Conductive adhesive bonding strength test sample preparation device

Abstract

The utility model provides a conductive adhesive bonding strength test sample preparation device which comprises a base station, and a clamping assembly, a template fixing assembly, a dispensing simulation template and a device placing template which are arranged on the base station, the clamping assembly is used for fixing a substrate sample, and the template fixing assembly is used for fixing the substrate sample. The clamping assembly comprises two supporting plates arranged oppositely, clamping arms arranged on the two supporting plates correspondingly and clamping plates arranged at the ends of the clamping arms, and the two clamping plates are vertically arranged and are driven by the clamping arms to get close to each other in the horizontal direction so as to horizontally fix the substrate sample piece; and the template fixing assembly is used for fixing the dispensing simulation template or the device placement template above the substrate sample. By means of the arrangement, personal errors are greatly reduced, the conductive adhesive bonding strength testing sample piece is easy and convenient to manufacture and good in consistency, and then the accuracy and reproducibility of conductive adhesive bonding strength testing are improved.

Description

Technical Field

[0001] The utility model relates to the field of conductive adhesives, in particular to a conductive adhesive bonding strength test sample preparation device. Background Art

[0002] With the miniaturization and high performance of modern microelectronic devices, electronic assembly technology is also developing in the direction of miniaturization, high density and high integration, which puts forward higher requirements on the stability and connection strength of semiconductor packaging connection materials. Conductive adhesive has become an ideal substitute for traditional tin-lead solder and alloy solder with its advantages of low curing temperature, high resolution, good thermomechanical properties, simple process and good wettability with materials, and is widely used in semiconductor packaging connection and other processes.

[0003] As one of the important indicators of conductive adhesive, the early evaluation of bonding strength is particularly necessary. In the process of conductive adhesive bonding strength test, the impact of the production of conductive adhesive bonding strength test samples on the results is one of the factors that have a greater impact besides the material itself. In this regard, back-end manufacturers such as conductive adhesive chip packaging, electronic components and integrated circuit connection manufacturers are generally equipped with professional equipment (automatic / semi-automatic dispensing machines, placement machines, etc.) to accurately evaluate the performance of conductive adhesives. However, for front-end slurry R&D manufacturers, these equipment costs are relatively high, which will increase more R&D funding. Therefore, the evaluation method in the R&D stage is mostly to manually dispense glue on the substrate to be tested and then bond the device to further test the bonding strength. However, it is difficult to control the amount of glue dispensed by manually squeezing the syringe, and the effective bonding of the device is fixed by surface connection. Manual dispensing is difficult to control the spacing, resulting in inconsistent dispensing amount and bonding area between different test samples, affecting the test accuracy, and then causing instability and non-repeatability of the test results, slowing down the progress of R&D and causing greater economic losses.

[0004] Therefore, it is necessary to design a simple conductive adhesive bonding strength test sample preparation device, which lays a more accurate, reproducible and controllable foundation for testing the bonding strength of the conductive adhesive. Utility Model Content

[0005] The utility model aims to provide a conductive adhesive bonding strength test sample preparation device which is easy and convenient to operate and has good consistency, thereby reducing human errors as much as possible and making the conductive adhesive bonding strength test more accurate and reproducible.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a device for preparing a conductive adhesive bonding strength test sample, comprising a base, a clamping assembly arranged on the base, a template fixing assembly, a glue dispensing simulation template and a device placement template, the clamping assembly is used to fix the substrate sample, the clamping assembly comprises two supporting plates arranged opposite to each other, clamping arms respectively arranged on the two supporting plates and clamping plates arranged at the ends of the clamping arms, the two clamping plates are arranged vertically and approach each other in the horizontal direction under the drive of the clamping arms to fix the substrate sample horizontally, and the template fixing assembly is used to fix the glue dispensing simulation template or the device placement template above the substrate sample.

[0007] As a further improved technical solution of the utility model, when the glue dispensing simulation template is fixed on the template fixing component, the distance between the upper surface of the substrate sample and the lower surface of the glue dispensing simulation template is 1-2 mm.

