of mold processing chip cleaning mechanism, the waste chips generated during the mold processing and grinding will be blocked by the side baffles, the first baffle, the second baffle, the front baffle, the mounting plate and the top plate, so that the waste chips cannot splash everywhere, and the electric telescopic rod and the cleaning push plate are used to push the waste chips on the grinding table to the left and right for cleaning, and push the waste chips to the inside of the waste chip collection box, which not only cleans the waste chips but also facilitates the collection of the waste chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model;

[0017] Figure 2 For this utility model Figure 1 Schematic diagram of local structure;

[0018] Figure 3 For this utility model Figure 1 Schematic diagram of the structure from top view;

[0019] Figure 4 This is a schematic diagram of the support platform structure of the utility model.

[0020] In the figure: 1. Support table; 2. Support seat; 3. Grinding table; 4. Mounting plate; 5. Top plate; 6. Grinding device; 7. Side baffle; 8. First baffle; 9. Second baffle; 10. Front baffle; 11. Slider; 12. Electric telescopic rod; 13. Connecting plate; 14. Cleaning push plate; 15. Holder; 16. Waste collection box. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] For example, see Figure 1-4 A mold processing chip cleaning mechanism in this embodiment includes a support platform 1, a support seat 2, a grinding platform 3, a mounting plate 4, a top plate 5 and a grinding device 6, and a cleaning mechanism is provided on the top of the support platform 1.

[0023] The support seat 2 is fixedly installed on the bottom outer wall of the support platform 1 and there are two of them. The grinding table 3 is fixedly installed on the top outer wall of the support platform 1. The mounting plate 4 is fixedly installed on the top outer wall of the support platform 1. The top plate 5 is fixedly installed on the top outer wall of the mounting plate 4. The grinding device 6 is fixedly installed on the bottom outer wall of the top plate 5.

[0024] The cleaning mechanism includes two side baffles 7 fixedly installed on the top outer wall of the support platform 1, a first baffle 8 is fixedly installed on the outer wall on the opposite side of the two side baffles 7, a second baffle 9 is fixedly installed on the outer wall on the opposite side of the two side baffles 7, the second baffle 9 is located in front of the first baffle 8, the second baffle 9 and the first baffle 8 are both fixedly installed on the top outer wall of the support platform 1, and the distance between the left and right outer walls of the first baffle 8 is greater than the distance between the left and right outer walls of the second baffle 9.

[0025] A front baffle 10 is slidably connected between the two second baffles 9, and sliders 11 are fixedly installed on the outer walls on the left and right sides of the front baffle 10. A slide groove is opened on the outer walls on the opposite side of the two second baffles 9, and the slide block 11 is slidably connected inside the slide groove and is adapted in size. An electric telescopic rod 12 is fixedly installed on the outer wall on the opposite side of the two side baffles 7, and a connecting plate 13 is fixedly installed on the telescopic axis of the electric telescopic rod 12. A cleaning push plate 14 is fixedly installed on the outer wall on the opposite side of the two connecting plates 13. The bottom outer wall of the cleaning push plate 14 is at the same height as the top outer wall of the grinding table 3, and the distance between the front and rear outer walls of the cleaning push plate 14 is the same as the distance between the front and rear outer walls of the grinding table 3. The front and rear outer walls of the cleaning push plate 14 are respectively slidably connected between the front baffle 10 and the mounting plate 4.

[0026] A clamping seat 15 is fixedly installed on the outer wall of the opposite side of the two support seats 2, and a clamping slot is opened on the top outer wall of the clamping seat 15. A waste chip collection box 16 is clamped inside the clamping seat 15. The waste chip collection box 16 is clamped inside the clamping slot and is of a suitable size. Two chip removal holes are opened on the top of the support table 1. The waste chip collection box 16 is located directly below the chip removal holes, and the chip removal holes are located between the adjacent side baffles 7, the first baffle 8, the second baffle 9 and the grinding table 3.

[0027] In this embodiment, the cleaning push plate 14 will clamp the left and right walls of the mold, and the electric telescopic rod 12 will move the mold to the left or right side, so that the mold can be automatically polished on the side close to the polishing disk. When polishing the other surfaces of the mold, it is only necessary to change the surface for polishing.

[0028] In this embodiment, the front baffle 10 is slidably connected between the two second baffles 9 by means of a slider 11, so as to facilitate its removal or installation.

[0029] In this embodiment, the movable distance of the cleaning push plate 14 is greater than the distance between the left and right outer walls of the grinding table 3 .

[0030] In this embodiment, the grinding device 6 includes an electric lifting rod for driving the fixed frame to move up and down, so as to adjust the height and position of the grinding tool or grinding head, and also includes a telescopic shaft on which the fixed frame is installed and supports the relevant components of the grinding tool or grinding head, and also includes a rotating component fixed cylinder rotatably installed on the fixed frame, and a rotating shaft rotatably installed in the fixed cylinder. These components are used to drive the grinding plate to rotate and move radially to achieve the grinding operation, and also include a grinding plate and an arc plate, and the grinding plate is the component that actually performs the grinding work.