[0008] As a further improved technical solution of the present invention, when the device placement template is fixed on the template fixing assembly, the distance between the upper surface of the substrate sample and the lower surface of the device placement template is 1-2 mm.

[0009] As a further improved technical solution of the utility model, the thickness of the dispensing simulation template is 1-3mm, and a plurality of rows of circular through holes are provided on the dispensing simulation template. The inner diameter of each circular through hole is 1-1.5mm, and the hole spacing of each row of circular through holes is 1-1.5mm.

[0010] As a further improved technical solution of the utility model, the device placement template is provided with a rectangular through groove corresponding to the position of the circular through hole on the dispensing simulation template.

[0011] As a further improved technical solution of the utility model, the dispensing simulation template includes a rectangular body and right-angle gaskets arranged at the four corners of the rectangular body.

[0012] As a further improved technical solution of the utility model, the device placement template includes a rectangular body and right-angle gaskets arranged at the four corners of the rectangular body.

[0013] As a further improved technical solution of the utility model, the template fixing assembly includes four limiting parts, and the limiting parts include two vertical baffles and a horizontal supporting plate arranged between the two baffles, and the two vertical baffles are perpendicular to each other.

[0014] As a further improved technical solution of the utility model, it also includes a sample box, the substrate sample is horizontally clamped in the sample box, the upper surface of the substrate sample is not lower than the upper edge of the sample box, and the clamping assembly clamps and fixes the sample box in the horizontal direction.

[0015] As a further improved technical solution of the utility model, the outer side of the clamping arm is provided with a thread, and the support plate is provided with a threaded hole that matches the thread of the clamping arm.

[0016] It can be seen from the above technical scheme that the conductive adhesive bonding strength test sample preparation device of the utility model has the following advantages:

[0017] 1. By setting the clamping assembly, the substrate sample can be accurately fixed in the appropriate position, ensuring the stability and accuracy of the substrate sample during subsequent operations.

[0018] 2. By setting the template fixing component to fix the dispensing simulation template or the device placement template on the substrate sample, on the one hand, the template can be quickly and accurately positioned, greatly improving the operating efficiency; on the other hand, the amount and position of each dispensing, as well as the position of the device placement, can be ensured to be consistent, thereby improving the accuracy and repeatability of the test.

[0019] 3. The device can adapt to substrate samples of different sizes by adjusting the clamping components, and has strong versatility and adaptability. In addition, by replacing the dispensing simulation templates and device placement templates of different specifications, it can meet the production needs of different types of test samples. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a side view of a device for preparing a conductive adhesive bonding strength test sample according to an embodiment of the present invention.

[0021] Figure 2 for Figure 1 A top view of the device for preparing samples for testing the bonding strength of conductive adhesive.

[0022] Figure 3 It is a schematic diagram of a glue dispensing simulation template in a conductive adhesive bonding strength test sample preparation device according to an embodiment of the present invention.

[0023] Figure 4 It is a schematic diagram of a device placement template in a conductive adhesive bonding strength test sample preparation device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] Please refer to Figure 1 and Figure 2As shown, the utility model provides a conductive adhesive bonding strength test sample preparation device, which includes a base 10, a clamping assembly 20 arranged on the base 10, a template fixing assembly 30, a sample box 40, and a dispensing simulation template 50 ( Figure 3 ) and device placement template 60( Figure 4 ).

[0026] The base 10 is used to carry and install other components in the device, and it has a horizontal bearing surface. The clamping assembly 20 is arranged above the base 10, and is used to fix the substrate sample. In this embodiment, the substrate sample is horizontally clamped in the sample box 40, and then the clamping assembly 20 clamps and fixes the sample box 40 in the horizontal direction. The sample box 40 matches the shape of the substrate sample. When the substrate sample is placed in the sample box 40, the upper surface of the substrate sample is not lower than the upper edge of the sample box 40. On the one hand, the sample box 40 is used to protect the substrate sample. On the other hand, it can also prevent the edge of the substrate sample from causing wear to the clamping assembly 20, maintain the positioning accuracy of the clamping assembly 20, and extend the service life of the clamping assembly 20.

[0027] The clamping assembly 20 includes two supporting plates 23 arranged opposite to each other, clamping arms 21 respectively arranged on the two supporting plates 23, and clamping plates 22 arranged at the ends of the clamping arms 21, and the two clamping plates 22 are arranged vertically. In this embodiment, the clamping arm 21 is a screw with a thread on the outer side, and the supporting plate 23 is provided with a threaded hole that matches the thread of the clamping arm 21. When the clamping arm 21 is rotated, the clamping arm 21 drives the clamping plates 22 to move in the horizontal direction, and the two clamping plates 22 can approach each other under the drive of the clamping arm 21 to fix the substrate sample horizontally.

[0028] The template fixing assembly 30 is used to fix the dispensing simulation template 50 or the device placement template 60 above the substrate sample. The template fixing assembly 30 includes four limiting parts 31, and the limiting part 31 includes two vertical baffles 311 and a horizontal support plate 312. The two vertical baffles 312 are perpendicular to each other and form an angle, and the horizontal support plate 312 is arranged between the two baffles 311. A rectangular limiting space is formed between the four limiting parts 31. The dispensing simulation template 50 or the device placement template 60 is clamped between the four limiting parts 31.

[0029] Please refer to Figure 3 As shown, the dispensing simulation template 50 includes a rectangular body 51 and right-angle gaskets 52 arranged at the four corners of the rectangular body 51. The thickness of the rectangular body 51 is 1-3mm, and a plurality of rows of circular through holes 53 are arranged on the rectangular body 51. The inner diameter of each circular through hole 53 is 1-1.5mm, and the hole spacing of each row of circular through holes 53 is 1-1.5mm. Specifically, in this embodiment, the rectangular body 51 is preferably made of stainless steel with a plate thickness of 2mm, and the circular through holes 53 are made by laser drilling with a diameter of 1mm.

[0030] The right-angle gasket 52 is arranged on the lower surface of the rectangular body 51, and is used to buckle with the limit part 31. In addition, the distance between the lower surface of the rectangular body 51 and the substrate sample can be adjusted by setting right-angle gaskets of different thicknesses. Preferably, when the dispensing simulation template 50 is fixed on the template fixing component 30, the distance between the upper surface of the substrate sample and the lower surface of the dispensing simulation template is 1-2mm. Such a setting, on the one hand, is convenient for demoulding. The appropriate distance can ensure that during the dispensing process, the conductive glue will not adhere to the dispensing simulation template 50 before curing, so that the demoulding process is smoother, which is crucial for maintaining the integrity of the sample and reducing damage; on the other hand, the amount of glue can be effectively controlled. Through precise distance control, the amount of dispensing can be effectively controlled to avoid too much or too little, and ensure that the conductive glue is evenly distributed and appropriate on the substrate sample, thereby improving the accuracy of the bonding strength test.

[0031] The device placement template 60 is used to position the device on the substrate sample after dispensing. Figure 4 As shown, the device placement template 60 includes a rectangular body 61 and right-angle gaskets 62 arranged at the four corners of the rectangular body 61. The device placement template 60 is provided with a rectangular through groove 63 corresponding to the position of the circular through hole 53 on the dispensing simulation template 50. When the device placement template 60 is fixed on the template fixing component 30, the distance between the upper surface of the substrate sample and the lower surface of the device placement template 60 is 1-2mm. In this embodiment, the rectangular body 61 is made of stainless steel with a plate thickness of 2mm. The rectangular through groove 63 is made by laser cutting and has a length of 3mm and a width of 1mm.

[0032] It should be noted that the number, size and arrangement of the circular through holes 53 on the dispensing simulation template 50 and the rectangular through slots 63 on the device placement template 60 can be set according to actual needs. In this way, multiple conductive adhesive bonding strength test samples can be prepared at the same time, greatly improving the preparation efficiency.