[0031] Embodiment 2 is provided with a reinforcement seat on the basis of embodiment 1, and the working stability of the electric telescopic rod 12 is increased through the function of the reinforcement seat.

[0032] The working principle of the above embodiment is:

[0033] First, place the mold on the top of the grinding table 3, and then start the electric telescopic rod 12 to drive the cleaning push plate 14 to move towards the direction close to the mold and clamp it. At this time, push the mold to the left or right. When the mold is clamped and fixed, the front baffle 10 is installed between the two second baffles 9. At this time, the grinding device 6 can be started to grind the mold. At this time, the waste chips generated during the grinding of the mold will be blocked by the mounting plate 4, the top plate 5, the side baffle 7, the first baffle 8, the second baffle 9 and the front baffle 10. When one side of the mold is polished and the other side needs to be reversely polished, the electric telescopic rod 12 on the left or right side pushes the cleaning push plate 14 again. At this time, the cleaning push plate 14 will discharge the waste chips remaining on the upper surface of the grinding table 3 through the chip discharge hole into the waste chip collection box 16. At this time, the cleaning and collection of the waste chips are completed.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip cleaning mechanism for mold processing, comprising a support table (1), a support seat (2), a grinding table (3), a mounting plate (4), a top plate (5) and a grinding device (6), characterized in that: A cleaning mechanism is provided on the top of the support platform (1); The cleaning mechanism comprises two side baffles (7) fixedly mounted on the outer wall of the top of the support platform (1); a first baffle (8) is fixedly mounted on the outer wall on the opposite side of the two side baffles (7); a second baffle (9) is fixedly mounted on the outer wall on the opposite side of the two side baffles (7); a front baffle (10) is slidably connected between the two second baffles (9); sliding blocks (11) are fixedly mounted on the outer walls on the left and right sides of the front baffle (10); an electric telescopic rod (12) is fixedly mounted on the outer wall on the opposite side of the two side baffles (7); a connecting plate (13) is fixedly mounted on the telescopic shaft of the electric telescopic rod (12); and a cleaning push plate (14) is fixedly mounted on the outer wall on the opposite side of the two connecting plates (13).

2. A chip cleaning mechanism for mold processing according to claim 1, characterized in that: The second baffle (9) is located in front of the first baffle (8); the second baffle (9) and the first baffle (8) are both fixedly mounted on the top outer wall of the support platform (1); the distance between the left and right outer walls of the first baffle (8) is greater than the distance between the left and right outer walls of the second baffle (9).

3. A chip cleaning mechanism for mold processing according to claim 1, characterized in that: The bottom outer wall of the cleaning push plate (14) is at the same height as the top outer wall of the grinding table (3); the distance between the front and rear outer walls of the cleaning push plate (14) is the same as the distance between the front and rear outer walls of the grinding table (3); and the front and rear outer walls of the cleaning push plate (14) are respectively slidably connected between the front baffle (10) and the mounting plate (4).

4. A chip cleaning mechanism for mold processing according to claim 1, characterized in that: A clamping seat (15) is fixedly mounted on the outer wall of one side opposite to the two support seats (2); a clamping slot is provided on the top outer wall of the clamping seat (15); a waste collection box (16) is clamped inside the clamping seat (15); the waste collection box (16) is clamped inside the clamping slot and has a matching size.

5. A chip cleaning mechanism for mold processing according to claim 4, characterized in that: The top of the support platform (1) is provided with two chip removal holes, the waste chip collection box (16) is located directly below the chip removal holes, and the chip removal holes are located between adjacent side baffles (7), the first baffle (8), the second baffle (9) and the grinding table (3).

6. A chip cleaning mechanism for mold processing according to claim 1, characterized in that: A sliding groove is provided on the outer wall of the two second baffles (9) on the opposite side, and the sliding block (11) is slidably connected inside the sliding groove and has a matching size.

7. A chip cleaning mechanism for mold processing according to claim 1, characterized in that: The support seat (2) is fixedly mounted on the bottom outer wall of the support platform (1) and there are two of them; the grinding platform (3) is fixedly mounted on the top outer wall of the support platform (1); the mounting plate (4) is fixedly mounted on the top outer wall of the support platform (1); the top plate (5) is fixedly mounted on the top outer wall of the mounting plate (4); and the grinding device (6) is fixedly mounted on the bottom outer wall of the top plate (5).

8. A chip cleaning mechanism for mold processing according to claim 1, characterized in that: Four reinforcement seats are fixedly mounted on the top outer wall of the support platform (1), and the top outer walls of two of the reinforcement seats are fitted to the top outer wall of the electric telescopic rod (12).

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