[0033] The working process of the conductive adhesive bonding strength test sample preparation device of the present embodiment is as follows: first, the substrate sample is placed horizontally in the sample box 40, and the substrate sample is fixed at a preset position through the clamping component 20 according to the glue dispensing position; after the substrate sample is fixed, the glue dispensing simulation template 50 is clamped on the template fixing component 30, and then the conductive glue is scraped on the substrate sample by a scraper to form a preset circular glue spot; then the glue dispensing simulation template 50 is removed and replaced with the device placement template 60, and the device is placed above the glue spot to bond the device to the substrate sample; finally, the prepared sample is dried and cured, and subsequent tests can be carried out.

[0034] Terms such as "upper" and "lower" used herein to indicate spatial relative positions are used for the purpose of convenience to describe the relationship of one feature relative to another feature as shown in the drawings. It is understood that, depending on the placement of the product, the terms of spatial relative positions may be intended to include different orientations other than those shown in the drawings, and should not be construed as limitations on the claims.

[0035] In addition, the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of this specification should be based on the technical personnel in the relevant technical field. Although this specification has described the present invention in detail with reference to the above embodiments, ordinary technical personnel in the field should understand that the technical personnel in the relevant technical field can still modify or make equivalent substitutions to the present invention, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A conductive adhesive bonding strength test sample preparation device, characterized in that: It includes a base, a clamping assembly arranged on the base, a template fixing assembly, a dispensing simulation template and a device placement template. The clamping assembly is used to fix the substrate sample. The clamping assembly includes two supporting plates arranged opposite to each other, clamping arms respectively arranged on the two supporting plates and clamping plates arranged at the ends of the clamping arms. The two clamping plates are arranged vertically and approach each other in the horizontal direction under the drive of the clamping arms to fix the substrate sample horizontally. The template fixing assembly is used to fix the dispensing simulation template or the device placement template above the substrate sample.

2. The conductive adhesive bonding strength test sample preparation device according to claim 1, characterized in that: When the glue dispensing simulation template is fixed on the template fixing component, the distance between the upper surface of the substrate sample and the lower surface of the glue dispensing simulation template is 1-2 mm.

3. The conductive adhesive bonding strength test sample preparation device according to claim 1, characterized in that: When the device placement template is fixed on the template fixing assembly, the distance between the upper surface of the substrate sample and the lower surface of the device placement template is 1-2 mm.

4. The conductive adhesive bonding strength test sample preparation device according to claim 1, characterized in that: The thickness of the dispensing simulation template is 1-3 mm, and a plurality of rows of circular through holes are arranged on the dispensing simulation template. The inner diameter of each circular through hole is 1-1.5 mm, and the hole spacing of the circular through holes in each row is 1-1.5 mm.

5. The conductive adhesive bonding strength test sample preparation device according to claim 4, characterized in that: The device placement template is provided with a rectangular through groove corresponding to the position of the circular through hole on the dispensing simulation template.

6. The conductive adhesive bonding strength test sample preparation device according to claim 1, characterized in that: The dispensing simulation template includes a rectangular body and right-angle gaskets arranged at the four corners of the rectangular body.

7. The conductive adhesive bonding strength test sample preparation device according to claim 1, characterized in that: The device placement template comprises a rectangular body and right-angle gaskets arranged at the four corners of the rectangular body.

8. The conductive adhesive bonding strength test sample preparation device according to claim 6 or 7, characterized in that: The template fixing assembly includes four limiting parts, and the limiting parts include two vertical baffles and a horizontal supporting plate arranged between the two baffles, and the two vertical baffles are perpendicular to each other.

9. The conductive adhesive bonding strength test sample preparation device according to claim 1, characterized in that: It also includes a sample box, in which the substrate sample is horizontally clamped, the upper surface of the substrate sample is not lower than the upper edge of the sample box, and the clamping assembly clamps and fixes the sample box in the horizontal direction.

10. The conductive adhesive bonding strength test sample preparation device according to claim 1, characterized in that: The outer side of the clamping arm is provided with a thread, and the support plate is provided with a threaded hole matched with the thread of the clamping arm.

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